Datasheet M27C322 Datasheet (SGS Thomson Microelectronics)

Page 1
32 Mbit (2Mb x16) UV EPROM and OTP EPROM
5V ± 10% SUPPLY VOLTAGE in READ
OPERATION
ACCESS TIME: 80ns
WORD-WIDE CONFIGURABLE
32 Mbit MASK ROM REPLACEMENT
– Active Current 50mA at 5MHz – Stand-by Current 100µA
PROGRAMMING VOLTAGE: 12V ± 0.25V
PROGRAMMING TIME: 50µs/word
ELECTRONIC SIGNATURE
– Manufacturer Code: 0020h – Device Code: 0034h
DESCRIPTION
The M27C322 is a 32 Mbit EPROM of fe red i n the UV range (ultra violet erase). It is ideally suited for microprocessor systems requiring large data or program storage. It is organised as 2 MWords of 16 bit. The pin-out is compatible with a 32 Mbit Mask ROM.
The FDIP42W (window ceramic frit-seal package) has a transparent lid which all ows the user to ex­pose the chip to ultraviolet light to erase the bit pat­tern. A new pattern can then be written rapidly to the device by following the programming proce­dure.
For applications where the content is programmed only one time and erasure is not required, the M27C322 is offered in PDIP42 package.
42
1
FDIP42W (F) PDIP42 (P)
42
Figure 1. Logic Diagram
V
CC
21
A0-A20
GV
E
PP
M27C322
M27C322
1
16
Q0-Q15
V
SS
AI02156
1/13April 2000
Page 2
M27C322
Figure 2A. DIP Connections
A18 A19
GV
A7 A6 A5 A4 A3 A2 A1 A0
V
SS PP
Q0 Q8 Q1 Q9
Q10
Q3
Q11
1 2 3 4 5 6 7 8 9 10
M27C322
11
E
12 13 14 15 16 17 18 19 20 21
42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22
AI02157
A8A17 A9 A10 A11 A12 A13 A14 A15 A16 A20 V
SS
Q15 Q7 Q14 Q6 Q13 Q5Q2 Q12 Q4 V
CC
DEVICE OPERATION
The operating modes of the M27C322 are listed in the Operating Modes Table. A single power supply is required in the read mode. All inputs are TTL compatib le exce pt for V
and 12V on A9 for the
PP
Electronic Signature.
Read Mode
The M27C322 has a word-wide organization. Chip Enable (E used for device selection. Output Enable (G
) is the power control and should be
) is the output control and should be used to gate data to the output pins in dependent of device selection. Assuming that the addresses are s table, the ad­dress access time (t
) is equal to the delay
AVQV
Table 1. Signal Names
A0-A20 Address Inputs Q0-Q15 Data Outputs E
V
G
PP
V
CC
V
SS
from E to output (t output after a delay of t
VPP, assuming that E has been low an d the
of G addresses have been stable for at least t t
.
GLQV
Chip Enable Output Enable / Program Supply Supply Voltage Ground
). Data is available at the
ELQV
from the falling e dge
GLQV
AVQV
Standby Mode
The M27C322 has a standby mode which reduces
the supply current from 50mA to 100µA. The M27C322 is placed in the standby mode by apply­ing a CMOS high signal to the E
input.When in the standby mode, the outputs are in a high imped­ance state, independent of the G
VPP input.
Two Line Outp ut C ontrol
Because EPROMs are usually used in larger memory arrays, this product features a 2 line con­trol function which accommodates the use of mul­tiple memory connection. The two line control function allows:
a. the lowest possible memory power dissipation, b. complete assurance that output bus content ion
will not occur.
For the most efficient use of these two control lines, E ry device selecting function, while G
should be decoded and used as the prima-
VPP should be made a common connectio n to all devices in the array and connected to the READ
line from the system control bus. This ensures that all deselect­ed memory devices are in their low power standby mode and that the output pins are only active when data is required from a particular memory device.
-
2/13
Page 3
M27C322
Table 2. Absolute Maximum Ratings
(1)
Symbol Parameter Value Unit
T
A
T
BIAS
T
STG
(2)
V
IO
V
CC
(2)
V
A9
V
PP
Note: 1. Except for the ratin g " Operating Temperat ure Range" , stresses above th ose listed i n t he Table "Absolute Maximum Ratings" may
cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indi cated in t he Opera t in g sections of thi s specifi cation i s not imp l i ed. Exposure to Absolute M aximum Rating condi­tions for extended per iods may aff ect device reliabilit y. Refer also to the STMicroel ectronics SURE Program an d other relevan t qual ­ity docum en ts .
