Fully ISO 7816-3 and EMV Compliant
(Including Auxiliary I/O Pins)
■
Buck-Boost Charge Pump Generates 3V or 5V
■
2.7V to 6.0V Input Voltage Range
■
Very Low Operating Current: 60µA
■
>10kV ESD on All Smart Card Pins
■
Dynamic Pull-Ups Deliver Fast Signal Rise Times
■
Soft Start Limits Inrush Current at Turn On
■
3V ↔ 5V Signal Level Translators
■
Shutdown Current: <1µA
■
Short-Circuit and Overtemperature Protected
■
Alarm Output Indicates Fault Condition
■
Multiple Devices May Be Paralleled for
Multicard Applications
■
Available in 24-Pin SSOP Package
U
APPLICATIONS
■
Handheld Payment Terminals
■
Pay Telephones
■
ATMs
■
Key Chain Readers
■
Smart Card Readers
The LTC®1755 universal Smart Card interface is fully
compliant with ISO 7816-3 and EMV specifications. It
provides the smallest and simplest interface circuit between a host microcontroller and general purpose Smart
Cards.
An internal charge pump DC/DC converter delivers regulated 3V or 5V to the Smart Card, while on-chip level
shifters allow connection to a low voltage controller. All
Smart Card contacts are rated for 10kV ESD, eliminating
the need for external ESD protection devices.
Input voltage may range from 2.7V to 6.0V, allowing direct
connection to a battery. Automatic DC/DC converter soft
start mitigates start-up problems that may result when the
input power is provided by another regulator. Multiple
LTC1755 devices may be paralleled and connected to a
single controller for multicard applications.
Battery life is maximized by 60µA operating current and
1µA shutdown current. The 24-pin SSOP package mini-
mizes PCB area for compact portable systems.
, LTC and LT are registered trademarks of Linear Technology Corporation.
TYPICAL APPLICATION
SMART CARD
PRESENT SWITCH
SMART CARD
U
3.3V
1
PRES
2
PWR
3
CS
4
NC/NO
5
C3
10µF
GND
V
CC
AUX1
AUX2
I/O
RST
CLK
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
C2
10µF
GND
6
V
LTC1755
IN
7
V
CC
8
AUX1
9
AUX2
10
I/O
11
RST
12
CLK
AUX1IN
AUX2IN
5V/3V
CARD
ALARM
READY
DV
DATA
RIN
CIN
24
23
22
21
20
CC
19
–
C
18
+
C
17
16
15
14
13
C1
0.68µF
µCONTROLLER
1755 TA01
1
Page 2
LTC1755
1
2
3
4
5
6
7
8
9
10
11
12
TOP VIEW
GN PACKAGE
24-LEAD NARROW PLASTIC SSOP
24
23
22
21
20
19
18
17
16
15
14
13
PRES
PWR
CS
NC/NO
GND
V
IN
V
CC
AUX1
AUX2
I/O
RST
CLK
5V/3V
CARD
ALARM
READY
DV
CC
C
–
C
+
AUX1IN
AUX2IN
DATA
RIN
CIN
WW
W
U
ABSOLUTE MAXIMUM RATINGS
(Note 1)
VIN to GND............................................... –0.3V to 6.5V
DVCC, VCC to GND.................................... –0.3V to 5.5V
Digital Inputs to GND................ –0.3V to (DVCC + 0.3V)
CLK, RST, I/O, AUX1,
AUX2 to GND..............................–0.3V to VCC + 0.3V
High Input Voltage Threshold (VIH)● DVCC – 0.6 0.5 • DV
Low Input Voltage Threshold (VIL)●0.5 • DV
High Level Output Voltage (VOH)Source Current = 20µA●0.7 • DV
Low Level Output Voltage (VOL)Sink Current = –500µA (Note 3)●0.3V
Output Rise/Fall TimeLoaded with 30pF●0.5µs
Input Current (IIH/IIL)CS = DV
2
The ● denotes specifications which apply over the full specified
= 0●50100µA
VCC
IDLE State, DV
IDLE State, DV
5V/3V = 0V
5V/3V = DV
5V/3V = 0V2.7V ≤ VIN ≤ 6.0V●55mA
5V/3V = DV
= 10µF●2.712ms
OUT
= 0mA, VCC = 5V, C
VCC
= 0V, 3.6V < VIN ≤ 6V●10µA
CC
= 5.5V, VIN ≤ 6V●20µA
CC
●4.755.005.25V
●2.803.003.20V
CC
CC
CC
●–11µA
CC
CC
CC
CC
3V ≤ VIN ≤ 6.0V●65mA
2.7V ≤ VIN ≤ 6.0V●40mA
= 10µF●100250µs
OUT
0.3V
V
V
Page 3
LTC1755
ELECTRICAL CHARACTERISTICS
The ● denotes specifications which apply over the full specified
temperature range, otherwise specificatons are at TA = 25°C. VIN = 2.7V to 6V, DVCC = 2V to 5.5V, unless otherwise noted.
