The LTC®1606 is a 250ksps, sampling 16-bit A/D converter that draws only 75mW (typical) from a single 5V
supply. This easy-to-use device includes sample-andhold, precision reference, switched capacitor successive
approximation A/D and trimmed internal clock.
The LTC1606’s input range is an industry standard ±10V.
Maximum DC specs include ±2.0LSB INL and 16 bits no
missing codes over temperature. An external reference
can be used if greater accuracy over temperature is
needed.
The 90dB signal-to-noise ratio offers an improvement of
3dB over competing devices, and the RMS transition noise
is reduced (0.65LSB vs 1LSB) relative to competitive
parts.
The ADC has a microprocessor compatible, 16-bit or two
byte parallel output port. A convert start input and a data
ready signal (BUSY) ease connections to FIFOs, DSPs and
microprocessors.
, LTC and LT are registered trademarks of Linear Technology Corporation.
±10V
INPUT
Low Power, 250kHz, 16-Bit Sampling ADC on 5V Supply
5V
6 TO 13
15 TO 22
26
25
24
23
10µF
DIGITAL
CONTROL
SIGNALS
2827
V
DIGVANA
200Ω
1
33.2k
4
4.096V
10µF
3
2.5V
2.2µF
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
operating temperature range, otherwise specifications are at TA = 25°C. (Note 5)
PARAMETERCONDITIONSMINTYPMAXUNITS
V
Output VoltageI
REF
V
Output TempcoI
REF
Internal Reference Source Current1µA
External Reference Voltage for Specified Linearity(Notes 9, 10)2.302.502.70V
External Reference Current DrainExt. Reference = 2.5V (Note 9)●100µA
CAP Output VoltageI
= 0●2.4702.5002.520V
OUT
= 0±5ppm/°C
OUT
= 04.096V
OUT
The ● indicates specifications which apply over the full
LTC1606/LTC1606A
3
Page 4
LTC1606
UU
DIGITAL INPUTS AND DIGITAL OUTPUTS
operating temperature range, otherwise specifications are at TA = 25°C. (Note 5)
SYMBOLPARAMETERCONDITIONSMINTYPMAXUNITS
V
IH
V
IL
I
IN
C
IN
V
OH
V
OL
I
OZ
C
OZ
I
SOURCE
I
SINK
High Level Input VoltageVDD = 5.25V●2.4V
Low Level Input VoltageVDD = 4.75V●0.8V
Digital Input CurrentVIN = 0V to V
Digital Input Capacitance5pF
High Level Output VoltageVDD = 4.75VIO = –10µA4.5V
Hi-Z Output Leakage D15 to D0V
Hi-Z Output Capacitance D15 to D0CS High (Note 9)●15pF
Output Source CurrentV
Output Sink CurrentV
OUT
OUT
OUT
DD
= 0V to VDD, CS High●±10µA
= 0V–10mA
= V
DD
The ● indicates specifications which apply over the full
LTC1606/LTC1606A
●±10µA
IO = –200µA●4.0V
IO = 1.6mA●0.100.4V
10mA
WU
TIMING CHARACTERISTICS
range, otherwise specifications are at TA = 25°C. (Note 5)
The ● indicates specifications which apply over the full operating temperature
LTC1606/LTC1606A
SYMBOLPARAMETERCONDITIONSMINTYPMAXUNITS
f
SAMPLE(MAX)
t
CONV
t
ACQ
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
t
9
t
10
t
11
t
12
Maximum Sampling Frequency●250kHz
Conversion Time●2.5µs
Acquisition Time●1.5µs
Convert Pulse Width(Note 11)●40ns
Data Valid Delay After R/C↓(Note 9)●2.5µs
BUSY Delay from R/C↓CL = 30pF●65ns
BUSY Low●2.5µs
BUSY Delay After End of Conversion100ns
Aperture Delay40ns
Bus Relinquish Time●1550ns
BUSY Delay After Data Valid●2090ns
Previous Data Valid After R/C↓2µs
R/C to CS Setup Time(Notes 9, 10)●5ns
Time Between Conversions●4µs
Bus AccessCL = 30pF, (Notes 10)●1560ns
Byte DelayCL = 30pF, (Notes 9, 10)●1560ns
4
Page 5
LTC1606
WU
POWER REQUIREMENTS
range, otherwise specifications are at TA = 25°C. (Note 5)
SYMBOLPARAMETERCONDITIONSMINTYPMAXUNITS
V
DD
I
DD
P
DIS
Positive Supply Voltage(Notes 9, 10)4.755.25V
Positive Supply Current●1520mA
Power Dissipation●75100mW
The ● indicates specifications which apply over the full operating temperature
LTC1606/LTC1606A
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2: All voltage values are with respect to ground with DGND, AGND1
and AGND2 wired together (unless otherwise noted).
input
IN
ANA
DD
=
DD
.
