Datasheet LTC1605-2, LTC1605-1 Datasheet (Linear Technology)

Page 1
1
LTC1605-1/LTC1605-2
Single Supply 16-Bit, 100ksps,
Sampling ADCs
The LTC®1605-1/LTC1605-2 are 100ksps, sampling 16-bit A/D converters that draw only 55mW (typical) from a single 5V supply. These easy-to-use devices include a sample-and-hold, precision reference, switched capacitor successive approximation A/D and trimmed internal clock.
The LTC1605-1’s input range is 0V to 4V while the LTC1605-2’s input range is ±4V. An external reference can be used if greater accuracy over temperature is needed.
The ADC has a microprocessor compatible, 16-bit or two byte parallel output port. A convert start input and a data ready signal (BUSY) ease connections to FIFOs, DSPs and microprocessors.
Sample Rate: 100ksps
Complete 16-Bit Solution on a Single 5V Supply
Unipolar Input Range: 0V to 4V (LTC1605-1)
Bipolar Input Range: ±4V (LTC1605-2)
Power Dissipation: 55mW Typ
Signal-to-Noise Ratio: 86dB Typ
Operates with Internal or External Reference
Internal Synchronized Clock
28-Pin 0.3" PDIP and SSOP Packages
, LTC and LT are registered trademarks of Linear Technology Corporation.
Industrial Process Control
Multiplexed Data Acquisition Systems
High Speed Data Acquisition for PCs
Digital Signal Processing
LTC1605-1 Low Power, 100kHz, 16-Bit Sampling ADC on 5V Supply
4k
4k
200
2.5V
REFERENCE
20k 10k
16-BIT
SAMPLING ADC
D15 TO D0
33.2k
2.2µF
2.5V
2.5V
10µF 0.1µF
2.2µF
0V TO 4V
INPUT
V
IN
CAP
REF
AGND1
1
4
2
AGND25DGND
14
CONTROL
LOGIC AND
TIMING
BUSY
BYTE
CS
R/C
28 27
6 TO 13
15 TO 22
26
25
24
23
DIGITAL CONTROL SIGNALS
1605-1/2 TA01
16-BIT OR 2 BYTE PARALLEL BUS
5V
V
DIGVANA
BUFFER
3
CODE
0
INL (LSBs)
65535
1605-1/2 TA02/G04
16384
32768
49152
2.0
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
–2.0
Typical INL Curve
FEATURES
DESCRIPTIO
U
APPLICATIO S
U
TYPICAL APPLICATIO
U
Page 2
2
LTC1605-1/LTC1605-2
(Notes 1, 2)
V
ANA
.......................................................................... 7V
V
DIG
to V
ANA
........................................................... 0.3V
V
DIG
........................................................................... 7V
Ground Voltage Difference
DGND, AGND1 and AGND2 .............................. ±0.3V
Analog Inputs (Note 3)
VIN..................................................................... ±25V
CAP ............................ V
ANA
+ 0.3V to AGND2 – 0.3V
REF....................................Indefinite Short to AGND2
Momentary Short to V
ANA
Digital Input Voltage (Note 4) ........ V
DGND
– 0.3V to 10V
Digital Output Voltage........ V
DGND
– 0.3V to V
DIG
+ 0.3V
Power Dissipation.............................................. 500mW
Operating Ambient Temperature Range
LTC1605-1C/LTC1605-2C ....................... 0°C to 70°C
LTC1605-1I/LTC1605-2I .................... – 40°C to 85°C
Storage Temperature Range ................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec).................. 300°C
Consult factory for Military grade parts.