High Input Voltage Threshold (VIH)I
Low Input Voltage Threshold (VIL)I
High Level Output Voltage (VOH)Source Current = 20µA●0.8 • V
Low Level Output Voltage (VOL)Sink Current = –1mA●0.3V
Rise/ Fall TimeLoaded with 30pF●0.5µs
Short-Circuit CurrentShorted to V
CLK
High Level Output Voltage (VOH)Source Current = 100µA●VCC – 0.5V
Low Level Output Voltage (VOL)Sink Current = –200µA●0.3V
CLK Rise/Fall TimeCLK Loaded with 30pF●16ns
CLK FrequencyCLK Loaded with 30pF●5MHz
RST
High Level Output Voltage (VOH)Source Current = 200µA●0.8 • V
Low Level Output Voltage (VOL)Sink Current = –200µA●0.3V
RST Rise/Fall TimeLoaded with 30pF●0.5µs
PRES
High Input Voltage Threshold (VIH)●0.7 • DVCC0.5 • DV
Low Input Voltage Threshold (VIL)●0.5 • DVCC0.2 • DV
PRES Pull-Up Current●0.51µA
PRES Debounce TimeProportional to the 0.68µF Charge Pump Capacitor●4080ms
= ±20µA●0.6 • VCC0.5 • V
IH(MAX)
= 1mA●0.5 • V
IL(MAX)
DATA, AUX1IN, AUX2IN = DV
DATA, AUX1IN, AUX2IN = 0V (Note 3)
CC
CC
●3.55mA
CC
CC
CC
CC
CC
CC
CC
0.8V
CC
V
V
V
V
V
V
V
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2: The LTC1755 is guaranteed to meet performance specifications
from 0°C to 70°C. Specifications over the –40°C to 85°C operating
temperature range are assured by design, characterization and correlation
with statistical process controls.
Note 3: The DATA, AUX1IN, AUX2IN, AUX1, AUX2 and I/O pull-down
drivers must sink up to 250µA sourced by the internal current sources.
3
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LTC1755
UUU
PIN FUNCTIONS
PRES (Pin 1): (Input) Connects to the Smart Card acceptor’s
PRESENT indicator switch to detect if a card is inserted.
This pin has a pull-up current source so that a grounded
switch can be detected with no external components. The
pull-up current source is nonlinear, delivering higher
current when the PRES pin is above 1V but very little
current below 1V. This helps resist false card indications
due to leakage current. The activation state of the PRES pin
can be set by the NC/NO pin so that both normally open
(NO) and normally closed (NC) switches are easily recognized (see NC/NO pin description).
DVCC sets the logic reference level for the PRES pin.
PWR (Pin 2): (Input) A low on the PWR pin places the
LTC1755 in the ACTIVE state enabling the charge pump.
The READY pin indicates when the card supply voltage
(VCC) has reached its final value and communication with
the Smart Card is possible. The reset and clock channels
are enabled after READY goes low. The three I/O channels
are also enabled only after READY goes low, however they
may be disabled separately via the CS pin.
The falling edge of PWR latches the state of the 5V/3V pin.
After PWR is low, changes on the 5V/3V pin are ignored.
CS (Pin 3): (Input) The CS pin enables the three bidirectional I/O channels of the LTC1755. When the I/O channels
are disabled the Smart Card pins (I/O, AUX1, AUX2) are
forced to logic one and the controller pins (DATA, AUX2IN,
AUX1IN) are high impedance. CS can be brought low
along with PWR when the device is first enabled, however
communication with the Smart Card is inhibited until V
reaches its final value as indicated by a low on the READY
pin.
DVCC sets the logic reference level for the CS pin.