Note 3: When these pin voltages are taken below ground or above V
= VDD, they will be clamped by internal diodes. This product can
V
DIG
handle input currents of greater than 100mA below ground or above V
without latch-up.
Note 4: When these pin voltages are taken below ground, they will be
clamped by internal diodes. This product can handle input currents of
90mA below ground without latchup. These pins are not clamped to V
Note 5: VDD = 5V, f
specified.
Note 6: Linearity, offset and full-scale specifications apply for a V
with respect to ground.
Note 7: Integral nonlinearity is defined as the deviation of a code from a
straight line passing through the actual end points of the transfer curve.
The deviation is measured from the center of the quantization band.
Note 8: Bipolar offset is the offset voltage measured from –0.5 LSB when
the output code flickers between 0000 0000 0000 0000 and 1111 1111
1111 1111.
= 250kHz, tr = tf = 5ns unless otherwise
SAMPLE
UUU
PIN FUNCTIONS
Note 9: Guaranteed by design, not subject to test.
Note 10: Recommended operating conditions.
Note 11: With CS low the falling R/C edge starts a conversion. If R/C
returns high at a critical point during the conversion, it can create errors.
For best results, ensure that R/C returns high within 1µs after the start of
the conversion.
Note 12: As measured with fixed resistors shown in Figure 4. Adjustable to
zero with external potentiometer.
Note 13: Full-scale error is the worst-case of –FS or +FS untrimmed
deviation from ideal first and last code transitions, divided by the transition
voltage (not divided by the full-scale range) and includes the effect of
offset error.
Note 14: All specifications in dB are referred to a full-scale ±10V input.
Note 15: Full-power bandwidth is defined as full-scale input frequency at
which a signal-to-(noise + distortion) degrades to 60dB or 10 bits of
accuracy.
Note 16: Recovers to specified performance after (2 • FS) input
overvoltage.
VIN (Pin 1): Analog Input. Connect through a 200Ω
resistor to the analog input. Full-scale input range is
±10V.
AGND1 (Pin 2): Analog Ground. Tie to analog ground
plane.
REF (Pin 3): 2.5V Reference Output. Bypass with 2.2µF
tantalum capacitor. Can be driven with an external reference.
CAP (Pin 4): Reference Buffer Output. Bypass with 10µF
tantalum capacitor. The capacitor output voltage is 4.096V
when REF = 2.5V.
AGND2 (Pin 5): Analog Ground. Tie to analog ground
plane.
D15 to D8 (Pins 6 to 13): Three-State Data Outputs.
Hi-Z state when CS is high or when R/C is low.
DGND (Pin 14): Digital Ground.
D7 to D0 (Pins 15 to 22): Three-State Data Outputs.
Hi-Z state when CS is high or when R/C is low.
BYTE (Pin 23): Byte Select. With BYTE low, data will be
output with Pin 6 (D15) being the MSB and Pin 22 (D0)
being the LSB. With BYTE high the upper eight bits and
the lower eight bits will be switched. The MSB is output
on Pin 15 and bit 8 is output on Pin 22. Bit 7 is output on
Pin 6 and the LSB is output on Pin 13.
R/C (Pin 24): Read/Convert Input. With CS low, a falling
edge on R/C puts the internal sample-and-hold into the
hold state and starts a conversion. With CS low, a rising
edge on R/C enables the output data bits.
5
Page 6
LTC1606
1k30pF30pF
DBN
DBN
1k
5V
1606 TC02
A. VOH TO Hi-ZB. VOL TO Hi-Z
PIN FUNCTIONS
UUU
CS (Pin 25): Chip Select. Internally OR’d with R/C. With
R/C low, a falling edge on CS will initiate a conversion.
