Datasheet M27V322 Datasheet (SGS Thomson Microelectronics)

Page 1
M27V322
32 Mbit (2Mb x16) Low Voltage UV EPROM and OTP EPROM
3.3V ± 10% SUPPLY VOLTAGE in READ
OPERATION
READ ACCESS TIME
– 100ns at V
PIN COMPATIBLE WITH M27C322
WORD-WIDE CONFIGURABLE
32 Mbit MASK ROM REPLACEMENT
LOW POWER CONSUMPTION
– Active Current 30mA at 5MHz – Stand-by Current 60µA
PROGRAMMING VOLTAGE: 12V ± 0.25V
PROGRAMMING TIME: 50µs/word
ELECTRONIC SIGNATURE
– Manufacturer Code: 0020h – Device Code: 0034h
CC
42
1
FDIP42W (F) PDIP42 (P)
42
Figure 1. Logic Diagram
1
DESCRIPTION
The M27V322 is a 32 Mbit EPROM offered in the UV range (ultra violet erase) and OTP range. It is ideally suited for microprocessor systems requir­ing large data or program storage. It is organised as 2 MWords of 16 bit. The pin-out is compatible with a 32 Mbit Mask ROM.
The FDIP42W (window ceramic frit-seal package) has a transparent lid which all ows the user to ex­pose the chip to ultraviolet light to erase the bit pat­tern. A new pattern can then be written rapidly to the device by following the programming proce­dure.
For applications where the content is programmed only one time and erasure is not required, the M27V322 is offered in PDIP42 package.
A0-A20
GV
PP
V
CC
21
E
M27V322
V
SS
16
Q0-Q15
AI03050
1/13March 2000
Page 2
M27V322
Figure 2A. DIP Connections
A18 A19
GV
A7 A6 A5 A4 A3 A2 A1 A0
V
SS PP
Q0 Q8 Q1 Q9
Q10
Q3
Q11
1 2 3 4 5 6 7 8 9 10
M27V322
11
E
12 13 14 15 16 17 18 19 20 21
42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22
AI03051
A8A17 A9 A10 A11 A12 A13 A14 A15 A16 A20 V
SS
Q15 Q7 Q14 Q6 Q13 Q5Q2 Q12 Q4 V
CC
DEVICE OPERATION
The operating modes of the M27V322 are listed in the Operating Modes Table. A single power supply is required in the read mode. All inputs are TTL compatib le exce pt for V
and 12V on A9 for the
PP
Electronic Signature.
Read Mode
The M27V322 has a word-wide organization. Chip Enable (E used for device selection. Output Enable (G
) is the power control and should be
) is the output control and should be used to gate data to the output pins in dependent of device selection. Assuming that the addresses are s table, the ad­dress access time (t
) is equal to the delay
AVQV
Table 1. Signal Names
A0-A20 Address Inputs Q0-Q15 Data Outputs E
V
G
PP
V
CC
V
SS
from E to output (t output after a delay of t
VPP, assuming that E has been low an d the
of G addresses have been stable for at least t t
.
GLQV
Chip Enable Output Enable / Program Supply Supply Voltage Ground
). Data is available at the
ELQV
from the falling e dge
GLQV
AVQV
Standby Mode
The M27V322 has a standby mode which reduces the supply current from 30mA to 30µA. The
M27V322 is placed in the standby mode by apply­ing a CMOS high signal to the E
input.When in the standby mode, the outputs are in a high imped­ance state, independent of the G
VPP input.
Two Line Outp ut C ontrol
Because EPROMs are usually used in larger memory arrays, this product features a 2 line con­trol function which accommodates the use of mul­tiple memory connection. The two line control function allows:
a. the lowest possible memory power dissipation, b. complete assurance that output bus content ion
will not occur.
For the most efficient use of these two control lines, E ry device selecting function, while G
should be decoded and used as the prima-
VPP should be made a common connectio n to all devices in the array and connected to the READ
line from the system control bus. This ensures that all deselect­ed memory devices are in their low power standby mode and that the output pins are only active when data is required from a particular memory device.
-
2/13
Page 3
M27V322
Table 2. Absolute Maximum Ratings
(1)
Symbol Parameter Value Unit
T
A
T
BIAS
T
STG
(2)
V
IO
V
CC
(2)
V
A9
V
PP
Note: 1. Except for the rating "Operating Temperature Range", s tresses above thos e l i sted in the Table "A bsolute M aximum Ratings" may
cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indi cated in the Operating sections of this s pecification is not impli ed. Exposure to A bsolute M aximum Rating condi­tions for extended per iods may aff ect device reliabilit y. Refer also to the STMicroel ectronics SURE Program an d other relevan t qual ­ity docum en ts .
