Voltage Monitor for Power Fail or
Low Battery Warning
■
Thermal Limiting
■
Performance Specified Over Temperature
■
Superior Upgrade for MAX690 Family
U
O
PPLICATI
A
■
Critical µP Power Monitoring
■
Intelligent Instruments
■
Battery-Powered Computers and Controllers
■
Automotive Systems
S
DUESCRIPTIO
The LTC692/LTC693 provide complete power supply monitoring and battery control functions for microprocessor
reset, battery backup, CMOS RAM write protection, power
failure warning and watchdog timing. A precise internal
voltage reference and comparator circuit monitor the
power supply line. When an out-of-tolerance condition
occurs, the reset outputs are forced to active states and the
Chip Enable output unconditionally write-protects external memory. In addition, the RESET output is guaranteed
to remain logic low even with VCC as low as 1V.
The LTC692/LTC693 power the active CMOS RAMs with a
charge pumped NMOS power switch to achieve low dropout and low supply current. When primary power is lost,
auxiliary power, connected to the battery input pin, powers
the RAMs in standby through an efficient PMOS switch.
For an early warning of impending power failure, the
LTC692/LTC963 provide an internal comparator with a
user-defined threshold. An internal watchdog timer is
also available, which forces the reset pins to active states
when the watchdog input is not toggled prior to a preset
time-out period.
O
A
PPLICATITYPICAL
≥ 7.5V
V
IN
+
10µF
51k
10k
MICROPROCESSOR RESET, BATTERY BACKUP, POWER FAILURE
WARNING AND WATCHDOG TIMING ARE ALL IN A SINGLE CHIP
FOR MICROPROCESSOR SYSTEMS.
LT1086-5
V
IN
ADJ
5V
V
OUT
+
100µF
U
0.1µF
3V
RESET Output Voltage vs
Supply Voltage
5
TA = 25°C
EXTERNAL PULL-UP = 10µA
= 0V
V
4
BATT
3
2
RESET OUTPUT VOLTAGE (V)
1
0
1
0
2
SUPPLY VOLTAGE (V)
3
4
5
LTC692/3 • TA02
µP
SYSTEM
µP
POWER
LTC692/3 • TA01
0.1µF
POWER TO
CMOS RAM
µP RESET
µP NMI
I/O LINE
100Ω
V
CC
V
BATT
PFI
LTC692
LTC693
GND
V
OUT
RESET
PFO
WDI
0.1µF
1
Page 2
LTC692/LTC693
A
W
O
LUTEXI T
S
A
WUW
ARB
I
Terminal Voltage
VCC.................................................... –0.3V to 6.0V
V
................................................. –0.3V to 6.0V
PFO Short Circuit Source CurrentPFI = HIGH, PFO = 0V1325µA
(Note 4)PFI = LOW, PFO = V
PFI Comparator Response Time (falling)∆VIN = –20mV, VOD = 15mV2µs
PFI Comparator Response Time (rising)∆VIN = 20mV, VOD = 15mV40µs
(Note 4) with 10kΩ Pull-Up8µs
Chip Enable Gating
CE IN ThresholdV
CE IN Pullup Current (Note 7)3µA
CE OUT Output VoltageI
CE Propagation DelayVCC = 5V, CL = 20pF2035ns
CE OUT Output Short Circuit CurrentOutput Source Current30mA
Oscillator
OSC IN Input Current (Note 7)±2µA
OSC SEL Input Pull-Up Current (Note 7)5µA
OSC IN Frequency RangeOSC SEL = 0V●0250kHz
OSC IN Frequency with External CapacitorOSC SEL = 0V, C
= 2.8V, TA = 25°C, unless otherwise noted.
BATT
ICS
Logic High3.5V
OUT
WDI = 0V
= 3.2mA0.4V
SINK
= 1µA3.5V
I
SOURCE
OUT
IL
V
IH
= 3.2mA0.4V
SINK
= 3.0mAV
I
SOURCE
= 1µA, VCC = 0VV
I
SOURCE
Output Sink Current35mA
= 47pF4kHz
OSC
●450µA
●–50–8µA
25mA
0.8V
2.0V
– 1.50V
OUT
– 0.05V
OUT
●2045ns
The ● denotes specifications which apply over the full operating
temperature range.
Note 1: Absolute maximum ratings are those values beyond which the life
of the device may be impaired.
Note 2: All voltage values are with respect to GND.
Note 3: For military temperature range, consult the factory.
Note 4: The output pins of BATT ON, LOW LINE, PFO, WDO, RESET and
RESET have weak internal pull-ups of typically 3µA. However, external
pull-up resistors may be used when higher speed is required.