With R/C high, a falling edge on CS will enable the output
data.
BUSY (Pin 26): Output Shows Converter Status. It is low
when a conversion is in progress. Data valid on the rising
edge of BUSY. CS or R/C must be high when BUSY rises
TEST CIRCUITS
Load Circuit for Access Timing
5V
1k
DBN
1k30pF30pF
A. Hi-Z TO VOH AND VOL TO V
OH
DBN
1606 TC01
B. Hi-Z TO VOL AND VOH TO V
OL
or another conversion will start without time for signal
acquisition.
V
(Pin 27): 5V Analog Supply. Bypass to ground with
ANA
a 0.1µF ceramic and a 10µF tantalum capacitor.
V
(Pin 28): 5V Digital Supply. Connect directly to Pin
DIG
27.
Load Circuit for Output Float Delay
UU
W
FUNCTIONAL BLOCK DIAGRA
V
IN
REF
CAP
(4.096V)
AGND1
AGND2
DGND
7.35k
4k
2.5V REF
REF BUF
1.64x
2.5k9k
INTERNAL
CLOCK
16-BIT CAPACITIVE DAC
SUCCESSIVE APPROXIMATION
CS
C
SAMPLE
C
SAMPLE
REGISTER
CONTROL LOGIC
R/CBYTE
ZEROING SWITCHES
16
BUSY
+
COMP
–
OUTPUT LATCHES
1606 BD
V
ANA
V
DIG
D15
•
•
•
D0
6
Page 7
LTC1606
U
WUU
APPLICATIONS INFORMATION
Conversion Details
The LTC1606 uses a successive approximation algorithm
and an internal sample-and-hold circuit to convert an
analog signal to a 16-bit or two byte parallel output. The
ADC is complete with a precision reference and an internal
clock. The control logic provides easy interface to microprocessors and DSPs. (Please refer to the Digital Interface
section for the data format.)
Conversion start is controlled by the CS and R/C inputs. At
the start of conversion the successive approximation
register (SAR) is reset. Once a conversion cycle has
begun, it cannot be restarted.
During the conversion, the internal 16-bit capacitive DAC
output is sequenced by the SAR from the most significant
bit (MSB) to the least significant bit (LSB). Referring to
Figure 1, VIN is connected through the resistor divider to
the sample-and-hold capacitor during the acquire phase
and the comparator offset is nulled by the autozero switches.
In this acquire phase, a minimum delay of 1.5µs will
provide enough time for the sample-and-hold capacitor to
acquire the analog signal. During the convert phase, the
autozero switches open, putting the comparator into the
compare mode. The input switch switches C
SAMPLE
ground, injecting the analog input charge onto the summing junction. This input charge is successively compared with the binary-weighted charges supplied by the
capacitive DAC. Bit decisions are made by the high speed
comparator. At the end of a conversion, the DAC output
balances the VIN input charge. The SAR contents (a 16-bit
data word) that represents the VIN are loaded into the
16-bit output latches.
SAMPLE
C
R
IN1
V
IN
SAMPLE
R
HOLD
IN2
Figure 1. LTC1606 Simplified Equivalent Circuit
SAMPLE
C
DAC
V
DAC
DAC
SI
–
+
COMPARATOR
to
S
A
R
16-BIT
LATCH
1606 • F01
Driving the Analog Inputs
The nominal input range for the LTC1606 is ±10V or
(±4 • V
) and the input is overvoltage protected to ±25V.
REF
The input impedance is typically 10kΩ, therefore, it should
be driven with a low impedance source. Wideband noise
coupling into the input can be minimized by placing a
1000pF capacitor at the input as shown in Figure 2. An
NPO-type capacitor gives the lowest distortion. Place the
capacitor as close to the device input pin as possible. If an
amplifier is to be used to drive the input, care should be
taken to select an amplifier with adequate accuracy, linearity and noise for the application. The following list is a
summary of the op amps that are suitable for driving the
LTC1606. More detailed information is available in the
Linear Technology data books and LinearViewTM CD-ROM.
200Ω
A
IN
1000pF33.2k
Figure 2. Analog Input Filtering
V
IN
CAP
1606 • F02
LT1007 - Low noise precision amplifier. 2.7mA supply
current ±5V to ±15V supplies. Gain bandwidth product
8MHz. DC applications.