2. Minimum DC vo ltage on Input o r Outpu t is – 0.5V w ith poss ible un dershoot to –2. 0V fo r a peri od les s than 20ns. Ma ximum DC
voltage on Output is V
3. Depends on range.
Ambient Operating Temperature
Temperature Under Bias –50 to 125 °C Storage Temperature –65 to 150 °C
Input or Output Voltage (except A9) –2 to 7 V Supply Voltage –2 to 7 V A9 Voltage –2 to 13.5 V Program Supply Voltage –2 to 14 V
+0.5V with possible overshoot to VCC +2V for a period l ess than 20n s.
CC
(3)
–40 to 125 °C
Table 3. Operating Modes
Mode E
Read Output Disable Program Program Inhibit Standby Electronic Signature
Note: X = VIH or VIL, VID = 12V ± 0.5V.
V
IL
V
IL
V
Pulse V
IL
V
IH
V
IH
V
IL
GV
V
PP
V
IL
V
IH
PP
PP
A9 Q15-Q0
X Data Out X Hi-Z X Data In X Hi-Z
X X Hi-Z
V
IL
V
ID
Codes
Table 4. Electronic Signature
Identifier A0 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Hex Data
Manufacturer’s Code Device Code
Note: Outputs Q15-Q8 are set to '0' .
V V
IL
IH
00100000 20h 00110100 34h
3/13
Page 4
M27C322
Table 5. AC Measurement Conditions
High Speed Standard
Input Rise and Fall Times 10ns 20ns Input Pulse Voltages 0 to 3V 0.4V to 2.4V Input and Output Timing Ref. Voltages 1.5V 0.8V and 2V
Figure 3. AC Testing Input Output Waveform
High Speed
3V
1.5V
0V
Standard
2.4V
0.4V
Table 6. Capacitance
Symbol Parameter Test Condition Min Max Unit
C
IN
C
OUT
Note: 1. Sampled only, not 100% tested.
(1)
(TA = 25 °C, f = 1 MHz)
Input Capacitance Output Capacitance
2.0V
0.8V
AI01822
Figure 4. AC Testing Load Circuit
1.3V
DEVICE UNDER
TEST
CL = 30pF for High Speed CL = 100pF for Standard CL includes JIG capacitance
V
= 0V
IN
V
= 0V
OUT
1N914
3.3k
CL
10 pF 12 pF
OUT
AI01823B
System Considerations
The power switching characteristics of Advanced CMOS EPROMs require careful decoupling of the supplies to the devices. The supply current ICC has three segments of importance to the system designer: the standby current, the active current and the transient peaks that are produc ed by the falling and rising edges of E
. The magnitude of the transient current peaks is dependent on the ca­pacitive and inductive loadi ng of the device out­puts. The associated transient voltage peaks can be suppressed by complying with the two line out-
4/13
put control and by properly selected decoupling capacitors. It is recommended that a 0.1µF ceram­ic capacitor is used on every device between V
CC
and VSS. This should be a high frequency type of low inherent inductance and should be placed as close as possible to the device. In addition, a
4.7µF electrolytic capacitor should be used be­tween V
and VSS for every eight devices. This
CC
capacitor should be mounted near the power sup­ply connection point. The purpose of this capacitor is to overcome the voltage d r op caus ed by the in­ductive effects of PC B traces.
Page 5
M27C322
Table 7. Read Mode DC Characteristics
(1)
(TA = 0 to 70 °C, –40 to 85 °C or –40 to 125 °C; VCC = 5V ± 10%; VPP = VCC)
Symbol Parameter Test Condition Min Max Unit
I
I
I
CC
I
CC
I
CC
I V
V
IH
V
V
Note: 1. VCC must be ap pl i e d simultaneously with or before VPP and removed simultaneously or af ter VPP.
Input Leakage Current
LI
Output Leakage Curren t
LO
= VIL, GVPP = VIL, I
E
Supply Current
= VIL, GVPP = VIL, I
E
1
Supply Current (Standby) TTL
2
Supply Current (Standby) CMOS Program Current
PP
Input Low Voltage –0.3 0.8 V
IL
(2)
Input High Voltage 2 Output Low Voltage
OL
Output High Voltage TTL
OH
2. Maximum DC voltage on Outp ut is V
CC
+0.5 V.
