Datasheet M27C320 Datasheet (SGS Thomson Microelectronics)

Page 1
32 Mbit (4Mb x8 or 2Mb x16) OTP EPROM
5V ± 10% SUPPLY VOLTAGE in READ
OPERATION
BYTE-WIDE or WORD-WIDE
CONFIGURABLE
32 MbitMASK ROM REPLACEMENT
LOW POWER CONSUMPTION
– Active Current70mA at 8MHz – Stand-by Current 100mA
PROGRAMMING VOLTAGE: 12V ± 0.25V
PROGRAMMING TIME: 100µs/byte
(typical)(PRESTO III Algorithm)
ELECTRONIC SIGNATURE:
– Manufacturer Code0020h – Device Code: 0032h
M27C320
PRELIMINARY DATA
44
1
SO44 (M) TSOP48 (N)
12 x20 mm
Figure 1. Logic Diagram
DESCRIPTION
The M27C320 is a 32 Mbit EPROM offered in the OTP range (one time programmable). It is ideally suited for microprocessor systems requiring large data or program storage. It is organised as either 4 MWords of 8 bit or 2 MWords of 16 bit. The pin­out is compatible with the 32 Mbit Mask ROM.
The M27C320 is offered in TSOP48 (12 x 20mm) and SO44 packages.
Table 1. Signal Names
A0-A20 Address Inputs Q0-Q7 Data Outputs Q8-Q14 Data Outputs Q15A–1 Data Output / Address Input E Chip Enable GV
PP
BYTE Byte-Wide Select V
CC
V
SS
Output Enable / Program Supply
Supply Voltage Ground
A0-A20
GV
PP
V
CC
21
Q15A–1
15
Q0-Q14
E
M27C320
BYTE
V
SS
AI02152
September 1998
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
1/15
Page 2
M27C320
Figure 2A. SO Pin Connections
NC A20
1 2
A7 A6 A5 A4 A3 A2 A1 A0
3 4 5 6 7 8 9 10 11 12
M27C320
E
13 14 15 16
A17 A8
V
SS
GV
PP Q0
Q8
17Q1
Q9
18 19
Q10
Q3
20 21
Q11
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 2322
AI02153
A19A18
A9 A10 A11 A12 A13 A14 A15 A16 BYTE V
SS
Q15A–1 Q7 Q14 Q6 Q13 Q5Q2 Q12 Q4 V
CC
Figure 2B. TSOP Pin Connections
BYTE
A16 A15 A14 A13 A12
A10
A9 A8
A19
V
SS
A20 A18 A17
A7 A6 A5 A4
A2 A1 A0
1
12
M27C320
13
24 25
E
48
37 36
AI02154
V
SS
V
SS
Q15A–1 Q7 Q14 Q6 Q13A11 Q5 Q12 Q4 V
CC
V
CC
V
SS
Q11 Q3 Q10 Q2 Q9 Q1 Q8A3 Q0 GV
PP
V
SS
V
SS
Warning: NC = Not Connected.
Table 2. Absolute Maximum Ratings
Symbol Parameter Value Unit
T
A
T
BIAS
T
STG
(2)
V
IO
V
CC
(2)
V
A9
V
PP
Note: 1. Except for the rating ”Operating Temperature Range”, stresses above those listedin the Table ”Absolute Maximum Ratings” may
2/15
cause permanent damage to the device. These are stress ratings only and operation of the device atthese or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating condi­tions for extended periodsmay affect device reliability. Referalso to theSTMicroelectronics SUREProgram and other relevant qual­ity documents.
2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than 20ns. Maximum DC voltage on Output is V
3. Depends on range.
Ambient Operating Temperature Temperature Under Bias –50 to 125 °C Storage Temperature –65 to 150 °C
Input or Output Voltage (except A9) –2 to 7 V Supply Voltage –2 to 7 V A9 Voltage –2 to 13.5 V Program Supply Voltage –2 to 14 V
+0.5V with possible overshoot to VCC+2V for a period less than 20ns.
CC
(1)
(3)
–40 to 125 °C
Page 3
Table 3. Operating Modes
Mode E GV
Read Word-wide Read Byte-wide Upper V Read Byte-wide Lower Output Disable Program Program Inhibit Standby Electronic Signature
Note: X = VIHor VIL,VID= 12V ± 0.5V.
