Datasheet LTC1606 Datasheet (Linear Technology)

Page 1
FEATURES
Final Electrical Specifications
Sample Rate: 250ksps
Single 5V Supply
Bipolar Input Range: ±10V
Signal-to-Noise Ratio: 90dB Typ
Power Dissipation: 75mW Typ
Integral Nonlinearity: ±2.0LSB Max
Guaranteed No Missing Codes
Operates with Internal or External Reference
Internal Synchronized Clock
28-Pin SSOP Package
Improved 2nd Source to AD976A and ADS7805
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APPLICATIONS
Industrial Process Control
Multiplexed Data Acquisition Systems
High Speed Data Acquisition for PCs
Digital Signal Processing
LTC1606
16-Bit, 250ksps,
Single Supply ADC
March 2000
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DESCRIPTION
The LTC®1606 is a 250ksps, sampling 16-bit A/D con­verter that draws only 75mW (typical) from a single 5V supply. This easy-to-use device includes sample-and­hold, precision reference, switched capacitor successive approximation A/D and trimmed internal clock.
The LTC1606’s input range is an industry standard ±10V. Maximum DC specs include ±2.0LSB INL and 16 bits no missing codes over temperature. An external reference can be used if greater accuracy over temperature is needed.
The 90dB signal-to-noise ratio offers an improvement of 3dB over competing devices, and the RMS transition noise is reduced (0.65LSB vs 1LSB) relative to competitive parts.
The ADC has a microprocessor compatible, 16-bit or two byte parallel output port. A convert start input and a data ready signal (BUSY) ease connections to FIFOs, DSPs and microprocessors.
, LTC and LT are registered trademarks of Linear Technology Corporation.
±10V
INPUT
Low Power, 250kHz, 16-Bit Sampling ADC on 5V Supply
5V
6 TO 13
15 TO 22
26
25
24
23
10µF
DIGITAL CONTROL SIGNALS
28 27
V
DIGVANA
200
1
33.2k
4
4.096V
10µF
3
2.5V
2.2µF
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen­tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
V
CAP
REF
7.35k
IN
2.5k 9k
1.64x BUFFER
4k
REFERENCE
AGND1
AGND25DGND
2
16-BIT
SAMPLING ADC
CONTROL
LOGIC AND
TIMING
14
D15 TO D0
BUSY
CS
R/C
BYTE
1606 TA01
0.1µF
16-BIT OR 2 BYTE PARALLEL BUS
1
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LTC1606
W
O
A
(Notes 1, 2)
V
ANA
V
DIG
V
DIG
LUTEXI TIS
S
.......................................................................... 7V
to V
........................................................... 0.3V
ANA
........................................................................... 7V
A
WUW
U
ARB
G
Ground Voltage Difference
DGND, AGND1 and AGND2 .............................. ±0.3V
Analog Inputs (Note 3)
VIN..................................................................... ±25V
CAP ............................ V
+ 0.3V to AGND2 – 0.3V
ANA
REF....................................Indefinite Short to AGND2
Momentary Short to V
Digital Input Voltage (Note 4) ........ V
Digital Output Voltage........ V
– 0.3V to V
DGND
– 0.3V to 10V
DGND
DIG
ANA
+ 0.3V
Power Dissipation.............................................. 500mW
Operating Ambient Temperature Range
LTC1606AC/LTC1606C............................0°C to 70°C
LTC1606AI/LTC1606I ......................... – 40°C to 85°C
Storage Temperature Range ................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec).................. 300°C
/
PACKAGE
V
IN
AGND1
REF
CAP
AGND2
D15 (MSB)
D14 D13 D12 D11 D10
D9 D8
DGND
Consult factory for Military grade parts.