LT1097 - Low cost, low power precision amplifier. 300µA
supply current. ±5V to ±15V supplies. Gain bandwidth
product 0.7MHz. DC applications.
LT1227 - 140MHz video current feedback amplifier. 10mA
supply current. ±5V to ±15V supplies. Low noise and low
distortion.
LT1360 - 37MHz voltage feedback amplifier. 3.8mA supply current. ±5V to ±15V supplies. Good AC/DC specs.
LT1363 - 50MHz voltage feedback amplifier. 6.3mA supply current. Good AC/DC specs.
LT1364/LT1365 - Dual and quad 50MHz voltage feedback
amplifiers. 6.3mA supply current per amplifier. Good AC/
DC specs.
LT1468 - 90MHz 22V/µs 16-bit accurate amplifier.
LinearView is a trademark of Linear Technology Corporation
7
Page 8
LTC1606
U
WUU
APPLICATIONS INFORMATION
Internal Voltage Reference
The LTC1606 has an on-chip, temperature compensated,
curvature corrected, bandgap reference, which is factory
trimmed to 2.50V. The full-scale range of the ADC is equal
to (±4 • V
reference is connected to the input of a buffer (1.64x)
through a 4k resistor (see Figure 3). The input to the buffer
or the output of the reference is available at REF (Pin 3).
The internal reference can be overdriven with an external
reference if more accuracy is needed. The buffer output
drives the internal DAC and is available at CAP (Pin 4). The
CAP pin can be used to drive a steady DC load of less than
2mA. Driving an AC load is not recommended because it
can cause the performance of the converter to degrade.
(4.096V)
) or nominally ±10V. The output of the
REF
REF
(2.5V)
2.2µF
CAP
10µF
3
+
4
4k
–
0.64R
BANDGAP
REFERENCE
R
INTERNAL
CAPACITOR
1606 • F03
DAC
Figure 3. Internal or External Reference Source
is applied to VIN and R4 is adjusted until the output code
is changing between 0111 1111 1111 1110 and 0111
1111 1111 1111. Figure 6 shows the bipolar transfer
characteristic of the LTC1606.
1
2.2µF
+
2.2µF
576k
10µF
2
3
4
5
V
IN
AGND1
REF
CAP
AGND2
1
2
3
4
5
LTC1606
V
IN
AGND1
REF
LTC1606
CAP
AGND2
1606 • F04
1606 • F05
±10V INPUT
200Ω
1%
33.2k
1%
+
10µF
Figure 4. ±10V Input Without Trim
±10V INPUT
200Ω
1%
+
33.2k
1%
5V
R4
50k
+
R3
50k
Figure 5. ±10V Input with Offset and Gain Trim
For minimum code transition noise, the REF pin and the
CAP pin should each be decoupled with a capacitor to
filter wideband noise from the reference and the buffer
(2.2µF tantalum for the REF pin and 10µF tantalum for the
CAP pin).
Offset and Gain Adjustments
The LTC1606 offset and full-scale errors have been trimmed
at the factory with the external resistors shown in Figure
4. This allows for external adjustment of offset and full
scale in applications where absolute accuracy is important. See Figure 5 for the offset and gain trim circuit. First,
adjust the offset to zero by adjusting resistor R3. Apply an
input voltage of –152.6µV (–0.5LSB) and adjust R3 so the
code is changing between 1111 1111 1111 1111 and 0000
0000 0000 0000. The gain error is trimmed by adjusting
resistor R4. An input voltage of 9.999542V (+FS – 1.5LSB)
8
011...111
011...110
000...001
000...000
111...111
111...110
OUTPUT CODE
100...001
100...000
BIPOLAR
ZERO
FS = 20V
1LSB = FS/65536
–1
0V
1
LSB
INPUT VOLTAGE (V)
LSB
FS/2 – 1LSB–FS/2
1606 • F06
Figure 6. LTC1606 Bipolar Transfer Characteristics
Page 9
LTC1606
U
WUU
APPLICATIONS INFORMATION
DC Performance
One way of measuring the transition noise associated with
a high resolution ADC is to use a technique where a DC
signal is applied to the input of the ADC and the resulting
output codes are collected over a large number of conversions. For example in Figure 7, the distribution of output
code is shown for a DC input that has been digitized 4096
times. The distribution is Gaussian and the RMS code
transition is about 0.65LSB.