V
V V
V
Pulse V
IL
V
IH
V
IH
V
PP
IL
IL
IL
IL
IL
V
IL
V
IL
V
IL
V
IH
PP
V
PP
X X X Hi-Z Hi-Z Hi-Z
V
IL
BYTE A9 Q0-Q7 Q8-Q14 Q15A–1
V
IH
V
IL
V
IL
X X Hi-Z Hi-Z Hi-Z
V
IH
V
IH
V
IH
X Data Out Data Out Data Out X Data Out Hi-Z V X Data Out Hi-Z
X Data In Data In Data In X Hi-Z Hi-Z Hi-Z
V
ID
Codes Codes Code
Table 4. Electronic Signature
Identifier A0 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Hex Data
Manufacturer’s Code Device Code V
Note: Outputs Q8-Q15 are set to ’0’.
V
IL
IH
00100000 20h 00110010 32h
M27C320
IH
V
IL
DEVICE OPERATION
The operatingmodes ofthe M27C320 are listed in the OperatingModes Table.A single power supply is required in the read mode. All inputs are TTL compatible except for VPPand 12V on A9 for the Electronic Signature.
Read Mode
The M27C320 has two organisations, Word-wide and Byte-wide.The organisationis selected by the signal level ontheBYTE pin. WhenBYTE is at V
IH
the Word-wide organisation is selected and the Q15A–1 pin is used for Q15 Data Output. When the BYTE pin is at VILthe Byte-wide organisation is selected andthe Q15A–1 pin is used for the Ad­dress Input A–1. When the memory is logically re­garded as 16 bit wide, but read in the Byte-wide organisation, then with A–1 at VILthe lower 8 bits of the 16 bit data are selected and with A–1at V
IH
the upper 8 bits of the 16 bit data are selected.
The M27C320 has two control functions, both of which must be logically active in order to obtain data at the outputs. In addition the Word-wide or Byte-wide organisation must be selected.
Chip Enable (E) is thepower control andshould be used fordevice selection.Output Enable (G) is the output control and should be used to gate data to the output pins independent of device selection. Assuming that the addresses are stable, the ad­dress access time (t from E to output (t
ELQV
output after a delay of t
) is equal to the delay
AVQV
). Data is available at the
from the falling edge
GLQV
of G, assuming that E has been low and the ad­dresseshave beenstable for atleast t
AVQV-tGLQV
Standby Mode
The M27C320 has standby mode which reduces the supply current from 50mA to 100µA. The M27C320 is placedin the standby modeby apply­ing aCMOS high signal to the Einput. Whenin the standby mode, the outputs are in a high imped­ance state, independent of the G input.
.
3/15
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M27C320
Table 5. AC Measurement Conditions
High Speed Standard
Input Rise and Fall Times 10ns 20ns Input Pulse Voltages 0 to 3V 0.4V to 2.4V Input and Output Timing Ref. Voltages 1.5V 0.8V and 2V
Figure 3. Testing Input Output Waveform
High Speed
3V
1.5V
0V
Standard
2.4V
0.4V
Table 6. Capacitance
(1)
(TA=25°C, f = 1 MHz)
2.0V
0.8V
AI01822
Figure 4. AC Testing Load Circuit
1.3V
1N914
3.3k
DEVICE UNDER
TEST
C
L
CL= 30pF for High Speed CL= 100pF for Standard CLincludes JIG capacitance
Symbol Parameter Test Condition Min Max Unit
V
C
IN
C
OUT
Note: 1. Sampled only,not 100% tested.
Input Capacitance Output Capacitance V
=0V
IN
=0V 12 pF
OUT
10 pF
OUT
AI01823B
Two Line Output Control
Because EPROMs are usually used in larger memory arrays, this product features a 2 line con­trol function which accommodates the use of mul­tiple memory connection. The two line control function allows:
a. the lowest possible memory power dissipation, b. complete assurance that output bus contention
will not occur.
4/15
For the most efficient use of these two control lines, Eshould be decoded and used astheprima­ry device selecting function, while G should be made a common connection to all devices in the array and connected to the READ line from the system control bus. This ensures that all deselect­ed memory devices are in their low power standby mode and that the output pins are only active when data is required from a particular memory device.
Page 5
M27C320
Table 7. Read Mode DC Characteristics
(1)
(TA= 0 to 70 °C; VCC=5V±10%)
Symbol Parameter Test Condition Min Max Unit
I
I
I
CC
I
CC
I
CC
I V
V
IH
V
V
Note: 1. VCCmust be applied simultaneously with or before VPPand removed simultaneously or after VPP.