ORDER PART
NUMBER
LTC1605-1CG LTC1605-1IG LTC1605-2CG LTC1605-2IG LTC1605-1CN LTC1605-1IN LTC1605-2CN LTC1605-2IN
T
JMAX
= 125°C, θJA = 95°C/W (G)
T
JMAX
= 125°C, θJA = 130°C/W (N)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
IN
Analog Input Range (Note 9) 4.75V ≤ V
ANA
5.25V, 4.75V V
DIG
5.25V
LTC1605-1 0 to 4 V
LTC1605-2
±4V
C
IN
Analog Input Capacitance 10 pF
R
IN
Analog Input Impedance 10 k
The denotes the specifications which apply over the full operating temperature range, otherwise
PARAMETER CONDITIONS MIN TYP MAX UNITS
Resolution 16 Bits No Missing Codes 15 Bits Transition Noise 1 LSB
RMS
Integral Linearity Error (Note 7) ±3LSB Zero Error Ext. Reference = 2.5V (Note 8) ±10 mV Zero Error Drift ±2 ppm/°C Full-Scale Error Drift ±7 ppm/°C Full-Scale Error Ext. Reference = 2.5V (Notes 12, 13) ±0.50 % Full-Scale Error Drift Ext. Reference = 2.5V ±2 ppm/°C Power Supply Sensitivity
V
ANA
= V
DIG
= V
DD
VDD = 5V ±5% (Note 9) ±8LSB
The denotes the specifications which apply over the full operating
CO VERTER CHARACTERISTICS
U
A ALOG I PUT
UU
ABSOLUTE AXI U RATI GS
W
WW
U
PACKAGE/ORDER I FOR ATIO
UUW
1 2 3 4 5 6 7 8
9 10 11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
V
IN
AGND1
REF
CAP
AGND2
D15 (MSB)
D14 D13 D12 D11 D10
D9 D8
DGND
V
DIG
V
ANA
BUSY CS R/C BYTE D0 D1 D2 D3 D4 D5 D6 D7
G PACKAGE
28-LEAD PLASTIC SSOP
N PACKAGE
28-LEAD PDIP
TOP VIEW
temperature range, otherwise specifications are at TA = 25°C. With external reference (Notes 5, 6).
specifications are at TA = 25°C. (Note 5)
Page 3
3
LTC1605-1/LTC1605-2
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
S/(N + D) Signal-to-(Noise + Distortion) Ratio 1kHz Input Signal (Note 14) 87 dB
10kHz Input Signal 85 dB 20kHz, –60dB Input Signal 30 dB
THD Total Harmonic Distortion 1kHz Input Signal, First 5 Harmonics – 101 dB
10kHz Input Signal, First 5 Harmonics – 92 dB
Peak Harmonic or Spurious Noise 1kHz Input Signal –101 dB
10kHz Input Signal –92 dB Full-Power Bandwidth (Note 15) 275 kHz Aperture Delay 40 ns Aperture Jitter Sufficient to Meet AC Specs Transient Response Full-Scale Step (Note 9) 2 µs Overvoltage Recovery (Note 16) 150 ns
The denotes the specifications which apply over the full operating temperature range,
PARAMETER CONDITIONS MIN TYP MAX UNITS
V
REF
Output Voltage I
OUT
= 0 2.470 2.500 2.520 V
V
REF
Output Tempco I
OUT
= 0 ±5 ppm/°C
Internal Reference Source Current 1 µA External Reference Voltage for Specified Linearity (Notes 9, 10) 2.30 2.50 2.70 V External Reference Current Drain Ext. Reference = 2.5V (Note 9) 100 µA CAP Output Voltage I
OUT
= 0 2.50 V
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
IH
High Level Input Voltage VDD = 5.25V 2.4 V
V
IL
Low Level Input Voltage VDD = 4.75V 0.8 V
I
IN
Digital Input Current VIN = 0V to V
DD
±10 µA
C
IN
Digital Input Capacitance 5pF
V
OH
High Level Output Voltage VDD = 4.75V IO = –10µA 4.5 V
IO = –200µA 4.0 V
V
OL
Low Level Output Voltage VDD = 4.75V IO = 160µA 0.05 V
IO = 1.6mA 0.10 0.4 V
I
OZ
Hi-Z Output Leakage D15 to D0 V
OUT
= 0V to VDD, CS High ±10 µA
C
OZ
Hi-Z Output Capacitance D15 to D0 CS High (Note 9) 15 pF
I
SOURCE
Output Source Current V
OUT
= 0V –10 mA
I
SINK
Output Sink Current V
OUT
= V
DD
10 mA
The denotes the specifications which apply over the
The denotes the specifications which apply over the
