INTEGRATED ULTRA LOW POWER SRAM,
POWER-FAIL CONTROL CIRCUIT and
BATTERY
READ CYCLE TIME EQUALS WRITE CYCLE
TIME
AUTOMATIC P OWER-F AIL CHIP DES ELECT and
WRITE PROTECTION
WRITE PROTECT VOLT AGES
= Power-fail Deselect Voltage):
(V
PFD
– M48Z58: 4.50V ≤ V
– M48Z58Y: 4.20V ≤ V
SELF-CONTAINED BATTERY in the CAPHAT
DIP PACKAGE
PACKAGING INCLUDES a 28-LEAD SOIC
and SNAPHAT
®
TOP
(to be Ordered Separately)
SOIC PACKAGE PROVIDES DIRECT
CONNECTION for a SNAPHAT TOP which
CONTAINS the BATTERY and CRYSTAL
PIN and FUNCTION COMPATIBLE with
JEDEC STANDARD 8K x 8 SRAMs
PFD
PFD
4.75V
≤
≤
4.50V
SNAPHAT (SH)
Battery
28
28
1
SOH28 (MH)
Figure 1. Logic Diagram
M48Z58
M48Z58Y
1
PCDIP28 (PC)
Battery CAPHAT
DESCRIPTION
The M48Z58/58Y ZEROPOW ER
®
RAM is an 8K x
V
CC
8 non-volatile static RAM that integrates power-fail
deselect circuitry and battery control logic on a
single die. The monolithic chip is available in two
special packages to provide a highly integrated
1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those indi cat ed in the operati onal
section of this specification is not implied. Exposure to the absolute maximum rating conditions for extended periods of time may
affect reliability.
2. Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for longer than 30 seconds).
CAUTION: Negat i ve undershoots below –0.3 volts are not allowed on any pin while in the Battery Back-up mode.
CAUTION: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.
Ambient Operating TemperatureGrade 1
Grade 6
Storage T emper ature (VCC Off)–40 to 85 °C
Lead Solder Temperature for 10 seconds260°C
Input or Output Voltages–0.3 to 7 V
Supply Voltage–0.3 to 7 V
Output Current20mA
Power Dissipation1W
The M48Z58/58Y is a non-volatile pin and function
equivalent to any JEDEC standard 8K x 8 SRAM.
It also easily fits into many ROM, EPROM, and
EEPROM sockets, providing the non-volatility of
PROMs without any requirement for special write
timing or limitations on the number of writes t hat
can be performed.
The 28 pin 600mil DIP CAPHAT houses the
M48Z58/58Y silicon with a long life lithium button
cell in a single package.
The 28 pin 330mil SOIC provides s ockets with gold
plated contacts at both ends for direct connection
to a separate SNAPHAT housing containing the
battery. The unique design allows the SNAPHAT
battery package to be mounted on top of the SOIC
package after the completion of the surface mount
process. Insertion of the SNAPHAT housing after
reflow prevents potential battery damage due to the
high temperatures required for device surfacemounting. The SNAPHAT housing is keyed to prevent reverse insertion.
The SOIC and battery packages are shipped separately in plastic anti-static tubes or in Tape & Reel
form.
POWER
V
PFD
8K x 8
SRAM ARRAY
V
SS
Table 4. AC Measurement Conditions
Input Rise and Fall Times≤ 5ns
Input Pulse Voltages0 to 3V
Input and Output Timing Ref. Voltages1.5V
Note that Output Hi-Z is defined as the point where data is no
longer driven.
Figure 4. AC Testing Load Circuit
5V
1.9kΩ
DEVICE
UNDER
TEST
1kΩ
CL includes JIG capacitance
CL = 100pF or 5pF
DQ0-DQ7
E
W
G
AI01394
OUT
AI01030
3/17
Page 4
M48Z58, M48Z58Y
(1, 2)
T ab le 5. Capacitance
= 25 °C)
(T
A
SymbolParameterT est ConditionMinMaxUnit
C
IN
(3)
C
IO
Notes:
1. Effective capacitance measured with power supply at 5V .
= 0 to 70°C or –40 to 85°C; VCC = 4.75V to 5.5V or 4.5V to 5.5V)
(T
A
SymbolParameterTest ConditionMinMaxUnit
I
LI
I
LO
Supply CurrentOutputs open50mA
I
CC
I
CC1
I
CC2
V
IL
V
IH
V
OL
V
OH
T able 7. Power Down/Up Trip Points DC Characteristics
= 0 to 70°C or –40 to 85°C)
(T
A
Input Leakage Current0V ≤ VIN ≤ V
Output Leakage Current0V ≤ V
Supply Current (Standby) TTLE = V
Supply Current (Standby) CMOSE = VCC – 0.2V3mA
OUT
≤ V
IH
CC
CC
±1µA
±5µA
3mA
Input Low Voltage–0.30.8V
Input High Voltage2.2VCC + 0.3V
Output Low Voltage IOL = 2.1mA0.4V
Output High VoltageIOH = –1mA2.4V
(1)
SymbolParameterMinTypMaxUnit
V
PFD
V
PFD
Power-fail Deselect Voltage (M48Z58/58Y)4.54.64.75V
Power-fail Deselect Voltage (M48Z58/58YY)4.24.354.5V
V
SO
t
DR
Notes:
1. All voltages referenced to V
2. At 25 °C
DESCRIPTION
Battery Back-up Switchover Voltage3.0V
(2)
Expected Data Retention Time10YEARS
.
SS
(cont’d)
For the 28 lead SOIC, the battery package (i.e.
SNAPHAT) part number is "M4Z28-BR00SH1".
The M48Z58/58Y also has its own Power-fail Detect circuit. The control circuitry constantly monitors
the single 5V supply for an out of tolerance condi-
4/17
tion. When V
is out of tolerance, the circuit write
CC
protects the SRAM, providing a high degree of data
security in the midst of unpredictable system operation brought on by low V
. As VCC falls below
CC
approximately 3V , the control circuitry connects the
battery which maintains data until valid power returns.
Page 5
M48Z58, M48Z58 Y
T able 8. Power Down/Up Mode AC Characteristics
= 0 to 70°C or –40 to 85°C)
(T
A
SymbolParameterMinMaxUnit
E or W at VIH before Power Down0µs
V
(max) to V
PFD
V
(min) to VSS VCC Fall Time10µs
PFD
V
(min) to V
PFD
VSS to V
V
(max) to V
PFD
passes V
CC
(min) to VSS fall time of less than tFB may cause corruption of RAM data.
PFD
(min) = 20ms for industrial temperature grade 6 device.
REC
PFD
(max) to Inputs Recognized40200ms
PFD
(min) fall time of less than tF may result in deselection/writ e protection not occ urri ng until 200 µs after
PFD
(min).
PFD
(min) VCC Fall Time300µs
PFD
(max) VCC Rise Time10µs
PFD
(min) VCC Rise Time1µs
Notes
t
t
F
t
FB
t
t
REC
:1.V
2. V
3. t
PD
(1)
(2)
t
R
RB
(3)
V
Figure 5. Power Down/Up Mode AC Waveforms
V
CC
V
(max)
PFD
V
(min)
PFD
VSO
INPUTS
OUTPUTS
tF
tPD
tFB
tDR
tRB
DON'T CARE
VALIDVALID
(PER CONTROL INPUT)
HIGH-Z
tR
tREC
RECOGNIZEDRECOGNIZED
(PER CONTROL INPUT)
AI01168C
5/17
Page 6
M48Z58, M48Z58Y
T ab le 9. Read Mode AC Characteristics
= 0 to 70°C or –40 to 85°C; VCC = 4.75V to 5.5V or 4.5V to 5.5V)
(T
A
SymbolParameter
Notes:
t
AVAV
(1)
t
AVQV
(1)
t
ELQV
(1)
t
GLQV
(2)
t
ELQX
(2)
t
GLQX
(2)
t
EHQZ
(2)
t
GHQZ
(1)
t
AXQX
1. C
= 100pF (see Figure 4).
L
= 5pF (see Figure 4).