NC/NO (Pin 4): (Input) This pin controls the activation
level of the PRES pin. When it is high (DVCC) the PRES pin
is active high. When it is low (GND) the PRES pin is active
low. In either case the presence of a Smart Card is
indicated by a low on the CARD output. When a ground
side normally open (NO) switch is used the NC/NO pin
should be grounded. When a ground side normally closed
(NC) switch is used the NC/NO pin should be connected to
DVCC.
CC
Note: If a normally closed switch is used, a small current
(several microamperes) will flow through the switch whenever a Smart Card is not present. For ultralow power
consumption in shutdown, a normally open switch is
optimum.
DVCC sets the logic reference level for the NC/NO pin.
GND (Pin 5): Ground Reference for the IC. This pin should
be connected to a low impedance ground plane. Bypass
capacitors for VIN and VCC should be in close proximity to
the GND pin.
VIN (Pin 6): Supply Voltage for the Charge Pump. May be
between 2.7V and 6V. A 10µF low ESR ceramic bypass ca-
pacitor is required on this pin for optimum performance.
VCC (Pin 7): Regulated Smart Card Supply Voltage. This
pin should be connected to the Smart Card VCC contact.
The 5V/3V pin determines the VCC output voltage.
The VCC pin is protected against short circuits by comparing the actual output voltage with an internal reference
voltage. If VCC is below its correct level (for as little as 5µs)
the LTC1755 switches to the Alarm state (see the State
Diagram). The VCC pin requires a 10µF charge storage
capacitor to ground. For optimum performance a low ESR
ceramic capacitor should be used.
During the Idle and Alarm states the VCC pin is rapidly
discharged to ground to comply with the deactivation
requirements of the EMV and ISO-7816 specifications.
AUX1 (Pin 8): (Input/Output) Smart Card Side Auxiliary
I/O Pin. This pin is used for auxiliary bidirectional data
transfer between the microcontroller and the Smart Card.
It has the same characteristics as the I/O pin.
AUX2 (Pin 9): (Input/Output) Smart Card Side Auxiliary
I/O Pin. This pin is used for auxiliary bidirectional data
transfer between the microcontroller and the Smart Card.
It has the same characteristics as the I/O pin.
I/O (Pin 10): (Input/Output) Smart Card Side Data I/O Pin.
This pin is used for bidirectional data transfer between the
microcontroller and the Smart Card. It should be connected
to the Smart Card I/O contact. The Smart Card I/O pin must
be able to sink up to 250µA when driving the I/O pin low
4
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UUU
PIN FUNCTIONS
LTC1755
due to the pull-up current source. The I/O pin becomes a
low impedance to ground during the Idle state. It does not
become active until READY goes low indicating that VCC is
stable.
Once READY is low the I/O pin is protected against short
circuits to VCC by current limiting to 5mA maximum.
The DATA-I/O channel is bidirectional for half-duplex
transmissions. Its idle state is H-H. Once an L is detected
on one side of the channel the direction of transmission is
established. Specifically, the side which received an L first
is now the input, and the opposite side is the output.
Transmission from the output side back to the input side
is inhibited, thereby preventing a latch condition. Once the
input side releases its L, both sides return to H, and the
channel is now ready for a new L to be transmitted in either
direction. If an L is forced externally on the output side, and
it persists until after the L on the input side is released, this
illegal input will not be transmitted to the input side
because the transmission direction will not have changed.
The direction of transmission can only be established from
the idle (H-H) state and is determined by the first receipt
of an L on either side.
RST (Pin 11): (Output) Level-Shifted Reset Output Pin.
This pin should be connected to the Smart Card RST
contact. The RST pin becomes a low impedance to ground
during the Idle state (see the State Diagram). The reset
channel does not become active until the READY signal
goes low indicating that VCC is stable.
Short-circuit protection is provided on the RST pin by
comparing RST with RIN. If these signals differ for several
microseconds then the LTC1755 switches to the Alarm
state. This fault checking is only performed after the VCC pin
has reached its final value (as indicated by the READY pin).
CLK (Pin 12): (Output) Level-Shifted Clock Output Pin.
This pin should be connected to the Smart Card CLK
contact. The CLK pin becomes a low impedance to ground
during the Idle state (see the State Diagram). The clock
channel does not become active until the READY signal
goes low indicating that VCC is stable.