4
Note 5: The LTC692/LTC693 have minimum reset active times of 140ms
(200ms typically). The reset active time of the LTC693 can be adjusted
(see Table 2 in Applications Information Section).
Note 6: The external clock feeding into the circuit passes through the
oscillator before clocking the watchdog timer (See BLOCK DIAGRAM).
Variation in the time-out period is caused by phase errors which occur
when the oscillator divides the external clock by 64. The resulting variation
in the time-out period is 64 clocks plus one clock of jitter.
Note 7: The input pins of CE IN, OSC IN and OSC SEL have weak internal
pull-ups which pull to the supply when the input pins are floating.
Page 5
LPER
TIME (µs)
0
4
5
6
4
LTC692/3 • TPC06
3
2
0
123
5
1
1.305V
1.285V
87
6
VCC = 5V
T
A
= 25°C
+
–
V
PFI
1.3V
PFO
30pF
V
PFI
= 20mV STEP
PFO OUTPUT VOLTAGE (V)
V
vs I
OUT
5.00
4.95
4.90
4.85
OUTPUT VOLTAGE (V)
4.80
OUT
SLOPE = 5Ω
F
O
R
VCC = 5V
V
BATT
= 25°C
T
A
ATYPICA
= 2.8V
UW
CCHARA TERIST
E
C
V
vs I
OUT
2.80
2.78
SLOPE = 125Ω
2.76
OUTPUT VOLTAGE (V)
2.74
OUT
ICS
VCC = 0V
V
BATT
= 25°C
T
A
= 2.8V
LTC692/LTC693
Power Failure Input Threshold
vs Temperature
1.308
VCC = 5V
1.306
1.304
1.302
1.300
1.298
PFI INPUT THRESHOLD (V)
1.296
4.75
232
224
216
208
200
RESET ACTIVE TIME
192
184
–50
10
0
20
LOAD CURRENT (mA)
Reset Active Time vs
Temperature
VCC = 5V
50100 125
–250
2575
TEMPERATURE (°C)
Power Fail Comparator
Response Time
6
VCC = 5V
5
T
A
4
3
2
1
PFO OUTPUT VOLTAGE (V)
0
1.315V
1.295V
0
30
= 25°C
40
LTC692/3 • TPC01
LTC692/3 • TPC04
V
PFI
40
20
50
V
PFI
1.3V
= 20mV STEP
60
10080
TIME (µs)
2.72
100
0
Reset Voltage Threshold
vs Temperature
4.41
4.40
4.39
4.38
4.37
RESET VOLTAGE THRESHOLD (V)
4.36
4.35
–50
–250
+
PFO
140
120
LTC692/3 • TPC07
30pF
180160
–
300
200
LOAD CURRENT (µA)
50100 125
2575
TEMPERATURE (°C)
1.315V
1.295V
1.294
400
LTC692/3 • TPC02
500
–50
–250
Power Fail Comparator
Response Time
LTC692/3 • TPC05
Power Fail Comparator Response
Time with Pull-Up Resistor
6
VCC = 5V
5
= 25°C
T
A
4
3
2
1
PFO OUTPUT VOLTAGE (V)
0
0
2
V
= 20mV STEP
PFI
4
V
PFI
1.3V
6
TIME (µs)
108
+
PFO
–
12
LTC692/3 • TPC08
2575
TEMPERATURE (°C)
5V
10k
30pF
14
1816
50100 125
LTC692/3 • TPC03
5
Page 6
LTC692/LTC693
U
U
U
PI FU CTIO S
VCC: 5V Supply Input. The VCC pin should be bypassed
with a 0.1µF capacitor.
V
: Voltage Output for Backed Up Memory. Bypass with
OUT
a capacitor of 0.1µF or greater. During normal operation,
V
obtains power from VCC through an NMOS power
OUT
switch, M1, which can deliver up to 50mA and has a typical
ON resistance of 5Ω. When VCC is lower than V
is internally switched to V
used, connect V
V
: Backup Battery Input. When VCC falls below V
BATT
OUT
to VCC.
auxiliary power connected to V
BATT
. If V
BATT
and V
OUT
, is delivered to V
through PMOS switch, M2. If backup battery or auxiliary
power is not used, V
should be connected to GND.
BATT
GND: Ground Pin.
BATT ON: Battery On Logic Output from Comparator C2.
BATT ON goes low when V
is internally connected to
OUT
VCC. The output typically sinks 35mA and can provide base
drive for an external PNP transistor to increase the output
current above the 50mA rating of V
high when V
is internally switched to V
OUT
. BATT ON goes
OUT
BATT
PFI: Power Failure Input. PFI is the noninverting input to
the Power Fail Comparator, C3. The inverting input is
internally connected to a 1.3V reference. The Power Failure
Output remains high when PFI is above 1.3V and goes low
when PFI is below 1.3V. Connect PFI to GND or V
C3 is not used.