2. C
L
Read Cycle Time70ns
Address Valid to Output Valid70ns
Chip Enable Low to Output Valid70ns
Output Enable Low to Output Valid35ns
Chip Enable Low to Output Transition5ns
Output Enable Low to Output Transition5ns
Chip Enable High to Output Hi-Z25ns
Output Enable High to Output Hi-Z25ns
Address Transition to Output Transitio n10ns
M48Z58 / M48Z58Y
-70
MinMax
Unit
Figure 6. Read Mode AC Waveforms
A0-A12
E
G
DQ0-DQ7
Note:
Write Enable (
W) = High.
tAVAV
VALID
tAVQVtAXQX
tELQV
tELQX
tGLQX
tGLQV
tGHQZ
VALID
tEHQZ
AI01385
6/17
Page 7
M48Z58, M48Z58 Y
T ab le 10. Write Mode AC Characteristics
= 0 to 70°C or –40 to 85°C; VCC = 4.75V to 5.5V or 4.5V to 5.5V)
(T
A
SymbolParameter
t
WLQZ
t
AVAV
t
AVWL
t
AVEL
t
WLWH
t
ELEH
t
WHAX
t
EHAX
t
DVWH
t
DVEH
t
WHDX
t
EHDX
(1, 2)
Write Cycle Time70ns
Address Valid to Write Enable Low0ns
Address Valid to Chip Enable Low0ns
Write Enable Pulse Width50ns
Chip Enable Low to Chip Enable High55ns
Write Enable High to Address Transition0ns
Chip Enable High to Address Transition0ns
Input Valid to Write Enable High30ns
Input Valid to Chip Enable High30ns
Write Enable High to Input Transition5ns
Chip Enable High to Input Transition5ns
Write Enable Low to Output Hi-Z25ns
M48Z58 / M48Z58Y
-70
MinMax
Unit
Notes:
t
AVWH
t
AVEH
(1, 2)
t
WHQX
1. C
= 5pF (see Figure 4).
L
E goes low simultaneously with W going low, the outputs remain in the high impedance state.
2. If
Address Valid to Write Enable High60ns
Address Valid to Chip Enable High60ns
Write Enable High to Output Transition5ns
READ MODE
The M48Z58/58Y is in the Read Mode whenever
W (Write Enable) is high, E (Chip Enable) is low.
Thus, the unique address specified by the 13 Address Inputs defines which one of the 8,192 bytes
of data is to be accessed. Valid data will be available at the Dat a I/O pins within Address Access
time (t
stable, providing that the
also satisfied. If the
) after the last address input signal is
AV Q V
E and G acce ss times a re
E and G access times are not
met, valid data will be available after the latter of
the Chip Enable Access time (t
Enable Access time (t
GLQV
).
) or Output
ELQV
The state of the eight three-state Data I/O signals
is controlled by
before t
AVQ V
indeterminate state until t
puts are changed while
E and G. If the outputs are activated
, the data lines will be driven to an
. If the Address In-
AVQV
E and G remain active,
output data will remain valid for Output Data Hold
time (t
) but will go indeterminate until the next
AXQX
Address Access.
WRITE MODE
The M48Z58/58Y is in the W rite Mode whenever
E are low. The start of a write is referenced
and
from the latter occurring falling edge of
W or E. A
write is terminated by the earlier rising edge of
or
E. The addresses must be held valid throughout
the cycle.
of t
E or W must return high for a minimum
from Chip Enable or t
EHAX
WHAX
from Write
W
W
Enable prior to the initiation of another read or write
cycle. Data-in must be valid t
of write and remain valid for t
prior to the end
DVWH
afterward. G
WHDX
should be kept high during write cycles to avoid bus
contention; although, if the output bus has been
activated by a low on
disable the outputs t
E and G, a low on W will
after W falls.
WLQZ
7/17
Page 8
M48Z58, M48Z58Y
Figure 7. Write Enable Controlled, Write AC Waveforms
tAVAV
A0-A12
tAVEL
E
tAVWL
W
tWLQZ
DQ0-DQ7
VALID
tAVWH
tWLWH
Figure 8. Chip Enable Controlled, Write AC Waveforms
tDVWH
tWHAX
tWHQX
tWHDX
DATA INPUT
AI01386
8/17
A0-A12
E
W
DQ0-DQ7
tAVEL
tAVWL
tAVAV
VALID
tAVEH
tELEH
tDVEH
tEHAX
tEHDX
DATA INPUT
AI01387B
Page 9
M48Z58, M48Z58 Y
DA TA RETE NT ION MODE
With valid V
applied, the M48Z58/58Y operates
CC
as a conventional BYTEWIDE static RAM.
