Datasheet M63954P Datasheet (Mitsubishi)

Page 1
MITSUBISHI SEMICONDUCTORS <HVIC>
M63954P
HIGH VOLTAGE HALF BRIDGE DRIVER
DESCRIPTION
M63954P is high voltage integrated circuit designed for electronic ballast, Power MOSFET and IGBT module driver for half bridge applications.
FEATURES
¡FLOATING SUPPLY VOLTAGE ................................. 600V
¡OUTPUT CURRENT .............................................±500mA
¡HALF BRIDGE DRIVER ¡BUILT-IN OSCILLATOR ¡DIP_16 PACKAGE ¡BUILT-IN REGULATOR
APPLICATIONS
The M63954P can be used for fixed or continuous lamp con­trol of fluorescent lamp inverter.
BLOCK DIAGRAM
RVCOCVCO
4
3
VCO
2
+ –
0.652VREG
– +
+ –
0.773VREG
SQ R
Q
PIN CONFIGURATION (TOP VIEW)
1
VREG
2
VCO
3
CVCO
4
RVCO
5
AB
6
7
LNTH
8
LN
PACKAGE TYPE 16P4
Dead Time
Level
Shift
SQ R
M63954P
11
HVCC
10
HO
9
HGND
16 15 14 13 12 11 10
9
CNT OV GND LO VCC HVCC HO HGND
VREG
LN
LNTH
VCC
CNT
13
1
8 7
12
16
– +
UV
+ –
VREG
VREG START
DELAY
DELAY
DELAY
S
Q
R
SQ R
DELAY
DELAY
1/2VREG
LO
5
+
AB
6
ABTH
15
OV
+ –
14
GND
Sep. 2000
Page 2
MITSUBISHI SEMICONDUCTORS <HVIC>
M63954P
HIGH VOLTAGE HALF BRIDGE DRIVER
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Conditions Ratings Unit HGND HVCC VCC VOV VAB IAB VABTH VLN ILN VLNTH VVCO IHO ILO Pt K q Rth(j-c) Tj Topr Tstg
High Side Floating Supply Offset Voltage High Side Floating Supply Voltage Low Side Fixed Supply Voltage OV Input Voltage AB Input Voltage AB Input Current ABTH Input Voltage LN Input Voltage LN Input Current LNTH Input Voltage VCO Input Voltage High Side Output Current Low Side Output Current Package Power Dissipation Linear Derating Factor Junction-Case Thermal Resistance Junction Temperature Operation T emperature Storage Temperature
HGND=GND
Ta = 25°C, On Board Ta > 25°C, On Board
600 –0.5~+20 –0.5~+20
–0.5 ~ VCC+0.5 –0.5 ~ VCC+1.0
2 –0.5 ~ VCC+0.5 –0.5 ~ VCC+1.0
2 –0.5 ~ VCC+0.5 –0.5 ~ VCC+0.5
±500 ±500
1.56
12.5 25
150
–20 ~ +80
–40 ~ +125
V V V V V
mA
V V
mA
V
V mA mA
W
mW/°C
°C/W
°C °C °C
ELECTRICAL CHARACTERISTICS (Ta=25°C, GND=HGND, VCC=HVCC=15V, unless otherwise specified)
Symbol UnitParameter Test conditions
HVCC VCC VREG ICC1 ICC2 ICC3 ICC4 VUVr VUVt tUV VOV tOV IOV fVCO fO VVCO IVCO VCVCO ICVCO IrRVCO VSRVCO
High Side Floating Supply Voltage Low Side Fixed Supply Voltage Internal Supply Voltage Standby Current ON Suspension Oscillate Current ON Oscillation Current (50Hz) ON Oscillation Current (115kHz) VCC UV Reset Voltage VCC UV Trip Voltage VCC Supply UV Filter Time OV Protection Vth OV Filter Time OV Input Leak Current VCO Frequency Set Up Limit Output Frequency Set Up Limit VCO Input Voltage Limit VCO Input Leak Current CVCO Input Voltage CVCO Input Leak Current RVCO Leak Current RVCO Saturation Voltage
HVCC-HGND
VCC=15V, NO Load VCC=15V, CNT=5V, OV=5V VCC=15V, CNT=0V VCC=15V, RVCO1=15k, VVCO=0.33VREG RVCO2=39k, CVCO=100pF, VVCO=0.42VREG
VOV=0V
LO, HO
VVCO=0V VREG=7.2V VCVCO=0V, VVCO >VCVCO VCVCO=0V, VREG=7.2V, VRVCO=10V VCVCO=6V, VREG=7.2V, IRVCO=10mA
Min. Typ. Max.