PFO: Power Failure Output from C3. PFO remains high
when PFI is above 1.3V and goes low when PFI is below
1.3V. When VCC is lower than V
, C3 is shut down and
BATT
PFO is forced low.
RESET: Logic Output for µ P Reset Control. Whenever V
falls below either the reset voltage threshold (4.40V
typically) or V
, RESET goes active low. After V
BATT
returns to 5V, reset pulse generator forces RESET to
remain active low for a minimum of 140ms. When the
watchdog timer is enabled but not serviced prior to a preset
time-out period, reset pulse generator also forces RESET
to active low for a minimum of 140ms for every preset
BATT
BATT
.
OUT
, V
OUT
are not
BATT
OUT
when
CC
CC
,
time-out period (see Figure 11). The reset active time is
adjustable on the LTC693. An external pushbutton reset
can be used in connection with the RESET output. See
Pushbutton Reset in the Applications Information section.
RESET: RESET is an Active High Logic Ouput. It is the
inverse of RESET.
LOW LINE: Logic Output from Comparator C1. LOW LINE
indicates a low line condition at the VCC input. When V
CC
falls below the reset voltage threshold (4.40V typically),
LOW LINE goes low. As soon as VCC rises above the reset
voltage threshold, LOW LINE returns high (see Figure 1).
LOW LINE goes low when V
drops below V
CC
BATT
(see
Table 1).
WDI: Watchdog Input. WDI is a three level input. Driving
WDI either high or low for longer than the watchdog timeout period, forces both RESET and WDO low. Floating WDI
disables the Watchdog Timer. The timer resets itself with
each transition of the Watchdog Input (see Figure 11).
WDO: Watchdog Logic Output. When the watchdog input
remains either high or low for longer than the watchdog
time-out period, WDO goes low. WDO is set high whenever
there is a transition on the WDI pin, or LOW LINE goes low.
The watchdog timer can be disabled by floating WDI (see
Figure 11).
CE IN: Logic Input to the Chip Enable Gating Circuit. CE IN
can be derived from microprocessor's address line and/or
decoder output. See Applications Information Section and
Figure 5 for additional information.
CE OUT: Logic Output on the Chip Enable Gating Circuit.
When VCC is above the reset voltage threshold, CE OUT is a
buffered replica of CE IN. When VCC is below the reset
voltage threshold CE OUT is forced high (see Figure 5).
OSC SEL: Oscillator Selection Input. When OSC SEL is
high or floating, the internal oscillator sets the reset active
time and watchdog time-out period. Forcing OSC SEL low
allows OSC IN to be driven from an external clock signal or
an external capacitor to be connected between
OSC IN and
GND.
6
Page 7
LTC692/LTC693
U
U
U
PI FU CTIO S
OSC IN: Oscillator Input. OSC IN can be driven by an
external clock signal or an external capacitor can be
connected between OSC IN and GND when OSC SEL is
forced low. In this configuration the nominal reset active
time and watchdog time-out period are determined by
the number of clocks or set by the formula (see
W
BLOCK
IDAGRA
V
BATT
V
CC
M2
–
C2
+
Applications Information section). When OSC SEL is
high or floating, the internal oscillator is enabled and the
reset active time is fixed at 200ms typical. OSC IN selects
between the 1.6 seconds and 100ms typical watchdog
time-out periods. In both cases the time-out period
immediately after a reset is 1.6 seconds typical.
V
OUT
M1
CHARGE
PUMP
BATT ON
CE IN
PFI
OSC IN
OSC SEL
WDI
1.3V
GND
OSC
TRANSITION
DETECTOR
LOW LINE
+
C1
–
–
C3
+
RESET PULSE
GENERATOR
WATCHDOG
TIMER
CE OUT
PFO
RESET
RESET
WDO
LTC692/3 • BD
7
Page 8
LTC692/LTC693
PPLICATI
A
U
O
S
IFORATIO
WU
U
Microprocessor Reset
The LTC692/LTC693 use a bandgap voltage reference and
a precision voltage comparator C1 to monitor the 5V
supply input on VCC (see BLOCK DIAGRAM). When V
CC
falls below the reset voltage threshold, the RESET output
is forced to active low state. The reset voltage threshold
accounts for a 10% variation on VCC, so the RESET output
becomes active low when VCC falls below 4.50V (4.40V
typical). On power-up, the RESET signal is held active low
for a minimum of 140ms after reset voltage threshold is
reached to allow the power supply and microprocessor to
stabilize. The reset active time is adjustable on the LTC693.
