Datasheet LTST-C170KRKT Specification

LITE-ON TECHNOLOGY CORPORATION

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Features

* Meet ROHS, Green Product.
* Ultra bright AlInGaP Chip LED.
* Package In 8mm Tape On 7" Diameter Reels.
* Compatible With Automatic Placement Equipment.
* Compatible With Infrared And Vapor Phase Reflow Solder Process.
* EIA STD package.
* I.C. compatible.

Package Dimensions

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ± 0.10 mm (.004") unless otherwise noted.

Part No. Lens Source Color

LTST-C170KRKT

Water Clear

AllnGaP Red

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Absolute Maximum Ratings At Ta=25

Power Dissipation 75 mW

Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)

DC Forward Current 30 mA

Derating Linear From 50°C 0.4 mA/°C

Reverse Voltage 5 V

Operating Temperature Range -55°C to + 85°C

Parameter

℃

LTST-C170KRKT

80 mA

Unit

Storage Temperature Range -55°C to + 85°C

Wave Soldering Condition 260°C For 5 Seconds

Infrared Soldering Condition 260°C For 5 Seconds

Vapor Phase Soldering Condition 215°C For 3 Minutes

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Suggestion Profile:

(1) Suggestion IR Reflow Profile For Normal Process

(2) Suggestion IR Reflow Profile For Pb Free Process

Recom m ended P rofile Between Assem ble And Heat-Resistance Line

T h e P ro file is a va ila b le th a t mus t to u se SnAg C u so ld e r p a s te

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Electrical Optical Characteristics At Ta=25

Luminous Intensity IV C170KRKT 18.0 54.0 mcd

Viewing Angle

Peak Emission Wavelength

Dominant Wavelength

Spectral Line Half-Width

Parameter Symbol

2θ1/2

λ

P

λ

d

Δλ

Part No.

LTST-

C170KRKT 130 deg Note 2 (Fig.6)

C170KRKT 639 nm

C170KRKT 631 nm Note 3

C170KRKT 20 nm

℃

Min. Typ. Max. Unit Test Condition

IF = 20mA

Note 1

Measurement

@Peak (Fig.1)

Forward Voltage VF C170KRKT 2.0 2.4 V IF = 20mA

Reverse Current IR C170KRKT 10

Capacitance C C170KRKT 40 PF

Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the

CIE eye-response curve.

2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.

3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the
single wavelength which defines the color of the device.

μ

A

VR = 5V

VF = 0

f = 1MHZ

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Bin Code List

Luminous Intensity Unit : mcd @20mA

Bin Code Min. Max.

M 18.0 28.0

N 28.0 45.0

P 45.0 71.0
Q 71.0 112.0
R 112.0 180.0

Tolerance on each Intensity bin is +/-15%

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Typical Electrical / Optical Characteristics Curves

(25 °C Ambient Temperature Unless Otherwise Noted)

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Cleaning

Do not use unspecified chemical liquid to clean LED they could harm the package.

If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature

for less one minute.

Suggest Soldering Pad Dimensions

Package Dimensions Of Tape And Reel

Notes:

1. All dimensions are in millimeters (inches).

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Notes:

1. Empty component pockets sealed with top cover tape.

2. 7 inch reel-3000 pieces per reel.

3. Minimum packing quantity is 500 pcs for remainders.

4. The maximum number of consecutive missing lamps is two.

5. In accordance with ANSI/EIA 481-1-A-1994 specifications.

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CAUTIONS

1. Application

The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,
traffic control equipment, medical and life support systems and safety devices).

2. Storage

The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within one week.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a
sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C
for at least 24 hours before solder assembly.

3. Cleaning

Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.

4. Soldering

Recommended soldering conditions:

Reflow soldering Wave Soldering Soldering iron

Pre-heat
Pre-heat time
Peak temperature
Soldering time

120~150°C
120 sec. Max.
240°C Max.
10 sec. Max.

Pre-heat
Pre-heat time
Solder wave
Soldering time

100°C Max.
60 sec. Max.
260°C Max.
10 sec. Max.

Temperature
Soldering time

300°C Max.
3 sec. Max.
(one time only)

5. Drive Method

An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be incorporated
in the drive circuit, in series with each LED as shown in Circuit A below.