Input Leakage Current
LI
Output Leakage Current
LO
Supply Current
1
Supply Current (Standby) TTL
2
Supply Current (Standby) CMOS Program Current
PP
Input Low Voltage –0.3 0.8 V
IL
(2)
Input High Voltage 2 Output Low Voltage
OL
Output High Voltage TTL
OH
2. Maximum DC voltage on Output is V
CC
+0.5V.
E=V
E=V
0V V
IL
IL
0V V
,G=VIL,I
,G=VIL,I
E>VCC– 0.2V
I
IN
OUT
f = 8MHz
f = 5MHz
E=V
V
PP=VCC
I
= 2.1mA
OL
=–400µA
OH
V
V
IH
OUT
OUT
CC
CC
= 0mA,
= 0mA,
2.4 V
±1 µA
±10 µA
70 mA
50 mA
1mA
100 µA
10 µA
V
+1
CC
0.4 V
V
System Considerations
The power switching characteristics of Advanced CMOS EPROMs require carefull decoupliing of the suppliesto the devices. The supply current I
CC
has three segments of importance to the system designer: the standby current, the active current and the transient peaks that are produced by the falling and rising edges of E.
The magnitude of the transient current peaks is dependant on the capacititive and inductive load­ing of the device outputs. The associatedtransient voltage peaks can be supressed by complying with the two line output control and byproperly se­lected decoupling capacitors. It is recommended that a 0.1µF ceramic capacitor is used on every device between VCCand VSS. This should be a high frequency type of low inherent inductance and should be placed as close as possible to the device. In addition, a 4.7µF electrolytic capacitor
should be used between VCCand VSSfor every eight devices. This capacitor should be mounted near the power supply connection point. The pur­pose of this capacitor is to overcome the voltage drop caused by the inductive effects of PCB trac­es.
Programming
When delivered, allbits of the M27C320 arein the ’1’ state. Data is introduced by selectively pro­gramming ’0’s into the desired bit locations. Al­though only ’0’s will be programmed, both ’1’s and ’0’s can be present in the data word. The M27C320 is in the programming mode when V
PP
input is at 12.5V, G is at VIHand Eis pulsedto VIL. The data to be programmed isapplied to 16 bitsin parallel to the data outputpins. Thelevels required for the address and data inputs are TTL. VCCis specified to be 6.25V ± 0.25V.
5/15
Page 6
M27C320
Table 8. Read Mode AC Characteristics
(1)
(TA= 0 to 70 °C; VCC=5V±10%)
M27C320
Symbol Alt Parameter Test Condition
t
AVQVtACC
t
BHQV
t
ELQV
t
GLQV
(2)
t
BLQZ
(2)
t
EHQZ
(2)
t
GHQZ
t
AXQX
t
BLQX
Note: 1. VCCmust be applied simultaneously with or before VPPand removed simultaneously or after V
2. Sampled only, not 100% tested.
Address Valid to Output Valid
t
BYTE High to Output Valid
ST
Chip Enable Low to Output
t
CE
Valid Output Enable Low to
t
OE
Output Valid
t
BYTE Low to Output Hi-Z
STD
Chip Enable High to Output
t
DF
Hi-Z Output Enable High to
t
DF
Output Hi-Z Address Transition to
t
OH
Output Transition BYTE Low to Output
t
OH
Transition
E=V
E=V
G=V
E=V
E=V
G=V
E=V
E=V
E=V
,G=V
IL
,G=V
IL
IL
,G=V
IL
IL
,G=V
IL
,G=V
IL
IL
IL
IL
IL
IL
IL
IL
-80 -100 -120
Min Max Min Max Min Max
80 100 120 ns
80 100 120 ns
80 100 120 ns
40 50 60 ns
40 40 50 ns
0 40 0 40 0 50 ns
0 40 0 40 0 50 ns
555ns
555ns
Unit
PP
Figure 5. Word-Wide Read Mode AC Waveforms
A0-A20
E
GV
Q0-Q15
Note: BYTE = VIH.
PP
VALID
tAVQV
tGLQV
tELQV
VALID
tAXQX
tEHQZ
tGHQZ
Hi-Z
AI02207
6/15
Page 7
Figure 6. Byte-Wide Read Mode AC Waveforms
M27C320
A0-A20
E
GV
Q0-Q7
Note: BYTE = VIH.
PP
VALID
tAVQV
tGLQV
tELQV
Figure 7. BYTE Transition AC Waveforms
A0-A20
VALID
tAXQX
tEHQZ
tGHQZ
Hi-Z
AI02218
VALID
A–1
tAVQV
BYTE
Q0-Q7
tBLQX
Q8-Q15
tBLQZ
Note: Chip Enable (E) and Output Enable (G) = VIL.