DY A IC ACCURACY
UW
I TER AL REFERE CE CHARACTERISTICS
UU U
DIGITAL I PUTS A D DIGITAL OUTPUTS
UU
otherwise specifications are at TA = 25°C. (Notes 5, 14)
full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5)
full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5)
Page 4
4
LTC1605-1/LTC1605-2
The denotes the specifications which apply over the full operating temperature
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
f
SAMPLE(MAX)
Maximum Sampling Frequency 100 kHz
t
CONV
Conversion Time 8 µs
t
ACQ
Acquisition Time 2 µs
t
1
Convert Pulse Width (Note 11) 40 ns
t
2
Data Valid Delay After R/C (Note 9) 8 µs
t
3
BUSY Delay from R/C CL = 50pF 65 ns
t
4
BUSY Low 8 µs
t
5
BUSY Delay After End of Conversion 220 ns
t
6
Aperture Delay 40 ns
t
7
Bus Relinquish Time 10 35 83 ns
t
8
BUSY Delay After Data Valid 50 200 ns
t
9
Previous Data Valid After R/C 7.4 µs
t
10
R/C to CS Setup Time (Notes 9, 10) 10 ns
t
11
Time Between Conversions 10 µs
t
12
Bus Access and Byte Delay (Notes 9, 10) 10 83 ns
The denotes the specifications which apply over the full operating temperature
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
DD
Positive Supply Voltage (Notes 9, 10) 4.75 5.25 V
I
DD
Positive Supply Current 11 16 mA
P
DIS
Power Dissipation 55 80 mW
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
Note 2: All voltage values are with respect to ground with DGND, AGND1 and AGND2 wired together (unless otherwise noted).
Note 3: When these pin voltages are taken below ground or above V
ANA
=
V
DIG
= VDD, they will be clamped by internal diodes. This product can
handle input currents of greater than 100mA below ground or above V
DD
without latch-up. Note 4: When these pin voltages are taken below ground, they will be
clamped by internal diodes. This product can handle input currents of 90mA below ground without latchup. These pins are not clamped to V
DD
.
Note 5: VDD = 5V, f
SAMPLE
= 100kHz, tr = tf = 5ns unless otherwise
specified. Note 6: Linearity, offset and full-scale specifications apply for a V
IN
input
with respect to ground. Note 7: Integral nonlinearity is defined as the deviation of a code from a
straight line passing through the actual end points of the transfer curve. The deviation is measured from the center of the quantization band.
Note 8: Zero error for the LTC1605-1 is the voltage measured from
0.5LSB when the output code flickers between 0000 0000 0000 0000 and 0000 0000 0000 0001. Zero error for the LTC1605-2 is the voltage measured from –0.5LSB when the output code flickers between 0000 0000 0000 0000 and 1111 1111 1111 1111.
Note 9: Guaranteed by design, not subject to test. Note 10: Recommended operating conditions. Note 11: With CS low the falling R/C edge starts a conversion. If R/C
returns high at a critical point during the conversion it can create small errors. For best results ensure that R/C returns high within 3µs after the start of the conversion.
Note 12: As measured with fixed resistors shown in Figure 4. Adjustable to zero with external potentiometer.
Note 13: Full-scale error is the untrimmed deviation from ideal last code transition, divided by the full-scale range and includes the effect of offset error.
Note 14: All specifications in dB are referred to a full-scale 4V input for the LTC1605-1 and to ±4V input for the LTC1605-2.