2. Minimum DC vo ltage on Input o r Outpu t is – 0.5V w ith poss ible un dershoot to –2. 0V fo r a peri od les s than 20ns. Ma ximum DC
voltage on Output is V
3. Depends on range.
Ambient Operating Temperature
Temperature Under Bias –50 to 125 °C Storage Temperature –65 to 150 °C
Input or Output Voltage (except A9) –2 to 7 V Supply Voltage –2 to 7 V A9 Voltage –2 to 13.5 V Program Supply Voltage –2 to 14 V
+0.5V with possible overshoot to VCC +2V for a period l ess than 20n s.
CC
(3)
–40 to 125 °C
Table 3. Operating Modes
Mode E
Read Output Disable Program Program Inhibit Standby Electronic Signature
Note: X = VIH or VIL, VID = 12V ± 0.5V.
V
IL
V
IL
V
Pulse V
IL
V
IH
V
IH
V
IL
GV
V
PP
V
IL
V
IH
PP
PP
A9 Q15-Q0
X Data Out X Hi-Z X Data In X Hi-Z
X X Hi-Z
V
IL
V
ID
Codes
Table 4. Electronic Signature
Identifier A0 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Hex Data
Manufacturer’s Code Device Code
Note: Outputs Q15-Q8 are set to '0' .
V V
IL
IH
00100000 20h 00110100 34h
3/13
Page 4
M27V322
Table 5. AC Measurement Conditions
High Speed Standard
Input Rise and Fall Times 10ns 20ns Input Pulse Voltages 0 to 3V 0.4V to 2.4V Input and Output Timing Ref. Voltages 1.5V 0.8V and 2V
Figure 3. AC Testing Input Output Waveform
High Speed
3V
1.5V
0V
Standard
2.4V
0.4V
Table 6. Capacitance
Symbol Parameter Test Condition Min Max Unit
C
IN
C
OUT
Note: 1. Sampled only, not 100% tested.
(1)
(TA = 25 °C, f = 1 MHz)
Input Capacitance Output Capacitance
2.0V
0.8V
AI01822
Figure 4. AC Testing Load Circuit
1.3V
DEVICE UNDER
TEST
CL = 30pF for High Speed CL = 100pF for Standard CL includes JIG capacitance
V
= 0V
IN
V
= 0V
OUT
1N914
3.3k
CL
10 pF 12 pF
OUT
AI01823B
System Considerations
The power switching characteristics of Advanced CMOS EPROMs require careful decoupling of the supplies to the devices. The supply current ICC has three segments of importance to the system designer: the standby current, the active current and the transient peaks that are produc ed by the falling and rising edges of E
. The magnitude of the transient current peaks is dependent on the ca­pacitive and inductive loadi ng of the device out­puts. The associated transient voltage peaks can be suppressed by complying with the two line out-
4/13
put control and by properly selected decoupling capacitors. It is recommended that a 0.1µF ceram­ic capacitor is used on every device between V
CC
and VSS. This should be a high frequency type of low inherent inductance and should be placed as close as possible to the device. In addition, a
4.7µF electrolytic capacitor should be used be­tween V
and VSS for every eight devices. This
CC
capacitor should be mounted near the power sup­ply connection point. The purpose of this capacitor is to overcome the voltage d r op caus ed by the in­ductiv e effects of PCB traces.
Page 5
M27V322
Table 7. Read Mode DC Characteristics
(1)
(TA = –40 to 85 °C or 0 to 70 °C; VCC = 3.3V ± 10%; VPP = VCC)
Symbol Parameter Test Condition Min Max Unit
I
I
I
CC
I
CC
I
CC
I V
V
IH
V
V
Note: 1. VCC must be ap pl i e d simultaneously wi th or before VPP and removed simultaneously or after VPP.
Table 8. Read Mode AC Characteristics
Input Leakage Current
LI
Output Leakage Curren t
LO
Supply Current
1
Supply Current (Standby) TTL
2
Supply Current (Standby) CMOS Program Current
PP
Input Low Voltage –0.6
IL
(2)
Input High Voltage Output Low Voltage
OL
Output High Voltage TTL
OH
2. Maximum DC voltage on Output is V
CC
+0.5 V.