O
RDER I FOR ATIO
TOP VIEW
1 2 3 4 5 6 7 8
9 10 11 12 13 14
G PACKAGE
28-LEAD PLASTIC SSOP
T
= 125°C, θJA = 95°C/W
JMAX
28 27 26 25 24 23 22 21 20 19 18 17 16 15
V
DIG
V
ANA
BUSY CS R/C BYTE D0 D1 D2 D3 D4 D5 D6 D7
WU
ORDER PART
NUMBER
LTC1606ACG LTC1606AIG LTC1606CG LTC1606IG
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CONVERTER CHARACTERISTICS
temperature range, otherwise specifications are at TA = 25°C. (Notes 5, 6)
PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS
Resolution 16 16 Bits No Missing Codes 15 16 Bits Transition Noise 0.65 0.65 LSB Integral Linearity Error (Note 7) ±3 ±2 LSB Bipolar Zero Error Ext. Reference = 2.5V (Note 8) ±10 ±10 mV Bipolar Zero Error Drift ±2 ±2 ppm/°C Full-Scale Error Drift ±7 ±5 ppm/°C Full-Scale Error Ext. Reference = 2.5V (Notes 12, 13) ±0.50 ±0.25 % Full-Scale Error Drift Ext. Reference = 2.5V ±2 ±2 ppm/°C Power Supply Sensitivity
= V
DIG
= V
DD
V
ANA
VDD = 5V ±5% (Note 9) ±8 ±8 LSB
The indicates specifications which apply over the full operating
LTC1606 LTC1606A
RMS
2
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LTC1606
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ANALOG INPUT
specifications are at TA = 25°C. (Note 5)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
IN
C
IN
R
IN
Analog Input Range (Note 9) 4.75V ≤ V Analog Input Capacitance 10 pF Analog Input Impedance 10 k
The indicates specifications which apply over the full operating temperature range, otherwise
LTC1606/LTC1606A
5.25V, 4.75V V
ANA
5.25V ±10 V
DIG
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DYNAMIC ACCURACY
SYMBOL PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS
S/(N + D) Signal-to-(Noise + Distortion) Ratio 1kHz Input Signal (Note 14) 90 90 dB
THD Total Harmonic Distortion 1kHz Input Signal, First 5 Harmonics –102 – 102 dB
Peak Harmonic or Spurious Noise 1kHz Input Signal –102 –102 dB
Full-Power Bandwidth (Note 15) 275 275 kHz Aperture Delay 40 40 ns Aperture Jitter Sufficient to Meet AC Specs Sufficient to Meet AC Specs Transient Response Full-Scale Step (Note 9) 2 2 µs Overvoltage Recovery (Note 16) 150 150 ns
(Notes 5, 14)
LTC1606 LTC1606A
10kHz Input Signal 90 87 90 dB 20kHz, –60dB Input Signal 30 30 dB
10kHz Input Signal, First 5 Harmonics –94 –89 – 94 dB
10kHz Input Signal –94 –94 dB
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INTERNAL REFERENCE CHARACTERISTICS
operating temperature range, otherwise specifications are at TA = 25°C. (Note 5)
PARAMETER CONDITIONS MIN TYP MAX UNITS
V
Output Voltage I
REF
V
Output Tempco I
REF
Internal Reference Source Current 1 µA External Reference Voltage for Specified Linearity (Notes 9, 10) 2.30 2.50 2.70 V External Reference Current Drain Ext. Reference = 2.5V (Note 9) 100 µA CAP Output Voltage I
= 0 2.470 2.500 2.520 V
OUT
= 0 ±5 ppm/°C
OUT
= 0 4.096 V
OUT
The indicates specifications which apply over the full
LTC1606/LTC1606A
3
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LTC1606
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DIGITAL INPUTS AND DIGITAL OUTPUTS
operating temperature range, otherwise specifications are at TA = 25°C. (Note 5)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
IH
V
IL
I
IN
C
IN
V
OH
V
OL
I
OZ
C
OZ
I
SOURCE
I
SINK
High Level Input Voltage VDD = 5.25V 2.4 V Low Level Input Voltage VDD = 4.75V 0.8 V Digital Input Current VIN = 0V to V Digital Input Capacitance 5pF High Level Output Voltage VDD = 4.75V IO = –10µA 4.5 V
Low Level Output Voltage VDD = 4.75V IO = 160µA 0.05 V
Hi-Z Output Leakage D15 to D0 V Hi-Z Output Capacitance D15 to D0 CS High (Note 9) 15 pF Output Source Current V Output Sink Current V
OUT
OUT
OUT
DD
= 0V to VDD, CS High ±10 µA
= 0V –10 mA = V
DD
The indicates specifications which apply over the full
LTC1606/LTC1606A
±10 µA
IO = –200µA 4.0 V
IO = 1.6mA 0.10 0.4 V
10 mA
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TIMING CHARACTERISTICS
range, otherwise specifications are at TA = 25°C. (Note 5)
The indicates specifications which apply over the full operating temperature
LTC1606/LTC1606A