Note 15: Full-power bandwidth is defined as full-scale input frequency at which a signal-to-(noise + distortion) degrades to 60dB or 10 bits of accuracy.
Note 16: Recovers to specified performance after (±20V) input overvoltage for the LTC1605-1 and ±15V for the LTC1605-2.
TI I G CHARACTERISTICS
WU
POWER REQUIRE E TS
WU
range, otherwise specifications are at TA = 25°C. (Note 5)
range, otherwise specifications are at TA = 25°C. (Note 5)
Page 5
5
LTC1605-1/LTC1605-2
TYPICAL PERFOR A CE CHARACTERISTICS
UW
SUPPLY VOLTAGE (V)
4.50
9.5
SUPPLY CURRENT (mA)
10.0
10.5
11.0
11.5
12.0
12.5
4.75 5.00 5.25 5.50
1605-1/2 G01
f
SAMPLE
= 100kHz
TEMPERATURE (°C)
–50
10.0
POWER SUPPLY CURRENT (mA)
10.5
11.0
11.5
12.0
–25 0 25 50
1605-1/2 G02
75 100
f
SAMPLE
= 100kHz
LOAD CURRENT (mA)
CHANGE IN CAP VOLTAGE (V)
0.04
0.02
0
–0.02
–0.04
–0.06
–0.08
–0.10
–60 –40 –20 0
1605-1/2 G03
–70–80 –50 –30 –10 10
LTC1605-1
LTC1605-2
CODE
0
DNL (LSB)
65535
1605-1/2 G05
16384
32768
49152
2.0
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
–2.0
FREQUENCY (kHz)
0
MAGNITUDE (dB)
1605-1/2 G07/F11
5 10 15 20 25 30 35 40 45 50
0 –10 –20 –30 –40 –50 –60 –70 –80 –90
–100 –110 –120 –130
f
SAMPLE
= 100kHz
f
IN
= 1kHz SINAD = 87dB THD = 101.1dB SNR = 87.2dB
INPUT FREQUENCY (kHz)
1
SINAD (dB)
90
88
86
84
82
80
10 100
1605-1/2 G08
INPUT FREQUENCY (kHz)
1
TOTAL HARMONIC DISTORTION (dB)
–70
–80
–90
–100
–110
10 100
1605-1/2 G09
Supply Current vs Supply Voltage Supply Current vs Temperature
Change in CAP Voltage vs Load Current
Typical INL Curve Typical DNL Curve
Power Supply Feedthrough vs Ripple Frequency
LTC1605-2 Nonaveraged 4096-Point FFT Plot
SINAD vs Input Frequency (LTC1605-2)
Total Harmonic Distortion vs Input Frequency (LTC1605-2)
CODE
0
INL (LSBs)
65535
1605-1/2 TA02/G04
16384
32768
49152
2.0
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
–2.0
RIPPLE FREQUENCY (Hz)
POWER SUPPLY FEEDTHROUGH (dB)
–20
–30
–40
–50
–60
–70
–80
100 10k 100k 1M
LTXXXX GXX
1k
LTC1605-2
LTC1605-1
Page 6
6
LTC1605-1/LTC1605-2
16-BIT CAPACITIVE DAC
COMPREF BUF
2.5V REF
CAP
(2.5V)
C
SAMPLE
C
SAMPLE
D15
D0
BUSY
CONTROL LOGIC
R/C BYTE
INTERNAL
CLOCK
CS
ZEROING SWITCHES
V
DIG
V
ANA
V
IN
REF
AGND1 AGND2
DGND
16
1605-1/2 BD
+
SUCCESSIVE APPROXIMATION
REGISTER
OUTPUT LATCHES
4k
4k
6K*
20k
3.75k*
10k OPEN*
*RESISTOR VALUES FOR THE LTC1605-2
VIN (Pin 1): Analog Input. Connect through a 200 resistor to the analog input. Full-scale input range is 0V to 4V for the LTC1605-1 and ±4V for the LTC1605-2.
