Datasheet LTST-E670MBL30 Specification

LITE-ON TECHNOLOGY CORPORATION

Features

* Package in 8mm tape on 7" diameter reel s.
* Compatible with automatic placement equipment.
* Compatible with infrared and vapor phase ref low solder process.
* EIA STD package.
* I.C. compatible.
* Lead Free Package(According to RoHS)
* ESD-withstand voltage : up to 1kV acc , to JESD22-A114-B.

Package Dimensions

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Part No. : LTST-E670MBL30

BNS-OD-C131/A4

Part No. Lens Color Source Color

LTST-E670MBL30 Water Clear InGaN on SiC Blue

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is 0.2 mm (.008") unless otherwise noted.

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Absolute Maximum Ratings at Ta=25

Parameter LTST-E670MBL30 Unit

Power Dissipation 135 mW

Peak Forward Current

(1/10 Duty Cycle, 0.1ms Pulse Width)

DC Forward Current

Derating Linear From 50

Reverse Voltage

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

100

0.25 mA/°C

mA

30 mA

5 V

Operating Temperature Range -40 to + 100

Storage Temperature Range -40 to + 100

Suggest IR Reflow Condition :

IR-Reflow Soldering Profile for lead free soldering

(Acc. to J-STD-020B)

Part No. : LTST-E670MBL30

BNS-OD-C131/A4

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d is derived from the CIE chromaticity diagram and represents the single

Electrical / Optical Characteristics at Ta=25

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

Part No.

Parameter Symbol

Min. Typ. Max. Unit Test Condition

LTST-

Luminous Intensity IV E670MBL30 140.0

Viewing Angle

Peak Emission
Wavelength

Dominant Wavelength

2

θ

1/2

P

λ

d

λ

E670MBL30

E670MBL30

E670MBL30

120 deg Note 2 (Fig.6)

465.0

450.0 mcd

468.0

nm

475.0

IF = 30mA

Note 1

Measurement

@Peak (Fig.1)

nm Note 3

Spectral Line
Half-Width

∆λ

Forward Voltage VF E670MBL30

Reverse Current IR E670MBL30

E670MBL30

26 nm

4.0 4.5 V IF = 30mA

100



A

VR = 5V

NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE

eye-response curve.

2. 1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.

3. The dominant wavelength,



wavelength which defines the color of the device.

4. Forward Voltage Tolerance is +/- 0.1 volt.

Part No. : LTST-E670MBL30

BNS-OD-C131/A4

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Bin Code List

Luminous Intensity Unit : mcd @ 30mA

Bin Code Min. Max.

R2 140.0 180.0

S1 180.0 224.0

S2 224.0 280.0

T1 280.0 355.0

T2 355.0 450.0

Tolerance on each Intensity bin is +/-15%

Dominant Wavelength Unit : nm @ 30mA

Bin Code Min. Max.

AC 465.0 470.0

AD 470.0 475.0

Tolerance for each Dominate Wavelength bin is +/- 1nm

Part No. : LTST-E670MBL30 Page : 4 of 10

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Typical Electrical / Optical Characteristics Curves

(25°°°°C Ambient Temperature Unless Otherwise Noted)

Part No. : LTST-E670MBL30

BNS-OD-C131/A

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se the LED in ethyl alcohol or isopropyl alcohol at normal temperature

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User Guide

Cleaning

Do not use unspecified chemical liquid to clean LED they could harm the package.
If cleaning is necessary, immer
for less than one minute.

Recommend Printed Circuit Board Attachment Pad

Infrared / vapor phase

Reflow Soldering

Package Dimensions of Tape

Note:

1. All dimensions are in millimeters (inches).

Part No. : LTST-E670MBL30

BNS-OD-C131/A4

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Package Dimensions of Reel

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Notes:

1. Empty component pockets sealed with top cover tape.

2. 7 inch reel-2000 pieces per reel.

3. Minimum packing quantity is 500 pieces for remainders.

4. The maximum number of consecutive missing lamps is two.

5. In accordance with EIA-481-1-B specifications.

Part No. : LTST-E670MBL30

BNS-OD-C131/A4

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CAUTIONS

1. Application

The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,
traffic control equipment, medical and life support systems and safety devices).

2. Storage

The storage ambient for the LEDs should not exceed 85°C temperature or 60% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within one week.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a
sealed container with appropriate desiccant, or in desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C
for at least 24 hours before solder assembly.

