The M74HC73 is an high speed CMOS DUAL J-K
FLIP FLOP WITH CLEAR fabrica ted with silicon
gate C
2
MOS technology.
Depending on the logic level applied to J and K
inputs, this device changes state on the negative
going transition of clock input pulse (CK
). The
TSSOPDIPSOP
ORDER CODES
PACKAGETUBET & R
DIPM74HC73B1R
SOPM74HC73M1RM74HC73RM13TR
TSSOPM74HC73TTR
clear function is accomplished independently of
the clock condition when the clear input (CLR
) is
taken low.
All inputs are equipped with protection circuits
against static discharge and transient excess
voltage.
PIN CONNECTION AND IEC LOGIC SYMBOLS
1/11August 2001
Page 2
M74HC73
INPUT AND OUTPUT EQUIVALENT CIRCUIT PIN DESCRIPTION
Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is
not implied
(*) 500mW at 65
WAVEFORM 3 : PROPAGATION DELAY TIME, MINIMUM PULSE WIDTH, SETUP AND HOLD TIME
(f=1MHz; 50% duty cycle)
7/11
Page 8
M74HC73
Plastic DIP-14 MECHANICAL DATA
mm.inch
DIM.
MIN.TYPMAX.MIN.TYP.MAX.
a10.510.020
B1.391.650.0550.065
b0.50.020
b10.250.010
D200.787
E8.50.335
e2.540.100
e315.240.600
F7.10.280
I5.10.201
L3.30.130
Z1.272.540.0500.100
8/11
P001A
Page 9
SO-14 MECHANICAL DATA
M74HC73
DIM.
A1.750.068
a10.10.20.0030.007
a21.650.064
b0.350.460.0130.018
b10.190.250.0070.010
C0.50.019
c145° (typ.)
D8.558.750.3360.344
E5.86.20.2280.244
e1.270.050
e37.620.300
F3.84.00.1490.157
G4.65.30.1810.208
L0.51.270.0190.050
M0.680.026
S8° (max.)
MIN.TYPMAX.MIN.TYP.MAX.
mm.inch
PO13G
9/11
Page 10
M74HC73
TSSOP14 MECHANICAL DATA
mm.inch
DIM.
MIN.TYPMAX.MIN.TYP.MAX.
A1.20.047
A10.050.150.0020.0040.006
A20.811.050.0310.0390.041
b0.190.300.0070.012
c0.090.200.0040.0089
D4.955.10.1930.1970.201
E6.26.46.60.2440.2520.260
E14.34.44.480.1690.1730.176
e0.65 BSC0.0256 BSC
K0°8°0°8°
L0.450.600.750.0180.0240.030
A2
A
A1
b
e
c
K
L
E
D
E1
PIN 1 IDENTIFICATION
10/11
1
0080337D
Page 11
M74HC73
Information furnished is bel ieved to be accurate and reliable. However, STMicroe lectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from
its use. No li cense is granted by i mp lication or otherwise under a ny patent or patent rig h ts of S TMic roelec tronics. Specifications
mentioned in this publication ar e subject to change without notice. This publication supersedes and replaces all information
previously supplied. S TMicroelectronics products are not authorized for use as critica l components in life suppo rt devices or
systems without express written approval of STMicroelectronics.
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