Should the supply voltage decay, the RAM will
automatically power-fail deselect, write protecting
itself when V
(min) window. All outputs become high imped-
V
PFD
falls within the V
CC
PFD
(max),
ance, and all inputs are treated as "don’t care."
Note:
A power failure during a write cycle may
corrupt data at the c urrently addressed location,
but does not jeopardize the rest of the RAM’s
content. At voltages below V
(min), the user can
PFD
be assured the memory will be in a write protected
state, provided the V
fall time is not less than tF.
CC
The M48Z58/58Y may respond to transient noise
spikes on V
during the time the device is s ampling V
that reach into the deselect window
CC
. There-
CC
fore, decoupling of the power supply lines is recommended.
When V
drops below VSO, the control circuit
CC
switches power to the internal batter y which preserves data. The internal button c ell will maintain
data in the M48Z58/58Y for an accumulated period
of at least 10 years when V
As system power returns and V
is less than VSO.
CC
rises above VSO,
CC
the battery is disconnected, and the power supply
is switched to external V
tinues until V
reaches V
CC
Normal RAM operation can resume t
exceeds V
PFD
(max).
. Write protection con-
CC
(min) plus t
PFD
REC
REC
after V
(min).
CC
For more information on Battery Storage Life refer
to the Application Note AN1012.
POWER SUPPLY DECOUPLING and UNDERSHOOT PROTECTION
transients, including those produced by output
I
CC
switching, can produce voltage fluctuations, resulting in spikes on the V
bus. These transients can
CC
be reduced if capacitors are used to store energy,
which stabilizes the V
bus. The energy stored in
CC
the bypass capacitors will be released as low going
spikes are generated or energy will be absorbed
when overshoots occur . A ceramic bypass capacitor value of 0.1µF (as shown in Figure 9) is recommended in order to provide the needed filtering.
In addition to transients that are caused by normal
SRAM operation, power cycling can generate
negative voltage spikes on V
values below V
by as much as one Volt. These
SS
that drive it to
CC
negative spikes can cause data corruption in the
SRAM while in battery backup mode. To protect
from these voltage spikes, it is recommeded to
connect a schottky diode from V
connected to V
, anode to VSS). Schottky diode
CC
to VSS (cathode
CC
1N5817 is recommended for through hole and
MBRS120T3 is recommended for surface mount.
Figure 9. Supply Voltage Protection
V
CC
V
CC
0.1µFDEVICE
V
SS
AI02169
9/17
Page 10
M48Z58, M48Z58Y
ORDERING INFORMATION SCHEME
Example: M48Z58Y -70 MH 1 TR
Supply Voltage and Write
Protect Voltage
(1)
58
VCC = 4.75V to 5.5V
V
= 4.5V to 4.75V
PFD
58Y V
Notes:
Caution:
= 4.5V to 5.5V
CC
V
= 4.2V to 4.5V
PFD
1. The M48Z58 part is offered with the PCDIP28 (i.e. CAPHAT) package only.
2. The SOIC package (SOH28) requires the battery package (SNAPHAT) which is ordered separately under the part number
"M4Z28-BR00SH1" in plasti c tube or "M4Z28 -BR 00SH 1T R" in Tape & Reel form.
3. Delivery may include either the 2-pin version of the SOIC/SNAPHAT or the 4-pin version of the SOIC/SNAPHAT. Both are
functionally equivalent (see package drawing section for details).
4. Industrial temperature grade available in SOIC package (SOH28) only.
Do not place the SNAPHAT battery package "M4Z28-BR00SH1" in conductive foam since this will drain the lithium button-cel l
battery.
Speed
-70 70ns
Package
PC PCDIP28
(2,3)
MH
SOH28
Temp. Range
1 0 to 70 °C
(4)
6
–40 to 85°C
Shipping Method
for SOIC
blank Tubes
TR Tape & Reel
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this device,
please contact the STMicroelectronics Sales Office nearest to you.
Information furnished is believed to be accurate and reliable. However, STMicroelectronics as sumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and repl aces all information previously supplied. STMicroelectron ics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelect roni cs