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
f
SAMPLE(MAX)
t
CONV
t
ACQ
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
t
9
t
10
t
11
t
12
Maximum Sampling Frequency 250 kHz Conversion Time 2.5 µs Acquisition Time 1.5 µs Convert Pulse Width (Note 11) 40 ns Data Valid Delay After R/C (Note 9) 2.5 µs BUSY Delay from R/C CL = 30pF 65 ns BUSY Low 2.5 µs BUSY Delay After End of Conversion 100 ns Aperture Delay 40 ns Bus Relinquish Time 15 50 ns BUSY Delay After Data Valid 20 90 ns Previous Data Valid After R/C 2 µs R/C to CS Setup Time (Notes 9, 10) 5ns Time Between Conversions 4 µs Bus Access CL = 30pF, (Notes 10) 15 60 ns Byte Delay CL = 30pF, (Notes 9, 10) 15 60 ns
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LTC1606
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POWER REQUIREMENTS
range, otherwise specifications are at TA = 25°C. (Note 5)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
DD
I
DD
P
DIS
Positive Supply Voltage (Notes 9, 10) 4.75 5.25 V Positive Supply Current 15 20 mA Power Dissipation 75 100 mW
The indicates specifications which apply over the full operating temperature
LTC1606/LTC1606A
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired. Note 2: All voltage values are with respect to ground with DGND, AGND1
and AGND2 wired together (unless otherwise noted).
input
IN
ANA
DD
=
DD
.
Note 3: When these pin voltages are taken below ground or above V
= VDD, they will be clamped by internal diodes. This product can
V
DIG
handle input currents of greater than 100mA below ground or above V without latch-up.
Note 4: When these pin voltages are taken below ground, they will be clamped by internal diodes. This product can handle input currents of 90mA below ground without latchup. These pins are not clamped to V
Note 5: VDD = 5V, f specified.
Note 6: Linearity, offset and full-scale specifications apply for a V with respect to ground.
Note 7: Integral nonlinearity is defined as the deviation of a code from a straight line passing through the actual end points of the transfer curve. The deviation is measured from the center of the quantization band.
Note 8: Bipolar offset is the offset voltage measured from –0.5 LSB when the output code flickers between 0000 0000 0000 0000 and 1111 1111 1111 1111.
= 250kHz, tr = tf = 5ns unless otherwise
SAMPLE
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PIN FUNCTIONS
Note 9: Guaranteed by design, not subject to test. Note 10: Recommended operating conditions. Note 11: With CS low the falling R/C edge starts a conversion. If R/C
returns high at a critical point during the conversion, it can create errors. For best results, ensure that R/C returns high within 1µs after the start of the conversion.
Note 12: As measured with fixed resistors shown in Figure 4. Adjustable to zero with external potentiometer.
Note 13: Full-scale error is the worst-case of –FS or +FS untrimmed deviation from ideal first and last code transitions, divided by the transition voltage (not divided by the full-scale range) and includes the effect of offset error.
Note 14: All specifications in dB are referred to a full-scale ±10V input. Note 15: Full-power bandwidth is defined as full-scale input frequency at
which a signal-to-(noise + distortion) degrades to 60dB or 10 bits of accuracy.
Note 16: Recovers to specified performance after (2 • FS) input overvoltage.
VIN (Pin 1): Analog Input. Connect through a 200 resistor to the analog input. Full-scale input range is ±10V.
AGND1 (Pin 2): Analog Ground. Tie to analog ground plane.
REF (Pin 3): 2.5V Reference Output. Bypass with 2.2µF tantalum capacitor. Can be driven with an external refer­ence.
CAP (Pin 4): Reference Buffer Output. Bypass with 10µF tantalum capacitor. The capacitor output voltage is 4.096V when REF = 2.5V.
AGND2 (Pin 5): Analog Ground. Tie to analog ground plane.
D15 to D8 (Pins 6 to 13): Three-State Data Outputs. Hi-Z state when CS is high or when R/C is low.
DGND (Pin 14): Digital Ground. D7 to D0 (Pins 15 to 22): Three-State Data Outputs.