On power-down, the RESET signal remains active low
even with VCC as low as 1V. This capability helps hold the
microprocessor in stable shutdown condition. Figure 1
shows the timing diagram of the RESET signal.
The precision voltage comparator, C1, typically has 40mV
of hysteresis which ensures that glitches at the VCC pin do
not activate the RESET output. Response time is typically
10µ s. To help prevent mistriggering due to transient loads,
VCC pin should be bypassed with a 0.1µ F capacitor with the
leads trimmed as short as possible.
The LTC693 has two additional outputs: RESET and LOW
LINE. RESET is an active high output and is the inverse of
RESET. LOW LINE is the output of the precision voltage
comparator C1. When VCC falls below the reset voltage
threshold, LOW LINE goes low. LOW LINE returns high as
soon as VCC rises above the reset voltage threshold.
Battery Switchover
The battery switchover circuit compares VCC to the
V
input, and connects V
BATT
When VCC rises to 70mV above V
switchover comparator, C2, connects V
a charge pumped NMOS power switch, M1. When V
falls to 50mV above V
BATT
to whichever is higher.
OUT
, the battery
BATT
to VCC through
OUT
, C2 connects V
OUT
to V
CC
BATT
through a PMOS switch, M2. C2 has typically 20mV of
hysteresis to prevent spurious switching when V
remains nearly equal to V
. The response time of C2
BATT
CC
is approximately 20µs.
During normal operation, the LTC692/LTC693 use a charge
pumped NMOS power switch to achieve low dropout and
low supply current. This power switch can deliver up to
50mA to V
of 5Ω. The V
from VCC and has a typical “on” resistance
OUT
pin should be bypassed with a capacitor
OUT
of 0.1µF or greater to ensure stability. Use of a larger
bypass capacitor is advantageous for supplying current to
heavy transient loads.
When operating currents larger than 50mA are required
from V
, or a lower dropout (V
OUT
CC
– V
voltage differ-
OUT
ential) is desired, the LTC693 should be used. This product provides BATT ON output to drive the base of the
external PNP transistor (Figure 2). If higher currents are
needed with the LTC692, a high current Schottky diode
can be connected from the VCC pin to the V
OUT
pin to
supply the extra current.
8
V
RESET
LOW LINE
CC
V2
t1
V1
Figure 1. Reset Active Time
V2
V1 = RESET VOLTAGE THRESHOLD
V2 = RESET VOLTAGE THRESHOLD +
RESET THRESHOLD HYSTERESIS
t1
t1 = RESET ACTIVE TIME
V1
LTC692/3 • F01
Page 9
LTC692/LTC693
R
V– 50mV
1A
CC
≤
µ
U
O
PPLICATI
A
5V
0.1µF
3V
Figure 2. Using BATT ON to Drive External PNP Transistor
S
IFORATIO
ANY PNP POWER TRANSISTOR
5
BATT ON
3
1
V
V
CC
LTC693
BATT
GND
V
OUT
4
WU
2
0.1µF
LTC692/3 • F02
U
The LTC692/LTC693 are protected for safe area operation
with a short circuit limit. Output current is limited to
approximately 200mA. If the device is overloaded for long
periods of time, thermal shutdown turns the power switch
off until the device cools down. The threshhold temperature for thermal shutdown is approximately 155°C with
about 10°C of hysteresis which prevents the device from
oscillating in and out of shutdown.
The PNP switch used in competitive devices was not
chosen for the internal power switch because it injects
unwanted current into the substrate. This current is collected by the V
pin in competitive devices and adds to
BATT
the charging current of the battery which can damage
lithium batteries. The LTC692/LTC693 use a charge pumped
NMOS power switch to eliminate unwanted charging
current while achieving low dropout and low supply current. Since no current goes to the substrate, the current
collected by the V
A 125Ω PMOS switch connects the V
pin is strictly junction leakage.
BATT
input to V
BATT
OUT
in
battery backup mode. The switch is designed for very low
dropout voltage (input-to-output differential). This feature
is advantageous for low current applications such as
battery backup in CMOS RAM and other low power CMOS
circuitry. The supply current in battery backup mode is
1µA maximum.
The operating voltage at the V
pin ranges from 2.0V to
BATT
4.0V. High value capacitors, such as electrolytic or faradsize double layer capacitors, can be used for short term
V
– V
OUT
I =
5V
0.1µF
3V
Figure 3. Charging External Battery Through V
V
V
CC
LTC692
LTC693
BATT
GND
BATT
R
R
V
OUT
0.1µF
LTC692/3 • F03
OUT
memory backup instead of a battery. The charging resistor
for the rechargeable batteries should be connected to
V
since this eliminates the discharge path that exists
OUT
when the resistor is connected to VCC (Figure 3).