AGND1 (Pin 2): Analog Ground. Tie to analog ground plane.
REF (Pin 3): 2.5V Reference Output. Bypass with 2.2µF tantalum capacitor. Can be driven with an external refer­ence.
CAP (Pin 4): Reference Buffer Output. Bypass with 2.2µF tantalum capacitor.
AGND2 (Pin 5): Analog Ground. Tie to analog ground plane.
D15 to D8 (Pins 6 to 13): Three-State Data Outputs. Hi-Z state when CS is high or when R/C is low.
DGND (Pin 14): Digital Ground. D7 to D0 (Pins 15 to 22): Three-State Data Outputs.
Hi-Z state when CS is high or when R/C is low. BYTE (Pin 23): Byte Select. With BYTE low, data will be
output with Pin 6 (D15) being the MSB and Pin 22 (D0)
PIN FUNCTIONS
UUU
being the LSB. With BYTE high the upper eight bits and the lower eight bits will be switched. The MSB is output on Pin 15 and bit 8 is output on Pin 22. Bit 7 is output on Pin 6 and the LSB is output on Pin 13.
R/C (Pin 24): Read/Convert Input. With CS low, a falling edge on R/C puts the internal sample-and-hold into the hold state and starts a conversion. With CS low, a rising edge on R/C enables the output data bits.
CS (Pin 25): Chip Select. Internally OR’d with R/C. With R/C low, a falling edge on CS will initiate a conversion. With R/C high, a falling edge on CS will enable the output data.
BUSY (Pin 26): Output Shows Converter Status. It is low when a conversion is in progress. Data valid on the rising edge of BUSY. CS or R/C must be high when BUSY rises or another conversion will start without time for signal acquisition.
V
ANA
(Pin 27): 5V Analog Supply. Bypass to ground with
a 0.1µF ceramic and a 10µF tantalum capacitor.
V
DIG
(Pin 28): 5V Digital Supply. Connect directly to
Pin␣ 27.
FU CTIO AL BLOCK DIAGRA
UU
W
Page 7
7
LTC1605-1/LTC1605-2
APPLICATIONS INFORMATION
WUU
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autozero switch, S3. In this acquire phase, a minimum delay of 2µs will provide enough time for the sample-and- hold capacitor to acquire the analog signal. During the convert phase, S3 opens, putting the comparator into the compare mode. The input switch S2 switches C
SAMPLE
to ground, injecting the analog input charge onto the sum­ming junction. This input charge is successively com­pared with the binary-weighted charges supplied by the capacitive DAC. Bit decisions are made by the high speed comparator. At the end of a conversion, the DAC output balances the VIN input charge. The SAR contents (a 16­bit data word) that represents the VIN are loaded into the 16-bit output latches.
Driving the Analog Inputs
The nominal input range for the LTC1605-1 is 0V to 4V or (1.6V
REF
) and for the LTC1605-2 the input range is ±4V
or (±1.6V
REF
). The inputs are overvoltage protected to
±25V. The input impedance is typically 10k; therefore, it should be driven by a low impedance source. Wideband noise coupling into the input can be minimized by placing a 1000pF capacitor at the input as shown in Figure 2. An NPO-type capacitor gives the lowest distortion. Place the capacitor as close to the device input pin as possible. If an amplifier is to be used to drive the input, care should be taken to select an amplifier with adequate accuracy, linearity and noise for the application. The following list is a summary of the op amps that are suitable for driving the LTC1605-1/LTC1605-2. More detailed information is available in the Linear Technology data books and LinearViewTM CD-ROM.
Conversion Details
The LTC1605-1/LTC1605-2 use a successive approxi­mation algorithm and an internal sample-and-hold cir­cuit to convert an analog signal to a 16-bit or two byte parallel output. The ADC is complete with a precision reference and an internal clock. The control logic pro­vides easy interface to microprocessors and DSPs. (Please refer to the Digital Interface section for the data format.)