Hi-Z state when CS is high or when R/C is low. BYTE (Pin 23): Byte Select. With BYTE low, data will be
output with Pin 6 (D15) being the MSB and Pin 22 (D0) being the LSB. With BYTE high the upper eight bits and the lower eight bits will be switched. The MSB is output on Pin 15 and bit 8 is output on Pin 22. Bit 7 is output on Pin 6 and the LSB is output on Pin 13.
R/C (Pin 24): Read/Convert Input. With CS low, a falling edge on R/C puts the internal sample-and-hold into the hold state and starts a conversion. With CS low, a rising edge on R/C enables the output data bits.
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LTC1606
1k 30pF 30pF
DBN
DBN
1k
5V
1606 TC02
A. VOH TO Hi-Z B. VOL TO Hi-Z
PIN FUNCTIONS
UUU
CS (Pin 25): Chip Select. Internally OR’d with R/C. With R/C low, a falling edge on CS will initiate a conversion. With R/C high, a falling edge on CS will enable the output data.
BUSY (Pin 26): Output Shows Converter Status. It is low when a conversion is in progress. Data valid on the rising edge of BUSY. CS or R/C must be high when BUSY rises
TEST CIRCUITS
Load Circuit for Access Timing
5V
1k
DBN
1k 30pF 30pF
A. Hi-Z TO VOH AND VOL TO V
OH
DBN
1606 TC01
B. Hi-Z TO VOL AND VOH TO V
OL
or another conversion will start without time for signal acquisition.
V
(Pin 27): 5V Analog Supply. Bypass to ground with
ANA
a 0.1µF ceramic and a 10µF tantalum capacitor.
V
(Pin 28): 5V Digital Supply. Connect directly to Pin
DIG
27.
Load Circuit for Output Float Delay
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FUNCTIONAL BLOCK DIAGRA
V
IN
REF
CAP
(4.096V)
AGND1 AGND2
DGND
7.35k
4k
2.5V REF
REF BUF
1.64x
2.5k9k
INTERNAL
CLOCK
16-BIT CAPACITIVE DAC
SUCCESSIVE APPROXIMATION
CS
C
SAMPLE
C
SAMPLE
REGISTER
CONTROL LOGIC
R/C BYTE
ZEROING SWITCHES
16
BUSY
+
COMP
OUTPUT LATCHES
1606 BD
V
ANA
V
DIG
D15
D0
6
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LTC1606
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APPLICATIONS INFORMATION
Conversion Details
The LTC1606 uses a successive approximation algorithm and an internal sample-and-hold circuit to convert an analog signal to a 16-bit or two byte parallel output. The ADC is complete with a precision reference and an internal clock. The control logic provides easy interface to micro­processors and DSPs. (Please refer to the Digital Interface section for the data format.)
Conversion start is controlled by the CS and R/C inputs. At the start of conversion the successive approximation register (SAR) is reset. Once a conversion cycle has begun, it cannot be restarted.
During the conversion, the internal 16-bit capacitive DAC output is sequenced by the SAR from the most significant bit (MSB) to the least significant bit (LSB). Referring to Figure 1, VIN is connected through the resistor divider to the sample-and-hold capacitor during the acquire phase and the comparator offset is nulled by the autozero switches. In this acquire phase, a minimum delay of 1.5µs will provide enough time for the sample-and-hold capacitor to acquire the analog signal. During the convert phase, the autozero switches open, putting the comparator into the compare mode. The input switch switches C
SAMPLE
ground, injecting the analog input charge onto the sum­ming junction. This input charge is successively com­pared with the binary-weighted charges supplied by the capacitive DAC. Bit decisions are made by the high speed comparator. At the end of a conversion, the DAC output balances the VIN input charge. The SAR contents (a 16-bit data word) that represents the VIN are loaded into the 16-bit output latches.
SAMPLE
C
R
IN1
V
IN
SAMPLE
R
HOLD
IN2
Figure 1. LTC1606 Simplified Equivalent Circuit
SAMPLE
C
DAC
V
DAC
DAC
SI
+
COMPARATOR
to
S A R
16-BIT
LATCH
1606 • F01
Driving the Analog Inputs
The nominal input range for the LTC1606 is ±10V or (±4 • V
) and the input is overvoltage protected to ±25V.