Short-circuit protection is provided on the CLK pin by comparing CLK with CIN. If these signals differ for several microseconds then the LTC1755 switches to the Alarm state.
This fault checking is only performed after the VCC pin has
reached its final value (as indicated by the READY pin).
The clock channel is optimized for signal integrity in order
to meet the stringent duty cycle requirements of the EMV
specification. Therefore, to reduce power in low power
applications, clock stop mode is recommended when data
is not being exchanged.
CIN (Pin 13): (Input) Clock Input Pin from the Microcontroller. During the Active state this signal appears on the
CLK pin after being level-shifted and buffered.
DVCC sets the logic reference level for the CIN pin.
RIN (Pin 14): (Input) Reset Input Pin from the Microcon-
troller. During the Active state this signal appears on the
RST pin after being level-shifted and buffered.
DVCC sets the logic reference level for the RIN pin.
DATA (Pin 15): (Input/Output) Microcontroller Side Data
I/O Pin. This pin is used for bidirectional data transfer
between the microcontroller and the Smart Card. The
microcontroller data pin must be open drain and must be
able to sink up to 250µA when driving the DATA pin low
due to the pull-up current source. The DATA pin becomes
high impedance during the Idle state or when CS is high
(see the State Diagram). It does not become active until the
READY signal goes low indicating that VCC is stable.
AUX2IN (Pin 16): (Input/Output) Microcontroller Side
Auxiliary I/O pin. This pin is used for bidirectional auxiliary
data transfer between the microcontroller and the Smart
Card. It has the same characteristics as the DATA pin.
AUX1IN (Pin 17): (Input/Output) Microcontroller Side
Auxiliary I/O Pin. This pin is used for bidirectional auxiliary
data transfer between the microcontroller and the Smart
Card. It has the same characteristics as the DATA pin.
C+, C– (Pins 18, 19): Charge Pump Flying Capacitor
Terminals. Optimum values for the flying capacitor range
from 0.68µF to 1µF. Best performance is achieved with a
low ESR X7R ceramic capacitor.
5
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LTC1755
UUU
PIN FUNCTIONS
DV
(Pin 20): Supply Voltage for the Microcontroller Side
CC
Digital Input and Input/Output Pins (Typically 3V). If the
charge pump input pin (VIN) is powered from the same
source as the microcontroller, then DVCC should be connected directly to VIN. In this case only one (10µF) input
bypass capacitor is needed for the LTC1755. If the DV
pin is powered separately then it should be bypassed
separately with a 0.1µF capacitor. The DVCC pin may be
between 2V and 5.5V.
The DVCC pin is monitored for adequate voltage. If DV
drops below approximately 1.5V the LTC1755 automatically enters the Idle state.
READY (Pin 21): (Output) Readiness Indicator of the
Smart Card Supply Voltage (VCC). When the LTC1755 is
placed in the Active state the soft start feature slowly
ramps the VCC voltage. A low on the READY pin indicates
that VCC has reached its final value.
The READY pin is configured as an open-drain pull-down
with a weak pull-up current source. This permits wiredOR connections of multiple LTC1755s to a single microcontroller.
ALARM (Pin 22): (Output) A low on this pin indicates that
a fault has occurred and that the LTC1755 is in the Alarm
state (see the State Diagram). Possible faults include V
underrange for at least 5µs, overtemperature shutdown,
CLK or RST invalid output levels, and card removal during
the Active state.
CC
CC
CC
CLK or RST invalid and overtemperature faults are detected only after VCC has reached its final value (as
indicated by the READY pin). VCC underrange and card
removal during Active faults are detected at any time
during the Active period (i.e., once PWR = 0V).
The ALARM pin is configured as an open-drain pull-down
with a weak pull-up current source. This permits wiredOR connections of multiple LTC1755s to a single microcontroller.
CARD (Pin 23): (Output) Level-Shifted and Debounced
PRES Signal from the Smart Card Acceptor Switch. When
a valid card indication appears, this pin communicates the
presence of the Smart Card to the microcontroller. The
CARD pin has an open-drain active pull-down with a weak
pull-up current source for logic-OR connections. The
debounce circuit ensures that a card has been present for
a continuous period of at least 40ms before asserting
CARD low. The CARD pin returns high within 50µs of card
removal. The PRES pin, in conjunction with the NC/NO pin,
determines if a card is present.