E
(1)
0V V
IN ≤ VCC
0V V
OUT ≤ VCC
= VIL, GVPP = VIL, I
f = 5MHz
E = V
IH
E > VCC – 0.2V
V
= V
PP
CC
I
= 2.1mA
OL
I
= –400µA
OH
OUT
= 0mA,
±1 µA
±10 µA
30 mA
1mA 60 µA 10 µA
0.2V
CC
0.7V
CCVCC
+ 0.5
0.4 V
2.4 V
(TA = –40 to 85 °C or 0 to 70 °C; VCC = 3.3V ± 10%; VPP = VCC)
M27V322
Symbol Alt Parameter Test Condition
-100
(3)
-120
-150
V V
Unit
Min Max Min Max Min Max
t
AVQVtACC
t
ELQV
t
GLQV
(2)
t
EHQZ
(2)
t
GHQZ
t
AXQX
Note: 1. VCC must be ap pl i e d simultaneously wi th or before VPP and removed simultaneously or after V
2. Sampled only, not 100% tested.
3. Speed obtain ed with High Speed measu rement condi t i ons.
Address Valid to Output Valid
t
Chip Enable Low to Output Valid
CE
Output Enable Low to Output
t
OE
Valid
t
Chip Enable High to Output Hi-Z
DF
Output Enable High to Output
t
DF
Hi-Z Address Transition to Output
t
OH
Transition
E
= VIL, G = V
G
= V
= V
E
G
= V
= V
E
= VIL, G = V
E
IL
IL
IL
IL
IL
IL
100 120 150 ns 100 120 150 ns
50 60 60 ns
045050050ns
045050050ns
555ns
PP
5/13
Page 6
M27V322
Figure 5. Read Mode AC Waveforms
A0-A20
E
GV
PP
Q0-Q15
VALID
tAVQV
tGLQV
tELQV
Table 9. Programming Mode DC Characteri stics
tAXQX
(1)
VALID
tEHQZ
tGHQZ
Hi-Z
AI02207
(TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12V ± 0.25V)
Symbol Parameter Test Condition Min Max Unit
V
I
LI
I
CC
I
PP
V V
V
OL
V
OH
V
Note: 1. VCC must be ap pl i e d simultaneously wi th or before VPP and removed simultaneously or after VPP.
Input Leakage Current
Supply Current 50 mA Program Current Input Low Voltage –0.3 0.8 V
IL
Input High Voltage 2.4
IH
Output Low Voltage Output High Voltage TTL A9 Voltage 11.5 12.5 V
ID
VIN V
IL
E
= V
I
= 2.1mA
OL
I
= –2.5mA
OH
IH
IL
±10 µA
50 mA
V
+ 0.5
CC
0.4 V
3.5 V
V
6/13
Page 7
M27V322
Table 10. MARGIN MODE AC Characteristics
(1)
(TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12V ± 0.25V)
Symbol Alt Parameter Test Condition Min Max Unit
t
A9HVPH
t
VPHEL
t
A10HEH
t
A10LEH
t
EXA10X
t
EXVPX
t
VPXA9X
Note: 1. VCC must be ap pl i e d simultaneously wi th or before VPP and removed simultaneously or after VPP.
Table 11. Programming Mode AC Characteristics
(TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12V ± 0.25V)
Symbol Alt Parameter Test Condition Min Max Unit
t
AVEL
t
QVEL
t
VCHEL
t
VPHEL
t
VPLVPH
t
ELEH
t
EHQX
t
EHVPX
t
VPLEL
t
ELQV
t
EHQZ
t
EHAX
Note: 1. VCC must be ap pl i e d simultaneously wi th or before VPP and removed simultaneously or after VPP.
