Datasheet M74HC648, M74HC646 Datasheet (SGS Thomson Microelectronics)

M74HC646
M74HC648

HC6 46 OCTA L BUSTRAN S CE I VER / REG I STE R (3-STAT E)

HC648 OCTAL BUS TRANSCEIVER/REGISTER (3-STATE, INV.)

.HIGH SPEED

f

= 73 MHz(TYP.) AT VCC=5V

MAX

.LOWPOWERDISSIPATION

ICC=4µA(MAX.) AT TA=25°C

.HIGH NOISEIMMUNITY

V

NIH=VNIL

.OUTPUT DRIVE CAPABILITY

15 LSTTL LOADS

=28%VCC(MIN.)

B1R

(PlasticPackage)

M1R

(MicroPackage)

.SYMMETRICALOUTPUT IMPEDANCE

IOH=IOL=6 mA(MIN.)

.BALANCEDPROPAGATION DELAYS

t

PLH=tPHL

.WIDE OPERATINGVOLTAGE RANGE

VCC(OPR)= 2 V TO6 V

M74HC X XXM1R M74H CXXXB1 R

ORDER CODES :

.PIN ANDFUNCTION COMPATIBLE

WITH 54/74LS646/648

DESCRIPTION

The M74HC646/648 are highspeedCMOSOCTAL
BUS TRANSCEIVERS AND REGISTERS, (3­STATE) fabricated in silicon gate C2MOS technol­ogy. They have the same high speedperformance
ofLSTTLcombined withtrueCMOS low powercon­sumption.
These devices consist of bus transceiver circuits
with3-state output, D-typeflip-flops,and controlcir­cuitryarranged for multiplexed transmission ofdata
directly from the inputbus or from the internal reg­isters.Dataon theAor Bbuswill beclocked intothe
registers on the low-to-high transition of the appro­priate clockpin(ClockAB- orClockBA).Enable(G)
and direction (DIR) pins are provided to control the
transceiverfunctions. In thetransceiver mode, data
present at the high-impedance port may be stored
in either register or in both.
The select controls (Select AB select BA) canmulti­plex stored and real-time (transparent mode) data.
The direction control determines which bus will re­ceivedata whenenable G is active(low).
In theisolation mode (enable G high),”A” data may
be stored in one register and/or ”B” data may be
storedinthe otherregister.Whenanoutputfunction
is disabled, the input function is still enabled and
may be used to store and transmit data. Only one
of the two buses, A or B, may be driven at a time.
All inputs are equipped with protection circuits

PIN CONNECTIONS (top view)

INPUT AND OUTPUT EQUIVALENT CIRCUIT

GAB,GAB,CAB, A, B
SAB,SBA, CBA

October 1993

1/12

M74HC646/648

LOGIC DIAGRAM (HC648)

Note: In case ofM54/74HC646 output invertermarked *at A bus and B bus are eliminated.

TIMING CHART

2/12

M74HC646/648

TRUTH TABLE

HC646 ( The truth table for HC648 is the same as this, but with the outputs inverted)

G DIR CAB CBA SAB SBA A B FUNCTION

INPUTS INPUTS Both the A bus and the B bus are inputs

HX

LH

LL

X : DON’TCARE
Z :HIGH IMPEDANCE
Qn :THE DATA STOREDTO THEINTERNALFLIP-FLOPSBY MOST RECENTLOW TO HIGHTRANSITION OF THECLOCK INPUTS
* : THEDATA AT THE A ANDB BUSWILLBE STORED TO THE INTERNALFLIP-FLOPS ON EVERY LOWTO HIGH TRANSITIONOF

THECLOCK INPUTS

X X X X Z Z The output functions of the A and B bus are disabled

X X INPUTS INPUTS Both the A and B bus are used for inputs to the

internal flip-flops. Data at the bus will be stored on
low to high transition of the clock inputs

INPUTS OUTPUTS The A bus are inputs and the B bus are outputs

X X* L X L L The data at the A bus are displayed at the B bus

HH

X* L X L L The data at the A bus are displayed at the B bus.

HH

The data of the A bus are stored to the internal
flip-flop on low to high transition of th clock pulse.

X X* H X X Qn The data stored to the internal flip-flop are dispayed

at the B bus

X* H X L L The data at the A bus are stored to the internal flip-

HH

flop on low to high transition of the clock pulse. The
states of the internal flip-flops output directly to the
B bus

OUTPUTS INPUTS The B bus are inputs and the A bus are outputs

X* X X L

L L The data at the B bus are displayed at the A bus
HH

X* X L L L The data at the B bus are displayed at the A bus.