2500
2000
1500
COUNTS
1000
500
0
–3–2 –101234
CODE
Figure 7. Histogram for 4096 Conversions
DIGITAL INTERFACE
Internal Clock
The ADC has an internal clock that is trimmed to achieve
a typical conversion time of 2.3µs. No external adjust-
ments are required and, with the typical acquisition time of
1µs, throughput performance of 250ksps is assured.
t
1
R/C
1606 • F07
Timing and Control
Conversion start and data read are controlled by two
digital inputs: CS and R/C. To start a conversion and put
the sample-and-hold into the hold mode, bring CS and
R/C low for no less than 40ns. Once initiated, it cannot be
restarted until the conversion is complete. Converter
status is indicated by the BUSY output and this is low while
the conversion is in progress.
There are two modes of operation. The first mode is shown
in Figure 8. The digital input R/C is used to control the start
of conversion. CS is tied low. When R/C goes low, the
sample-and-hold goes into the hold mode and a conversion is started. BUSY goes low and stays low during the
conversion and will go back high after the conversion has
been completed and the internal output shift registers
have been updated. R/C should remain low for no less than
40ns. During the time R/C is low, the digital outputs are in
a Hi-Z state. R/C should be brought back high within 1µs
after the start of the conversion to ensure that no errors
occur in the digitized result. The second mode, shown in
Figure 9, uses the CS signal to control the start of a
conversion and the reading of the digital output. In this
mode the R/C input signal should be brought low no less
than 10ns before the falling edge of CS. The minimum
pulse width for CS is 40ns. When CS falls, BUSY goes low
and will stay low until the end of the conversion. BUSY will
go high after the conversion has been completed. The new
data is valid when CS is brought back low again to initiate
a read. Again, it is recommended that both R/C and CS
return high within 1µs after the start of the conversion.
BUSY
MODE
DATA MODE
t
t
2
t
3
t
6
ACQUIRECONVERTCONVERTACQUIRE
t
CONV
t
9
PREVIOUS
DATA VALID
Hi-ZNOT VALIDHi-Z
t
7
PREVIOUS
DATA VALID
11
t
4
t
5
t
ACQ
DATA
VALID
t
8
Figure 8. Conversion Timing with Outputs Enabled After Conversion (CS Tied Low)
DATA
VALID
1606 • F08
9
Page 10
LTC1606
U
WUU
APPLICATIONS INFORMATION
R/C
BUSY
MODE
DATA BUS
t
10
t
1
CS
t
t
6
ACQUIRECONVERTACQUIRE
Figure 9. Using CS to Control Conversion and Read Timing
t
10
3
t
CONV
t
10
t
1
t
4
t
12
DATA
VALID
t
10
Hi-ZHI-Z
t
1606 • F09
7
R/C
BYTE
PINS 6 TO 13
PINS 15 TO 22
t
10
CS
Hi-Z
Hi-Z
t
12
HIGH BYTE
LOW BYTE
LOW BYTE
t
12
HIGH BYTE
t
7
t
10
Hi-Z
Hi-Z
1606 • F10
Figure 10. Using CS and BYTE to Control Data Bus Read Timing
10
Page 11
LTC1606
U
WUU
APPLICATIONS INFORMATION
Output Data
The output data can be read as a 16-bit word or it can be
read as two 8-bit bytes. The format of the output data is
two’s complement. The digital input pin BYTE is used to
control the two byte read. With the BYTE pin low, the first
eight MSBs are output on the D15 to D8 pins and the eight
LSBs are output on the D7 to D0 pins. When the BYTE pin
is taken high, the eight LSBs replace the eight MSBs
(Figure 10).
Dynamic Performance
FFT (Fast Fourier Transform) test techniques are used to
test the ADC’s frequency response, distortion and noise at
the rated throughput. By applying a low distortion sine
wave and analyzing the digital output using an FFT algorithm, the ADC’s spectral content can be examined for
frequencies outside the fundamental.