13 13
6.9 — —
2.0
2.0
9.0
5.5 14
3.4 30
–0.5
— —
1.5 –2
5.5 –2 — —
Limits
15 15
7.2
0.75
2.0
5.0 8
10
6.5
3.6
–0.08
— — —
–0.66
5.55
–0.66
— —
17 17
7.5
1.0
4.0
8.0 12 11
7.5
100
3.8
150
250 125
VREG–1.5
5.6 —
0.5
500
V V
V mA mA mA mA
V
V
µs
V
µs
µA
kHz kHz
V
µA
V
µA µA
mV
Sep. 2000
Page 3
MITSUBISHI SEMICONDUCTORS <HVIC>
HIGH VOLTAGE HALF BRIDGE DRIVER
ELECTRICAL CHARACTERISTICS (Ta=25°C, GND=HGND, VCC=HVCC=15V, unless otherwise specified)
Symbol UnitParameter Test conditions
VLN VLNTH VLNIO ILN ILNTH ILNTHh tLN VAB VABTH VABIO IAB IABTH tAB VCNT VCNTh ICNT tCNT IRFC tDEAD VHOH1 VHOH2 VHOH3 VHOL1 VHOL2 VHOL3 VLOH1 VLOH2 VLOH3 VLOL1 VLOL2 VLOL3 tr tf
LN Input Voltage Limit LNTH Input Voltage Limit LN Offset Voltage LN Input Leak Current LNTH Input Leak Current LNTH Input Hysteresis Current LN Filter Time AB Input Voltage Limit ABTH Input Voltage Limit AB Offset Voltage AB Input Leak Current ABTH Input Leak Current AB Filter Time CNT Input Threshold Voltage CNT Input Hysteresis Voltage CNT Input Leak Current CNT Filter Time Floating Supply Leak Current Dead Time
HO Output Voltage
LO Output Voltage
Output Rise Time Output Fall Time
VLN>VLNTH VLN>VLNTH, VCC<VUVr VLN > VLNTH, VLNTH=5V
VAB<VABTH VAB>VABTH
VCNT=0V
VHGND=600V C=1000pF IHO=0mA IHO=–20mA IHO=–200mA IHO=0mA IHO=20mA IHO=200mA ILO=0mA ILO=–20mA ILO=–200mA ILO=0mA ILO=20mA ILO=200mA Amplitude 10% 90%, C=1000pF Amplitude 90% 10%, C=1000pF
Min. Typ. Max.
1.0
1.0
–50
–1 –1 20 14
0 0
–50 –0.5 –0.5
30
3.4
0.8
–0.5
30 —
1.0 14 10
1.0 — — — 14 10
1.0 — —
← ←
— — —
Limits
— —
— –0.22 –0.22
40
— –0.08 –0.08
3.6
1.0
–0.08
14.4 13
5.5 5
0.5 6
14.4 13
5.5 5
0.5 6
50 50
M63954P
VCC–1.5 VCC–1.5
50 — — 80
100 VREG–1.5 VREG–1.5
50 — —
150
3.8
1.2 —
150
1.0
1.9 — — —
100
1.0 12 — — —
100
1.0 12
120 120
V V
mV
µA µA µA µs
V V
mV
µA µA µs
V V
µA µs µA µs
V V V
mV
V V V V V
mV
V
V ns ns
OUTPUT FREQUENCY (RVCO1=15k, RVCO2=15k, CVCO=100pF)
Oscillation Frequency VCO Input Voltage Min.
50kHz 60kHz
0.33VREG
0.42VREG
— —
Typ.
50 60
Max.