Conversion start is controlled by the CS and R/C inputs. At the start of conversion, the successive approximation register (SAR) is reset. Once a conversion cycle has begun, it cannot be restarted.
During the conversion, the internal 16-bit capacitive DAC output is sequenced by the SAR from the most significant bit (MSB) to the least significant bit (LSB). Referring to Figure 1, VIN is connected through the resistor divider and S1 to the sample-and-hold capacitor during the acquire phase and the comparator offset is nulled by the
Figure 1. LTC1605-1/LTC1605-2 Simplified Equivalent Circuit
V
DAC
1605-1/2 F01
+
C
DAC
DAC
S1
SAMPLE
S2
HOLD
C
SAMPLE
S A
R
16-BIT LATCH
COMPARATOR
SAMPLE
S3
R
IN2
R
IN1
V
IN
LinearView is a trademark of Linear Technology Corporation
1k 50pF 50pF
DBN
DBN
1k
5V
1605-1/2 TC02
A. VOH TO HI-Z B. VOL TO HI-Z
Load Circuit for Access Timing
Load Circuit for Output Float Delay
1k C
L
C
L
DBN DBN
1k
5V
1605-1/2 TC01
A. HI-Z TO VOH AND VOL TO V
OH
B. HI-Z TO VOL AND VOH TO V
OL
TEST CIRCUITS
Page 8
8
LTC1605-1/LTC1605-2
APPLICATIONS INFORMATION
WUU
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LT®1007 - Low noise precision amplifier. 2.7mA supply current ±5V to ±15V supplies. Gain bandwidth product 8MHz. DC applications.
LT1097 - Low cost, low power precision amplifier. 300µA supply current. ±5V to ±15V supplies. Gain bandwidth product 0.7MHz. DC applications.
LT1227 - 140MHz video current feedback amplifier. 10mA supply current. ±5V to ±15V supplies. Low noise and low distortion.
LT1360 - 37MHz voltage feedback amplifier. 3.8mA supply current. ±5V to ±15V supplies. Good AC/DC specs.
LT1363 - 50MHz voltage feedback amplifier. 6.3mA supply current. Good AC/DC specs.
LT1364/LT1365 - Dual and quad 50MHz voltage feed­back amplifiers. 6.3mA supply current per amplifier. Good AC/DC specs.
LT1468 - 90MHz, 22V/µs 16-Bit Accurate Amplifier
For minimum code transition noise the REF pin and the CAP pin should each be decoupled with a capacitor to filter wideband noise from the reference and the buffer (2.2µF tantalum).
Offset and Gain Adjustments
The LTC1605-1/LTC1605-2 offset and full-scale errors have been trimmed at the factory with the external resistors shown in Figure 4. This allows for external adjustment of offset and full scale in applications where absolute accuracy is important. See Figure 5 for the offset and gain trim circuit for the LTC1605-1/LTC1605-2. First adjust the offset to zero by adjusting resistor R3. Apply an input voltage of 30.5µV (0.5LSB) and adjust R3 so the code is changing between 0000 0000 0000 0001 and 0000 0000 0000 0000. The gain error is trimmed by adjusting resistor R4. An input voltage of 3.999908V (FS – 1.5LSB) is applied to VIN and R4 is adjusted until the output code is changing between 1111 1111 1111 1110 and 1111 1111 1111 1111. Figure 6a shows the unipolar transfer characteristic of the LTC1605-1.
