Datasheet M58MR032D, M58MR032C Datasheet (SGS Thomson Microelectronics)

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Page 1

32 Mbit (2Mb x16, Mux I/O, Dual Bank, Burst)

■ SUPPLY VOLTAGE

= V

–V

Erase and Read

–V

= 12V for fast Program (optional)

■ MULTIPLEXED ADDRESS/DATA

■ SYNCHRONOUS / ASYNCHRONOUS READ

– Burst mode Read: 40MHz – Page mode Read (4 Words Page) – Random Access: 100ns

■ PROGRAMMING TIME

– 10µs by Word typical – Two or four words programming option

■ MEMORY BLOCKS

– Dual Bank Memory Array: 8/24 Mbit – Parameter Blocks (Top or Bott o m location)

■ DUAL OPERATIONS

– Read within one Bank while Program or

Erase within the other

– No delay between Read and Write operations

■ PROTECTION/S ECURITY

– All Blocks protected at Power-up – Any combination of Blocks can be protected – 64 bit unique device identifier – 64 bit user programmable OTP cells – One parameter block permanently lockable

■ COMMON FLASH INTERFACE (CFI)

■ 100,000 PROGRAM/ERASE CYCL ES per

BLOCK

■ ELECTRONIC SIGNATURE

– Manufacturer Code: 20h – Top Device Code, M58MR032C: 88DAh – Bottom Device Code, M58MR032D: 88DBh

= 1.7V to 2.0V for Program,

DDQ

M58MR032C M58MR032D

1.8V Supply Flash Memory

PRELIMINARY DATA

FBGA

TFBGA48 (ZC)

10 x 4 ball array

Figure 1. Logic Diagram

DDQVPP

A16-A20

M58MR032C M58MR032D

ADQ0-ADQ15

WAIT

BINV

AI90019

August 2002

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.

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Page 2

M58MR032C, M58MR032D

Figure 2. TFBGA Connections (Top view through package)

87654321

DDQ

ADQ14ADQ15

KWAIT

ADQ13 ADQ12

WPRPBINVLA20A16V

ADQ2ADQ3ADQ6ADQ7V

ADQ10ADQ11ADQ4ADQ5V

109

A19

A18

DDQ

A17

ADQ8

ADQ1

ADQ9

1211

ADQ0

1413

AI90020

DESCRIPTION

The M58MR032 is a 32 Mbit non-volatile Flash memory that m ay be erased electrically a t block level and programmed i n-system on a Word-byWord basis using a 1.7V to 2.0V V

supply for the

circuitry. For Program and Erase operations the necessary high voltages are gen erated internally. The device supports synchronous burst read and asynchronous read from all the blocks of the memory array; at power-up the device is configured for page mode read. In sy nchronous burst mode, a new data is output at each clock cycle for frequencies up to 40MHz.

The array matrix organization allows each block to be erased and reprogrammed without affecting other blocks. All blocks are protected against programming and erase at Power-up.

Blocks can be unprotected to make changes in the application and then re-protected.

A parameter block "Security block" can be permanently protected against programming and erasing

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in order to increase the data security. An optional 12V V

power supply is provided to speed up the

program phase at costumer production. An internal command interface (C.I.) decode s the instructions to access/modify the memory content. The program/erase controller (P/E.C.) automatically executes the algorithms taking care of the timings necessary for program and erase operations. Two status registers indicate the state of each bank.

Instructions for Read Array, Read Electronic Signature, Read Status Register, Clear Status Register, Write Read Configuration Register, Program, Block Erase, Bank Erase, Program Suspend, Program Resume, Erase Suspend, Erase Resume, Block Protect, Block Unprotect, Block Locking, Protection Program, CFI Query, are wri tten to t he memory through a Command Interface (C.I.) using standard micro-processor write timings.

The memory is offered in TFBGA48, 0. 5 mm ball pitch packages and it is supplied with all the bits

erased (set to ’1’).

Page 3

M58MR032C, M58MR032D

Table 1. Signal Names

A16-A20 Address Inputs

ADQ0-ADQ15

Data Input/Outputs or Address Inputs, Command Inputs

Organization

The M58MR032 is organized as 2Mb by 16 bits. The first sixteen address lines are multiplexed with the Data Input/Output signals on the m ultiplexed address/data bus ADQ0-ADQ15. The remaining address lines A16-A20 are the MSB addresses.

E G W RP

Chip Enable Output Enable Write Enable Reset/Power-down

Chip Enable E W

inputs provide memory control.

, Output Enable G and Write Enable

The clock K input synchronizes the memory to the microprocessor during burst read.

Reset RP

is used to reset all the memory circuitry and to set the chip in power-down mode if a proper setting of the Read Configuration Register en-

WP K Burst Clock L

Write Protect

Latch Enable

ables this function.

output indicates to t he microprocessor the

WAIT status of the memory during the burst mode operations.

Memory Blocks

WAIT BINV Bus Invert V

DDQ

Wait Data in Burst Mode

Supply Voltage Supply Voltage for Input/Output

Buffers Optional Supply Voltage for

Fast Program & Erase

The device features asymmetrically blocked architecture. M58MR032 has an array of 71 blocks and is divided into two banks A and B, prov iding D ual Bank operations. While programming or erasing in Bank A, read operations are possible into Bank B or vice versa. Only one bank at the time is allowed to be in program or erase mode. It is possible to perform burst reads that cross bank boundaries.

The memory features an eras e suspend allowing reading or programming in another block. Once suspended the erase can be resumed. Program

Ground

can be suspended to read data in another block and then resumed. The Bank S ize and sectoriza-

DU Don’t Use as Internally Connected

NC Not Connected Internally

tion are summarized in Table 3. Parameter Blocks are located at the top of the memory address space for the M58MR032C, and at the bottom for the M58MR032D. The memory maps are shown in Figure 3.

Table 2. Absolute Maximum Ratings

Symbol Parameter Value Unit

BIAS

STG

(3)

, V

DDQ

Note: 1. Except for the ratin g "Operati ng Temperature Range" , stresses above those listed i n t he Table "Absolute M aximum Ratings" may

cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indi cated in t he Operating sect i ons of thi s specifi cation i s not impl i ed. Exposure to Absolute M aximum Rating c onditions for extended per iods may aff ect device reliabilit y. Refer also to the STMicroel ectronics SURE Program an d other relevan t qual ity docum en ts .

2. Depends on range.

3. Mini m um Voltage may undershoot to –2V duri ng transit i on and for less than 20ns.

Ambient Operating Temperature

Temperature Under Bias –40 to 125 °C Storage Temperature –55 to 155 °C Input or Output Voltage Supply Voltage –0.5 to 2.7 V Program Voltage –0.5 to 13 V

(1)

(2)

–40 to 85 °C

–0.5 to V

DDQ

+0.5

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M58MR032C, M58MR032D

The architecture includes a 128 bits Protection register that is divided into two 64-bits segments. In the first one is written a unique device nu mbe r, while the second o ne is programmable by the us er. The user programmable segm ent can be permanently protected programming the bit 1 of the Protection Lock Register (see protection register and Security Block). The parameter bl ock (# 0) is a security block. It c an be permanently p rotected

Table 3. Bank Size and Sectorization

Bank Size Parameter Blocks Main Blocks

Bank A 8 Mbit 8 blocks of 4 KWord 15 blocks of 32 KWord Bank B 24 Mbit - 48 blocks of 32 KWord

Figure 3. Me m ory Map

Top Boot Block

Address lines A20-A0

000000h

007FFFh

Bank B

512 Kbit or

32 KWord

Total of 48 Main Blocks

by the user programming the bit 2 of the Protection Lock Register.

Block protection against Program or Erase provides additional data security. All blocks are protected and unlocked at Power-up. Instructions are provided to protect or un-protec t any block in the application. A second register locks the protection status while WP

is low (see Block Locking descrip-

tion).

Bottom Boot Block

Address lines A20-A0

000000h

000FFFh

64 Kbit or

4 KWord

Total of 8 Parameter Blocks

Bank A

178000h

17FFFFh

180000h

187FFFh

1F0000h

1F7FFFh

1F8000h

1F8FFFh

1FF000h

1FFFFFh

512 Kbit or

32 KWord

512 Kbit or

32 KWord

512 Kbit or

32 KWord

64 Kbit or

4 KWord

64 Kbit or

4 KWord

Total of 15 Main Blocks

Total of 8 Parameter Blocks

Bank A

Bank B

007000h

007FFFh

008000h

00FFFFh

078000h

07FFFFh

080000h

087FFFh

1F8000h

1FFFFFh

64 Kbit or

4 KWord

512 Kbit or

32 KWord

Total of 15 Main Blocks

512 Kbit or

32 KWord

512 Kbit or

32 KWord

Total of 48 Main Blocks

512 Kbit or

32 KWord

AI90069

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M58MR032C, M58MR032D

SIGNAL DESCRIPTIONS

See Figure 1 and Table 1.

Address Inputs or Data Input/Output (ADQ0ADQ15). When Chip Enable E

put Enable G

is at VIH the multiplexe d address/

is at VIL and Out-

data bus is used to input addresses for the memory array, data to be programmed in the memory array or commands to be written to the C.I. The address inputs for the memory array are latched on the rising edge of Latch Enable L latch is transparent when L

is at VIL. In synchro-

. The address

nous operations the address is also latched on the first rising/falling edge of K (depending on clock configuration) when L

is low. Both input data and commands are latched on the rising edge of Write Enable W able G

. When Chip Ena ble E and Output En-

are at VIL the address/data bus outputs data from the Memory Array, the Electronic Signature Manufacturer or Device codes, the Block Protection status the Read Configuration Register status, the protection register or the Status Register. The address/data bus is high impedance when the chip is desele cted, O ut put E nabl e G

is at VIL.

or RP

is at VIH,

Address Inputs (A16-A20). The five MSB addresses of the m emory array are latched on t he rising edge of Latch Enable L

. In synchronous operation these inputs are also latched on the first rising/falling edge of K (depending on clock configuration) when L

Chip Enable (E

is low.

). The Chip Enable input activates the memory control logic, input buffers, decoders and sense amplifiers. E

at VIH deselects the memory and red uces the power consumption to the standby level. E

can also be used to control writing to the command register and to the memory array, while W

Output Enable (G

remains at VIL.

). The Output Enable gates the outputs through the data buffers during a read operation. When G

is at VIH the outputs are High im-

pedance.

Write Enable (W

). This input controls writing to

the Command Register and Data latches. Data are latched on the rising edge of W

Write Protect (WP

). This input gives an addition-

al hardware protection level against program or erase when pulled at V

, as described in the Block

Lock instruction description.

Reset/Power-down Input (RP

). The RP input

provides hardware reset of the memory, and/or Power-down functions, depending on the Read Configuration Register status. Reset /Po wer-down of the memory is achieved by pulling RP

to VIL for

at least t

. When the reset pulse is given, the

PLPH

memory will recover from Power-down (when enabled) in a minimum of t

PHEL

, t

PHLL

or t

PHWL

(see

Table 31 and F igure 15) after the rising edge of

. Exit from Reset/Power-down changes the

RP contents of the Read Configuration Register bits 14 and 15, setting the mem ory in asynchronous page mode read and power save function disabled. All blocks are protected and unl oc ked after a Reset/Power-down.

Latch Enable (L

). L latches the address bits

ADQ0-ADQ15 and A16-A20 on its rising edge. The address latch is transparent when L

is at V

and it is inhibited when L is at VIH. Clo c k (K). The clock input synchronizes the

memory to the micro controller during burst mode read operation; the address is latched on a K edge (rising or falling, according to the configuration settings) when L

is at VIL. K is don’t care during asyn-

chronous page mode read and in write operations.

Wait (WAIT

). WAIT i s an output signal used dur-

ing burst mode read, indicating whet her the data on the output bus are valid or a wait state must be inserted. This output is high impedance when E

are high or RP is at VIL, and can be configured

to be active during the wait cycle or one clock cycle in advance.