Circuit model A Circuit model B

LED

LED

(A) Recommended circuit.
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics

of those LEDs.

6. ESD (Electrostatic Discharge)

Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:

 Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.
 All devices, equipment, and machinery must be properly grounded.
 Work tables, storage racks, etc. should be properly grounded.
 Use ion blower to neutralize the static charge which might have built up on surface of the LED’s

plastic lens as a result of friction between LEDs during storage and handling.

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ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward

LITE-ON TECHNOLOGY CORPORATION

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voltage, or “ no lightup ” at low currents.
To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.
The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.

7. Reliability Test

Classification Test Item Test Condition Reference Standard

Endurance

Test

Environmental

Test

Operation Life

High Temperature

High Humidity

Storage

High Temperature

Storage

Low Temperature

Storage

Temperature

Cycling

Thermal

Shock

Solder

Resistance

IR-Reflow

Normal Process

Ta= Under Room Temperature As Per Data Sheet
Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)*@20mA.

IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90～95%

Test Time= 240HRS±2HRS

*

Ta= 105±5℃

Test Time= 1000HRS (-24HRS,+72HRS)

*

Ta= -55±5℃

Test Time=1000HRS (-24HRS,+72H RS)

*

105℃ ～ 25℃ ～ -55℃ ～ 25℃
30mins 5mins 30mins 5mins
10 Cycles

IR-Reflow In-Board, 2 Times
85 ± 5℃ ～ -40℃ ± 5℃
10mins 10mins 10 Cycles

T.sol= 260 ± 5℃
Dwell Time= 10 ± 1secs

Ramp-up rate(183℃ to Peak) +3℃/ second max
Temp. maintain at 125(±25)℃ 120 seconds max
Temp. maintain above 183℃ 60-150 seconds
Peak temperature range 235℃+5/-0℃
Time within 5°C of actual Peak Temperature (tp)
10-30 seconds
Ramp-down rate +6℃/second max

MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)

MIL-STD-202F:103B(1980)
JIS C 7021:B-11(1982)

MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)

JIS C 7021:B-12 (1982)

MIL-STD-202F:107D (1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021:A-4(1982)

MIL-STD-202F:107D(1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1011 (1991)

MIL-STD-202F:210A(1980)
MIL-STD-750D:2031(1995)
JIS C 7021:A-1(1982)

MIL-STD-750D:2031.2(1995)
J-STD-020(1999)

Ramp-up rate(217 to Peak) +3 / second max℃℃
Temp. maintain at 175(±25) 180 seconds max℃

IR-Reflow

Pb Free Process

Solderability

Temp. maintain above 217 60℃ -150 seconds
Peak temperature range 260 +0/℃ -5℃
Time within 5°C of actual Peak Temperature (tp)
20-40 seconds
Ramp-down rate +6 /second max℃

T.sol= 235 ± 5℃
Immersion time 2±0.5 sec

Immersion rate 25±2.5 mm/sec
Coverage ≧95% of the dipped surface

MIL-STD-750D:2031.2(1995)
J-STD-020(1999)

MIL-STD-202F:208D(1980)
MIL-STD-750D:2026(1995)
MIL-STD-883D:2003(1991)
IEC 68 Part 2-20
JIS C 7021:A-2(1982)

8. Others

The appearance and specifications of the product may be modified for improvement without prior notice.

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9. Suggested Checking List

Training and Certification

1. Everyone working in a static-safe area is ESD-certified?

2. Training records kept and re-certification dates monitored?

Static-Safe Workstation & Work Areas

1. Static-safe workstation or work-areas have ESD signs?

2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?

3. All ionizer activated, positioned towards the units?

4. Each work surface mats grounding is good?

Personnel Grounding

1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel

strap or conductive shoes with conductive flooring?

2. If conductive footwear used, conductive flooring also present where operator stand or walk?

3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?

4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?

5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.

Device Handling

1. Every ESDS items identified by EIA-471 labels on item or packaging?

2. All ESDS items completely inside properly closed static-shielding containers when not at
static-safe workstation?

3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?

4. All flexible conductive and dissipative package materials inspected before reuse or recycles?

Others

1. Audit result reported to entity ESD control coordinator?

2. Corrective action from previous audits completed?

3. Are audit records complete and on file?

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