Datasheet LTST-C190KSKT Specification

Features

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* Meet ROHS
* Extra thin (0.80H mm) Chip LED
* Ultra bright AlInGaP Chip LED.
* Package In 8mm Tape On 7" Diameter Reels.
* EIA STD package.
* I.C. compatible.
* Compatible With Automatic Placement Equipment.
* Compatible With Infrared Reflow Solder Process.

Package Dimensions

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Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ± 0.10 mm (.004") unless otherwise noted.

Part No. Lens Source Color

LTST-C190KSKT

Water Clear

AllnGaP Yellow

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Absolute Maximum Ratings At Ta=25

Parameter

℃℃℃℃

LTST-C190KSKT

Power Dissipation 75 mW

Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)

80 mA

DC Forward Current 30 mA

Reverse Voltage 5 V

Operating Temperature Range -30°C to + 85°C

Unit

Storage Temperature Range -40°C to + 85°C

Infrared Soldering Condition 260°C For 10 Seconds

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Suggestion Profile:

Suggestion IR Reflow Profile For Pb Free Process

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Electrical Optical Characteristics At Ta=25

Parameter Symbol

Part No.

LTST-

℃℃℃℃

Min. Typ. Max. Unit Test Condition

Luminous Intensity IV C190KSKT 28.0 - 180.0 mcd

Viewing Angle

Peak Emission Wavelength

Dominant Wavelength

Spectral Line Half-Width

2θ1/2

λ

P

λ

d

Δλ

C190KSKT

C190KSKT

130 deg Note 2 (Fig.5)

588 nm

C190KSKT 584.5 - 597.0 nm

C190KSKT

15 nm

IF = 20mA

Note 1

Measurement

@Peak (Fig.1)

IF = 20mA

Note 3

Forward Voltage VF C190KSKT 1.80 - 2.40 V IF = 20mA

Reverse Current IR C190KSKT

10

μ

A

VR = 5V

Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the

CIE eye-response curve.

2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.

3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the
single wavelength which defines the color of the device.

4. Caution in ESD:

Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic

glove when handling the LED. All devices, equipment and machinery must be properly grounded.

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Bin Code List

Forward Voltage Unit: V @20mA

Bin Code Min. Max.

F2 1.80 2.10
F3 2.10 2.40

Tolerance on each Forward Voltage bin is +/-0.1 volt

Luminous Intensity Unit : mcd @20mA

Bin Code Min. Max.

N 28.0 45.0

P 45.0 71.0
Q 71.0 112.0
R 112.0 180.0

Tolerance on each Intensity bin is +/-15%

Dominant Wavelength Unit : nm @20mA

Bin Code Min. Max.

H 584.5 587.0

J 587.0 589.5

K 589.5 592.0

L 592.0 594.5

M 594.5 597.0

Tolerance for each Dominate Wavelength bin is +/- 1nm

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Typical Electrical / Optical Characteristics Curves

(25 °C Ambient Temperature Unless Otherwise Noted)

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If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature for

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Cleaning

Do not use unspecified chemical liquid to clean LED they could harm the package.

less one minute.

Suggest Soldering Pad Dimensions

Package Dimensions Of Tape And Reel

Notes:

1. All dimensions are in millimeters (inches).

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Notes:

1. Empty component pockets sealed with top cover tape.

2. 7 inch reel-3000 pieces per reel.

3. Minimum packing quantity is 500 pcs for remainders.

4. The maximum number of consecutive missing lamps is two.

5. In accordance with ANSI/EIA 481 specifications.

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CAUTIONS

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1. Application

The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,
traffic control equipment, medical and life support systems and safety devices).

2. Storage

The package is sealed:

The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to use within

one year, while the LEDs is packed in moisture-proof package with the desiccants inside.
The package is opened:

The storage ambient for the LEDs should not exceed 30°C temperature or 60% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within one week.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a
sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C
for at least 20 hours before solder assembly.

3. Cleaning

Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.