For the LTC1605-2, first adjust the offset to zero by adjusting resistor R3. Apply an input voltage of –61µV (–0.5LSB) and adjust R3 so the code is changing be­tween 1111 1111 1111 1111 and 0000 0000 0000 0000. The gain error is trimmed by adjusting resistor R4. An input voltage of 3.999817V (+FS – 1.5LSB) is applied to VIN and R4 is adjusted until the outut code is changing between 0111 1111 1111 1110 and 0111 1111 1111
1111. Figure 6b shows the bipolar transfer characteris­tics of the LTC1605-2.
DC Performance
One way of measuring the transition noise associated with a high resolution ADC is to use a technique where a DC signal is applied to the input of the ADC and the resulting output codes are collected over a large number of conversions. For example, in Figure 7 the distribution of output code is shown for a DC input that has been digitized 10000 times. The distribution is Gaussian and the RMS code transition is about 1LSB.
Figure 2. Analog Input Filtering
1605-1/2 F02
1000pF 33.2k
V
IN
CAP
A
IN
200
Internal Voltage Reference
The LTC1605-1/LTC1605-2 has an on-chip, temperature compensated, curvature corrected, bandgap reference, which is factory trimmed to 2.50V. The full-scale range of the ADC is equal to (1.6V
REF
) or nominally 0V to 4V for the
LTC1605-1 and (±1.6V
REF
) or nominally ±4V for the
LTC1605-2. The output of the reference is connected to the input of a unity-gain buffer through a 4k resistor (see Figure 3). The input to the buffer or the output of the reference is available at REF (Pin 3). The internal refer­ence can be overdriven with an external reference if more accuracy is needed. The buffer output drives the internal DAC and is available at CAP (Pin 4). The CAP pin can be used to drive a steady DC load of less than 2mA. Driving an AC load is not recommended because it can cause the performance of the converter to degrade.
Page 9
9
LTC1605-1/LTC1605-2
APPLICATIONS INFORMATION
WUU
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INPUT VOLTAGE (V)
–FS/2 0V
OUTPUT CODE
1605-1/2 F06b
011...111
011...110
000...001
000...000
111...111
111...110
100...000
100...001
–1
LSB1LSB
BIPOLAR
ZERO
FS/2 – 1LSB
FS = 8V 1LSB = FS/65536
Figure 6B. LTC1605-2 Bipolar Transfer Characteristics
CODE
0
500
1500
1000
2500
2000
4000
3500
3000
4500
COUNT
1605-1/2 F07
–5–4–3–2–1012345
Figure 7. Histogram for 10000 Conversions
INPUT VOLTAGE (V)
0V
OUTPUT CODE
1605-1/2 F06a
111...111
111...110
000...000
000...001
1
LSB
UNIPOLAR
ZERO
FS – 1LSB
FS = 4V 1LSB = FS/65536
Figure 6a. LTC1605-1 Unipolar Transfer Characteristics
Figure 5. 0V to 4V Input for the LTC1605-1 and ±4V for the LTC1605-2 with Offset and Gain Trim
+
5
4
3
2
1
2.2µF
+
2.2µF
33.2k 1%
0V TO 4V
OR ±4V
INPUT 200
1%
V
IN
AGND1
REF
CAP
AGND2
LTC1605-1 LTC1605-2
1605-1/2 F05
576k
R4
50k
R3 50k
OFFSET
TRIM
GAIN
TRIM
5V
S
S
+
1605-1/2 F03
INTERNAL
CAPACITOR
DAC
BANDGAP
REFERENCE
V
ANA
4k
2.2µF
CAP
(2.5V)
2.2µF
REF
(2.5V)
4
3
Figure 3. Internal or External Reference Source
+
5
4
3
2
1
2.2µF
+
2.2µF
33.2k 1%
0V TO 4V
OR ±4V
INPUT
200
1%
V
IN
AGND1
REF CAP
AGND2
LTC1605-1 LTC1605-2
1605-1/2 F04
Figure 4. 0V to 4V Input for the LTC1605-1 and ±4V for the LTC1605-2 Without Trim
Page 10
10
LTC1605-1/LTC1605-2
APPLICATIONS INFORMATION
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DIGITAL INTERFACE
Internal Clock
The ADC has an internal clock that is trimmed to achieve a typical conversion time of 7µs. No external adjustments are required and, with the typical acquisition time of 1µs, throughput performance of 100ksps is assured.