REF
The input impedance is typically 10k, therefore, it should be driven with a low impedance source. Wideband noise coupling into the input can be minimized by placing a 1000pF capacitor at the input as shown in Figure 2. An NPO-type capacitor gives the lowest distortion. Place the capacitor as close to the device input pin as possible. If an amplifier is to be used to drive the input, care should be taken to select an amplifier with adequate accuracy, linear­ity and noise for the application. The following list is a summary of the op amps that are suitable for driving the LTC1606. More detailed information is available in the Linear Technology data books and LinearViewTM CD-ROM.
200
A
IN
1000pF 33.2k
Figure 2. Analog Input Filtering
V
IN
CAP
1606 • F02
LT1007 - Low noise precision amplifier. 2.7mA supply current ±5V to ±15V supplies. Gain bandwidth product 8MHz. DC applications.
LT1097 - Low cost, low power precision amplifier. 300µA supply current. ±5V to ±15V supplies. Gain bandwidth product 0.7MHz. DC applications.
LT1227 - 140MHz video current feedback amplifier. 10mA supply current. ±5V to ±15V supplies. Low noise and low distortion.
LT1360 - 37MHz voltage feedback amplifier. 3.8mA sup­ply current. ±5V to ±15V supplies. Good AC/DC specs.
LT1363 - 50MHz voltage feedback amplifier. 6.3mA sup­ply current. Good AC/DC specs.
LT1364/LT1365 - Dual and quad 50MHz voltage feedback amplifiers. 6.3mA supply current per amplifier. Good AC/ DC specs.
LT1468 - 90MHz 22V/µs 16-bit accurate amplifier.
LinearView is a trademark of Linear Technology Corporation
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LTC1606
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APPLICATIONS INFORMATION
Internal Voltage Reference
The LTC1606 has an on-chip, temperature compensated, curvature corrected, bandgap reference, which is factory trimmed to 2.50V. The full-scale range of the ADC is equal to (±4 • V reference is connected to the input of a buffer (1.64x) through a 4k resistor (see Figure 3). The input to the buffer or the output of the reference is available at REF (Pin 3). The internal reference can be overdriven with an external reference if more accuracy is needed. The buffer output drives the internal DAC and is available at CAP (Pin 4). The CAP pin can be used to drive a steady DC load of less than 2mA. Driving an AC load is not recommended because it can cause the performance of the converter to degrade.
(4.096V)
) or nominally ±10V. The output of the
REF
REF
(2.5V)
2.2µF
CAP
10µF
3
+
4
4k
0.64R
BANDGAP
REFERENCE
R
INTERNAL
CAPACITOR
1606 • F03
DAC
Figure 3. Internal or External Reference Source
is applied to VIN and R4 is adjusted until the output code is changing between 0111 1111 1111 1110 and 0111 1111 1111 1111. Figure 6 shows the bipolar transfer characteristic of the LTC1606.
1
2.2µF
+
2.2µF
576k
10µF
2
3 4
5
V
IN
AGND1
REF CAP
AGND2
1 2
3
4
5
LTC1606
V
IN
AGND1
REF
LTC1606
CAP
AGND2
1606 • F04
1606 • F05
±10V INPUT
200
1%
33.2k 1%
+
10µF
Figure 4. ±10V Input Without Trim
±10V INPUT
200
1%
+
33.2k 1%
5V
R4
50k
+
R3 50k
Figure 5. ±10V Input with Offset and Gain Trim
For minimum code transition noise, the REF pin and the CAP pin should each be decoupled with a capacitor to filter wideband noise from the reference and the buffer (2.2µF tantalum for the REF pin and 10µF tantalum for the CAP pin).
Offset and Gain Adjustments
The LTC1606 offset and full-scale errors have been trimmed at the factory with the external resistors shown in Figure
4. This allows for external adjustment of offset and full scale in applications where absolute accuracy is impor­tant. See Figure 5 for the offset and gain trim circuit. First, adjust the offset to zero by adjusting resistor R3. Apply an input voltage of –152.6µV (–0.5LSB) and adjust R3 so the code is changing between 1111 1111 1111 1111 and 0000 0000 0000 0000. The gain error is trimmed by adjusting resistor R4. An input voltage of 9.999542V (+FS – 1.5LSB)
8
011...111
011...110
000...001
000...000
111...111
111...110
OUTPUT CODE
100...001
100...000
BIPOLAR
ZERO
FS = 20V 1LSB = FS/65536
–1
0V
1
LSB
INPUT VOLTAGE (V)
LSB
FS/2 – 1LSB–FS/2
1606 • F06
Figure 6. LTC1606 Bipolar Transfer Characteristics
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LTC1606
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APPLICATIONS INFORMATION
DC Performance
One way of measuring the transition noise associated with a high resolution ADC is to use a technique where a DC signal is applied to the input of the ADC and the resulting output codes are collected over a large number of conver­sions. For example in Figure 7, the distribution of output code is shown for a DC input that has been digitized 4096 times. The distribution is Gaussian and the RMS code transition is about 0.65LSB.