2. Sampled only, not 100% tested.
(2)
t
t
t
AS10VA10
t
AS10VA10
t
AH10
t t
VA9 High to VPP High
AS9
VPP High to Chip Enable Low
VPS
Chip Enable Transition to V Chip Enable Transition to VPP Transition
VPH
VPP Transition to VA9 Transition
AH9
t
AS
t
DS
t
VCS
t
OES
t
PRT
t
PW
t
DH
t
OEH
t
VR
t
DV
t
DFP
t
AH
2 µs
s High to Chip Enable High (Set) Low to Chip Enable High (Reset)
Transition
A10
s
s
s
s
s
(1)
Address Valid to Chip Enable Low 1 µs Input Valid to Chip Enable Low 1 µs VCC High to Chip Enable Low VPP High to Chip Enable Low VPP Rise Time
s 1µs
50 ns Chip Enable Program Pulse Width (Initial) 45 55 µs Chip Enable High to Input Transition 2 µs Chip Enable High to VPP Transition VPP Low to Chip Enable Low
s 1µs
Chip Enable Low to Output Valid 1 µs Chip Enable High to Output Hi-Z 0 130 ns Chip Enable High to Address Transition 0 ns
Programming
When delivered (and after each erasure for UV EPROM), all bits of the M27V322 are in the "1" state. Data is introduced by selectively program ­ming "0"s into the desired bit locations. Although only "0"s will be programmed, both "1"s and "0"s can be present in the dat a word. The on ly way to change a "0" to a "1" is by die exposition to ultravi-
olet light (UV EPROM). The M27V322 is in the programming mode when V G
VPP is at VIH and E is pulsed t o VIL. The data to
input is at 12.V,
PP
be programmed is applied to 16 b its in paralle l to the data output pins. The levels required for the address and data inputs are TTL. V
is specified
CC
to be 6.25V ± 0.25V.
7/13
Page 8
M27V322
Figure 6. MARGIN MODE AC Waveforms
V
CC
A8
A9
tA9HVPH tVPXA9X
GV
PP
E
A10 Set
A10 Reset
tVPHEL
tA10HEH
tA10LEH
tEXVPX
tEXA10X
AI00736B
Note: A8 High level = 5V ; A9 High level = 12V.
Figure 7. Programming and Verify Mod es AC Wavefor ms
A0-A20
Q0-Q15
V
CC
GV
PP
E
tAVEL
DATA IN DATA OUT
tQVEL
tVCHEL
tVPHEL
PROGRAM VERIFY
VALID
tEHQX
tEHVPX tELQV
tELEH
tEHAX
tEHQZ
tVPLEL
AI02205
Note: BYTE = VIH.
8/13
Page 9
Figure 8. Programming Flowchart
VCC = 6.25V, VPP = 12V
SET MARGIN MODE
n = 0
E = 50µs Pulse
NO
NO
VERIFY
YES
Last
NO
Addr
YES
RESET MARGIN MODE
CHECK ALL WORDS
1st: VCC = 5V
2nd: VCC = 3V
++ Addr
AI03059B
YES
++n
= 25
FAIL
PRESTO III P rog ra m mi ng Algorithm
The PRESTO III Programming Algorithm allows the whole array to be program ed with a guaran­teed margin in a typical time of 100 seconds. Pro­gramming with PRESTO I II con sists of a pplying a sequence of 50µs prog ram pulses to each word
until a correct verify occurs (see Figure 8). During programing and verify operation a MARGIN MODE circuit must be activated to guarantee that each cell is programed with enough margin. No overprogram pulse is applied since the verify in MARGIN MODE provides the necessary margin to each programmed cell.
Program Inhibit
Programming of multiple M27V322s in parallel with different data is also easily accomplished. Ex­cept for E
, all like inputs including GVPP of the par­allel M27V322 may be common. A TTL l ow level pulse applied to a M27V322's E 12V, will program that M27V322. A high level E
input and VPP at
in­put inhibits the ot her M27V322s from being pro­grammed.
Program Verify
A verify (read) should be performed on the pro­grammed bits to determine that they were correct­ly programmed. The verify is accomplished with
M27V322
GV
at VIL. Data should be verified with t
PP
ter the falling edge of E
.
On-B oard Programmi ng
The M27V 322 can be directly program med in t he application circuit. See the relevant Application Note AN620.
Electronic Signature
The Electronic Signature (ES) mode allows the reading out of a binary code from an EPROM that will identify its manufac turer and type. This m ode is intended for use by program ming equipme nt to automatically match the device to be programmed with its corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C am­bient temperature range that is required when pro­gramming the M27V322. To activate the ES mode, the programming equipment m ust force 11.5V to
12.5V on address line A9 of the M27V322, with = V
V
PP
= 5V. Two identifier bytes may then be
CC
sequenced from the device outputs by toggling ad­dress line A0 from V lines must be held at V
to VIH. All other address
IL
during Electronic Signa-
IL
ture mode. Byte 0 (A0 = V
code and byte 1 (A0 = V
) represents the manufacturer
IL
) the device identifier
IH
code. For the STMicroelectronics M27V322, these two identifier bytes are given in Table 4 and can be read-out on outputs Q0 to Q7.