Bus Invert (BINV). BINV is an input/output signal used to reduce the amount of power needed to switch the external address/data bus. The power saving is achieved by inverting the dat a output on ADQ0-ADQ15 every time this gives an advantage in terms of number of toggling bits. In burst mode read, each new data output from the memory is compared with the previous data. If the number of transitions required on the data bus is in excess of 8, the data is inverted and the BINV signal will be driven by the memory at V

to inform the receiv-

ing system that dat a must be inverted b efore any further processing. By doing so, the act ual transitions on the data bus will be less than 8.

In a similar way, when a command is given, BINV may be driven by the system at V

to inform the

memory that the data input must be inverted. Like the other input/output pins, BINV is high im-

pedance when the chip is deselected, output enable G

is at VIH or RP is at VIL; when used as an input, BINV must follow the same set-up and h old timings of the data inputs.

and V

is the main power supply for all operations

(Read, Program and Erase). V

Supply Voltage (1.7V to 2.0V).

DDQ

is the supply

DDQ

voltage for Input and Output.

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Page 6

M58MR032C, M58MR032D

VPP Program Supply Voltage (12V). VPP is both

a control input and a po wer supply pin. The two functions are selected by the voltage range applied to the pin; if V (0 to 2V) V

is seen as a control inpu t, and the

is kept in a low voltage range

current absorption is limited to 5µA (0.2µA typical). In this ca se wi th V protection against program or erase; with V V

these functions are enabled (see T able 26).

PP1

value is only sampled during program or

= VIL we obtain an absolute

erase write cycles; a chang e in its v alue after t he

operation has been started does not have any effect and program or erase are carried on regularly. If V

is used in the 11.4V to 12.6V range (V

PPH

then the pin acts as a power supply (see Table

26). This supply voltage must remain stable as long as program or erase are running. In read mode the current sunk is less then 0.5mA, while during program and erase operations the current may increase up to 10mA.

Ground. VSS is the reference for al l the vol t-

age measurements.

)

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Page 7

M58MR032C, M58MR032D

DEVICE OPERATIONS

The following operations can be performed using the appropriate bus cycle s: Address Latch, Read Array (Random, and Page Modes), Write command, Output Disable, Standby, reset/Powerdown and Block Locking. See Table 4.

Address Latch. In asynchronous operation, the address is latched on the rising edge of L

input. In burst mode the address is latched either on the rising edge of L (depending on configuration settings) when L

or on the first rising/falling edge of K

low. Read. Read operations are used to output the

contents of the Memory Array, the Electronic Sig-

Table 4. User Bus Operations

(1)

nature, the Status Register, the CFI, the Block Protection Status, the Read Configuration Register status and the Protection Register.

Read operation of the Memory Array may be performed in asynchronous page mode or synchronous burst mode. In asynchronous page mode data is internally read and stored in a page buffer. The page has a size of 4 words and is addres sed by ADQ0 and ADQ1 address inputs.

According to the device configuration the following Read operations: Electronic Signature - Status Register - CFI - Block Protection Status - Read Configuration Register Status - Protection Register must be accessed as asynchronous read or as single synchronous read (see Figure 4).

Operation E G W L RP WP ADQ15-ADQ0

Address Latch

Write Output Disable Standby

(rising edge)

XX X Reset / Power-down X X X X Block Locking

Note: 1. X = Don’t care.

XX X

X X

Address Input

Data Input

Hi-Z Hi-Z Hi-Z

(3)

(1)

ADQ0

Table 5. Read Electronic Signature (AS and Read CFI instructions)

Code Device E

Manufacturer Code

M58MR032C

G W

ADQ1

Device Code

M58MR032D

Note: 1. Addresses are latch ed on the risin g edge of L i nput.

2. EA means Electronic Signature Address (see Read Electronic Signature)

3. Value during address latch.

Table 6. Read Block Protection (AS and Read CFI instructions)

Block Status E

Protected and unlocked Unprotected and unlocked Protected and locked Unprotected and locked

Note: 1. Addresses are latch ed on the risin g edge of L i nput.

2. A locked block ca n be unprotec ted only with WP

3. Value during address latch.

4. BA means Block Address. Fir st cy cle command address should indicat e the bank of the block address.

(2)

G W

at V

IH.

ADQ1

(3)

(1)

ADQ0

(3)

Address

(3)

IL BA

Other

(2)

Other

Address

(4)

(2)

ADQ15-0

0020h 88DAh 88DBh

ADQ15-0

0001 0000 0003 0002

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Page 8

M58MR032C, M58MR032D

Table 7. Read Protection Register (RSIG and RCFI Instruction)

(1)

Word E G W A20-17 ADQ15-8 ADQ7-0 ADQ15-8 ADQ7-3 ADQ2 ADQ1 ADQ0

Lock

Unique ID 0

Unique ID 1

Unique ID 2

Unique ID 3

OTP 0

OTP 1

OTP 2

OTP 3

Note: 1. Addresses are latch ed on the ri si ng edge of L i nput.

ILVILVIH

2. X = Don’t ca re.

(2)

80h 00h 00000B

Security

prot.data

81h ID data ID data ID data ID data ID data

82h ID data ID data ID data ID data ID data

83h ID data ID data ID data ID data ID data

84h ID data ID data ID data ID data ID data

85h OTP data

86h OTP data

87h OTP data

88h OTP data

OTP data

OTP

data

OTP

data

OTP

data

OTP

data

OTP

prot.data

OTP data

Table 8. Dual Bank Operations

(1, 2, 3)

Commands allowed in the other bank

Status of one

bank

Read

Array

Read

Status

Read

ID/CFI

Program

Erase/

Erase

Resume

Program Suspend

Erase

Suspend

Protect

Unprotect

Idle Yes Yes Yes Yes Yes Yes Yes Yes Reading ––––––––

Programming Yes Yes Yes – – – – Yes Erasing Yes Yes Yes – – – – Yes Program

Suspended Erase

Suspended

Note: 1. For detailed description of command see Table 33 and 34.

2. Ther e i s a status register for each bank; status register indicates bank state, no t P /E . C. status.

3. Command must be written to a n address within the bl ock targeted by that com m and.

Yes Yes Yes – – – – Yes

Yes Yes Yes Yes – Yes – Yes

8/52

Page 9

M58MR032C, M58MR032D

Figure 4. Single Synchronous Read Sequence (RSIG, RCFI, RSR instructions)

A20-A16

ADQ15-ADQ0

VALID ADDRESS

CONF. CODE 2

VALID ADDRESS VALID DATA NOT VALID

CONFIGURATION CODE 3

VALID ADDRESS VALID DATA

CONFIGURATION CODE 4

VALID ADDRESS NOT VALID

Both Chip Enable E and Output Enable G must be at V

in order to read the output of the memory.

Read array is the default state of the device when exiting power down or after power up.

Burst Read. The device also supports a burst read. In this mode a burst sequence is s tarted at the first clock edge (risin g or falling according to configuration settings) after th e falling edge of L After a configurable delay of 2 to 5 clock cycles a new data is output at each clock cycle. The burst sequence may be configured for linear or interleaved order and for a length of 4, 8 words or for continuous burst mode. Wrap and no-wrap modes are also supported.

A WAIT

signal may be asserted to indicate to the system that an output delay will occur. This delay will depend on the starting address of the burst sequence; the worst case dela y will o ccur w hen the sequence is crossing a 64 word boundary and the starting address was at the end of a four word boundary. See the Write Read Configuration Register (CR) Instruction for more details on all the possible settings for the synchronous burst read (see Table 14). It is possible to perform burst read across bank boundary (all banks in read array mode).

Write. Write operations are used to give I nstruction Commands to the memory or to latch Input Data to be programmed. A write operation is initiated when Chip Enable E at V

with Output Enable G at VIH. Addresses are

latched on the rising edge of L put Data are latched on the rising edge of W

and Write Enable W are

. Commands and In-

or E

whichever occurs first. Noise pulses of less than

5ns typical on E

NOT VALID

VALID DATA

, W and G signals do not start a

NOT VALID

write cycle. Write operations are asynchronous and clock is ignored during write.

Dual Bank Operations. The Dual Bank allows to run different operations simultaneously i n the tw o banks. It is possible to read array data from one bank while the other is programming, erasing or reading any data (CFI, status register or electronic

signature). Read and write cycles can be initiated for simulta-

neous operations in different banks without any delay. Only one b ank at a time is all owed to be in program or erase mode, while the other must be in one of the read modes (see Table 8).

Commands must be writt en to an address within the block targeted by that command.

Output Disa bl e . The data outputs are high impedance when the Output Enable G

Write Enable W

at VIH.

is at VIH with

Standby. The mem ory is in standby when C hip Enable E

is at VIH and the P/E.C. is idle. The power consumption is reduced to the standby level and the outputs are high impedance, independent of the Output Enable G

or Write Enable W inputs.

Automatic Standby. When in Read mode, after 150ns of bus inactivity and when CMOS levels are driving the addresses, the chip automatically enters a pseudo-standby mode where consumption is reduced to the CMOS standby value, while outputs still drive the bus. The automatic standby feature is not available when the device is configured for synchronous burst mode.

AI90022

9/52

Page 10

M58MR032C, M58MR032D

Table 9. Identifier Codes

Code Address (h) Data (h)

Manufacturer Code Bank Address + 00 0020

Device Code

Block Protection

Die Revision Code Bank Address + 03 Read Configuration Register Bank Address + 05 Lock Protection Register Bank Address + 80

Protection Register

Note: 1. DRC means Die Revisio n Co de.

CR means Read Configuration Register. LPR means Lock Protection Register. PR means Uni q ue Device Number and User Progra mmable OTP.

Reset/Power-down. The memory is in Powerdown when the Read Configuration Register is set for Power-down and RP sumption is reduced to the Power-down level, and Outputs are in high impedance, independent of the Chip Enable E W

inputs. The memory is in reset when the Read

, Output Enabl e G or Write Enab le

Configuration Register is set for Reset and RP at VIL

. The power consumption is the same of the standby and the outputs are in hig h impedance. After a Reset/Power down t he device defaults to

Top Bank Address + 01 88DA Bottom Bank Address + 01 88DB Protected and Unlocked Unprotected and Unlocked 0000 Protected and Locked 0003 Unprotected and Locked 0002

Bank Address + 02

Bank Address + 81 Bank Address + 88

Block Locking. Any combination of blocks can be temporarily protected against Program or

is at VIL. The power con-

Erase by setting the lock register and pulling WP to VIL. The following summarizes the locking operation. All blocks are protected on power-up. They can then be unprotected or protected with the Unprotect and Protect commands. The Lock com-

mand protects a b lock and prev ents it from being unlocked when WP overridden. Lock is cleared only when the dev ice

is reset or powered-down (see Protect instruction). read array mode, the status register is set to 80h and the read configuration register defaults to asynchronous read.

0001

(1)

DRC

(1)

LPR

(1)

= 0. When WP = 1, Lock is

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Page 11

M58MR032C, M58MR032D

INSTRUCTIONS AND COMMANDS

Eighteen instructions are available (see Tables 10 and 11) to perform Read Memory Array, Read Status Register, Read Electronic Signature, CFI Query, Block Erase, Bank Erase, Program, Tetra Word Program, Double Word Program, Clear Status Register, Program/Erase Suspend, Program/ Erase Resume, Block Protect, Block Unprotect, Block Lock, Protection Register Program, Read Configuration Register and Lock Protection Program.

Status Register ou tput may be read at any time, during programming or erase, to monitor the progress of the operation.

An internal Command Interface (C.I.) decodes the instructions while an internal Program/Erase Controller (P/E.C.) handles all timing and verifies the correct execution of the Program and Erase instructions. P/E.C. provides a Status Register whose bits indicate operation and exit status of the internal algorithms. The Command Interface is reset to Read Array when power is first applied, when exiting from Reset or whenever V than V

. Command sequence must be followed

LKO

is lowe r

exactly. Any invalid combination of commands will reset the device to Read Array.

Read (RD)

The Read instruction consists of o ne write cycle (refer to Device Operations section) and places the addressed bank in Read Array mode. When a device reset occurs, the memo ry is in Read Array as default. A read array command will be ignored while a bank is programming or erasing. However in the other bank a read array command will be accepted.