2500
2000
1500
COUNTS
1000
500
0
–3 –2 –1 0 1 2 3 4
CODE
Figure 7. Histogram for 4096 Conversions
DIGITAL INTERFACE
Internal Clock
The ADC has an internal clock that is trimmed to achieve a typical conversion time of 2.3µs. No external adjust- ments are required and, with the typical acquisition time of 1µs, throughput performance of 250ksps is assured.
t
1
R/C
1606 • F07
Timing and Control
Conversion start and data read are controlled by two digital inputs: CS and R/C. To start a conversion and put the sample-and-hold into the hold mode, bring CS and R/C low for no less than 40ns. Once initiated, it cannot be restarted until the conversion is complete. Converter status is indicated by the BUSY output and this is low while the conversion is in progress.
There are two modes of operation. The first mode is shown in Figure 8. The digital input R/C is used to control the start of conversion. CS is tied low. When R/C goes low, the sample-and-hold goes into the hold mode and a conver­sion is started. BUSY goes low and stays low during the conversion and will go back high after the conversion has been completed and the internal output shift registers have been updated. R/C should remain low for no less than 40ns. During the time R/C is low, the digital outputs are in a Hi-Z state. R/C should be brought back high within 1µs after the start of the conversion to ensure that no errors occur in the digitized result. The second mode, shown in Figure 9, uses the CS signal to control the start of a conversion and the reading of the digital output. In this mode the R/C input signal should be brought low no less than 10ns before the falling edge of CS. The minimum pulse width for CS is 40ns. When CS falls, BUSY goes low and will stay low until the end of the conversion. BUSY will go high after the conversion has been completed. The new data is valid when CS is brought back low again to initiate a read. Again, it is recommended that both R/C and CS return high within 1µs after the start of the conversion.
BUSY
MODE
DATA MODE
t
t
2
t
3
t
6
ACQUIRE CONVERT CONVERTACQUIRE
t
CONV
t
9
PREVIOUS
DATA VALID
Hi-Z NOT VALID Hi-Z
t
7
PREVIOUS
DATA VALID
11
t
4
t
5
t
ACQ
DATA
VALID
t
8
Figure 8. Conversion Timing with Outputs Enabled After Conversion (CS Tied Low)
DATA
VALID
1606 • F08
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LTC1606
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APPLICATIONS INFORMATION
R/C
BUSY
MODE
DATA BUS
t
10
t
1
CS
t
t
6
ACQUIRE CONVERT ACQUIRE
Figure 9. Using CS to Control Conversion and Read Timing
t
10
3
t
CONV
t
10
t
1
t
4
t
12
DATA
VALID
t
10
Hi-ZHI-Z
t
1606 • F09
7
R/C
BYTE
PINS 6 TO 13
PINS 15 TO 22
t
10
CS
Hi-Z
Hi-Z
t
12
HIGH BYTE
LOW BYTE
LOW BYTE
t
12
HIGH BYTE
t
7
t
10
Hi-Z
Hi-Z
1606 • F10
Figure 10. Using CS and BYTE to Control Data Bus Read Timing
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LTC1606
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APPLICATIONS INFORMATION
Output Data
The output data can be read as a 16-bit word or it can be read as two 8-bit bytes. The format of the output data is two’s complement. The digital input pin BYTE is used to control the two byte read. With the BYTE pin low, the first eight MSBs are output on the D15 to D8 pins and the eight LSBs are output on the D7 to D0 pins. When the BYTE pin is taken high, the eight LSBs replace the eight MSBs (Figure 10).
Dynamic Performance
FFT (Fast Fourier Transform) test techniques are used to test the ADC’s frequency response, distortion and noise at the rated throughput. By applying a low distortion sine wave and analyzing the digital output using an FFT algo­rithm, the ADC’s spectral content can be examined for frequencies outside the fundamental.