VALID
Hi-Z
tAXQX
tBHQV
DATA OUT
DATA OUT
AI02219
7/15
Page 8
M27C320
Table 9. Programming Mode DC Characteristics
(1)
(TA=25°C; VCC= 6.25V ± 0.25V; VPP= 12V ± 0.25V)
Symbol Parameter Test Condition Min Max Unit
I
LI
I
CC
I
PP
V V
V
OL
V
OH
V
Note: 1. VCCmust be applied simultaneously with or before VPPand removed simultaneously or after VPP.
Input Leakage Current Supply Current 50 mA Program Current Input Low Voltage –0.3 0.8 V
IL
Input High Voltage 2.4 VCC+ 0.5 V
IH
Output Low Voltage Output High Voltage TTL IOH= –2.5mA 3.5 V A9 Voltage 11.5 12.5 V
ID
Table 10. MARGINMODE AC Characteristics
(1)
V
IL
I
OL
VIN≤ V
E=V
IL
= 2.1mA
IH
±10 µA
50 mA
0.4 V
(TA=25°C; VCC= 6.25V ± 0.25V; VPP= 12V ± 0.25V)
Symbol Alt Parameter Test Condition Min Max Unit
t
A9HVPH
t
VPHEL
t
A10HEH
t
A10LEH
t
EXA10X
t
EXVPX
t
VPXA9X
Note: 1. VCCmust be applied simultaneously with or before VPPand removed simultaneously or after VPP.
t t
t
AS10VA10
t
AS10VA10
t
AH10
t t
VA9High to VPPHigh
AS9
VPSVPP
Chip Enable Transition to V Chip Enable Transition to VPPTransition 2 µs
VPH
VPPTransition to VA9Transition
AH9
High to Chip Enable Low
High to Chip Enable High (Set) Low to Chip Enable High (Reset)
Transition
A10
2 µs 2 µs 1 µs 1 µs 1 µs
2 µs
8/15
Page 9
M27C320
Table 11. ProgrammingMode AC Characteristics
(1)
(TA=25°C; VCC= 6.25V ± 0.25V; VPP= 12V ± 0.25V)
Symbol Alt Parameter TestCondition Min Max Unit
t
AVEL
t
QVEL
t
VCHEL
t
VPHEL
t
VPLVPH
t
ELEH
t
EHQX
t
EHVPX
t
VPLEL
t
ELQV
(2)
t
EHQZ
t
EHAX
Note: 1. VCCmust be applied simultaneously with or before VPPand removed simultaneously or after VPP.
2. Sampled only, not 100% tested.
t t
t
VCS
t
OES
t
PRT
t
PW
t
t
OEH
t t
t
DFP
t
Address Valid to Chip Enable Low 1 µs
AS
Input Valid to Chip Enable Low 1 µs
DS
VCCHigh to Chip Enable Low VPPHigh to Chip Enable Low
2 µs
1 µs VPPRise Time 50 ns Chip Enable Program Pulse Width (Initial) 45 55 µs Chip Enable High to Input Transition 2 µs
DH
Chip Enable High to VPPTransition VPPLow to Chip Enable Low
VR
Chip Enable Low to Output Valid 1 µs
DV
2 µs
1 µs
Chip Enable High to Output Hi-Z 0 130 ns Chip Enable High to Address Transition 0 ns
AH
Figure 8. MARGIN MODE AC Waveforms
V
CC
A8
A9
tA9HVPH tVPXA9X
GV
PP
E
A10 Set
A10 Reset
tVPHEL
tA10HEH
tA10LEH
tEXVPX
tEXA10X
AI00736B
Note: A8 High level = 5V; A9 High level = 12V.
9/15
Page 10
M27C320
Figure 9. Programmingand Verify Modes AC Waveforms
A0-A20
tAVEL
Q0-Q15
tQVEL
V
CC
tVCHEL
GV
PP
tVPHEL
E
Note: BYTE = VIH.