Read Status Register (RSR)

A bank’s Status Register indicates when a program or erase operation is complete and the success or failure of operation itself. Issue a Read Status Register Instruction (70h) to read the Status Register content of t he addressed bank. The status of the other bank is not affected by the command. The Read S tatus Register instruction may be issued at any time, also when a Program/Erase operation is ongoing. T he following Read operations output the content of the Status Register of the addressed bank. The Status Register is latched on th e fa lling edg e of E can be read until E

must be toggled to update the latched data.

or G returns to VIH. Either E or

or G signals, and

Read Electronic Signature (RSIG)

The Read Electronic Signature instruction consists of one write cycle (refer to Device Operations section) giving the com mand 90h to an address

Table 10. Commands

Hex Code Command

00h Invalid Reset 01h Protect Confirm

03h

10h Alterna tive Program Set-up 20h Block Erase Set-up 2Fh Lock Confirm 30h Double Word Program Set-up 40h Program Set-up 50h Clear Status Register 55h Tetra Word Program Set-up

60h

70h Read Status Register 80h Bank Erase Set-up 90h Read Electronic Signature 98h CFI Query

B0h Program/Erase Suspend

C0h

D0h

FFh Read Array

Write Read Configuration Register Confirm

Protect Set-up and Write Read Configuration Register

Protection Program and Lock Protection Program

Program/Erase Resume, Erase Confirm or Unprotect Confirm

within the bank A. A subsequent read in the ad-

dress of bank A will output the Manufacturer Code,

the Device Code, the protection Status of Blocks

of bank A, the Die Revision Code, the Protect ion

Table 9).

If the first write cycle of Read Electronic Signature

instruction is issued to an address within the bank

B, a subsequent read in an address of bank B will

output the protection Status of Blocks of bank B.

The status of the other bank is not affected by the

command (see Table 8).

See Tables 5, 6, 7 and 8 for the valid address. The

Electronic Signature can be read from the memory

allowing programming equipment or applications

to automatically match their interface to the char-

acteristics of M58MR032C and M58MR032D.

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Page 12

M58MR032C, M58MR032D

Table 11. Instructions

Instruction Cyc. Ope ration

Read

Memory

1+ Write BKA FFh

Array

RSR

Read Status Register

1+ Write BKA 70h

Read

READ

RSIG

Electronic

1+ Write EA 90h

Signature

RCFI Read CFI 1+ Write CA 98h

CLRS

(5)

1 Write BKA 50h

Clear Status

EE Block Erase 2 Write BA 20h Write BA D0h BE Bank Erase 2 Write BKA 80h Write BKA D0h PG Program 2 Write WA 40h or 10h Write WA WD

DPG

TPG

Double Word Program

Tetra Word Program

3 Write WA1 30h Write WA1 WD1

5 Write WA1 55h Write WA1 WD1

Address

(1,2)

Data

(3)

(1)

Address

(1,2)

Read

Address

BKA

EA ED

CA CD

Operation

Read

Write WA2 WD2

(3)

Data

Status

Write WA3 WD3

PROGRAM/ERASE

Write WA4 WD4

Program

PES

Erase

1 Write BKA B0h

Suspend Program

PER

Erase

1 Write BKA D0h

Resume

BP Block Protect 2 Write BA 60h Write BA 01h

Block

Unprotect

PROTECT

BL Block Lock 2 Write BA 60h Write BA 2Fh

2 Write BA 60h Write BA D0h

Protection

PRP

2 Write PA C0h Write PA PD

Program Lock

LPRP

Protection Register

2 Write LPA C0h Write LPA LPD

Program

Write Read Configuration

2 Write RCA 60h Write RCA 03h

CONFIGURATION

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M58MR032C, M58MR032D

Note: 1. First cycle command address should be the same as the operation’s target address. The first cycle of the RD, RSR, RSIG or RCFI

CFI Query (RCFI)

The CFI Query Mode is associated to bank A. The address of the first write cycle must be within the bank A. The status of the other bank is not affected by the command (see Table 8). Writing 98h the device enters the Common Flash Interface Query mode. Next read operations in the bank A will read the CFI data. Write a read instruction to return to Read mode (refer to the Common Flash Interface section).

Clear Status Register (CLSR)

The Clear Status Register uses a single write operation, which resets bits b1, b3, b4 e b5 of the status register. The Clear Status Register is executed writing the command 50h independently of the applied V the device returns to read array mode. The Clear Status Register command clears only the status register of the addressed bank.

Block Erase (EE)

Block erasure sets all the bits within the selected block to ’1’. One block at a time can be erased. It is not necessary to pre-program the block as the P/E.C. will do it automatically before erasing. This instruction use two writes cycles. The first command written is the Block Era se S et up c om m and 20h. The second command is the Erase Confirm command D0h. An address within the block to be erased should be given to the memory during t he two cycles command. If the second command given is not an erase con firm, the status register bits b4 and b5 are set and the instruction aborts.

instruction is followed by read operations in the bank array or special register. Any number of read cycles can occur after one command cycle.

2. BKA m eans Address within the bank; BA means Block Address; EA means Elec tronic Signature Address; CA means C om m on Flash Interface Address; WA means Wo rd Address; PA means Pr otection Register Ad dress (see Ta bl e 7); LPA means Loc k Protection Register Address (see Table 7); RCA means Read Configuration Register Ad dress.

3. PD means Protect i on Data; CD means Common Flash Interface Data; ED means Electronic Si gnature Data; WD means Data to be prog rammed at t he address loc a t i on WA; LPD means Lock protection Register Da ta

4. WA1, WA2, WA3 and WA 4 m ust be consecutive add ress differi ng only for address bits A1- A0.

5. Read cycle after e CLSR instruction will output the memory array.

After writing the command, the device outputs status register data when any address within the bank is read. At the end of the operation the bank will remain in read status register until a read array command is written.

Status Register bit b7 is ’0’ while the erasure is in progress and ’1’ when it has completed. After completion the Status Register bit b5 returns ’1’ if there has been an Erase Failure. Status register b it b1 returns ’1’ if the user is attempting t o e rase a protected block. Status Register bit b3 returns a ’1’ if

is below V

. As data integrity cannot be guaranteed when

. Erase aborts if RP turns to

PPLK

the erase operation is aborte d, the eras e m ust be repeated (see Table 1 2). A Clear Status Register

voltage. After executing this comm and

instruction must be issued t o reset b1, b3, b4 and b5 of the Status Register. During the execution of the erase by the P/E.C., the bank with the block in erase accepts only the RS R (Read St atus Register) and PES (Program/Erase Suspend) instructions. See figure 19 for Erase Flowchart and Pseudo Code.

Bank Erase (BE)

Bank erase sets all the bits within the selected

bank to ’1’. It is not necessary to pre-program the block as the P/E.C. will do it automatically before erasing.

This instruction uses two writes cycles. The first command written is the Bank Erase set-up command 80h. The second command is the Erase Confirm command D0h. An address within the bank to be erased should be given to the memory during the two cycles command. See the Block Erase command section for status register bit details .

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M58MR032C, M58MR032D

Table 12. Status Register Bits

Mnemonic Bit Name

P/ECS 7 P/ECS

Status

ESS 6 Erase

Suspend Status

Logic

Level

1 Ready Indicates the P/E.C. status, check during

0 Busy

1 Suspended

Definition Note

Program or Erase, and on completion before checking bits b4 or b5 for Program or Erase Success.

On an Erase Suspend instruction P/ECS and

In Progress or Completed

ESS bits are set to ’1’. ESS bit remains ’1’ until an Erase Resume instruction is given.

ES 5 Erase

PS 4 Program

VPPS 3 V

PSS 2 Program

BPS 1 Block

0 Reserved

Note: Logic level ’1’ is VIH and ’0’ is VIL.

Status

Suspend Status

Protection Status

1 Erase Error ES bit is set to ’1’ if P/E.C. has applied the 0 Erase Success 1 Program Error

Program

Success VPP Invalid,

Abort V

0 1 Suspended

In Progress or

Completed Program/Erase

on protected Block, Abort

No operation to

protected blocks

Program (PG)

The Program instruction programs the array on a word-by-word basis. The first command must be given to the target block and only one partition can be programmed at a time; the other partition must be in one of the read m odes or in the erase sus pended mode (see Table 8).

This instruction uses two write cycles. The first command written is the Program Set-up command 40h (or 10h). A second write operation latches the Address and the Dat a to be writte n a nd starts the P/E.C.

Read operations in the t argeted bank output the Status Register content after the programming has started.

The Status Register bit b7 returns ’ 0’ while the programming is in progress and ’1’ when it has completed. After completion the Status register bit b4 returns ’1’ if there has been a Program Failure (see

maximum number of erase pulses to the block without achieving an erase verify.

PS bit set to ’1’ if the P/E.C. has failed to program a word.

VPPS bit is set if the VPP voltage is below V

when a Program or Erase instruction is

PPLK

executed. V of the erase/program operation.

On a program Suspend instruction P/ECS and PSS bits are set to ’1’. PSS remains ’1’ until a Program Resume Instruction is given.

BPS bit is set to ’1’ if a Program or Erase operation has been attempted on a protected block.

is sampled only at the beginning

Table 12). Status register bit b1 returns ’1’ if the user is attempting to p rogram a protected block. Status Register bit b3 returns a ’1’ if V V

. Any attempt to write a ’1’ to an already pro-

PPLK

grammed bit will result in a program fail (status register bit b4 set) if V nored if V

= V

PP1

Programming aborts if RP

= V

goes to VIL. As data in-

and will be ig-

PPH

tegrity cannot be guaranteed when the program operation is aborted, the block containing the memory location must be erased and reprogrammed. A Clear Status Register instruction must be issued to reset b5, b4, b3 and b1 of the Status Register.

During the execution of the program by the P/E.C., the bank in prog ra mming accepts only the RSR (Read Status Register) and PES (Program/Erase Suspend) instructions. See Figure 16 for Program Flowchart and Pseudo Code.

is below

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Page 15

Figure 5. Security Block Memory Map

Parameter Block # 0

88h

85h 84h

81h 80h

M58MR032C, M58MR032D

User Programmable OTP

Unique device number

Protection Register Lock 2 1 0

AI90023

Table 13. Protection States

(2)

Current State

(WP, DQ1, DQ0)

Program/Erase

Allowed

(1)

Next State After Event

(3)

Protect Unprotect Lo ck WP transition

100 Yes 10 1 100 111 000 101 No 101 100 111 001 110 Yes 11 1 110 111 011 111 No 111 110 111 011 000 Yes 00 1 000 011 100 001 No 001 000 011 101

011 No 011 011 011

Note: 1. All blo cks are protected at power-up, so the default configuration i s 001 or 101 acc ording to WP status.

2. Current state and Next st at e gives the protection status of a block. Th e protecti on status is def i ned by the wr ite protec t i n and by DQ1 (= 1 for a locked block) and DQ0 (= 1 for a protected block) as read in the Read Electronic Signature instruction with A1 = V and A0 = VIL.

3. Next state is the protection status of a block after a Protect or Unprotect or Lock command has been issued or after WP its logic value.

4. A WP

transition to VIH on a locked block will restore the previous DQ0 value, giving a 111 or 110.

111 or 110

(4)

has changed

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M58MR032C, M58MR032D

Doubl e Word Program (DP G)

This feature is offered to improve the programming throughput, writing a page of two adjacent words in parallel. The first command must be given to the target block and only one partition can be programmed at a time ; the other p artition must be in one of the read modes or in the erase suspended mode (see Table 8).

The two words must differ only for the address A0. Programming should not be attempted when V is not at V if V

is below V

. The operation can also be executed

PPH

but result could be uncertain.

PPH

These instructi on uses three write cycles. The first command written is the Double Word Program Set-Up command 30h. A second write operation latches the Address and the Data of the first word to be written, the third write operation latches the Address and the Data of the second word to be written and starts the P/E.C. (see Table 11).