5V/3V (Pin 24):(Input) Controls the output voltage (VCC)
of the DC/DC converter during the Active state. A valid high
sets VCC to 5V. A valid low sets VCC to 3V. The 5V/3V pin
is latched on the falling edge of the PWR pin. When PWR
is low, changes on the 5V/3V pin are ignored. To change
the voltage on VCC the LTC1755 must first be returned to
the Idle state by bringing the PWR pin high.
DVCC sets the logic reference level for the 5V/3V pin.
6
Page 7
BLOCK DIAGRA
W
DV
LTC1755
CC
PRES 1
PWR 2
CS 3
NC/NO 4
GND 5
V
IN
V
CC
AUX1 8
5V/3V
τ
DC/DC CONVERTER
AND
CONTROL LOGIC
6
7
*
*
24
23
22
21
20
19
18
17
CARD
ALARM
READY
DV
CC
–
C
+
C
AUX1IN
*
AUX2 9
*
I/O 10
RST 11
CLK
12
DYNAMIC PULL-UP CURRENT SOURCE
*
*
16
AUX2IN
*
DATA15
R
14
IN
C
13
IN
1755 BD
7
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LTC1755
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APPLICATIONS INFORMATION
10kV ESD Protection
All Smart Card pins (CLK, RST, I/O, AUX1, AUX2, VCC and
GND) can withstand over 10kV of human body model ESD
in situ. In order to ensure proper ESD protection, careful
board layout is required. The GND pin should be tied
directly to a ground plane. The VCC capacitor should be
located very close to the VCC pin and tied immediately to
the ground plane.
Capacitor Selection
The style and value of capacitors used with the LTC1755
determine several parameters such as output ripple voltage, charge pump strength, Smart Card switch debounce
time and VCC discharge rate.
Due to the switching nature of a capacitive charge pump,
low equivalent series resistance (ESR) capacitors are
recommended for the capacitors at VIN and VCC. Whenever the flying capacitor is switched to the VCC charge
storage capacitor, considerable current flows. The product of this high current and the ESR of the output capacitor
can generate substantial voltage spikes on the VCC output.
These spikes may cause problems with the Smart Card or
may interfere with the regulation loop of the LTC1755.
Therefore, ceramic or tantalum capacitors are recommended rather than higher ESR aluminum capacitors.
Between ceramic and tantalum, ceramic capacitors generally have the lowest ESR. Some manufacturers have
developed low ESR tantalum capacitors but they can be
expensive and may still have higher ESR than ceramic
types. Thus, while they cannot be avoided, ESR spikes will
typically be lowest when using ceramic capacitors.
For ceramic capacitors there are several different materials available to choose from. The choice of ceramic
material is generally based on factors such as available
capacitance, case size, voltage rating, electrical performance and cost. For example, capacitors made of Y5V
material have high packing density, which provides high
capacitance for a given case size. However, Y5V capacitors tend to lose considerable capacitance over the – 40°C
to 85°C temperature range. X7R ceramic capacitors are
more stable over temperature but don’t provide the high
packing density. Therefore, large capacitance values are
generally not available in X7R ceramic.
The value and style of the flying capacitor are important
not only for the charge pump but also because they
provide the large debounce time for the Smart Card
detection channel. A 0.68µF X7R capacitor is a good
choice for the flying capacitor because it provides fairly
constant capacitance over temperature and its value is not
prohibitively large.
The charge storage capacitor on the VCC pin determines
the ripple voltage magnitude and the discharge time of the
Smart Card voltage. To minimize ripple, generally, a large
value is needed. However, to meet the VCC discharge rate
specification, the value should not exceed 20µF. A 10µF
capacitor can be used but the ripple magnitude will be
higher leading to worse apparent DC load regulation.
Typically a 15µF to 18µF Y5V ceramic capacitor is the best
choice for the VCC charge storage capacitor. For best
performance, this capacitor should be connected as close
as possible to the VCC and GND pins. Note that most of the
electrostatic discharge (ESD) current on the six Smart
Card pins is absorbed by this capacitor.