0v V
IN ≤ VCC
0V ≤ V
OUT ≤ VCC
f = 8MHz
f = 5MHz
E = V
IH
E > VCC – 0.2V
V
= V
PP
CC
I
= 2.1mA
OL
I
= –400µA
OH
OUT
OUT
= 0mA,
= 0mA,
±1 µA
±10 µA
70 mA
50 mA
1mA
100 µA
10 µA
V
+ 1
CC
0.4 V
2.4 V
V
Table 8. Read Mode AC Characteristics
(1)
(TA = 0 to 70 °C, –40 to 85 °C or –40 to 125 °C; VCC = 5V ± 10%; VPP = VCC)
Symbol Alt Parameter Test Condition
t
AVQVtACC
t
ELQV
t
GLQV
(2)
t
EHQZ
(2)
t
GHQZ
t
AXQX
Note: 1. VCC must be ap pl i e d simultaneously with or before VPP and removed simultaneously or af ter V
2. Sampled only, not 100% tested.
3. Speed obtained with High Speed AC measurement co nditions.
Address Valid to Output Valid
t
Chip Enable Low to Output Valid
CE
t
Output Enable Low to Output Valid
OE
t
Chip Enable High to Output Hi-Z
DF
t
Output Enable High to Output Hi-Z
DF
Address Transition to Output
t
OH
Transition
E
= VIL, GVPP = V
G
VPP = V
E
= V
IL
G
VPP = V
E
= V
IL
= VIL, GVPP = V
E
IL
IL
-80
Min Max Min Max
IL
0 40 0 40 ns 0 40 0 40 ns
55ns
IL
M27C322
(3)
-100
80 100 ns 80 100 ns 40 50 ns
PP
Unit
5/13
Page 6
M27C322
Figure 5. Read Mode AC Waveforms
A0-A20
E
GV
PP
Q0-Q15
VALID
tAVQV
tGLQV
tELQV
Table 9. Programming Mode DC Characteri stics
tAXQX
(1)
VALID
tEHQZ
tGHQZ
Hi-Z
AI02207
(TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12V ± 0.25V)
Symbol Parameter Test Condition Min Max Unit
V
I
I
CC
I
PP
V
V V V
OH
V
Note: 1. VCC must be ap pl i e d simultaneously with or before VPP and removed simultaneously or af ter VPP.
Input Leakage Current
LI
Supply Current 50 mA Program Current Input Low Voltage –0.3 0.8 V
IL
Input High Voltage 2.4
IH
Output Low Voltage
OL
Output High Voltage TTL A9 Voltage 11.5 12.5 V
ID
VIN V
IL
E
= V
I
= 2.1mA
OL
I
= –2.5mA
OH
IH
IL
±10 µA
50 mA
V
+ 0.5
CC
0.4 V
3.5 V
V
6/13
Page 7
M27C322
Table 10. MARGIN MODE AC Characteristics
(1)
(TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12V ± 0.25V)
Symbol Alt Parameter Test Condition Min Max Unit
t
A9HVPH
t
VPHEL
t
A10HEH
t
A10LEH
t
EXA10X
t
EXVPX
t
VPXA9X
Note: 1. VCC must be ap pl i e d simultaneously with or before VPP and removed simultaneously or af ter VPP.
Table 11. Programming Mode AC Characteristics
(TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12V ± 0.25V)
Symbol Alt Parameter Test Condition Min Max Un it
t
AVEL
t
QVEL
t
VCHEL
t
VPHEL
t
VPLVPH
t
ELEH
t
EHQX
t
EHVPX
t
VPLEL
t
ELQV
t
EHQZ
t
EHAX
Note: 1. VCC must be ap pl i e d simultaneously with or before VPP and removed simultaneously or af ter VPP.