Read operations in the t argeted bank output the Status Register content after the programming has started. The Status Register bit b7 ret urns ’0’ while the programming is in progress and ’1’ when it has completed. After compl etion the S tatus register bit b4 returns ’1’ if there has been a Program Failure. Status register bit b1 returns ’1’ if the user is attempting to program a protected block. Status Register bit b3 returns a ’1’ if V

is below V

PPLK

Any attempt to write a ’1’ to an already programmed bit will result in a program fail (status register bit b4 set). (See Table 12).

Programming aborts if RP

goes to VIL. As data integrity cannot be guaranteed when the program operation is aborted, the memory location must be erased and reprogrammed. A Clear Status Register instruction must be issued to reset b5, b4, b3 and b1 of the Status Register. During the execution of the program by the P/E.C., the bank in programming accepts only the RSR (Read Status Register) instruction. See Figure 17 for Double Word Program Flowchart and Pseudo code.

Tetra Word Program (TPG)

This feature is offered to improve the programming throughput, writing a page of four adjacent words in parallel. The first command must be given to the target block and only one partition can be programmed at a time ; the other p artition must be in one of the read modes or in the erase suspended mode (see Table 8).

The four words must differ only for the addresses A0 and A1. Programming should not be attempted when V

is not at V

be executed if V

. The operation can also

PPH

is below V

but result could

PPH

be uncertain. These instruction uses five write cycles. The first comman d wri tten is t he Tetra Word Program Set-Up command 55h. A second write operation latches the Address and the Data of the first word to be written, the third write operation

latches the Address an d the Data of the second word to be written, the fourth write operation latches the Address and the Data of the third word to be written, the fifth write operation latches the Address and the Data of the fourth word to be written and starts the P/E.C. (see Table 11).

Read operations in the t argeted bank output the Status Register content after the programming has started. The Status Register bit b7 returns '0' while the programming is in progress and '1' when it has completed. After compl etion the S tatus register bit b4 returns '1' if there has been a Program Failure. Status register bit b1 returns '1' if the user is attempting to program a protected block. Status Register bit b3 returns a '1' if V

is below V

Any attempt to write a ’1’ to an already programmed bit will result in a program fail (status register bit b4 set). (See Table 12).

Programming aborts if RP

Erase Suspend/Resume (PES/PER)

The Erase Suspend freezes , af t er a ce rtain latency period (within 25us), the erase operation and allows read in another block within the targeted bank or program in the other block.

This instruction uses one write cycle B0h and the address should be within the bank with the block in erase (see Table 11). The device continues to output status register data after the erase suspend is issued. The status register bi t b7 and bi t b 6 are set to ’1’ then the erase op eration has been sus pended. Bit b6 is set to '0' in case the erase is completed or in progress (see Table 12).

The valid commands while erase is suspended are: Program/Erase Resume, Program, Read Memory Array, Read St atus Regi ster, Read E lectronic Signature, CFI Query, Bloc k Protect, Block Unprotect and Block Lock. The user can protect the Block being erased issuing the B lock Protect or Block Lock commands.

During a block erase suspend, the device goes into standby mode by taking E

to VIH, which reduces active current draw. Erase is aborted if RP to V

If an Erase Suspend instruction was previously executed, the erase operation may be res umed by issuing the command D0h using an address within the suspended bank. The status register bit b6 and bit b7 are cleared when erase resumes an d read

PPLK

turns

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M58MR032C, M58MR032D

operations output the status register after the erase is resumed. Block erase cannot resume until program operations initiated during block erase suspend have completed. It is also possible to nest suspends as follows: suspend erase in the first partition, start programming in t he second or in the same partition, suspend program ming and then read from the second or the same pa rtition. The suggested flowchart for erase suspend/resume features of the memory is shown from Figure 20.

Program Suspe nd /Re s ume ( PES/PER)

Program suspend is accepted only during the Program instruction execution. When a Program Suspend command is writt en to the C.I., the P/E.C. freezes the Program operation.

Program Resume (PER) continues the Program operation. Program Suspend (PES) consists of writing the command B0h and the address should be within the bank with the w ord in programming (see Table 11).

The Status Register bit b2 is set to '1' (within 5µs) when the program has been suspend ed. Bit b2 is set to '0' in case the program is com pleted or in progress (see Table 12).

The valid commands while program is suspen ded are: Program/Erase Resume, Rea d Array, Read Status Register, Read Electronic Signature, CFI Query. During program suspend mode, the device goes in standby mode by taking E

to VIH. This reduces active current consumption. Program is aborted if RP

turns to VIL.

If a Program Suspend instruction was previously executed, the Program operation may be resumed by issuing the command D0h using an address within the suspended bank (see Table 11). The

status register bit b2 and bit b7 are cleared when program resumes and read operations out put the status register after the erase is resumed (see Table 12). The suggested flowchart for program suspend/resume features of the memory is shown from Figure 18.

Block Protect (BP)

The BP instruction use two write cycles. The f irst command written is the protection set-up 60h. The second command is block Protect comm and 01h, written to an address within the block to be protected (see Table 11). If the sec ond command is not recognized by the C.I the bit 4 and bit 5 of the status register will be set to indicate a wrong sequence of commands (see Table 12). To read the status register write the RSR command.

Block Unprotect (BU)

The instr uction use t wo write cycl es. The fi rst c ommand written is the protection set-up 60h. The second command is block Unprotect command D0h, written to an address within the block to be protected (see Table 11). If the sec ond command is not recognized by the C.I the bit 4 and bit 5 of the status register will be set to indicate a wrong sequence of commands (see Table 12). To read the status register write the RSR command.

Block Lock (BL)

The instr uction use t wo write cycl es. The fi rst c ommand written is the protection set-up 60h. The second command is block Lock command 2Fh, written to an address within the block to be protected (see Table 11). If the second com mand is not recognized by the C.I the bit 4 and bit 5 of the status register will be set to indicate a wrong sequence of commands. To read the status register write the RSR command (see Table 12).

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M58MR032C, M58MR032D

BLOCK PROTECTION

The M58MR032C/M58MR032 D provide a flexible protection of all the memory providing t he protection, un-protection and locking of any blocks. All blocks are protected at power-up. Each block of the array has two levels of protec t ion a gainst programming or erasing o peration. The first level is set by the Block Protect instruction; a protected block cannot be programmed or erased until a Block Unprotect instruction is g iven for t hat bl oc k. A second level of protection is set by the Block Lock instruction, and requires the use of the WP pin, according to the following scheme:

– when WP

is at VIH, the Lock status is overridden

and all blocks can be protected or unprotected;

– when WP

is at VIL, Lock status is enabled; the locked blocks are protected, regardless of their previous protect state, and protection status cannot be changed. Bloc ks that are not locked can still change their protection status;

– the lock status is cleared for all blocks at power

up.

The protection and lock status can be monitored for each block using the Read Electronic Signature (RSIG) instruction. Protected blocks will output a '1' on DQ0 and locke d blocks will output a '1 ' in DQ1 (see Table 13).

PROTECTION REGISTER PROGRAM (PRP) and LO C K PROTEC TION REGISTE R PROGRAM (LPRP)

The M58MR032C/M58MR032D features a 128-bit protection register and a security Block in order t o increase the prote ction of a system design. The Protection Register is divided in two 64-bit segments. The first segm ent (81h to 84h) is a unique device number, while the second one (85h to 88h) can be program med by the user. When shipped the user programmable segment is read at '1'. It can be only programmed at '0'.

The user programmable segment c an be prot ected writing the bit 1 of the Protection Lock regi ster (80h). The bit 1 protects al so the bi t 2 of the P rotection Lock Register.

The M58MR032C/M58MR032D feature a security Block. The security Block is located at 1FF0001FFFFF (M58MR032C) or at 000000-000FFF (M58MR032D) of the device. This block can be permanently protected by the user programming the bit 2 of the Protection Lock Register (see F igure 5).

The protection Register and the Protection Lock Register can be read using the RSIG and RCFI instructions. A subsequent read in the address starting from 80h to 88h, the user will retrieve respectively the Protection Lock register, the unique device number segment and the OTP user programmable register segment (see Table 23).

WRITE READ CONFIGURATION REGISTER (CR).

This instruction uses two Coded Cycles, the first write cycle is the write Read Configuration Register set-up 60h, the second write cycle is write Read Configuration Register confirm 0 3h both to Read Configuration Register address (see Table

11). This instruction writes the contents of address bits

ADQ15-ADQ0 to bits CR15-CR0 of the Read Configuration Register (A20-A16 are don't care). At Power-up the Read Configuration Regi ster is set to asynchronous Read mode, Power-down disabled and bus invert (power save function) disabled. A description of the effects of each configuration bit is given in Table 14.

Read mode (CR15). The device supports an asynchronous page mode and a synchronous burst mode. In asynchronous page mode, the default at power-up, data is internally read and stored in a buffer of 4 words selected by ADQ0 and ADQ1 address inputs. In synchronous burst mode, the device latches the starting address and t hen outputs a sequence of data that depends on the Read Configuration Register settings (see Figures 10, 11 and 12).

Synchronous burst mode is supported in b oth parameter and main blocks; it is also possible to perform burst mode read across the banks.

Bus Invert configuration (CR14). This register bit is used to enable the BINV pin functionality. BINV functionality depends upon configuration bits CR14 and CR15 (see Table 14 for configuration bits definition) as shown in Table 15. As output pin BINV is active only when enabled (CR14 = 1) in Read Array burst mode (CR15 = 0). As input pin BINV is active only when enabled (CR14 = 1). BINV is ignored when ADQ0-ADQ15 lines are used as address inputs (addresses must not be inverted).

X-Latency (CR13-CR11). These configuration bits define the number of clock cycles elapsing

going low to valid data available in b urst

from L mode (see Figure 6). The correspondence between X-Latency set tings and the maximum sus tainable frequency mus t be calculated taking into account some system parameters.

Two conditions must be satisfied: –(n + 2) t

> t

–t

KQV

≥ t

ACC + tQVK_CPU

+ t

QVK_CPU

+ t

AVK_CPU

where "n" i s the chosen X-Lat ency configuration code, t

is the clock period, t

AVK_CPU

is the address setup time guaranteed by the system CPU, and t

QVK_CPU

is the data setup time required by

the system CPU.

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M58MR032C, M58MR032D

Table 14. Read Configuration Register (AS and Read CFI instructions)

Configuration Regis ter Function

Read mode

CR15

CR14

CR13-CR11

CR10

CR9 Reserved

CR8

CR7

CR6

CR5-CR4 Reserved

CR3

CR2-CR0

Note: 1. The R CR can be read v i a the RSIG com mand (90h). Bank A Address + 05h con tains the RCR data. See Tab l e 9.

2. All the bi ts in the RCR are set to default on device power-up or reset.

0 = Synchronous Burst mode read 1 = Asynchronous Page mode read (default)

Bus Invert configuration (power save) 0 = disabled (default) 1 = enabled

X-Latency 010 = 2 clock latency 011 = 3 clock latency 100 = 4 clock latency 101 = 5 clock latency 111 = reserved Other configurations reserved

Power-down configuration 0 = power-down disabled (default) 1 = power-down enabled

Wait configuration 0 = WAIT 1 = WAIT

Burst order configuration 0 = Interleaved 1 = Linear (default)

Clock configuration 0 = Address latched and data output on the falling clock edge 1 = Address latched and data output on the rising clock edge (default)

Burst Wrap 0 = burst wrap within burst length set by CR2-CR0

1 = Don’t wrap accesses within burst length set by CR2-CR0 (default) Burst length

001 = 4 word burst length 010 = 8 word burst length 111 = Continuous burst mode (requires CR7 = 1)

is active during wait state is active one data cycle before wait state (default)

(1)

Table 15. BINV Configuration Bits

BINV

CR15 CR14

IN OUT

00X0 0 1 Active Active 10X0 1 1 Active 0

19/52

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M58MR032C, M58MR032D

Power-down configura tion (CR10). Th e RP pin

may be configured to give very low power consumption when driven low (pow er-down state). In power-down the I typical figure of I (default at power-up) the RP

supply current is reduced to a

; if this function is disabled

CC2

pin causes only a reset of the device and the supply current is the stand-by value. The recovery time after a RP

pulse is significantly longer when power-down is enabled (see Table 31).