Replacing the Backup Battery
When changing the backup battery with system power
on, spurious resets can occur while the battery is removed due to battery standby current. Although battery
standby current is only a tiny leakage current, it can still
charge up the stray capacitance on the V
oscillation cycle is as follows: When V
BATT
pin. The
BATT
reaches within
50mV of VCC, the LTC692/LTC693 switch to battery
backup. V
OUT
pulls V
low and the devices go back to
BATT
normal operation. The leakage current then charges up
the V
pin again and the cycle repeats.
BATT
If spurious resets during battery replacement pose no
problems, then no action is required. Otherwise, a resistor
from V
to GND will hold the pin low while changing the
BATT
battery. For example, the battery standby current is 1µA
maximum over temperature and the external resistor
required to hold V
below VCC is:
BATT
With VCC = 4.25V, a 3.9M resistor will work. With a 3V
battery, this resistor will draw only 0.77µA from the
battery, which is negligible in most cases.
9
Page 10
LTC692/LTC693
PPLICATI
A
U
O
S
IFORATIO
WU
U
If battery connections are made through long wires, a 10Ω
to 100Ω series resistor and a 0.1µ F capacitor are recommended to prevent any overshoot beyond VCC due to the
lead inductance (Figure 4).
10Ω
3.9M
Figure 4. 10Ω/0.1µF combination eliminates inductive
overshoot and prevents spurious resets during battery
replacement.
0.1µF
V
BATT
LTC692
LTC693
GND
LTC692/3 • F04
Table 1 shows the state of each pin during battery backup.
When the battery switchover section is not used, connect
V
to GND and V
BATT
OUT
to VCC.
Memory Protection
The LTC693 includes memory protection circuitry which
ensures the integrity of the data in memory by preventing
write operations when VCC is at an invalid level. Two
additional pins, CE IN and CE OUT, control the Chip Enable
or Write inputs of CMOS RAM. When VCC is 5V, CE OUT
follows CE IN with a typical propagation delay of 20ns.
When VCC falls below the reset voltage threshold or V
BATT
,
CE OUT is forced high, independent of CE IN. CE OUT is an
alternative signal to drive the CE, CS, or Write input of
battery backed up CMOS RAM. CE OUT can also be used
to drive the Store or Write input of an EEPROM, EAROM or
NOVRAM to achieve similar protection. Figure 5 shows the
timing diagram of CE IN and CE OUT.
CE IN can be derived from the microprocessor's address
decoder output. Figure 6 shows a typical nonvolatile
CMOS RAM application.
Memory protection can also be achieved with the LTC692
by using RESET as shown in Figure 7.
Table 1. Input and Output Status in Battery Backup Mode
SIGNALSTATUS
V
CC
V
OUT
V
BATT
BATT ONLogic high. The open-circuit output voltage is equal to V
PFIPower Failure Input is ignored.
PFOLogic low
RESETLogic low
RESETLogic high. The open-circuit output voltage is equal to V
LOW LINE Logic low
WDIWatchdog Input is ignored.
WDOLogic high. The open-circuit output voltage is equal to V
CE INChip Enable Input is ignored.
CE OUTLogic high. The open-circuit output voltage is equal to V
OSC INOSC IN is ignored.
OSC SELOSC SEL is ignored.
C2 monitors VCC for active switchover.
V
is connected to V
OUT
The supply current is 1µA maximum.
through an internal PMOS switch.
BATT
OUT
OUT
OUT
OUT
.
.
.
.
10
V
CE IN
CE OUT
V2
CC
V
= V
OUT
BATT
Figure 5. Timing Diagram for CE IN and CE OUT
V1
V1 = RESET VOLTAGE THRESHOLD
V2 = RESET VOLTAGE THRESHOLD +
RESET THRESHOLD HYSTERESIS
V
OUT
= V
BATT
LTC692/3 • F05
Page 11
LTC692/LTC693
V =1.3V 1+
R1R2R1
R3
H
+
V1.3V 1
R1
R2
–
(5V –1.3V)R1
1.3V(R3R4)
L
=+
+
PPLICATI
A
5V
0.1µF
3V
V
V
CC
BATT
GND
LTC693
CE OUT
U
O
S
IFORATIO
V
OUT
CE IN
RESET
RESET
+
10µF
20ns PROPAGATION DELAY
FROM DECODER
TO µP
WU
0.1µF
Figure 6. A Typical Nonvolatile CMOS RAM Application
V
5V
0.1µF
3V
V
V
CC
LTC692
BATT
GND
OUT
RESET
+
10µF
0.1µF
CS
Figure 7. Write Protect for RAM with the LTC692
U
V
CC
62512
RAM
CS
GND
LTC692/3 • F06
V
CC
62128
RAM
CS1
CS2
GND
LTC692/3 • F07
Power Fail Warning
The LTC692/LTC693 generate a Power Failure Output
(PFO) for early warning of failure in the microprocessor's
power supply. This is accomplished by comparing the
Power Failure Input (PFI) with an internal 1.3V reference.