The bypass capacitor at VIN is also important. Large dips
on the input supply due to ESR may cause problems with
the internal circuitry of the LTC1755. A good choice for the
input bypass capacitor is a 10µF Y5V style ceramic
Dynamic Pull-Up Current Sources
The current sources on the bidirectional pins (DATA,
AUX2IN, AUX1IN, I/O, AUX2 and AUX1) are dynamically
activated to achieve a fast rise time with a relatively small
static current (Figure 1). Once a bidirectional pin is relinquished, a small start-up current begins to charge the
node. An edge rate detector determines if the pin is
released by comparing its slew rate with an internal
V
OR DV
CC
CC
V
+
REF
I
START
–
δV
δt
BIDIRECTIONAL PIN
Figure 1. Dynamic Pull-Up Current Sources
1755 F01
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LTC1755
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APPLICATIONS INFORMATION
reference value. If a valid transition is detected, a large
pull-up current enhances the edge rate on the node. The
higher slew rate corroborates the decision to charge the
node thereby effecting a dynamic form of hysteresis. Once
the node has reached the power supply voltage the internal
comparator requires several hundred nanoseconds to
reset. Pulling down on the pin before the reset delay
expires will result in a momentary contention and a higher
current flow. Therefore, the comparator delay sets the
upper limit on the maximum data rate of the bidirectional
channels to about 500kHz.
Synchronous Card Applications
For multicard synchronous applications the LTC1755 has
separate control pins for the CLK and I/O lines. The PWR
pin enables the charge pump as well as the CLK and RST
channels while the CS pin enables only the bidirectional
channels. In multicard applications the CS pin can be used
to disable communication to one card while leaving its
clock line running. With this option the same I/O pin can
be used for multiple cards. For simpler applications the CS
and PWR pins can be connected together to enable or
disable the entire chip.
Low Power Operation
The LTC1755 is inherently a low power device. When there
is no Smart Card present the supply current is less than
10µA. If DVCC is 0V the current drops below 1µA. When a
Smart Card is present the LTC1755 operates with a quiescent current of only 60µA, thus the majority of power is
consumed by charge pump losses and the card itself. If the
card can be made to consume less power during idle times
a significant power savings will be achieved. Whenever
possible Clock Stop Mode should be used (or alternatively
a very low “idling” clock speed). Furthermore, in the Active
state, the bidirectional pins should all be relinquished
whenever possible since there is some static current flow
when a bidirectional pin is pulled down.
Overtemperature Fault Protection
Self-Start Mode
By connecting the CARD pin to the CS and PWR pins the
LTC1755 can be made to start up automatically when a
Smart Card is detected (Figure 2). In this mode, the READY
pin becomes an interrupt signal indicating to the microcontroller that a Smart Card is present and that VCC, the
charge pump voltage, is at its final value. The Smart Card
remains powered as long as it is detected by the PRES pin.
When the Smart Card is removed the LTC1755 will automatically be deactivated by the fault detection circuitry.
CARD
Figure 2. Self-Start Mode
PWR
CS
1755 F02
Deactivation Sequence
For maximum flexibility the Smart Card can be deactivated
either manually or automatically. In manual mode the
deactivation is controlled by explicitly manipulating the
LTC1755 input and control pins (DATA, AUX1IN, AUX2IN,
RIN and CIN followed by PWR and CS). In automatic mode
the PWR pin is used to perform the built-in deactivation
sequence. Once PWR is brought high the built-in
deactivation sequence occurs as follows:
DEACTIVATION DIRECTIVE
V
CC
RST
CLK
AUX2
AUX1
RST = R
IN
CLK = C
IN
I/O
I/O = DATA
Figure 3. Deactivation Sequence
1755 F03
An overtemperature circuit disables the chip and activates
the ALARM pin if the IC’s junction temperature exceeds
150°C.
In the event of a fault, the LTC1755 automatically
implements the built-in deactivation sequence.
9
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LTC1755
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APPLICATIONS INFORMATION
POWER OFF
PWR = DV
Figure 4. LTC1755 State Diagram
IDLE
DEACTIVATION
CC
ALARM
DEACTIVATION
State Definitions
IDLE/DEACTIVATION
VCC, RST, CLK, I/O AUX2, AUX1 = L
READY, ALARM, DATA, AUX2IN, AUX1IN = Z
CARD = PRES ⊕ NC/NO
Once the LTC1755 enters the Idle/Deactivation state the
deactivation sequence begins. The deactivation sequence
will continue until VCC is discharged to approximately 1V.
An activation command (PWR = 0V) will only be acknowledged once this occurs.