Wait configuration (CR8). In burst mode WAIT indicates whether the data on the output bus are valid or a wait state must be inserted. The configuration bit determines if WAIT will be asserted one clock cycle before the wait state or during the wait state (see Figure 7). WAIT

is asserted during a continuous burst and also during a 4 or 8 burst length if no-wrap configuration is selected.

Burst order configuration (CR7) and Burst Wrap configuration (CR3). See Table 16 for

burst order and length.

Figure 6. X-L at ency Configu ra tion Sequence

Clock configuration (CR6). In burst mode deter-

mines if address is latc hed and data is out put on the rising or falling edge of the clock.

Burst length (CR2-CR0). In burst mode determines the number of words output by the memory. It is possible to have 4 words, 8 words or a continuous burst mode, in which all the words are read sequentially. In continuous burst mode the burst sequence can cross the end of each of the two banks (all banks in read array mode). In continuous burst mode or in 4, 8 words no-wrap it may happen that the mem ory will stop the data ou tput flow for a few clock cycles; this event is signaled by

going low until the output flow is resumed.

WAIT The initial address dete rmines if the outpu t delay will occur as w ell a s its du r ati o n. If the s tar t in g a ddress is aligned to a four words boundary no wait states will be needed. If the starting address is shifted by 1,2 or 3 positions from the four word boundary, WAIT

will be asserted for 1, 2 or 3 clock cycles when the burst sequence is crossing the first 64 word boundary. WAIT

will be asserted only once during a cont inuous burst access. S ee also Table 16.

A20-A16

ADQ15-ADQ0

VALID ADDRESS

CONF. CODE 2

VALID ADDRESS VALID DATA VALID DATA

CONFIGURATION CODE 3

VALID ADDRESS VALID DATA

CONFIGURATION CODE 4

VALID ADDRESS VALID DATA

VALID DATA

AI90024

20/52

Page 21

Figure 7. Wai t Co nf i gu ra tio n Sequence

M58MR032C, M58MR032D

A20-A16

ADQ15-ADQ0

WAIT CR8 = '0'

WAIT CR8 = '1'

VALID ADDRESS

VALID DATA

VALID DATA NOT VALID VALID DATA

AI90025

21/52

Page 22

22/52

Table 16. Burst Order and Length Configuration

Starting

Mode

Address 4 Words 8 Words

Linear Interleaved Linear Interleaved

0 0-1-2-3 0-1-2-3 0-1-2-3-4-5-6-7 0-1-2-3-4-5-6-7 0-1-2-3-4-5-6... 1 1-2-3-0 1-0-3-2 1-2-3-4-5-6-7-0 1-0-3-2-5-4-7-6 1-2-3-4-5-6-7... 2 2-3-0-1 2-3-0-1 2-3-4-5-6-7-0-1 2-3-0-1-6-7-4-5 2-3-4-5-6-7-8... 3 3-0-1-2 3-2-1-0 3-4-5-6-7-0-1-2 3-2-1-0-7-6-5-4 3-4-5-6-7-8-9...

...

Wrap

7 7-4-5-6 7-6-5-4 7-0-1-2-3-4-5-6 7-6-5-4-3-2-1-0 7-8-9-10-11-12-13...

... 60 60-61-62-63-64-65-66... 61 61-62-63-WAIT-64-65-66... 62 62-63-WAIT-WAIT-64-65-66... 63 63-WAIT-WAIT-WAIT-64-65-66...

Linear Interleaved Linear Interleaved

0 0-1-2-3 0-1-2-3-4-5-6-7 0-1-2-3-4-5-6... 1 1-2-3-4 1-2-3-4-5-6-7-8 1-2-3-4-5-6-7...

M58MR032C, M58MR032D

Continuous Burst

2 2-3-4-5 2-3-4-5-6-7-8-9... 2-3-4-5-6-7-8... 3 3-4-5-6 3-4-5-6-7-8-9-10 3-4-5-6-7-8-9...

...

7 7-8-9-10 7-8-9-10-11-12-13-14 7-8-9-10-11-12-13...

No-wrap

... 60 60-61-62-63 60-61-62-63-64-65-66-67 60-61-62-63-64-65-66... 61 61-62-63-WAIT-64 61-62-63-WAIT-64-65-66-67-68 61-62-63-WAIT-64-65-66... 62 62-63-WAIT-WAIT-64-65 62-63-WAIT-WAIT-64-65-66-67-68-69 62-63-WAIT-WAIT-64-65-66... 63 63-WAIT-WAIT-WAIT-64-65-66 63-WAIT-WAIT-WAIT-64-65-66-67-68-69-70 63-WAIT-WAIT-WAIT-64-65-66...

Page 23

M58MR032C, M58MR032D

POWER CONSUMPTION Power-down

The memory pro vides Reset/Power-down control input RP

. The Power-down func tion can be activated only if the relevant Read Configuration Register bit is set to ’1’. In this case, when the RP signal is pulled at VSS the supply current drops to typically I

(see Table 26), the memory is dese-

CC2

lected and the outputs are in high impedance. If

is pulled to VSS during a Program or Erase op-

RP eration, this operation is aborted and the memory content is no longer valid (see Reset/Power-down input description).

Power-up

The memory Command Interface is reset on Power-up to Read Array. Either E V

during Power-up to allow maximum security

or W must be tied to

and the possibility to write a command on the first rising edge of W

. At Power-up the device is config-

ured as:

– Page mode: (CR15 = 1) – Power-down disabled: (CR10 = 0) – BINV disabled: (CR14 = 0). All blocks are protecte d and unlocked.

, V

and VPP are independent po wer sup-

DDQ

plies and can be biased in any order.

Supply Rails

Normal precautions must be taken for supply voltage decoupling; each device in a system should have the V itor close to the V

rails decoupled with a 0.1µF capac-

, V

and VSS pins. The PCB

DDQ

trace widths should be sufficient to carry the required V

program and erase currents.

23/52

Page 24

M58MR032C, M58MR032D

COMMON FLASH INTERFACE (CFI)

The Comm on Fl ash In ter fac e (C FI) spec if i cati on i s a JEDEC approved, standardized data structure that can be read from the Flash memory device. CFI allows a syste m software to query the flash device to determine various electrical a nd timing parameters, density information and functions supported by the device. CFI allows the system to easily interface to the Flash memory, to learn about its features and parameters, enabling the software to configure itself when necessary.

Tables 17, 18, 19, 20, 21, 22 and 23 show the address used to retrieve each data. The CFI data structure gives information on the device, such as the sectorization, the command set and some electrical specifications. The CFI data structure contains also a se curity area; in this section, a 64 bit unique security number is written, starting at address 81h. This area can be accessed only in read mode and there are no ways of changing the code after it has been written by ST. Write a read instruction to return to Read mode (see Table 11). Refer to the CFI Query instruction to understand how the M58MR032 enters the CFI Query mode.

Table 17. Query Structure Overvi ew

Offset Sub-section Name Description

00h Reserved Reserved for algorithm-specific information 10h CFI Query Identification String Command set ID and algorithm data offset

1Bh System Interface Information Device timing & voltage information

27h Device Geometry Definition Flash device layout

P Primary Algorithm-specific Extended Query table

A Alternate Algorithm-specific Extended Query table

80h Security Code Area

Note: T he Flash memor y display the CFI data structure when CFI Query comman d i s issued. In this table are listed the m ai n sub-se ctions

detailed in Ta bl es 18, 19, 20, 21, 22 and 23. Query data are al ways prese nted on the low est order data outputs.

Additional information specific to the Primary Algorithm (optional)

Additional information specific to the Alternate Algorithm (optional)

Lock Protection Register Unique device Number and User Programmable OTP

Table 18. CFI Query Identification String

Offset Sub-section Name Description Value

00h 0020h Manufacturer Code ST 01h 02h reserved Reserved

03h

04h-0Fh reserved Reserved

10h 0051h 11h 0052h "R" 12h 0059h "Y" 13h 0002h 14h 0000h 15h offset = P = 0039h 16h 0000h 17h 0000h Alternate Vendor Command Set and Control Interface ID Code

18h 0000h 19h value = A = 0000h

1Ah 0000h

Note: Query data are always present ed on the lowe st - order data outputs (AD Q0-ADQ7) only. ADQ8- A DQ15 are ‘0’.

1. DRC means Die Revision Code.

88DAh 88DBh

DRC

(1)

Device Code

Die Revision Code

Query Unique ASCII String "QRY"

Primary Algorithm Command Set and Control Interface ID code 16 bit ID code defining a specific algorithm

Address for Primary Algorithm extended Query table (see Table 20) p = 39h

second vendor - specified algorithm supported (note: 0000h means none exists)

Address for Alternate Algorithm extended Query table (0000h means none exists)

Top

Bottom

"Q"

24/52

Page 25

M58MR032C, M58MR032D

Table 19. CFI Query System Interface Information

Offset D ata Description Value

Logic Supply Minimum Program/Erase or Write voltage

1Bh 0017h

1Ch 0020h

1Dh 0017h

1Eh 00C0h

1Fh 0004h

20h 0004h 21h 000Ah 22h 0000h 23h 0004h 24h 0004h 25h 0 004h 26h 0000h

bit 7 to 4 BCD value in volts bit 3 to 0 BCD value in 100 millivolts

Logic Supply Maximum Program/Erase or Write voltage

bit 7 to 4 BCD value in volts bit 3 to 0 BCD value in 100 millivolts

[Programming] Supply Minimum Program/Erase voltage

bit 7 to 4 HEX value in volts bit 3 to 0 BCD value in 100 millivolts

[Programming] Supply Maximum Program/Erase voltage

bit 7 to 4 HEX value in volts bit 3 to 0 BCD value in 100 millivolts

µs

times typical

Typical timeout per single byte/word program = 2

Typical timeout for tetra word program = 2 Typical timeout per individual block erase = 2 Typical timeout for full chip erase = 2 Maximum timeout for word program = 2 Maximum timeout for tetra word = 2

times typical

times typical Maximum timeout per individual block erase = 2 Maximum timeout for chip erase = 2

times typical

1.7V

12V

16µs 16µs

NA 512µs 512µs

16s

25/52

Page 26

M58MR032C, M58MR032D

Table 20. Device Geometry Definition

Offset Word

Mode

27h 0016h 28h

29h

2Ah 2Bh

2Ch 0003h Number of Erase Block Regions within the device

2Dh 2Eh

2Fh

30h 31h

32h 33h

34h

M58MR032C

35h 36h

37h 38h

2Dh 2Eh

2Fh

30h 31h

32h 33h

34h

M58MR032D

35h 36h

37h 38h

Data Description V alue

in number of bytes

0001h 0000h

0003h 0000h

002Fh 0000h

0000h 0001h

000Eh 0000h

0000h 0001h

0007h 0000h

0020h 0000h

0007h 0000h

0020h 0000h

000Eh 0000h

0000h 0001h

002Fh 0000h

0000h 0001h

Device Size = 2

Flash Device Interface Code description

Maximum number of bytes in multi-byte program or page = 2

bit 7 to 0 = x = number of Erase Block Regions It specifies the number of regions within the device containing one or more contiguous Erase Blocks of the same size.

Region 1 Information (main block - Bank B) Number of identical-size erase block = 002Fh+1

Region 1 Information (main block - Bank B) Block size in Region 1 = 0100h * 256 byte

Region 2 Information (main block - Bank A) Number of identical-size erase block = 000Eh+1

Region 2 Information (main block - Bank A) Block size in Region 2 = 0100h * 256 byte

Region 3 Information (parameter block - Bank A) Number of identical-size erase block = 0007h+1

Region 3 Information (parameter block - Bank A) Block size in Region 3 = 0020h * 256 byte

Region 1 Information (parameter block - Bank A) Number of identical-size erase block = 0007h+1

Region 1 Information (parameter block - Bank A) Block size in Region 1 = 0020h * 256 byte

Region 2 Information (main block - Bank A) Number of identical-size erase block = 000Eh+1

Region 2 Information (main block - Bank A) Block size in Region 2 = 0001h * 256 byte

Region 3 Information (parameter block - Bank B) Number of identical-size erase block = 002Fh+1

Region 3 Information (parameter block - Bank B) Block size in Region 3 = 0001h * 256 byte

4 MByte

x16

Async.