HH

The data of the B bus are stored to the internal flip­flop on low to high transition of the clock pulse

X* X X H Qn X The data stored to the internal flip-flops are

displayed at the A bus

x* X H L L the data at the B bus are stored to the internal flip-

HH

flop on low to high transition of the clock pulse. The
states of the internal flip-flops output directly to the
A bus

3/12

M74HC646/648

PIN DESCRIPTION

PIN No SYMBOL NAME AND FUNCTION

1 CLOCK AB A to B Clock Input (LOW to HIGH, Edge-Trigged)
2 SELECT AB Select A to B Source Input
3 GAB Direction Control Input

4, 5, 6, 7, 8, 9, 10, 11 A1 to A8 A data Inputs/Outputs

20, 19, 18, 17, 16, 15, 14, 13 B1 to B8 B Data Inputs/Outputs

21 G Output Enable Input (Active LOW)
22 SELECT BA Select B to A Source Input
23 CLOCK BA B to A Clock Input (LOW to HIGH, Edge-Triggered)
12 GND Ground (0V)
24 V

IEC LOGIC SYMBOLS

CC

HC646 HC648

Positive Supply Voltage

4/12

M74HC646/648

ABSOLU TE M AXI MUM RATI NG S

Symbol Parameter Value Unit

V

CC

V

V

O

I

IK

I

OK

I

O

I

or I

CC

P

D

T

stg

T

AbsoluteMaximumRatingsarethose valuesbeyond whichdamage tothedevicemayoccur. Functionaloperationunder these condition isnotimplied.
(*)500 mW: ≅ 65oC derateto300 mWby 10mW/oC: 65oCto85oC

RECO MM ENDED OPERAT I N G CO NDI TIONS

Symbol Parameter Value Unit

V

CC

V

I

V

O

T

op

t

r,tf

Supply Voltage -0.5 to +7 V
DC Input Voltage -0.5 to VCC+ 0.5 V

I

DC Output Voltage -0.5 to VCC+ 0.5 V
DC Input Diode Current ± 20 mA
DC Output Diode Current ± 20 mA
DC Output Source Sink Current Per Output Pin ± 35 mA
DC VCCor Ground Current ± 70 mA

GND

Power Dissipation 500 (*) mW
Storage Temperature -65 to +150
Lead Temperature (10 sec) 300

L

Supply Voltage 2 to 6 V
Input Voltage 0 to V
Output Voltage 0 to V

CC
CC

Operating Temperature -40 to +85
Input Rise and Fall Time VCC= 2 V 0 to 1000 ns

V

= 4.5 V 0 to 500

CC

= 6 V 0 to 400

V

CC

o

C

o

C

V
V

o

C

5/12

M74HC646/648

DC SPECIFICATIONS

Symbol Parameter

V

V

V

V

I

I

High Level Input Voltage 2.0 1.5 1.5

IH

Low Level Input

IL

Voltage

High Level Output Voltage 2.0

OH

Low Level Output Voltage 2.0

OL

Input Leakage Current 6.0 VI=VCCor GND ±0.1 ±1 µA

I

I

3 State Output Off State Current 6.0 VI=VIHor V

OZ

Quiescent Supply Current 6.0 VI=VCCor GND 4 40 µA

CC

Test Conditions Value

V

(V)

CC

TA=25oC -40 to 85oC

Min. Typ. Max. Min. Max.

4.5 3.15 3.15

6.0 4.2 4.2

2.0 0.5 0.5

4.5 1.35 1.35

6.0 1.8 1.8
=

V

I

V

IH

or

V

IL

V

I

V

IH

or

V

IL

IO=-20 µA

=-6.0 mA 4.18 4.31 4.13

O

=-7.8 mA 5.68 5.8 5.63

O

=

IO=20µA

= 6.0 mA 0.17 0.26 0.37

O

= 7.8 mA 0.18 0.26 0.37

O

4.5 4.4 4.5 4.4

6.0 5.9 6.0 5.9

4.5 I

6.0 I

4.5 0.0 0.1 0.1

6.0 0.0 0.1 0.1

4.5 I

6.0 I

1.9 2.0 1.9

0.0 0.1 0.1

IL

±0.5 ±5.0 µA

VO=VCCor GND

Unit

V

V

V

V

AC ELECTRICAL CHARACTERISTICS (CL=50pF,Inputtr=tf=6ns)

Test Conditions Value

Symbol Parameter

t
t

t
t

t
t

TLH
THL

PLH
PHL

PLH
PHL

Output Transition Time 2.0

Propagation Delay Time
(BUS - BUS)

Propagation Delay Time
(CLOCK - BUS)

V

(V)

CC

C

(pF)

L

TA=25oC -40 to 85oC

Min. Typ. Max. Min. Max.