PFO goes low when the voltage at the PFI pin is less than
1.3V. Typically PFI is driven by an external voltage divider
(R1 and R2 in Figures 8 and 9) which senses either an
unregulated DC input or a regulated 5V output. The voltage
divider ratio can be chosen such that the voltage at the PFI
pin falls below 1.3V, several milliseconds before the 5V
supply falls below the maximum reset voltage threshold of
4.50V. PFO is normally used to interrupt the microprocessor to execute shutdown procedure between PFO and
RESET or RESET.
The power fail comparator, C3, does not have hysteresis.
Hysteresis can be added however, by connecting a resistor between the PFO output and the noninverting PFI input
pin as shown in Figures 8 and 9. The upper and lower trip
points in the comparator are established as follows:
≥ 7.5V
V
IN
10µF
R1
51k
R2
10k
Figure 8. Monitoring
LT1086-5
V
INVOUT
++
ADJ
100µF
R3
300k
Unregulated
R4
10k
DC Supply with the
LTC692/LTC693 Power Fail Comparator
V
≥ 6.5V
IN
+
LT1086-5
V
V
OUT
10µF
IN
ADJ
+
Figure 9. Monitoring
10µF
Regulated
R1
27k
R2
8.2k
R5
3.3k
2.7M
5V
R4
10k
R3
DC Supply
with the LTC692/LTC693 Power Fail Comparator
5V
0.1µF
0.1µF
PFO
PFI
TO µP
PFO
PFI
TO µP
V
V
CC
CC
LTC692
LTC693
GND
LTC692/3 • F08
LTC692
LTC693
GND
LTC692/3 • F09
When PFO output is low, R3 sinks current from the
summing junction at the PFI pin.
When PFO output is high, the series combination of R3 and
R4 source current into the PFI summing junction.
Assuming R4R3,V5V
<<=
HYSTERESIS
R1
R3
Example 1: The circuit in Figure 8 demonstrates the use of
the power fail comparator to monitor the unregulated
power supply input. Assuming the the rate of decay of the
supply input VIN is 100mV/ms and the total time to execute
a shutdown procedure is 8ms. Also, the noise of VIN is
200mV. With these assumptions in mind, we can reasonably set VL = 7.25V which is 1.25V greater than the sum of
maximum reset voltage threshold and the dropout voltage
of LT1086-5 (4.5V + 1.5V) and V
HYSTERESIS
= 850mV.
11
Page 12
LTC692/LTC693
U
O
PPLICATI
A
V5V
HYSTERESIS
S
IFORATIO
R1
==
850mV
R3
WU
U
R3 ≈ 5.88 R1
Choose R3 = 300k and R1 = 51k. Also select R4 = 10k
which is much smaller than R3.
The 10.7ms allows enough time to execute shutdown
procedure for microprocessor and 831mV of hysteresis
would prevent PFO from going low due to the noise of VIN.
Example 2: The circuit in Figure 9 can be used to measure
the regulated 5V supply to provide early warning of power
failure. Because of variations in the PFI threshold, this
circuit requires adjustment to ensure the PFI comparator
trips before the reset threshold is reached. Adjust R5 such
that the PFO output goes low when the VCC supply reaches
the desired level (e.g., 4.6V).
Monitoring the Status of the Battery
C3 can also monitor the status of the memory backup
battery (Figure 10). If desired, the CE OUT can be used to
apply a test load to the battery. Since CE OUT is forced high
in battery backup mode, the test load will not be applied to
the battery while it is in use, even if the microprocessor is
not powered.
5V
V
CC
V
BATT
R1
1M
PFI
3V
Figure 10. Backup Battery Monitor with Optional Test Load
R2
1M
CE OUT
R
L
20K
OPTIONAL TEST LOAD
PFO
LTC693
CE IN
GND
LOW BATTERY SIGNAL
TO µP I/O PIN
I/O PIN
LTC692/3 • F10
Watchdog Timer
The LTC692/LTC693 provide a watchdog timer function to
monitor the activity of the microprocessor. If the microprocessor does not toggle the Watchdog Input (WDI)
within a seleced time-out period, RESET is forced to active
low for a minimum of 140ms. The reset active time is
adjustable on the LTC693. Since many systems cannot
service the watchdog timer immediately after a reset, the
LTC693 has longer time-out period (1.0 second minimum) right after a reset is issued. The normal time-out
period (70ms minimum) becomes effective following the
first transition of WDI after RESET is inactive. The watchdog time-out period is fixed at a 1.0 second minimum on
the LTC692. Figure 11 shows the timing diagram of
watchdog time-out period and reset active time. The
watchdog time-out period is restarted as soon as RESET
is inactive. When either a high-to-low or low-to-high
transition occurs at the WDI pin prior to time-out, the
watchdog timer is reset and begins to time-out again. To
ensure the watchdog timer does not time-out, either a
high-to-low or low-to-high transition on the WDI pin must
occur at or less than the minimum time-out period. If the
input to the WDI pin remains either high or low, reset
pulses will be issued every 1.6 seconds typically. The
watchdog timer can be deactivated by floating the WDI pin.