Figure 10. Programming Flowchart
NO
YES
VCC= 6.25V, VPP=
SET MARGIN MODE
++n
=25
FAIL
CHECK ALL WORDS
n=0
E=50µs Pulse
NO
VERIFY
Last
Addr
BYTE = VIH
1st: VCC=6V
2nd: VCC= 4.2V
12V
++ Addr
YES
NO
YES
VALID
DATA IN DATA OUT
tEHQX
tEHVPX tELQV
tVPLEL
tELEH
PROGRAM VERIFY
PRESTO III Programming Algorithm
The PRESTO III Programming Algorithm allows the whole array to be programed with a guaran­teed margin in a typical time of 100 seconds. Pro­gramming with PRESTO III consists of applying a sequence of 50µs program pulses to each word until a correct verify occurs (see Figure 10). During programing and verify operation a MARGIN MODE circuit is automatically activated to guaran­tee that each cell is programed with enough mar­gin. No overprogram pulse is applied since the verify in MARGIN MODE provides theneccessary margin to each programmed cell.
Program Inhibit
Programming of multiple M27C320s in parallel with differentdata is also easily accomplished.Ex­cept for E, all likeinputs including G of theparallel M27C320 may becommon. A TTL low level pulse applied to a M27C320’s E input and VPPat 12V, will program that M27C320. A high level Einput in­hibits the other M27C320s from being pro­grammed.
Program Verify
A verify (read) should be performed on the pro­grammed bitsto determinethat they were correct-
AI02220
ly programmed. The verify is accomplished with G at VIL. Data should be verified with t falling edge of E.
tEHAX
tEHQZ
AI02205
ELQV
after the
10/15
Page 11
M27C320
On-Board Programming
The M27C320 can be directly programmed in the application circuit. See the relevant Application Note AN620.
Electronic Signature
The Electronic Signature (ES) mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and type. This mode is intended for use by programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C am­bient temperaturerange that is required when pro-
gramming the M27C320. To activate the ES mode, the programming equipment must force
11.5V to 12.5V on address line A9 of the M27C320, with VPP=VCC=5V. Two identifier bytes may then be sequenced from the device outputs by togglingaddress line A0 from VILtoVIH. Alloth­er address lines must be held at VILduring Elec­tronic Signature mode.
Byte 0 (A0=VIL) representsthe manufacturer code and byte1 (A0=VIH) the device identifier code. For the STMicroelectronicsM27C320, these two iden­tifier bytes are given in Table 4 and can be read­out on outputs Q0 to Q7.
11/15
Page 12
M27C320
Table 12. Ordering Information Scheme
Example: M27C320 -80 M 1
Device Type
Operating Voltage
C = 4.5V to 5.5V
Speed
-80 = 80 ns
-100 = 100 ns
-120 = 120 ns
Package
M = SO44 N = TSOP48: 12 x 20mm
Temperature Range
1 = –0 to 70 °C
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this de­vice, please contact the ST Sales Office nearest to you.
12/15
Page 13
M27C320
Table 13. SO44 - 44 lead Plastic Small Outline, 525 mils body width, Package Mechanical Data
Symb
A 2.42 2.62 0.095 0.103 A1 0.22 0.23 0.009 0.010 A2 2.25 2.35 0.089 0.093
B 0.50 0.020
C 0.10 0.25 0.004 0.010
D 28.10 28.30 1.106 1.114
E 13.20 13.40 0.520 0.528
e 1.27 0.050
H 15.90 16.10 0.626 0.634
L 0.80 0.031 α 3° ––3°–– N44 44
CP 0.10 0.004
Typ Min Max Typ Min Max
mm inches
Figure 11. SO44 - 44 lead Plastic Small Outline, 525 mils body width, Package Outline
A2
A
C
B
e
CP
D
N
E
H
1
LA1 α
SO-b
Drawing is not to scale.
13/15
Page 14
M27C320
Table 14. TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Mechanical Data
Symb
Typ Min Max Typ Min Max
A 1.20 0.047
A1 0.05 0.15 0.002 0.006 A2 0.95 1.05 0.037 0.041
B 0.17 0.27 0.007 0.011 C 0.10 0.21 0.004 0.008 D 19.80 20.20 0.780 0.795
D1 18.30 18.50 0.720 0.728
E 11.90 12.10 0.469 0.476
e 0.50 - - 0.020 - -
L 0.50 0.70 0.020 0.028 α 0° 5° 0° 5° N48 48
CP 0.10 0.004
mm inches
Figure 12. TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20mm, ackage Outline
A2
1N
e
E
B
N/2
D1
D
DIE
A
CP
C
TSOP-a
Drawing is not to scale.
LA1 α
14/15
Page 15
M27C320
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of useofsuch information nor for any infringement ofpatents orother rights of third partieswhich may result from itsuse. Nolicense is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces allinformation previously supplied. STMicroelectronics products are not authorized for use as critical components in lifesupport devices or systems without express written approval of STMicroelectronics.
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