4. Soldering

Recommended soldering conditions:

Reflow soldering Soldering iron

Pre-heat
Pre-heat time
Peak temperature
Soldering time

150~200°C
120 sec. Max.
260°C Max.
10 sec. Max.(Max. two times)

Temperature
Soldering time

300°C Max.
3 sec. Max.
(one time only)

Soldering notes:

Because different board designs use different number and types of devices, solder pastes, reflow ovens, and
circuit boards, no single temperature profile works for all possible combinations.
However, you can successfully mount your packages to the PCB by following the proper guidelines and
PCB-specific characterization.
LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and
board-level assembly.
The results of this testing are verified through post-reflow reliability testing.
Profiles used at LITE-ON are based on JEDEC standards to ensure that all packages can be successfully and
reliably surface mounted.
Figure on page3 shows a sample temperature profile compliant to JEDEC standards.
You can use this example as a generic target to set up your reflow process.
You should adhere to the JEDEC profile limits as well as specifications and recommendations from the
solder paste manufacturer to avoid damaging the device and create a reliable solder joint.

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parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit,

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5. Drive Method

An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in

in series with each LED as shown in Circuit A below.

Circuit model A Circuit model B

LED

LED

(A) Recommended circuit.
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics

of those LEDs.

6. ESD (Electrostatic Discharge)

Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:

 Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.
 All devices, equipment, and machinery must be properly grounded.
 Work tables, storage racks, etc. should be properly grounded.
 Use ion blower to neutralize the static charge which might have built up on surface of the LED’s plastic

lens as a result of friction between LEDs during storage and handling.

ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage,

or “ no lightup ” at low currents.
To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.
The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.

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7. Reliability Test

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Classification

Endurance

Test

Environmental

Test

Test Item

Operation Life

High Temperature

High Humidity

Storage

High Temperature

Storage

Low Temperature

Storage

Temperature

Cycling

Thermal

Shock

Solder

Resistance

IR-Reflow

Pb Free Process

Test Condition Reference Standard

Ta= Under Room Temperature As Per Data Sheet
Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)

IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90～95%

Test Time= 240HRS±2HRS

*

Ta= 105±5℃

Test Time= 1000HRS (-24HRS,+72HRS)

*

Ta= -55±5℃

Test Time=1000HRS (-24HRS,+72H RS)

*

105℃ ～ 25℃ ～ -55℃ ～ 25℃
30mins 5mins 30mins 5mins
10 Cycles

IR-Reflow In-Board, 2 Times
85 ± 5℃ ～ -40℃ ± 5℃
10mins 10mins 10 Cycles

T.sol= 260 ± 5℃
Dwell Time= 10 ± 1secs

Ramp-up rate(217℃ to Peak) +3℃/ second max
Temp. maintain above 217℃ 60-150 seconds
Peak temperature range 260℃+0/-5℃
Time within 5°C of actual Peak Temperature (tp)
10~30 seconds
Ramp-down rate +6℃/second max

MIL-STD-750D:1026
MIL-STD-883D:1005
JIS C 7021:B-1

MIL-STD-202F:103B
JIS C 7021:B-11

MIL-STD-883D:1008
JIS C 7021:B-10

JIS C 7021:B-12

MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1010
JIS C 7021:A-4

MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1011

MIL-STD-202F:210A
MIL-STD-750D:2031
JIS C 7021:A-1

MIL-STD-750D:2031.2
J-STD-020D

T.sol= 235 ± 5℃

Solderability

Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Coverage ≧95% of the dipped surface

MIL-STD-202F:208D
MIL-STD-750D:2026
MIL-STD-883D:2003
IEC 68 Part 2-20
JIS C 7021:A-2

8. Others

The appearance and specifications of the product may be modified for improvement without prior notice.

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9. Suggested Checking List

Training and Certification

1. Everyone working in a static-safe area is ESD-certified?

2. Training records kept and re-certification dates monitored?

Static-Safe Workstation & Work Areas

1. Static-safe workstation or work-areas have ESD signs?

2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?

3. All ionizer activated, positioned towards the units?

4. Each work surface mats grounding is good?

Personnel Grounding

1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel

strap or conductive shoes with conductive flooring?

2. If conductive footwear used, conductive flooring also present where operator stand or walk?

3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?

4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?

5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.

Device Handling

1. Every ESDS items identified by EIA-471 labels on item or packaging?

2. All ESDS items completely inside properly closed static-shielding containers when not at
static-safe workstation?

3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?

4. All flexible conductive and dissipative package materials inspected before reuse or recycles?

Others

1. Audit result reported to entity ESD control coordinator?

2. Corrective action from previous audits completed?

3. Are audit records complete and on file?

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