Signal-to-Noise Ratio
The Signal-to-Noise and Distortion Ratio (SINAD) is the
ratio between the RMS amplitude of the fundamental input
frequency to the RMS amplitude of all other frequency
components at the A/D output. The output is band limited
to frequencies from above DC and below half the sampling
frequency. A typical LTC1606 has a SINAD of 90dB and
THD of –102dB with a 250kHz sampling rate and a 1kHz
input.
Total Harmonic Distortion
Total Harmonic Distortion (THD) is the ratio of the RMS
sum of all harmonics of the input signal to the fundamental
itself. The out-of-band harmonics alias into the frequency
band between DC and half the sampling frequency. THD is
expressed as:
2
2
√V
+ V
2
THD = 20log
where V1 is the RMS amplitude of the fundamental frequency and V2 through VN are the amplitudes of the
second through Nth harmonics.
Board Layout, Power Supplies and Decoupling
Wire wrap boards and molded sockets are not recommended for high resolution or high speed A/D converters.
To obtain the best performance from the LTC1606, a
printed circuit board is required. Layout for the printed
circuit board should ensure the digital and analog signal
lines are separated as much as possible. In particular, care
should be taken not to run any digital track alongside an
analog signal track or underneath the ADC. The analog
input should be screened by AGND.
Pay particular attention to the design of the analog and
digital ground planes. The DGND pin of the LTC1606
should be tied to the analog ground plane. Placing the
bypass capacitor as close as possible to the power supply,
the reference and reference buffer output is very important. Low impedance common returns for these bypass
capacitors are essential to low noise operation of the ADC,
and the foil width for these tracks should be as wide as
possible. Also, since any potential difference in grounds
between the signal source and ADC appears as an error
voltage in series with the input signal, attention should be
paid to reducing the ground circuit impedance as much as
possible.
3
+ V
V
1
2
... + V
4
2
N
11
Page 12
LTC1606
PACKAGE DESCRIPTION
5.20 – 5.38**
(0.205 – 0.212)
U
Dimensions in inches (millimeters) unless otherwise noted.
G Package
28-Lead Plastic SSOP (0.209)
(LTC DWG # 05-08-1640)
10.07 – 10.33*
(0.397 – 0.407)
252622 21 20 19 181716 1523242728
12345678 9 10 11 121413
° – 8°
0
7.65 – 7.90
(0.301 – 0.311)
1.73 – 1.99
(0.068 – 0.078)
0.13 – 0.22
(0.005 – 0.009)
NOTE: DIMENSIONS ARE IN MILLIMETERS
*
DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.152mm (0.006") PER SIDE
**
DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.254mm (0.010") PER SIDE
0.55 – 0.95
(0.022 – 0.037)
0.65
(0.0256)
BSC
0.25 – 0.38
(0.010 – 0.015)
0.05 – 0.21
(0.002 – 0.008)
G28 SSOP 1098
RELATED PARTS
PART NUMBERDESCRIPTIONCOMMENTS
LTC1274/LTC1277Low Power 12-Bit, 100ksps ADCs10mW Power Dissipation, Parallel/Byte Interface
LTC1415Single 5V, 12-Bit, 1.25Msps ADC55mW Power Dissipation, 72dB SINAD
LTC141814-Bit, 200ksps ADC15mW, Serial or Parallel Interface
LTC1419Low Power 14-Bit, 800ksps ADCTrue 14-Bit Linearity, 81.5dB SINAD, 150mW Dissipation
LT1460-2.5Micropower Precision Series Reference0.075% Max, 10ppm/°C Max, Only 130µA Supply Current
LT1461Precision Bandgap Reference0.04% Max, 3ppm/°C Max
LTC1594/LTC1598Micropower 4-/8-Channel 12-Bit ADCsSerial I/O, 3V and 5V Versions
LTC160416-Bit, 333ksps ADC±2.5V Input, 90dB SINAD, 100dB THD, No Missing Codes
LTC160516 Bits, 100kHz ADCPin Compatible
LTC1605-1/LTC1605-216 Bits, 100kHz ADC0V to 4V/±4V Input Range, Pin Compatible with LTC1606
12
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear-tech.com
1606i LT/TP 0300 4K • PRINTED IN THE USA
LINEAR TECHNOLOGY CORPORATION 2000
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.