The timer is also disabled when VCC falls below the reset
voltage threshold or V
BATT
.
12
Page 13
LTC692/LTC693
PPLICATI
A
U
O
S
IFORATIO
WU
U
The LTC693 provides an additional output (Watchdog
Output, WDO) which goes low if the watchdog timer is
allowed to time out and remains low until set high by the
next transition on the WDI pin. WDO is also set high when
VCC falls below the reset voltage threshold or V
BATT
.
The LTC693 has two additonal pins OSC SEL and OSC IN,
which allow reset active time and watchdog time-out
period to be adjusted per Table 2. Several configurations
are shown in Figure 12.
OSC IN can be driven by an external clock signal or an
external capacitor can be connected between OSC IN and
= 5V
V
CC
WDI
t1 = RESET ACTIVE TIME
WDO
t2 = NORMAL WATCHDOG TIME-OUT PERIOD
t3 = WATCHDOG TIME-OUT PERIOD IMMEDIATELY
AFTER A RESET
GND when OSC SEL is forced low. In these configurations,
the nominal reset active time and watchdog time-out
period are determined by the number of clocks or set by
the formula in Table 2. When OSC SEL is high or floating,
the internal oscillator is enabled and the reset active time
is fixed at 140ms minimum. OSC IN selects between the
1 second and 70ms minimum normal watchdog time-out
periods. In both cases, the time-out period immediately
after a reset is at least 1 second.
RESET
t2t3
t1
t1
Figure 11. Watchdog Time-out Period and Reset Active Time
EXTERNAL CLOCK
3
5V
V
OSC SEL
CC
LTC693
4
GND
INTERNAL OSCILLATOR
1.6 SECOND WATCHDOG
3
5V
V
OSC SEL
CC
LTC693
4
GNDGND
OSC IN
OSC IN
8
7
8
7
FLOATING
OR HIGH
FLOATING
OR HIGH
EXTERNAL OSCILLATOR
3
5V
5V
V
4
GND
INTERNAL OSCILLATOR
100ms WATCHDOG
3
V
4
CC
CC
OSC SEL
LTC693
OSC SEL
LTC693
OSC IN
OSC IN
8
7
8
7
FLOATING
OR HIGH
LTC692/3 • F11
Figure 12. Oscillator Configurations
LTC692/3 • F12
13
Page 14
LTC692/LTC693
PPLICATI
A
U
O
S
IFORATIO
WU
U
Table 2. LTC693 Reset Active Time and Watchdog Time-Out Selections
WATCHDOG TIME-OUT PERIOD
OSC SEL
LowExternal Clock Input1024
LowExternal Capacitor*
Floating or HighLow100ms1.6 sec200ms
Floating or HighFloating or High1.6 sec1.6 sec200ms
*The nominal internal frequency is 10.24kHz. The nominal oscillator frequency with external capacitor is F
OSC IN
NORMAL
(Short Period)LTC693
clks
400ms
× C
47pF
IMMEDIATELY
AFTER RESET
(Long Period)
4096
clks
1.6 sec
× C
47pF
(Hz) =
OSC
184,000
C(pF)
Pushbutton Reset
The LTC692/LTC693 do not provide a logic input for direct
connection to a pushbutton. However, a pushbutton in
series with a 100Ω resistor connected to the RESET output
V
5V
CC
LTC692
LTC693
RESET
0.1µF
pin (Figure 13) provides an alternative for manual reset.
Connecting a 0.1µ F capacitor to the RESET pin debounces
GND
the pushbutton input.
RESET ACTIVE TIME
2048
clks
800ms
× C
47pF
RESET
100Ω
MPU
(e.g. 6805)
LTC692/3 • F13
The 100Ω resistor in series with the pushbutton is required to prevent the ringing, due to the capacitance and
lead inductance, from pulling the RESET pins of the MPU
and LTC692/LT693 below ground.