2. Sampled only, not 100% tested.
(2)
t
t
t
AS10VA10
t
AS10VA10
t
AH10
t t
VA9 High to VPP High
AS9
VPP High to Chip Enable Low
VPS
Chip Enable Transition to V Chip Enable Transition to VPP Transition
VPH
VPP Transition to VA9 Transition
AH9
t
AS
t
DS
t
VCS
t
OES
t
PRT
t
PW
t
DH
t
OEH
t
VR
t
DV
t
DFP
t
AH
2 µs
s High to Chip Enable High (Set) Low to Chip Enable High (Reset)
Transition
A10
s
s
s
s
s
(1)
Address Valid to Chip Enable Low 1 µs Input Valid to Chip Enable Low 1 µs VCC High to Chip Enable Low VPP High to Chip Enable Low VPP Rise Time
s 1µs
50 ns Chip Enable Program Pulse Width (Initial) 45 55 µs Chip Enable High to Input Transition 2 µs Chip Enable High to VPP Transition VPP Low to Chip Enable Low
s 1µs
Chip Enable Low to Output Valid 1 µs Chip Enable High to Output Hi-Z 0 130 ns Chip Enable High to Address Transition 0 ns
Programming
When delivered (and after each erasure for UV EPROM), all bits of the M27C322 a re in the "1" state. Data is introduced by selectively program ­ming "0"s into the desired bit locations. Although only "0"s will be programmed, both "1"s and "0"s can be present in the dat a word. The on ly way to change a "0" to a "1" is by die exposition to ultravi-
olet light (UV EPROM). The M27C322 is in the programming mode when V G
VPP is at VIH and E is pulsed t o VIL. The data to
input is at 12.V,
PP
be programmed is applied to 16 b its in paralle l to the data output pins. The levels required for the address and data inputs are TTL. V
is specified
CC
to be 6.25V ± 0.25V.
7/13
Page 8
M27C322
Figure 6. MARGIN MODE AC Waveforms
V
CC
A8
A9
tA9HVPH tVPXA9X
GV
PP
E
A10 Set
A10 Reset
tVPHEL
tA10HEH
tA10LEH
tEXVPX
tEXA10X
AI00736B
Note: A8 High level = 5V; A9 High level = 12V.
Figure 7. Programming and Verify Mod es AC Wavefor ms
A0-A20
Q0-Q15
V
CC
GV
PP
E
tAVEL
DATA IN DATA OUT
tQVEL
tVCHEL
tVPHEL
PROGRAM VERIFY
VALID
tEHQX
tEHVPX tELQV
tELEH
tEHAX
tEHQZ
tVPLEL
AI02205
Note: BYTE = VIH.
8/13
Page 9
M27C322
Figure 8. Programming Flowchart
VCC = 6.25V, VPP = 12V
SET MARGIN MODE
n = 0
E = 50µs Pulse
NO
NO
VERIFY
YES
Last
NO
Addr
YES
RESET MARGIN MODE
CHECK ALL WORDS
1st: VCC = 6V
2nd: VCC = 4.2V
++ Addr
AI02206
YES
++n
= 25
FAIL
PRESTO III P rog ra m mi ng Algorithm
The PRESTO III Programming Algorithm allows the whole array to be program ed with a guaran­teed margin in a typical time of 100 seconds. Pro­gramming with PRESTO I II con sists of a pplying a sequence of 50µs prog ram pulses to each word
until a correct verify occurs (see Figure 8). During programing and verify operation a MARGIN MODE circuit must be activated to guarantee that each cell is programed with enough margin. No overprogram pulse is applied since the verify in MARGIN MODE provides the necessary margin to each programmed cell.
Program Inhibit
Programming of multiple M27C322s in parallel with different data is also easily accomplished. Ex­cept for E
, all like inputs including GVPP of the par­allel M27C322 may be common. A TTL low level pulse applied to a M27C322's E 12V, will program that M27C322. A high level E
input and VPP at
in­put inhibits the other M27C3 22s from being pro­grammed.
Program Verify
A verify (read) should be performed on the pro­grammed bits to determine that they were correct­ly programmed. The verify is accomplished with
GV
at VIL. Data should be verified with t
PP
ter the falling edge of E
.
ELQV
af-
On-B oard Programming
The M27C322 can be directly programmed in the application circuit. See the relevant Application Note AN620.
Electronic Signature
The Electronic Signature (ES) mode allows the reading out of a binary code from an EPROM that will identify its manufac turer and type. This m ode is intended for use by program ming equipme nt to automatically match the device to be programmed with its corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C am­bient temperature range that is required when pro­gramming the M27C322. To activate the ES mode, the programming equipment must force
11.5V to 12.5V on address line A9 of the M27C322, with V
PP
= V
= 5V. Two identifier
CC
bytes may then be sequenced from the device out­puts by toggling address line A0 from V other address lines must be held at V
to VIH. All
IL
during
IL
Electronic Signature mode. Byte 0 (A0 = V
code and byte 1 (A0 = V
) represents the manufacturer
IL
) the device identifier
IH
code. For the STMicroelectronics M27C322, these two identifier bytes are given in Table 4 and can be read-out on outputs Q0 to Q7.