8 Byte

64 KByte

8 KByte

64 KByte

26/52

Page 27

M58MR032C, M58MR032D

Table 21. Primary Algorithm-Specific Extended Qu ery Ta bl e

Offset

(P)h = 39h 0050h

(P+3)h = 3Ch 0031h Major version number, ASCII "1" (P+4)h = 3Dh 0030h Minor version number, ASCII "0"

Data Descript ion Value

0052h "R" 0049h "I"

Primary Algorithm extended Query table unique ASCII string “PRI”

"P"

(P+5)h = 3Eh 00E6h Extended Query table contents for Primary Algorithm. Address (P+5)h

0003h (P+7)h 0000h (P+8)h 0000h

(P+9)h = 42h 0001h Supported Functions after Suspend

(P+A)h = 43h 0003h Block Protect Status

(P+B)h 0000h

(P+C)h = 45h 0018h V

contains less significant byte.

bit 0 Chip Erase supported (1 = Yes, 0 = No) bit 1 Erase Suspend supported (1 = Yes, 0 = No) bit 2 Program Suspend supported (1 = Yes, 0 = No) bit 3 Legacy Lock/Unlock supported (1 = Yes, 0 = No) bit 4 Queued Erase supported (1 = Yes, 0 = No) bit 5 Instant individual block locking supported (1 = Yes, 0 = No) bit 6 Protection bits supported (1 = Yes, 0 = No) bit 7 Page mode read supported (1 = Yes, 0 = No) bit 8 Synchronous read supported (1 = Yes, 0 = No) bit 9 Simultaneous operation supported (1 = Yes, 0 = No) bit 10 to 31 Reserved; undefined bits are ‘0’. If bit 31 is ’1’ then another 31

bit field of optional features follows at the end of the bit-30 field.

Read Array, Read Status Register and CFI Query

bit 0 Program supported after Erase Suspend (1 = Yes, 0 = No) bit 7 to 1 Reserved; undefined bits are ‘0’

Defines which bits in the Block Status Register section of the Query are implemented.

bit 0 Block protect Status Register Protect/Unprotect

bit active (1 = Yes, 0 = No) bit 1 Block Lock Status Register Lock-Down bit active (1 = Yes, 0 = No) bit 15 to 2 Reserved for future use; undefined bits are ‘0’

Logic Supply Optimum Program/Erase voltage (highest performance)

No Yes Yes

No Yes Yes Yes Yes Yes

Yes

Yes Yes

1.8V

(P+D)h = 46h 00C0h V

(P+E)h = 47h

(P+F)h (P+10)h (P+11)h (P+12)h

0000h Reserved

bit 7 to 4 HEX value in volts bit 3 to 0 BCD value in 100 mV

Supply Optimum Program/Erase voltage

bit 7 to 4 HEX value in volts bit 3 to 0 BCD value in 100 mV

12V

27/52

Page 28

M58MR032C, M58MR032D

Table 22. Burst Read Information

Offset

(P)+13h = 48h 0003h Page-mode read capability

Data Description Value

bits 0-7 ’n’ such that 2

page bytes. See offset 28h for device word width to determine page-mode data output width. 00h indicates no read page buffer.

HEX value represents the number of read-

8 Byte

(P+14)h = 49h 0003h Number of synchronous mode read configuration fields that follow. 00h

indicates no burst capability.

(P+15)h = 4Ah 0001h Synchronous mode read capability configuration 1

bit 3-7 Reserved bit 0-2 ’n’ such that 2

number of continuous synchronous reads when the device is configured for its maximum word width. A value of 07h indicates that the device is capable of continuous linear bursts that will output data until the internal burst counter reaches the end of the device’s burstable address space. This field’s 3-bit value can be written directly to the read configuration register bit 0-2 if the device is configured for its maximum word width. See offset 28h for word width to determine the

burst data output width. (P+16)h = 4Bh 0002h Synchronous mode read capability configuration 2 8 (P+17)h = 4Ch 0007h Synchronous mode read capability configuration 3 Cont. (P+18)h = 4Dh 0028h Max operating clock frequency (MHz) 40 MHz (P+19)h = 4Eh 0001h Supported handshaking signal (WAIT

bit 0 during synchronous read (1 = Yes, 0 = No) bit 1 during asynchronous read (1 = Yes, 0 = No)

n+1

HEX value represents the maximum

pin)

Yes

Table 23. Security Code Area

Offset Data Description

80h 0000-0000-0000-0XX0 Lock Protection Register 81h XXXX 82h XXXX 83h XXXX 84h XXXX 85h XXXX 86h XXXX 87h XXXX 88h XXXX

64 bits: unique device number

64 bits: User Programmable OTP

28/52

Page 29

M58MR032C, M58MR032D

Table 24. AC Measuremen t Cond itions

Input Rise and Fall Times Input Pulse Voltages Input and Output Timing Ref. Voltages

0 to V

≤

DDQ

4ns

DDQ

Figure 9. AC Testing Load Circuit

/ 2

DDQ

1N914

3.3kΩ

Figure 8. Tes ting Inp ut/ Output Wav ef orms

DEVICE UNDER

DDQ

AI90026

Table 25. Capacitance

= 25 °C, f = 1 MHz)

(1)

Symbol Parameter Test Condition Min Max Unit

OUT

= 0V

OUT

Note: 1. Sampled only, not 100% tested.

Input Capacitance Output Capacitance

TEST

CL = 30pF

CL includes JIG capacitance

6pF

12 pF

OUT

AI90027

29/52

Page 30

M58MR032C, M58MR032D

Table 26. DC Characteristics

= –40 to 85°C; VDD = V

Symbol Parameter Test Condition Min Typ Max Unit

= 1.7V to 2.0V)

DDQ

Input Leakage Current

Output Leakage Current

Supply Current (Asynchronous Read Mode)

CC1

Supply Current (Synchronous R ead Mode Continuous Burst)

CC2

CC3

CC4

CC5

PP1

PP2

V V V

PPLK

Note: 1. Sampled only, not 100% tested.

Supply Current (Power-down)

Supply Current (Standby) Supply Current

(1)

(Program or Erase)

Supply Current

(1)

(Dual Bank)

VPP Supply Current (Program or Erase)

VPP Supply Current (Standby or Read)

Input Low Voltage –0.5 0.4 V

Input High Voltage

Output Low Voltage

Output High Voltage CMOS

VPP Supply Voltage

PP1

VPP Supply Voltage

PPH

Program or Erase Lockout 1 V

2. V

may be conne ct ed to 12V pow er supply for a total of less than 100 hrs.

0V ≤ V

= VIL, G = VIH, f = 6MHz

= VIL, G = VIH, f = 40MHz

Word Program, Block Erase

≤ V

DDQ

≤ V

OUT

DDQ

= VSS ± 0.2V

= VDD ± 0.2V

in progress

±1 µA ±5 µA

10 20 mA

20 30 mA

210µA

15 50 µA

10 20 mA

Program/Erase in progress

in one Bank, Asynchronous

20 40 mA

Read in the other Bank

Program/Erase in progress

in one Bank, Synchronous

30 50 mA

Read in the other Bank

= 12V ± 0.6V

≤ V

= 12V ± 0.6V

= 100µA

= –100µA V

Program, Erase

–0.4 V

DDQ

–0.1

DDQ

–0.4 V

DDQ

510mA

0.2 5 µA

100 400 µA

+ 0.4

DDQ

0.1 V

+ 0.4

DDQ

Double/Tetra Word Program 11.4 12.6 V

V V

30/52

Page 31

Table 27. Asynchronous Read AC Characteristics

= –40 to 85°C; VDD = V

= 1.7V to 2.0V)

DDQ

M58MR032C, M58MR032D

M58MR032

Symbol Alt Parameter Test Condition

AVAV

AVLH

AVQV

AVQV1

EHQX

(1)

EHQZ

ELLH

(2)

ELQV

(1)

ELQX

GHQX

(1)

GHQZ

(2)

GLQV

(1)

GLQX

LHAX

LHGL

LLLH

LLQV

LLQV1

Note: 1. Sampled only, not 100% tested.

may be delayed by up to t

2. G

AVAVDH

ACC

PAGE

ELAVDH

OLZ

AVDHAX

AVDLAVDH

AVDLQV

Address Valid to Next Address Valid

Address valid to Latch Enable High

Address Valid to Output Valid (Random)

Address Valid to Output Valid (Page)

Chip Enable High to Output T ransition

Chip Enable High to Output Hi-Z

Chip Enable Low to Latch Enable High

Chip Enable Low to Output Valid

Chip Enable Low to Output Transition

Output Enable High to Output Transition

Output Enable High to Output Hi-Z

Output Enable Low to Output Valid

Output Enable Low to Output Transition

Latch Enable High to Address Transition

Latch Enable High to Output Enable Low

Latch Enable Pulse Width Latch Enable Low to

Output Valid (Random) Latch Enable Low to

Output Valid (Page)

- t

ELQV

after the fal ling edge of E without increasi ng t

GLQV

= VIL, G = V

= V

= VIL, G = V

= V

= VIL, G = V

= V

= VIL, G = V

= V

= VIL, G = V

= V

Unit100 120

Min Max Min Max

100 120 ns

10 10 ns

100 120 ns

45 45 ns

00ns

20 20 ns

10 10 ns

100 120 ns

00ns

20 20 ns

25 35 ns

00ns

10 10 ns

100 120 ns

45 45 ns

ELQV

31/52

Page 32

M58MR032C, M58MR032D

Figure 10. Asynchronous Read AC Wavefor ms

VALID ADDRESS

VALID DATA VALID ADDRESS

tEHQZ

AI90028

tGHQZ

tGHQX

tEHQX

tAVAV

VALID ADDRESS

ADQ0-ADQ15

tAVQV

VALID ADDRESS

A16-A20

tAVLH tLHAX

tGLQV

tGLQX

tLLQV

tLLLH

tELLH

tELQV

tELQX

tLHGL

Note: Write Enable (W) = High.

32/52

Page 33

Figure 11. Page Read AC Waveforms

M58MR032C, M58MR032D

AI90029

tAVQV1

VALID ADDRESS VALID DATA VALID ADDRESSVALID DATA VALID DATA VALID ADDRESS VALID DATA

tAVLH tLHAX

VALID ADDRESS

tLLQV1

tLLQV

tGHQZ

tGLQV

tLHGL

tELQV

ADQ0-ADQ15

A16-A20

33/52

Page 34

M58MR032C, M58MR032D

Table 28. Synchronous Burst Read AC Characteristics

= –40 to 85°C; VDD = V

Symbol Alt Parameter Test Condition

AVK

ELK

KAX

KHKL

KLKH

AVCLKH

CELCLKH

CLK

CLKHAX

CLKHCLKL

CLKLCLKH

Address Valid to Clock 7 7 ns Chip Enable Low to Clock 7 7 ns Clock Period 25 25 ns Clock to Address Transition Clock High 5 5 ns Clock Low 5 5 ns Clock to Data Valid

KQV

CLKHQV

Clock to BINV Valid Clock to WAIT Valid

Clock to Output Transition

KQX

CLKHQX

Clock to BINV Transition Clock to WAIT Transition

LHAX

LLK

ADVHAX

AVDLCLKH

Latch Enable High to Address Transition

Latch Enable Low to Clock 7 7 ns

= 1.7V to 2.0V)

DDQ

= VIL, G = V

= V

M58MR032

Unit100 120

Min Max Min Max

13 13 ns

20 20 ns

44ns

13 13 ns

34/52

Page 35

Figure 12. Synchronous Burst Read

M58MR032C, M58MR032D

AI90030

VALID

VALID DATA

VALID

tEHQX

tKQXtKQV

tEHQZ

VALID

tGHQZ

tGHQX

tKQV tKQV

VALID

tKQX

VALID

tKQX

note 2 note 3

VALID ADDRESS VALID

ADQ0-ADQ15

tLLLH

tAVLH

VALID ADDRESS

A16-A20

tLLK

tAVK

note 1

tELK tKAX

tGLQX

signal can be c onfigured to be active du ri ng wait state or one cycle be l ow wait state.

signal is asserted only when burst l ength is configured as continuous (see Burst Read section for further informa tion).