U
O
R1
10k
R2
30k
SA
Capacitor Backup with 74HC4016 Switch
5V
14121110
1
74HC4016
7
2
13
+
PPLICATITYPICAL
100µF
Figure 13. The External Pushbutton Reset
V
V
CC
BATT
LTC693
LOW LINE
GND
V
OUT
0.1µF0.1µF
LTC692/3 • TA3
14
Page 15
LTC692/LTC693
U
O
PPLICATITYPICAL
SA
Write Protect for Additional RAMs
5V
0.1µF
3V
PACKAGE DESCRIPTIO
0.1µF
0.1µF
B
0.1µF
C
V
CS
V
CS
CS
V
CS
CS
CC
62512
RAM
CC
62128
RAM
1
2
CC
1
2
A
B
62128
RAM
C
LTC692/3 • TA04
V
V
CC
BATT
LTC693
LOW LINE
GND
V
OUT
CE OUT
CE IN
+
10µF
20ns PROPAGATION
DELAY
CS
A
CS
CS
OPTIONAL CONNECTION FOR
ADDITIONAL RAMs
U
Dimensions in inches (millimeters) unless otherwise noted.
N8 Package
8-Lead Plastic DIP
S8 Package
8-Lead Plastic SOIC
0.300 – 0.320
(7.620 – 8.128)
0.065
(1.651)
0.009 – 0.015
(0.229 – 0.381)
+0.025
0.325
–0.015
+0.635
8.255
()
–0.381
0.008 – 0.010
(0.203 – 0.254)
0.010 – 0.020
(0.254 – 0.508)
× 45°
0.016 – 0.050
0.406 – 1.270
TYP
0.045 ± 0.015
(1.143 ± 0.381)
0°– 8° TYP
0.045 – 0.065
(1.143 – 1.651)
0.100 ± 0.010
(2.540 ± 0.254)
0.053 – 0.069
(1.346 – 1.752)
0.014 – 0.019
(0.355 – 0.483)
0.130 ± 0.005
(3.302 ± 0.127)
0.125
(3.175)
MIN
0.018 ± 0.003
(0.457 ± 0.076)
0.050
(1.270)
BSC
0.020
(0.508)
MIN
0.004 – 0.010
(0.101 – 0.254)
0.228 – 0.244
(5.791 – 6.197)
0.400
(10.160)
MAX
876
1234
0.189 – 0.197
(4.801 – 5.004)
8
1
5
7
2
5
6
3
4
0.250 ± 0.010
(6.350 ± 0.254)
N8 0393
0.150 – 0.157
(3.810 – 3.988)
SO8 0393
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of circuits as described herein will not infringe on existing patent rights.
15
Page 16
LTC692/LTC693
PACKAGE DESCRIPTIO
0.300 – 0.325
(7.620 – 8.255)
0.009 – 0.015
(0.229 – 0.381)
+0.025
0.325
–0.015
+0.635
8.255
()
–0.381
0.015
(0.381)
MIN
0.130 ± 0.005
(3.302 ± 0.127)
0.125
(3.175)
MIN
U
Dimensions in inches (millimeters) unless otherwise noted.
N Package
16-Lead Plastic DIP
0.045 – 0.065
(1.143 – 1.651)
0.260 ± 0.010
(6.604 ± 0.254)
0.045 ± 0.015
(1.143 ± 0.381)
0.100 ± 0.010
(2.540 ± 0.254)
0.018 ± 0.003
(0.457 ± 0.076)
S Package
16-Lead SOL
0.065
(1.651)
TYP
0.770
(19.558)
MAX
14
15
16
2
1
3
12
13
4
11
6
5
910
8
7
N16 0393
0.291 – 0.299
(7.391 – 7.595)
0.005
(0.127)
RAD MIN
0.009 – 0.013
(0.229 – 0.330)
NOTE:
1. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.
THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS.
2. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 INCH (0.15mm).
(NOTE 2)
0.010 – 0.029
(0.254 – 0.737)
NOTE 1
0.016 – 0.050
(0.406 – 1.270)
× 45°
0° – 8° TYP
0.093 – 0.104
(2.362 – 2.642)
0.050
(1.270)
TYP
0.014 – 0.019
(0.356 – 0.482)
TYP
0.037 – 0.045
(0.940 – 1.143)
0.004 – 0.012
(0.102 – 0.305)
NOTE 1
0.398 – 0.413
(10.109 – 10.490)
(NOTE 2)
15 1413121110 9
16
2345678
1
0.394 – 0.419
(10.007 – 10.643)
S16 0393
16
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7487
(408) 432-1900
●
FAX
: (408) 434-0507
●
TELEX
: 499-3977
LT/GP 0493 10K REV 0
LINEAR TECHNOLOGY CORPORATION 1993
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