— —
Unit kHz
kHz
Sep. 2000
Page 4
DEAD TIME
MITSUBISHI SEMICONDUCTORS <HVIC>
M63954P
HIGH VOLTAGE HALF BRIDGE DRIVER
90%
HO
LO
OUTPUT RISE TIME
FALL TIME
HO, LO
90%
10%
tDEADtDEAD
10%
90% 90%
10%
tr tf
10%
Sep. 2000
Page 5
PERFORMANCE CURVES
MITSUBISHI SEMICONDUCTORS <HVIC>
M63954P
HIGH VOLTAGE HALF BRIDGE DRIVER
Thermal Derating Factor Characteristic ICC–VCC Characteristic
2
1.5 On Board
1
0.5
Power Dissipation Pt (W)
0
025 7550 150125100 8 13 18 23
Ambient Temperature Ta (°C)
8.0
7.5
7.0
VREG (V)
VREG–VCC Characteristic tDEAD–VCC Characteristic
Non Board
Oscillation suspended
Frequency=50kHz
6
5
4
3
ICC (mA)
2
1
0
1.5
1.4
1.3
1.2
tDEAD (µs)
Frequency=115kHz
Frequency=50kHz
VCC (V)
Oscillation suspended
Standby
tDEAD1
tDEAD2
6.5
6.0
8 13 18 23 8 13 18 23
VCC (V)
20
15
10
VLOH (V)
VLOH–VCC Characteristic VLOL–VCC Characteristic
ILO=0mA
ILO=–20mA
ILO=–200mA
5
0
8 13 18 23 8 13 18 23
VCC (V)
1.1
1
10
8
6
VLOL (V)
4
2
0
VCC (V)
VCC (V)
ILO=200mA
ILO=20mA
ILO=0
Sep. 2000
Page 6
MITSUBISHI SEMICONDUCTORS <HVIC>
M63954P
HIGH VOLTAGE HALF BRIDGE DRIVER
6
5
4
3
ICC (mA)
2
1
0 –50 0 50 100 150 –50 0 50 150100
12
10
8
6
VUV (V)
4
2
0 –50 0 50 100 150 –50 500 100 150
ICC–Ta Caracteristic VREG–Ta Characteristic
ICC4
ICC3
ICC2 ICC1
Ta (°C)
VUV–Ta Characteristic tDEAD–Ta Characteristic
VUVr
VUVt
7.35
7.30
7.25
7.20
7.15
VREG (V)
7.10
7.05
7.00
1.90
1.80
1.70
1.60
1.50
1.40
tDEAD (µs)
1.30
1.20
1.10
1.00
Oscillation suspended
Frequency=50kHz
Ta (°C)
tDEAD1
tDEAD2
Ta (°C)
16 14
12 10
VLOH (V)
VLOH–Ta Characteristic VLOL–Ta Characteristic
ILO=0mA
ILO=–20mA
8 6 4 2
0 –50 0 50 100 150 –50 0 50 100 150
Ta (°C)
ILO=–200mA
10
9 8 7 6 5
VLOL (V)
4 3 2 1
0
Ta (°C)
ILO=200mA
ILO=20mA
ILO=0mA
Ta (°C)
Sep. 2000
Page 7
DIP16-P-300-2.54
Weight(g)
JEDEC Code
1.0
EIAJ Package Code
Lead Material
Alloy 42/Cu Alloy
16P4
Plastic 16pin 300mil DIP
Symbol
Min Nom Max
A
A
2
b
b
1
b
2
c
E
D
L
Dimension in Millimeters
A
1
0.51 – –3.3–
0.4 0.5 0.6
1.4 1.5 1.8
0.9 1.0 1.3
0.22 0.27 0.34
18.8 19.0 19.2
6.15 6.3 6.45 –2.54– –7.62–
3.0
0° –15°
4.5
e
e
1
16
9
8
1
E
c
e
1
D
A2
A1
b2
b
b
1
e
L
A
SEATING PLANE
PACKAGE OUTLINE
MITSUBISHI SEMICONDUCTORS <HVIC>
M63954P
HIGH VOLTAGE HALF BRIDGE DRIVER
Sep. 2000
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