3. Cleaning

Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.

4. Soldering
Recommended soldering conditions:

Reflow soldering Wave Soldering Soldering iron

Pre-heat
Pre-heat time
Soldering Temp.
Soldering time

120~150°C
120 sec. Max.
260°C Max.
30 sec. Max.

Pre-heat
Pre-heat time
Solder wave
Soldering time

100°C Max.
60 sec. Max.
260°C Max.
10 sec. Max.

Temperature
Soldering time

300°C Max.
3 sec. Max.
(one time only)

5. Drive Method

An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be incorporated
in the drive circuit, in series with each LED as shown in Circuit A below.

Circuit model A Circuit model B

LED

LED

(A) Recommended circuit.
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics of

those LEDs.

6. ESD (Electrostatic Discharge)

Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:

 Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.
 All devices, equipment, and machinery must be properly grounded.
 Work tables, storage racks, etc. should be properly grounded.
 Use ion blower to neutralize the static charge which might have built up on surface of the LED’s

plastic lens as a result of friction between LEDs during storage and handling.

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Environmental

ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low

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forward voltage, or “no lightup” at low currents.
To verify for ESD damage, check for “light up” and Vf of the suspect LEDs at low currents.
The Vf of “good” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP
product.

7. Reliability Test
Classification

Endurance

Test

Test Item Test Condition Reference Standard

MIL-STD-750D:1026
MIL-STD-883D:1005
JIS C 7021:B-1

MIL-STD-202F:103B
JIS C 7021:B-11

MIL-STD-883D:1008
JIS C 7021:B-10

Operation Life

High Temperature

High Humidity

Storage

High Temperature

Storage

Ta= Under Room Temperature As Per Data Sheet
Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)*@30mA.

IR-Reflow In-Board, 2 Times
Ta= 65±5,RH= 9095%

Test Time= 240HRS±2HRS

*

Ta= 105±5

Test Time= 1000HRS (-24HRS,+72HRS)

*

Test

8. Others

Low Temperature

Storage

Temperature

Cycling

Thermal

Shock

IR-Reflow

Solderability

Ta= -55±5

Test Time=1000HRS (-24HRS,+72H RS)

*

105  25  -55  25
30mins 5mins 30mins 5mins

10 Cycles

IR-Reflow In-Board, 2 Times
85 ± 5  -40 ± 5

10mins 10mins 100 Cycles

Ramp-up rate(217 to Peak) +3/ second max
Temp. maintain at 175(±25) 180 seconds max
Temp. maintain above 217 60-150 seconds
Peak temperature range 260+0/-5
Time within 5°C of actual Peak Temperature (tp)
20-40 seconds

Ramp-down rate +6/second max

T.sol= 235 ± 5
Immersion time 2±0.5 sec

Immersion rate 25±2.5 mm/sec
Coverage 95% of the dipped surface

JIS C 7021:B-12

MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1010
JIS C 7021:A-4

MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1011

MIL-STD-750D:2031.2
J-STD-020B

MIL-STD-202F:208D
MIL-STD-750D:2026
MIL-STD-883D:2003
IEC 68 Part 2-20
JIS C 7021:A-2

The appearance and specifications of the product may be modified for improvement without prior notice.

9. Quality Guarantee

LiteOn guarantee DPPM level of failure function is smaller and equal to 50 DPPM.
(Based on 100k usage)

Part No. : LTST-E670MBL30 Page : 09 of 10

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strap or

safe

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10. Suggested Checking List

Training and Certification

1. Everyone working in a static-safe area is ESD-certified?

2. Training records kept and re-certification dates monitored?

Static-Safe Workstation & Work Areas

1. Static-safe workstation or work-areas have ESD signs?

2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?

3. All ionizer activated, positioned towards the units?

4. Each work surface mats grounding is good?

Personnel Grounding

1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel
conductive shoes with conductive flooring?

2. If conductive footwear used, conductive flooring also present where operator stand or walk?

3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?

4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?

5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.

Device Handling

1. Every ESDS items identified by EIA-471 labels on item or packaging?

2. All ESDS items completely inside properly closed static-shielding containers when not at static­workstation?

3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?

4. All flexible conductive and dissipative package materials inspected before reuse or recycle?

Others

1. Audit result reported to entity ESD control coordinator?

2. Corrective action from previous audits completed?

3. Are audit records complete and on file?

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