* Package in 8mm tape on 7" diameter reels.
* Compatible with automatic placement equipment.
* Compatible with infrared and vapor phase reflow solder process.
* EIA STD package.
* I.C. compatible.
* Lead-Free package (According to RoHS).
Package Dimensions
Part No. Lens Color Source Color LTST-T670TBL Water Clear InGaN Blue
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2 mm (.008") unless otherwise noted.
Part No. : LTST-T670TBL Page : 1 of 10
BNS-OD-C131/A4
Page 2
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Absolute Maximum Ratings at Ta=25℃
Parameter LTST-T670TBL Unit
Power Dissipation
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
DC Forward Current
Derating Linear From 50℃
Reverse Voltage
Operating Temperature Range -55℃ to + 100℃
Storage Temperature Range -55℃ to + 100℃
Suggest IR Reflow Condition For Pb Free Process:
120 mW
100
30 mA
0.25 mA/℃
5 V
mA
IR-Reflow Soldering Profile for lead free soldering
(Acc. to J-STD-020B)
Part No. : LTST-T670TBL
BNS-OD-C131/A4
Page : 2 of 10
Page 3
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Electrical / Optical Characteristics at Ta=25℃
Parameter Symbol
Luminous Intensity IV T670TBL 45.0 140.0mcd
Viewing Angle
Peak Emission Wavelength
Dominant Wavelength
Spectral Line Half-Width
2θ
1/2
λP
λd
∆λ
Part No.
LTST-
Min. Typ. Max.Unit Test Condition
IF = 20mA
Note 1
T670TBL 120 deg Note 2 (Fig.6)
T670TBL 470 nm
Measurement
@Peak (Fig.1)
T670TBL 465.0 475.0 nm Note 3
T670TBL 20 nm
Forward Voltage VF T670TBL 3.0 4.0 V IF = 20mA
Reverse Current IR T670TBL 100
μ
A
Capacitance C T670TBL 40 PF
VR = 5V
V F = 0 ,
f = 1 M H Z
NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
eye-response curve.
2.θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device.
Do not use unspecified chemical liquid to clean LED they could harm the package.
If cleaning is necessary, immerse the LED in ethyl alcohol or isopropyl alcohol at
normal temperature for less one minute.
Recommend Printed Circuit Board Attachment Pad
Infrared / vapor phase
Reflow Soldering
Package Dimensions Of Tape And Reel
Note:
1.All dimensions are in millimeters (inches).
Part No. : LTST-T670TBL
BNS-OD-C131/A4
Page : 6 of 10
Page 7
Package Dimensions of Reel
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Notes:
1. Empty component pockets sealed with top cover tape.
2. 7 inch reel-2000 pieces per reel.
3. Minimum packing quantity is 500 pieces for remainders.
4. The maximum number of consecutive missing lamps is two.
5. In accordance with EIA-481-1-B specifications.
Part No. : LTST-T670TBL
Page : 7 of 10
BNS-OD-C131/A4
Page 8
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,
traffic control equipment, medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 85°C temperature or 60% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within one week.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a
sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C
for at least 24 hours before solder assembly.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.
4. Soldering
Recommended soldering conditions:
Reflow soldering Wave Soldering Soldering iron
Pre-heat
Pre-heat time
Peak temperature
Soldering time
120~150°C
120 sec. Max.
260°C Max.
30 sec. Max.
Pre-heat
Pre-heat time
Solder wave
Soldering time
100°C Max.
60 sec. Max.
260°C Max.
10 sec. Max.
Temperature
Soldering time
300°C Max.
3 sec. Max.
(one time only)
5. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be incorporated
in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A Circuit model B
LED
LED
(A) Recommended circuit.
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs.
6. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.
All devices, equipment, and machinery must be properly grounded.
Work tables, storage racks, etc. should be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the LED’s
Part No. : LTST-T670TBL Page : 8 of 10
BNS-OD-C131/A4
Page 9
LITE-ON TECHNOLOGY CORPORATION
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low
Property of Lite-On Only
forward voltage, or “ no lightup ” at low currents.
To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.
The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP
product.
7. Reliability Test
Classification Test Item Test Condition Reference Standard
Endurance
Test
Environmental
Test
Operation Life
High Temperature
High Humidity
Storage
High Temperature
Storage
Low Temperature
Storage
Temperature
Cycling
Thermal
Shock
IR-Reflow
Ta= Under Room Temperature As Per Data Sheet
Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)*@20mA.
IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90~95%
Test Time= 240HRS±2HRS
*
Ta= 105±5℃
Test Time= 1000HRS (-24HRS,+72HRS)
*
Ta= -55±5℃
Test Time=1000HRS (-24HRS,+72H RS)
*
105℃ ~ 25℃ ~ -55℃ ~ 25℃
30mins 5mins 30mins 5mins
10 Cycles
IR-Reflow In-Board, 2 Times
85 ± 5℃ ~ -40℃ ± 5℃
10mins 10mins 100 Cycles
Ramp-up rate(217℃ to Peak) +3℃/ second max
Temp. maintain at 175(±25)℃ 180 seconds max
Temp. maintain above 217℃ 60-150 seconds
Peak temperature range 260℃+0/-5℃
Time within 5°C of actual Peak Temperature (tp)
20-40 seconds
Ramp-down rate +6℃/second max
MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)
MIL-STD-202F:103B(1980)
JIS C 7021:B-11(1982)
MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)
JIS C 7021:B-12 (1982)
MIL-STD-202F:107D (1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021:A-4(1982)