Signal-to-Noise Ratio
The Signal-to-Noise and Distortion Ratio (SINAD) is the ratio between the RMS amplitude of the fundamental input frequency to the RMS amplitude of all other frequency components at the A/D output. The output is band limited to frequencies from above DC and below half the sampling frequency. A typical LTC1606 has a SINAD of 90dB and THD of –102dB with a 250kHz sampling rate and a 1kHz input.
Total Harmonic Distortion
Total Harmonic Distortion (THD) is the ratio of the RMS sum of all harmonics of the input signal to the fundamental itself. The out-of-band harmonics alias into the frequency band between DC and half the sampling frequency. THD is
expressed as:
2
2
V
+ V
2
THD = 20log
where V1 is the RMS amplitude of the fundamental fre­quency and V2 through VN are the amplitudes of the second through Nth harmonics.
Board Layout, Power Supplies and Decoupling
Wire wrap boards and molded sockets are not recom­mended for high resolution or high speed A/D converters. To obtain the best performance from the LTC1606, a printed circuit board is required. Layout for the printed circuit board should ensure the digital and analog signal lines are separated as much as possible. In particular, care should be taken not to run any digital track alongside an analog signal track or underneath the ADC. The analog input should be screened by AGND.
Pay particular attention to the design of the analog and digital ground planes. The DGND pin of the LTC1606 should be tied to the analog ground plane. Placing the bypass capacitor as close as possible to the power supply, the reference and reference buffer output is very impor­tant. Low impedance common returns for these bypass capacitors are essential to low noise operation of the ADC, and the foil width for these tracks should be as wide as possible. Also, since any potential difference in grounds between the signal source and ADC appears as an error voltage in series with the input signal, attention should be paid to reducing the ground circuit impedance as much as possible.
3
+ V
V
1
2
... + V
4
2
N
11
Page 12
LTC1606
PACKAGE DESCRIPTION
5.20 – 5.38** (0.205 – 0.212)
U
Dimensions in inches (millimeters) unless otherwise noted.
G Package
28-Lead Plastic SSOP (0.209)
(LTC DWG # 05-08-1640)
10.07 – 10.33*
(0.397 – 0.407)
2526 22 21 20 19 181716 1523242728
12345678 9 10 11 12 1413
° – 8°
0
7.65 – 7.90
(0.301 – 0.311)
1.73 – 1.99
(0.068 – 0.078)
0.13 – 0.22
(0.005 – 0.009)
NOTE: DIMENSIONS ARE IN MILLIMETERS
*
DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.152mm (0.006") PER SIDE
**
DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.254mm (0.010") PER SIDE
0.55 – 0.95
(0.022 – 0.037)
0.65
(0.0256)
BSC
0.25 – 0.38
(0.010 – 0.015)
0.05 – 0.21
(0.002 – 0.008)
G28 SSOP 1098
RELATED PARTS
PART NUMBER DESCRIPTION COMMENTS
LTC1274/LTC1277 Low Power 12-Bit, 100ksps ADCs 10mW Power Dissipation, Parallel/Byte Interface LTC1415 Single 5V, 12-Bit, 1.25Msps ADC 55mW Power Dissipation, 72dB SINAD LTC1418 14-Bit, 200ksps ADC 15mW, Serial or Parallel Interface LTC1419 Low Power 14-Bit, 800ksps ADC True 14-Bit Linearity, 81.5dB SINAD, 150mW Dissipation LT1460-2.5 Micropower Precision Series Reference 0.075% Max, 10ppm/°C Max, Only 130µA Supply Current LT1461 Precision Bandgap Reference 0.04% Max, 3ppm/°C Max LTC1594/LTC1598 Micropower 4-/8-Channel 12-Bit ADCs Serial I/O, 3V and 5V Versions LTC1604 16-Bit, 333ksps ADC ±2.5V Input, 90dB SINAD, 100dB THD, No Missing Codes LTC1605 16 Bits, 100kHz ADC Pin Compatible LTC1605-1/LTC1605-2 16 Bits, 100kHz ADC 0V to 4V/±4V Input Range, Pin Compatible with LTC1606
12
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
www.linear-tech.com
1606i LT/TP 0300 4K • PRINTED IN THE USA
LINEAR TECHNOLOGY CORPORATION 2000
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