ERASURE OPERATIO N (appl i es to UV EPROM)
The erasure characteristics of the M27C322 is such that erasure begins when the cells are ex­posed to light with waveleng ths shorter than ap­proximately 4000 Å. It should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å range. Research shows that constant exposure to room level fluo­rescent lighting could erase a typical M27C322 in about 3 years, while it would take approximately 1 week to cause erasure when exposed to direct sunlight. If the M27C322 is to be exposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the M27C322 window to prevent unintentional era­sure. The recommended erasure procedure for M27C322 is exposure to short wave ultraviolet light which has a wav eleng th of 2537 Å. The inte­grated dose (i.e. UV intensity x exposure time) for erasure should be a minimum of 30 W-sec/cm The erasure time with this dosage is approximate­ly 30 to 40 minutes using an ultraviolet lamp with 12000 µW/cm
2
power rating. The M27C322 should be placed within 2.5cm (1 inch) of t he l amp tubes during the erasure. Some lamps have a filter on their tubes which should be removed before erasure.
2
.
9/13
Page 10
M27C322
Table 12. Ordering Information Scheme
Example: M27C322 -80 F 1
Device Type
M27
Supply Voltage
C = 5V ±10%
Device Function
322 = 32 Mbit (2Mb x16)
Speed
(1)
-80
= 80 ns
-100 = 100 ns
Package
F = FDIP42W P = PDIP42
Temperature Range
1 = 0 to 70 °C 3 = –40 to 125 °C 6 = –40 to 85 °C
Note: 1. High Speed, see AC Characteris tics secti on for further i n f ormation.
For a list of available options (Speed, Pac kage, etc...) or for furthe r information on any aspect of this de­vice, please contact the STMicroelectronics Sales Office nearest to you.
Table 13. Revision History
Date Revision Details
July 1999 First Issue
02/24/00
04/04/00
Programming Time changed Programming Flowchart changed (Figure 8) Presto III Programming Algorithm paragraph changed
–40 to 85 °C and –40 to 125 °C temperature ranges added (Table 7, 8 and 12) 80ns speed class in High Speed AC measurement conditions
10/13
Page 11
M27C322
Table 14. FDIP42W - 42 pin Ceramic Frit-seal DIP with window, Package Mechanic al Data
Symbol
Typ Min Max Typ M in Max
A 5.72 0.225 A1 0.51 1.40 0.020 0.055 A2 3.91 4.57 0.154 0.180 A3 3.89 4.50 0.153 0.177
B 0.41 0.56 0.016 0.022 B1 1.45 0.0 57
C 0.23 0.30 0.009 0.012
D 54.41 54.86 2.142 2.160 D2 5 0.80 2.000
E 15.24 0.600 – E1 14.50 14.90 0.571 0.587
e 2.54 0.100 – eA 14.99 0.590 – eB 16.18 18.03 0.637 0.710
L 3.18 4.10 0.125 0.161
S 1.52 2.49 0.060 0.098 K 8.00 0.3 15
K1 16.00 0.630
α 11° 11° N42 42
mm inches
Figure 9. FDIP42W - 42 pin Ceramic Frit-seal DIP with window, Package Outline
A2
B1 B e1
A3
A1AL
α
C
eA
D2
eB
D
S
N
E1 E
K
1
Note: Drawing is not to scale.
K1
FDIPW-b
11/13
Page 12
M27C322
Table 15. PDIP42 - 42 pin Plastic DIP, 600 mils width, Package Mechanical Data
Symbol
Typ Min Max Typ M in Max
A 5.0 8 0.200 A1 0.25 0. 010 – A2 3.56 4.06 0.140 0.160
B 0.38 0.53 0.015 0.021 B1 1.27 1.65 0.050 0.065
C 0.20 0.36 0.008 0.014
D 52.20 52.71 2.055 2.075 D2 5 0.80 2.000
E 15.24 0.600 – E1 13.59 13.84 0.535 0.545
e1 2.54 0.100 – eA 14.99 0.590 – eB 15.24 17.78 0.600 0.700
mm inches
L 3.18 3.43 0.125 0.135 S 0.86 1.37 0.034 0.054 α 10° 10° N42 42
Figure 10. PDIP42 - 42 pin Plastic DIP, 600 mils width, Package Outline
A2
A1AL
B1 B e1
D2
α
C
eA
eB
D
S
N
E1 E
Note: Drawing is not to scale.
12/13
1
PDIP
Page 13
M27C322
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