PWR = 0V
PWR = DV
PRES ≠ NC/NO
FAULT > 5µs
or
PRES ≠ NC/NO
CC
ACTIVE
NO
FAULT
FAULT
TIMEOUT
FAULT
1755 F04
ALARM/DEACTIVATION
Same as Idle/Deactivation except:
ALARM = L
The only possible next state is Idle/Deactivation which is
achieved by disabling the LTC1755 via the PWR pin
(i.e., PWR = DVCC).
The alarm indication can be cleared by rapidly cycling the
PWR pin. However, a new activation cycle will not begin
until VCC is or has dropped below approximately 1V.
ACTIVE
VCC = 3V or 5V (as determined by the 5V/3V pin)
RST = RIN, CLK = C
IN
I/O, AUX2, AUX1, DATA, AUX2IN, AUX1IN = Ready for
data (after READY becomes low)
CARD = PRES ⊕ NC/NO
ALARM = H
FAULT TIMEOUT
Same as Active except:
The duration of a fault is being measured. If the fault
duration exceeds 5µs then the Alarm/Deactivation state
follows. If the fault duration is less than 5µs, then the
device is returned to the Active state.
10
Page 11
PACKAGE DESCRIPTION
U
Dimensions in inches (millimeters) unless otherwise noted.
GN Package
24-Lead Plastic SSOP (Narrow 0.150)
(LTC DWG # 05-08-1641)
0.337 – 0.344*
(8.560 – 8.738)
LTC1755
0.033
161718192021222324
15
14
(0.838)
13
REF
0.015
± 0.004
(0.38 ± 0.10)
0.007 – 0.0098
(0.178 – 0.249)
0.016 – 0.050
(0.406 – 1.270)
* DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
0° – 8° TYP
× 45°
0.229 – 0.244
(5.817 – 6.198)
0.053 – 0.068
(1.351 – 1.727)
0.008 – 0.012
(0.203 – 0.305)
12
0.150 – 0.157**
(3.810 – 3.988)
5
4
3
678 9 10 11 12
0.004 – 0.0098
(0.102 – 0.249)
0.0250
(0.635)
BSC
GN24 (SSOP) 1098
11
Page 12
LTC1755
TYPICAL APPLICATION
SMART CARD
PRESENT SWITCH
C3
10µF
GND
V
CC
AUX1
SMART CARD
AUX2
I/O
RST
CLK
U
Paralleling Devices for Multicard Applications
V
IN
C2
10µF
1
PRES
2
PWR
3
CS
4
NC/NO
5
GND
6
V
LTC1755
IN
7
V
CC
8
AUX1
9
AUX2
10
I/O
11
RST
12
CLK
5V/3V
CARD
ALARM
READY
DV
AUX1IN
AUX2IN
DATA
R
C
24
23
22
21
20
CC
19
–
C
18
+
C
17
16
15
14
IN
13
IN
C1
0.68µF
µCONTROLLER
SMART CARD
PRESENT SWITCH
GND
SMART CARD
V
AUX1
AUX2
RST
CLK
I/O
CC
10µF
C6
C5
10µF
1
PRES
2
PWR
3
CS
4
NC/NO
5
GND
6
V
LTC1755
IN
7
V
CC
8
AUX1
9
AUX2
10
I/O
11
RST
12
CLK
5V/3V
CARD
ALARM
READY
DV
AUX1IN
AUX2IN
DATA
R
C
24
23
22
21
20
CC
19
–
C
18
+
C
17
16
15
14
IN
13
IN
C4
0.68µF
1755 TA02
RELATED PARTS
PART NUMBERDESCRIPTIONCOMMENTS
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DC/DC Converters
LTC1516Micropower Regulated 5V Charge Pump5V/50mA Output from 2V to 5V Input, S0-8 Package
LTC1555/LTC1556SIM Power Supply and Level TranslatorStep-Up/Step-Down Charge Pump + SIM Level Translators, >10kV ESD
LTC1754-55V Charge Pump with Shutdown in SOT-23VIN from 2.7V to 5.5V, 50mA Output with VIN ≥ 3V
LTC19863V/5V SIM Power Supply in SOT-23VIN from 2.6V to 4.4V, 3V/5V Output at 10mA
12
Linear T echnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear-tech.com
1755i LT/TP 1099 4K • PRINTED IN USA
LINEAR TECHNOLOGY CORPORATION 1999
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