ERASURE OPERATIO N (appl i es to UV EPROM)
The erasure characteristics of the M27V322 is such that erasure begins when the cells are ex­posed to light with waveleng ths shorter than ap­proximately 4000 Å. It should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å range. Research shows that constant exposure to room level fluo­rescent lighting could erase a typical M 27V322 in about 3 years, while it would take approximately 1 week to cause erasure when exposed to direct sunlight. If the M27V322 is to be exposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the M27V322 window to prevent unintentional era­sure. The recommended erasure procedure for M27V322 is exposure to short wave ultraviolet light which has a wav eleng th of 2537 Å. The inte­grated dose (i.e. UV intensity x exposure time) for erasure should be a minimum of 30 W-sec/cm The erasure time with this dosage is approximate­ly 30 to 40 minutes using an ultraviolet lamp with 12000 µW/cm
2
power rating. The M27V322 should be placed within 2.5cm (1 inch) of t he l amp tubes during the erasure. Some lamps have a filter on their tubes which should be removed before erasure.
ELQV
af-
2
.
9/13
Page 10
M27V322
Table 12. Ordering Information Scheme
Example: M27V322 -100 X F 1
Device Type
M27
Supply Voltage
V = 3.3V ±10%
Device Function
322 = 32 Mbit (2Mb x16)
Speed
-100 = 100 ns
-120 = 120 ns
-150 = 150 ns
V
Tolerance
CC
blank = 3.3V ±10% X = 3.3V ±5%
(1)
Package
F = FDIP42W P = PDIP42
Temperature Range
1 = 0 to 70 °C 6 = –40 to 85 °C
Note: 1. High Speed, see AC Characteristics section for further information .
For a list of available options (Speed, Pac kage, etc...) or for furthe r information on any aspect of this de­vice, please contact the STMicroelectronics Sales Office nearest to you.
Table 13. Revision History
Date Revision Details
July 1999 First Issue
Programming Flowchart changed (Figure 8)
02/09/00
PRESTO III Programming Algorithm paragraph changed FDIP42W Package Dimension, L Max added (Table 14)
10/13
Page 11
M27V322
Table 14. FDIP42W - 42 pin Ceramic Frit-seal DIP with window, Package Mechanic al Data
Symb
A 5.72 0.225 A1 0.51 1.40 0.020 0.055 A2 3.91 4.57 0.154 0.180 A3 3.89 4.50 0.153 0.177
B 0.41 0.56 0.016 0.022 B1 1.45 0.0 57
C 0.23 0.30 0.009 0.012
D 54.41 54.86 2.142 2.160 D2 5 0.80 2.000
E 15.24 0.600 – E1 14.50 14.90 0.571 0.587
e 2.54 0.100 – eA 14.99 0.590 – eB 16.18 18.03 0.637 0.710
L 3.18 4.10 0.125 0.161
S 1.52 2.49 0.060 0.098 K 8.00 0.3 15
K1 16.00 0.630
α 11° 11° N42 42
Typ Min Max Typ Min Max
mm inches
Figure 9. FDIP42W - 42 pin Ceramic Frit-seal DIP with window, Package Outline
A2
B1 B e1
A3
A1AL
α
C
eA
D2
eB
D
S
N
E1 E
K
1
Note: Drawing is not to scale.
K1
FDIPW-b
11/13
Page 12
M27V322
Table 15. PDIP42 - 42 pin Plastic DIP, 600 mils width, Package Mechanical Data
Symb mm inches
Typ Min Ma x Typ Min Max
A 5.0 8 0.200 A1 0.25 0. 010 – A2 3.56 4.06 0.140 0.160
B 0.38 0.53 0.015 0.021 B1 1.27 1.65 0.050 0.065
C 0.20 0.36 0.008 0.014
D 52.20 52.71 2.055 2.075 D2 5 0.80 2.000
E 15.24 0.600 – E1 13.59 13.84 0.535 0.545
e1 2.54 0.100 – eA 14.99 0.590 – eB 15.24 17.78 0.600 0.700
L 3.18 3.43 0.125 0.135 S 0.86 1.37 0.034 0.054 α 10° 10° N42 42
Figure 10. PDIP42 - 42 pin Plastic DIP, 600 mils width, Package Outline
A2
A1AL
B1 B e1
D2
α
C
eA eB
D
S
N
E1 E
Note: Drawing is not to scale.
12/13
1
PDIP
Page 13
M27V322
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implic ation or o therwise under any patent or patent rights of STMicroelectronics. Specifications menti oned in th i s publicati on ar e subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as c ri t i cal components in life support dev i ces or systems without express writ t en approval of STMicro el ectronics.
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