25 60 75

50

4.5 7 12 15

6.0 6 10 13

2.0

50

4.5 21 30 38

74 150 190

6.0 18 26 32

2.0

150

4.5 26 38 48

91 190 240

6.0 22 32 41

2.0

50

4.5 28 42 53

98 210 265

6.0 24 36 45

2.0

150

4.5 33 50 63

116 250 315

6.0 28 43 54

Unit

ns

ns

ns

ns

ns

6/12

M74HC646/648

AC ELECTRICAL CHARACTERISTICS (CL=50pF,Inputtr=tf=6ns)

Test Conditions Value

Symbol Parameter

t
t

PLH
PHL

Propagation Delay Time
(SELECT - BUS)

C

V

CC

(V)

L

(pF)

2.0

50

4.5 23 34 43

TA=25oC -40 to 85oC

Min. Typ. Max. Min. Max.

81 170 215

6.0 20 29 37

2.0

150

4.5 28 42 53

98 210 265

6.0 24 36 45

t

t

PZL
PZH

3-State Output Enable Time
(G, DIR)

2.0

50 RL=1KΩ

4.5 24 35 44

84 175 220

6.0 20 30 37

2.0

150 R

4.5 29 43 54

=1KΩ

L

102 215 270

6.0 25 37 46

t

t

PLZ
PHZ

Output Disable Time
(G, DIR)

2.0

50 R

4.5 23 35 44

=1KΩ

L

60 175 220

6.0 20 30 37

f

MAX

Maximum Clock Frequency 2.0

4.5 30 67 24

50

6 19 4.8

6.0 35 79 28

t

W(H)

t

W(L)

Minimum Clock Pulse Width 2.0

4.5 7 15 19

50

30 75 95

6.0 6 13 16

Minimum Set-up Time 2.0

t

s

50

4.5 4 10 13

16 50 65

6.0 3 9 11

Minimum Hold Time 2.0

t

h

50

4.5 5 5

55

6.0 5 5

C

C

C

PD

(*) CPDisdefined as the value ofthe IC’sinternal equivalent capacitance which is calculated fromthe operatingcurrent consumption without load.
(Referto Test Circuit). Average operting current canbe obtained bythe followingequation. ICC(opr) = CPD•VCC•fIN+ICC/8(per bit)

Input Capacitance 5 10 10 pF

IN

Bus Terminal Capacitance 10 pF

I/O

(*) Power Dissipation Capacitance for HC646

for HC648

39
38

Unit

ns

ns

ns

ns

ns

MHz

ns

ns

ns

pF

7/12

M74HC646/648

SWITCHING CHARACTERISTICS TEST CIRCUIT AND WAVEFORM

WAVEFORM 1 WAVEFORM 2

WAVEFORM3

WAVEFORM 4

WAVEFORM5

8/12

TEST WAVEFORM ICC(Opr.)

* INPUTTRANSITION TIMEIS THE SAME AS THATIN CASEOF SWITCHINGCHARACTERISTICSTEST.

M74HC646/648

9/12

M74HC646/648

Plastic DIP24 (0.25) MECHANICAL DATA

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

a1 0.63 0.025

b 0.45 0.018

b1 0.23 0.31 0.009 0.012

b2 1.27 0.050

D 32.2 1.268

E 15.2 16.68 0.598 0.657

e 2.54 0.100

e3 27.94 1.100

F 14.1 0.555

I 4.445 0.175

L 3.3 0.130

mm inch

10/12

P043A

SO24 MECHANICAL DATA

M74HC646/648

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

A 2.65 0.104
a1 0.10 0.20 0.004 0.007
a2 2.45 0.096

b 0.35 0.49 0.013 0.019

b1 0.23 0.32 0.009 0.012

C 0.50 0.020
c1 45° (typ.)

D 15.20 15.60 0.598 0.614

E 10.00 10.65 0.393 0.420

e 1.27 0.05

e3 13.97 0.55

F 7.40 7.60 0.291 0.299
L 0.50 1.27 0.19 0.050

S8°(max.)

mm inch

L

A

a2

b

e3

D

24 13

112

e

F

s

a1

c1

b1

C

E

11/12

M74HC646/648

Information furnishedis believed to be accurate and reliable. However, SGS-THOMSON Microelectronicsassumes no responsability for the
consequences of useof suchinformation nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted byimplication or otherwiseunder any patentor patentrights ofSGS-THOMSON Microelectronics.Specificationsmentioned
in this publication are subjectto changewithout notice. This publication supersedes andreplaces all information previouslysupplied.
SGS-THOMSON Microelectronicsproducts are not authorized foruse ascritical componentsinlife supportdevices or systems without express
written approval of SGS-THOMSON Microelectonics.

 1994SGS-THOMSON Microelectronics- All Rights Reserved

Australia -Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta -Morocco - The Netherlands-

Singapore -Spain - Sweden- Switzerland - Taiwan - Thailand- UnitedKingdom - U.S.A

SGS-THOMSON Microelectronics GROUP OFCOMPANIES

12/12