3. WAIT

2. WAIT

BINV

WAIT

Note: 1. The num ber of clock cy cles to be inserted depe nds upon the x-l atency set in th e read configuration register.

35/52

Page 36

M58MR032C, M58MR032D

Table 29. Write AC Characteristics, Write Enable Controlled

= –40 to 85 °C; VDD = V

= 1.7V to 2.0V)

DDQ

M58MR032

Symbol Alt Parameter

AVAV

AVLH

DVWH

ELLH

ELWL

GHLL

GHWL

LHAX

LHWH

LLLH

VDHEL

VPPHWH

WHDX

WHEH

WHGL

WHLL

WHVPPL

WHWL

WHWPV

WLWH

WPVWH

Address Valid to Next Address Valid 100 120 ns

Address Valid to Latch Enable High 10 10 ns

Input Valid to Write Enable High 40 40 ns

Chip Enable Low to Latch Enable High 10 10 ns

Chip Enable Low to Write Enable Low 0 0 ns

Output Enable High to Latch Enable Low 20 20 ns Output Enable High to Write Enable Low 20 20 ns Latch Enable High to Address Transition 10 10 ns Latch Enable High to Write Enable High 10 10 ns Latch Enable Pulse Width 10 10 ns

VCSVDD

VPP High to Write Enable High

Write Enable High to Input Transition 0 0 ns

Write Enable High to Chip Enable High 0 0 ns

Write Enable High to Output Enable Low 0 0 ns

OEH

Write Enable High to Latch Enable Low 0 0 ns Write Enable High to VPP Low

Write Enable High to Write Enable Low 30 30 ns

WPH

Write Enable High to Write Protect Valid 200 200 ns

Write Enable Low to Write Enable High 50 50 ns

Write Protect Valid to Write Enable High 200 200 ns

High to Chip Enable Low

Unit100 120

Min Max Min Max

50 50 µs

200 200 ns

36/52

Page 37

Figure 13. Write AC Waveforms, W Controlled

tWHLL

M58MR032C, M58MR032D

AI90031

tWHGL

tWHVPPL

VALID

DATA VALIDADDRESS VALID

tAVAV

tDVWH tWHDX

tLHAX

ADDRESS VALID

tAVLH

tLHWH

tLLLH

tWLWH

tELLH

tELWL

tGHLL

tWPVWH tWHWPV

tGHWL

tVPPHWH

PPH

tVDHEL

PP1

ADQ0-ADQ15

A16-A20

BINV VALID

37/52

Page 38

M58MR032C, M58MR032D

Table 30. Write AC Characteristics, Chip Enable Controlled

= –40 to 85 °C; VDD = V

= 1.7V to 2.0V)

DDQ

M58MR032

Symbol Alt Parameter

AVAV

AVLH

DVEH

EHDX

EHEL

EHWH

ELEH

ELLH

GHLL

LHAX

LHEH

LLLH

VDHEL

VPPHEH

EHVPPL

EHWPV

WLEL

WPVEH

Address Valid to Next Address Valid 100 120 ns

Address Valid to Latch Enable High 10 10 ns

Input Valid to Chip Enable High 40 40 ns

Chip Enable High to Input Transition 0 0 ns

Chip Enable High to Chip Enable Low 30 30 ns

CPH

Chip Enable High to Write Enable High 0 0 ns

Chip Enable Low to Chip Enable High 60 60 ns

Chip Enable Low to Latch Enable High 10 10 ns Output Enable High to Latch Enable Low 20 20 ns Latch Enable High to Address Transition 10 10 ns Latch Enable High to Chip Enable High 10 10 ns Latch Enable Pulse Width 10 10 ns

VCSVDD

VPP High to Chip Enable High Chip Enable High to VPP Low Chip Enable High to Write Protect Valid 200 200 ns

Chip Enable Low to Chip Enable Low 0 0 ns

Write Protect Valid to Chip Enable High 200 200 ns

High to Chip Enable Low

Unit100 120

Min Max Min Max

50 50 µs 200 200 ns 200 200 ns

38/52

Page 39

Figure 14. Write AC Waveforms, E Controlled

M58MR032C, M58MR032D

AI90032

DATA VALIDADDRESS VALID

tDVEH tEHDX

tLHAX

ADDRESS VALID

tAVLH

VALID

tLHEH

tLLLH

tEHWH

tELLH

tEHEL

tELEH

VALID

tWPVEH tEHWPV

tEHVPPL

tVPPHEH

PPH

PP1

ADQ0-ADQ15

A16-A20

BINV

tGHLL

tWLEL

tVDHEL

39/52

Page 40

M58MR032C, M58MR032D

Figure 15. Reset and Power-up AC Waveforms

E, G

tPHWL

tPHEL tPHGL

tPHWL tPHEL tPHGL

VDD, V

tVDHPH

DDQ

Power-up

tPLPH

AI90033

Table 31. Reset and Power-up AC Characteristics

Symbol Parameter Test Condition Min Unit

(1,2)

PLPH

PHEL

PHLL

PHWL

VDHPH

Note: 1. The de vi ce Reset is p ossible but not guarant eed if t

2. Sampled only, not 100% tested.

3. It is im portant to ass ert RP

RP Pulse Width 100 ns

During Program and Erase 50 µs

Reset High to Device Enabled

Other Conditions 30 ns

(3)

Supply Valid to Reset High 50 µs

< 100ns.

PLPH

in order to all ow proper CP U i ni tializat i on during Po wer-up or Sy st em reset.

Table 32. Program, Erase Times and Program , Erase End urance Cycl es

= –40 to 85°C; VDD = V

Parameter Min

Parameter Block (4 K-Word) Erase (Preprogrammed) 2.5 0.5 1 sec

= 1.7V to 2.0V, VPP = VDD unless otherwise specified)

DDQ

Max

(1)

Typ

Typical after

100k W/E Cycles

Unit

Main Block (32 K-Word) Erase (Preprogrammed) 10 1 3 sec Bank Erase (Preprogrammed, Bank A) 4 sec Bank Erase (Preprogrammed, Bank B) 15 sec

Chip Program

(2)

Chip Program (DPG, V Word Program

(3)

= 12V)

(2)

200 10 10 µs

40 sec 20 sec

Double Word Program 200 10 10 µs Tetra Word Program 200 10 10 µs Program/Erase Cycles (per Block) 100,000 cycles

Note: 1. Max values refer t o the maximum t i me allow ed by the internal algorithm before error bi t is set. Worst case condi tions program or

erase shou l d perform significantl y better.

2. Exc l udes the time needed to exe cute the sequence for program instruction.

3. Sam e tim i ng value if V

= 12V.

40/52

Page 41

M58MR032C, M58MR032D

Figure 16. Program Flow c hart and Pseudo Code

Start

Write 40h or 10h

Command

Write Address

& Data

Read Status

b7 = 1

YES

b3 = 0

YES

Suspend

YES

Suspend

Loop

VPP Invalid

Error (1, 2)

(1)

Program instruction: – write 40h or 10h command – write Address & Data (memory enters read status state after the Program instruction)

do: – read status register (E or G must be toggled) if PES instruction given execute suspend program loop

while b7 = 1

If b3 = 1, VPP invalid error: – error handler

b4 = 0

b1 = 0

End

Note: 1. Status check of b1 (Protected Blo ck), b3 (VPP Invalid) and b4 (P rogram Error) can be made af t er each program ope ration or after

a program sequence.

2. If an er ror is found, the Status Register m ust be cleared (CLRS instruction) before fu rther P/E. C. operation s.

YES

Program

Error (1, 2)

Program to Protected

Block Error (1, 2)

If b4 = 1, Program error: – error handler

If b1 = 1, Program to protected block error: – error handler

AI90034

41/52

Page 42

M58MR032C, M58MR032D

Figure 17. Double Wo rd Progr am and Tet ra Word Program Flowc hart and Pseudo code

Start

Write 55h

Command

Write Address 1

& Data 1

Write Address 2

& Data 2

Write Address 3

& Data 3

Write Address 4

& Data 4

Read Status

Suspend

YES

DPG instruction: – write 30h command – write Address 1 & Data 1 (3) – write Address 2 & Data 2 (3) (memory enters read status state after the Program instruction)

TPG instruction: – write 55h command – write Address 1 & Data 1 (4) – write Address 2 & Data 2 (4) – write Address 3 & Data 3 (4) – write Address 4 & Data 4 (4) (memory enters read status state after the Program instruction)

do: – read status register (E or G must be toggled) if PES instruction given execute suspend program loop

(1)

while b7 = 1

If b3 = 1, VPP invalid error: – error handler

If b4 = 1, Program error: – error handler

If b1 = 1, Program to protected block error: – error handler

AI90035

YES

Program to Protected

Block Error (1, 2)

b7 = 1

b3 = 0

b4 = 0

b1 = 0

End

Note: 1. Status check of b1 (Protected Block), b3 (VPP Invalid ) and b4 (Program Er ror) can be made after each program operation or after

a program sequence.

2. If an er ror is found, the Status Register m ust be cleared (CLRS instruction) before fu rther P/E. C. operation s.

3. Address 1 and add ress 2 must be consecutive addresses di ffering only for address bit A0.

4. Address, ad dress 2, address 3 and ad dress 4 must be co nsecutive add resses diff er i ng only for addr ess bit A1-A0.

Suspend

Loop

VPP Invalid

Error (1, 2)

Program

Error (1, 2)

42/52

Page 43

Figure 18. Program Suspend & Resume Flowchart and Pseudo Code

Start

Write B0h

Command

M58MR032C, M58MR032D

Write 70h

Command

Read Status

b7 = 1

YES

b2 = 1

YES

Write a read

Command

Read data from

another address

Write D0h Command

Program Continues

Program Complete

Write FFh Command

Read Data

PES instruction: – write B0h command

do: – read status register (E or G must be toggled)

while b7 = 1

If b2 = 0 Program completed

PER instruction: – write D0h command to resume the program – if the program operation completed then this is not necessary. The device returns to Read Array as normal (as if the Program/Erase suspend was not issued).

AI90036

43/52

Page 44

M58MR032C, M58MR032D

Figure 19. Block Erase Flowchart and Pseudo Code

Start

Write 20h

Command

Write Block Address

& D0h Command

Read Status

b7 = 1

b3 = 0

b4, b5 = 0

b5 = 0 Erase Error (1)

YES

Suspend

Sequence Error (1)

VPP Invalid

Error (1)

Command

EE instruction: – write 20h command – write Block Address (A12-A20) & command D0h (memory enters read status state after the EE instruction)

do: – read status register (E or G must be toggled) if PES instruction given execute suspend erase loop

YES

Suspend

Loop

while b7 = 1

If b3 = 1, VPP invalid error: – error handler

If b4, b5 = 1, Command sequence error: – error handler

If b5 = 1, Erase error: – error handler

44/52

b1 = 0

End

YES

Erase to Protected

Block Error (1)

If b1 = 1, Erase to protected block error: – error handler

AI90037

Page 45

Figure 20. Erase Suspend & Resume Flowchart and Pseudo Code

Start

Write B0h

Command

M58MR032C, M58MR032D

Write 70h

Command

Read Status

b7 = 1

b6 = 1

Read data from

another block

Program/Protection Program

Block Protect/Unprotect/Lock

Write D0h Command

Erase Continues

YES

Erase Complete

Write FFh

Command

Read Data

PES instruction: – write B0h command

do: – read status register (E or G must be toggled)

while b7 = 1

If b6 = 0, Erase completed

PER instruction: – write D0h command to resume erasure – if the erase operation completed then this is not necessary. The device returns to Read Array as normal (as if the Program/Erase suspend was not issued).

AI90038

45/52

Page 46

M58MR032C, M58MR032D

Table 33. Command Interface States - Lock table

Cur r en t Stat e o f the

Current Partition

Current State of

the Other

Partition

Any State Read

Any State

Setup

Idle

Erase

Suspend

Idle

Any State

Setup

Busy

Idle

Program Suspend

Mode State Other s

Protect

Unprotect

Lock RCR

Protecti on

Regi ster

Progr am-

Multiple

Progr am

Program

Suspend

Block-Bank

Erase

Suspend

Array

CFI

Electronic Signature

Status

Setup

Error

Protect-

Unprotect-

LockBlock

Set RCR

Done

Read

Array, CF I,

Elect. Sign., Status

Setup

Error

Done

Read

Array, CF I,

Elect. Sign., Status

SEE

MODIFY

TABLE

Block

Protect-

Unprotect-

LockError

Write RCR

Error

SEE

MODIFY

TABLE

SEE

MODIFY

TABLE

SEE

MODIFY

TABLE

SEE

MODIFY

TABLE

Erase

Error

SEE

MODIFY

TABLE

SEE

MA DIFY

TABLE

Read A rray Read Array

Unprotect-

LockError

Write RCR

Read A rray Read Array

Comma nd Input to t he Current Partiti on (and Next St ate of t he Current Part i ti on)

Read

Memor y

Array (FFH)

Block

Protect-

Error

PS Re ad

Array

Erase

Error

ES Re ad

Array

Erase

Confirm P/

E Resume

Confirm

(D0h)

Block

Protect-

Unprotect-

LockBlock

Program

(Busy)

Erase

(Busy)

Erase

(Busy)

ES Re ad

Array

Erase

(Busy)

ES Re ad

Array

Read

Status

(70h)

Read

Status

Block

Protect-

Unprotect-

LockError

Write RCR

Error

Read

Status

Read

Status

Read

Status

PS Read

Status

Erase

Error

Read

Status

ES Read

Status

Clear

Status

(50h)

Read A rray

Block

ProtectUnprotectLockError

Write RCR

Error

Read A rray

PS Read

Array

Erase

Error

Read A rray

ES Read

Array

Read elect.

sign. (90h)

Read Elect.

Sign.

Block

Protect-

Unprotect-

LockError

Write RCR

Error

Read Elect. Sign.

PS Read

Elect. Sign.

Erase Error

Read Elect. Sign.

ES Read

Elect. Sign.

Read CFI

(98h)

Read CFI

Block

Protect-

Unprotect-

LockError

Write RCR

Error

Read CFI

PS Read

CFI

Erase

Error

Read CFI

ES Read

CFI

Block

Protect-

Unprotect-

Lock

setup

write RCR

setup (60h)

Block

ProtectUnprotectLockSetup Write RCR

Setup Block

ProtectUnprotect-

LockError

Write RCR

Error

Block

ProtectUnprotectLockSetup Write RCR

Setup

Block

ProtectUnprotectLockSetup Write RCR

Setup

Block

ProtectUnprotectLockSetup Write RCR

Setup

PS Read

Array

Erase

Error

Block

ProtectUnprotectLockSetup Write RCR

Setup

Block

ProtectUnprotectLockSetup Write RCR

Setup

Block

Protect

Confirm

(01h)

R ead A rray Read Array Rea d Array

Block

Protect-

Unprotect-

LockBlock

R ead A rray Read Array Rea d Array

PS Read

Array

Erase

Error

R ead A rray Read Array Rea d Array

ES Read

Array

Block

Lock

Confirm

(2Fh)

Block

ProtectUnprotectLockBlock

PS Read

Array

Erase Error

ES Read

Array

Write RCR

Confirm

(03h)

Set RCR

PS Re ad

Array

Erase

Error

ES Re ad

Array

46/52

Page 47

Table 34. Command Interface States - Modify table

Current St ate of t he Cu r r e n t

Cur r en t Stat e

of the Other

Partition

Setup

Busy

Idle

Erase Suspend

Program Suspend

Setup

Busy

Idle

Erase Suspend

Program Suspend

Idle

Setup Busy

Busy

Idle

Erase Suspend

Program Suspend

Any Sta te

Idle Busy

Setup

Busy

Idle

Erase Suspend

Program

Suspend

Setup

Idle

Erase Suspend

Idle

Setup

Busy

I dle Pr ogr am Se tup

Program

Suspend

Unprotect-Lock/

Erase Suspend

Part i t i o n

Mode State Others

Array, CFI,

Read

Protect

RCR

Protecti on

Progr am-

Multiple Program

Program Suspend

Block-Bank

Erase

Electronic

Signature,

Status Register

Error, Pro tect-

Unprotect-

LockBlo ck, Set

RCR

Setup

Done

Setup

Done

Read A rray,

CFI, El ect.

Sign., Status

Setup

Busy Erase (Busy) E rase (Busy) Erase (Busy)

Read A rray,

CFI, El ect.

Sign., Status

SEE LOCK

Protect ion

SEE LOCK

Program (Busy) Program (Busy) Program (Busy)

SEE LOCK

TABLE

Command Input t o the Current Parti t i on ( and Next State of t he Current Part i t ion)

Program Setup

(10h/40h)

Read Array Read Array

Progr am setup

Read Array Read Array

Progr am setup

Read Array Read Array

Protect ion

Read Array Read Array

Progr am Se tup

Read Array Read Array

Progr am Se tup

Read Array Read Array

PS Read Array PS Read Array PS Read Array PS Read Array PS Read Array PS Read Arr ay

Erase E rror E rase Error Erase Error Erase Error E rase E rro r Era se Error

ES Read Array

ES Read Array ES Read Array

M58MR032C, M58MR032D

Block Erase

Setup (20h)

Block Erase

Setup

Read Array Read Array Read Array

Block Erase

Setup

Read Array Read Array Read Array

Protection

Block Erase

Setup

Read Array Read Array Read Array

Block Erase

Setup

Read Array Read Array Read Array

ES Read Array ES Read Array ES Read Array

Program-Erase Suspend (B0h)

Read Array

Protection

Regis ter (Busy )

Read Array

Program (Busy) PS Read Status

Read Array

ES Read Status

OTP Setup

(C0h)

Read Array Read Array Read Array

OTP Setup

Read Array Read Array Read Array

OTP Setup

Protection

Regis ter (Busy )

Read Array Read Array Read Array OTP Setup

Program (Busy) Program (Busy) Program (Busy)

Read Array Read Array Read Array

OTP Setup

Erase (Busy) Erase (Busy) Erase (Busy)

Multiple

Program Setup

(30h/55h)

Multiple

Progr am Se tup

Multiple

Progr am Se tup

Protecti on

Multiple

Progr am Se tup

Multiple

Progr am Se tup

ES Read Array

Multiple

Progr am Se tup

Bank Erase Setup (80h)

Bank Erase

Set up

Bank Erase

Set up

Protection

Bank Erase

Set up

Bank Erase

Set up

ES Re ad Array

47/52

Page 48

M58MR032C, M58MR032D

Table 35. Ordering Information Scheme

Example: M58MR032C 100 ZC 6 T

Device Type

M58

Architecture

M = Multiplexed Address/Data, Dual Bank, Burst Mode

Operating Voltage

R = 1.8V

Device Function

032C = 32 Mbit (x16), Dual Bank: 1/4-3/4 partitioning, Top Boot 032D = 32 Mbit (x16), Dual Bank: 1/4-3/4 partitioning, Bottom Boot

Speed

100 = 100 ns 120 = 120 ns

Package

ZC = TFBGA48: 0.5 mm pitch

Temperature Range

6 = –40 to 85°C

Option

T = Tape & Reel packing

Devices are shipped from the factory with the memory content bits erased to ’1’.

Table 36. Daisy Chain Ordering Scheme

Example: M58MR032 -ZC T

Device Type

M58MR032

Daisy Chain

-ZC = TFBGA48: 0.5 mm pitch

Option

T = Tape & Reel Packing

For a list of available options (Speed, Pac kage, etc...) or for furthe r information on any aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.

48/52

Page 49

Table 37. Document Revision History

Date Version Revision Details

November 2000 -01 First Issue

12/20/00 -02 Protection/Security clarification

FBGA Connections change (Figure 2) Memory Map diagram clarification (Figure 3) Single Synchronous Read clarification (Figure 4) Identifier Codes clarific ation (Table 9) X-Latency configuration clarification CFI Query Identification String change (Table 18) Synchronous Burst Read Waveforms change (Figure 12) Reset AC Characteristics clarification (Table 31) Program Time clarification (Table 32) TFBGA Package Mechanical and Outline drawing change (Table 27, Figure 21)

1/08/01 -03 Reset AC Characteristics clarification (Table 31)

Reset AC Waveforms diagram change (Figure 15)

3/02/01 -04 Document type: from Target Specification to Product Preview

Write AC Waveforms W Contr. change (Figure 13) Reset and Power-up AC Characteristics and Waveform change (Table 31, Figure 15) TFBGA Package Mechanical Data change (Table 38)

M58MR032C, M58MR032D

3/19/01 -05 TFBGA Package Mechanical Data change

Reset and Power-up AC Characteristics clarification

01-Aug-2002 5.1 Revision numbering modified: a minor revision will be indicated by incrementing the

digit after the dot, and a major revision, by incrementing the digit before the dot. (revision version 05 becomes 5.0). Supply voltage ranges V

and V

modified, Burst mode Read frequency

DDQ

modified. Maximum operating frequency modified in Table 22, Burst Read Information. Par amete rs t

, t

KQV

KAX

and t

modified in Table 28, Synchronous

LHAX

Burst Read AC Characteristics. Document status changed from Product Preview to Preliminary Data.

49/52

Page 50

M58MR032C, M58MR032D

Table 38. TFBGA48 - 10 x 4 ball array, 0.5 mm pitch, Package Mechanical Data

Symbol

Typ Min Max Typ Min Max

A 0.950 1.200 0.0374 0.0 472 A1 0.200 0.300 0.0079 0.0 118 A2 0.790 0.0311

b 0.300 0.250 0.350 0.0118 0.0 098 0.0138

D 10.530 10.480 10.580 0.4146 0.4126 0.4165 D1 4.500 – – 0.1772 – –

D2 6.500 – – 0.2559 – – D3 8.500 – – 0.3346 – –

ddd 0.080 0.0031

E 6.290 6.240 6.340 0.2476 0.2457 0.2496 E1 1.500 – – 0.05 91 – – E2 3.500 – – 0.13 78 – – E3 5.500 – – 0.21 65 – –

e 0.500 – – 0.0197 – –

FD 3.015 – – 0.1187 – –

FD1 2.015 – – 0.0793 – – FD2 1.015 – – 0.0400 – –

FE 2.395 – – 0.0943 – –

FE1 1.395 – – 0.0549 – – FE2 0.395 – – 0.0156 – –

SD 0. 250 – – 0.0098 – –

SE 0.250 – – 0.0098 – –

millimeters inches

Figure 21. TFBGA48 - 10 x 4 ball array, 0.5 mm pitch, Bottom View Package Outl ine

D3 D2

Drawing is not to scale.

FE1 FE2

BALL "A1"

FD2 FD1

DUMMY BALLS

ddd

BGA-Z17

50/52

Page 51

M58MR032C, M58MR032D

Figure 22. TFBGA48 Daisy Chain - Package Connections (Top view through package)

12 78 13121110914

6543

Figure 23. TFBGA48 Daisy Chain - PCB Connections proposal (Top view through package)

AI90039

12 78 13121110914

START

POINT

6543

END

POINT

AI90040

51/52

Page 52

M58MR032C, M58MR032D

Information furnished is believed to be ac curate and reli able. Howev er, STMicroel ectronics assumes no responsibilit y for the consequence s of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implic ation or otherwise under any patent or patent rights of STMi croelectr onics. Specifications mentioned in thi s publicati on are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as cri tical comp onents in life support dev i ces or systems wi t hout express written ap proval of STMi croelect ro nics.

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All other names are the property of their respective owners.

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52/52

Datasheet M58MR032D, M58MR032C Datasheet (SGS Thomson Microelectronics)

Specifications and Main Features

Frequently Asked Questions

User Manual