Timing and Control
Conversion start and data read are controlled by two digital inputs: CS and R/C. To start a conversion and put the sample-and-hold into the hold mode, bring CS and R/C low for no less than 40ns. Once initiated, it cannot be restarted until the conversion is complete. Converter status is indicated by the BUSY output and this is low while the conversion is in progress.
There are two modes of operation. The first mode is shown in Figure 8. The digital input R/C is used to control the start of conversion. CS is tied low. When R/C goes low, the sample-and-hold goes into the hold mode and a conversion is started. BUSY goes low and stays low during the conversion and will go back high after the conversion has been completed and the internal output shift registers have been updated. R/C should remain low for no less than 40ns. During the time R/C is low, the
Figure 8. Conversion Timing with Outputs Enabled After Conversion (CS Tied Low)
t
1
t
11
t
2
t
4
t
3
t
7
t
6
ACQUIRE CONVERT CONVERTACQUIRE
t
5
t
8
t
ACQ
t
CONV
t
9
PREVIOUS
DATA VALID
PREVIOUS
DATA VALID
HI-Z NOT VALID HI-Z
DATA VALID
DATA
VALID
R/C
BUSY
MODE
DATA MODE
1605-1/2 F08
digital outputs are in a Hi-Z state. R/C should be brought back high within 3µs after the start of the conversion to ensure that no errors occur in the digitized result. The second mode, shown in Figure 9, uses the CS signal to control the start of a conversion and the reading of the digital output. In this mode, the R/C input signal should be brought low no less than 10ns before the falling edge of CS. The minimum pulse width for CS is 40ns. When CS falls, BUSY goes low and will stay low until the end of the conversion. BUSY will go high after the conversion has been completed. The new data is valid when CS is brought back low again to initiate a read. Again, it is recommended that both R/C and CS return high within 3µs after the start of the conversion.
Output Data
The output data can be read as a 16-bit word or it can be read as two 8-bit bytes. The format of the output data is straight binary for the LTC1605-1 and two’s complement for the LTC1605-2. The digital input pin BYTE is used to control the two byte read. With the BYTE pin low, the first eight MSBs are output on the D15 to D8 pins and the eight LSBs are output on the D7 to D0 pins. When the BYTE pin is taken high, the eight LSBs replace the eight MSBs (Figure 10).
Page 11
11
LTC1605-1/LTC1605-2
APPLICATIONS INFORMATION
WUU
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Figure 9. Using CS to Control Conversion and Read Timing
ACQUIRE CONVERT ACQUIRE
DATA
VALID
t
1
t
10
t
10
t
1
t
10
t
10
t
3
t
6
t
4
t
CONV
t
12
t
7
HI-ZHI-Z
R/C
BUSY
CS
MODE
DATA BUS
1605-1/2 F09
Figure 10. Using CS and BYTE to Control Data Bus Read Timing
t
10
t
10
t
12
t
7
t
12
HI-Z
HI-Z
HI-Z
HI-Z
HIGH BYTE
LOW BYTE
LOW BYTE
HIGH BYTE
R/C
BYTE
CS
PINS 6 TO 13
PINS 15 TO 22
1605-1/2 F10
Page 12
12
LTC1605-1/LTC1605-2
APPLICATIONS INFORMATION
WUU
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Dynamic Performance
FFT (Fast Fourier Transform) test techniques are used to test the ADC’s frequency response, distortion and noise at the rated throughput. By applying a low distortion sine wave and analyzing the digital output using an FFT algorithm, the ADC’s spectral content can be examined for frequencies outside the fundamental. Figure 11 shows a typical LTC1605-2 FFT plot which yields a SINAD of 87dB and THD of –101.1dB.
Signal-to-Noise Ratio
The Signal-to-Noise and Distortion Ratio (SINAD) is the ratio between the RMS amplitude of the fundamental input frequency to the RMS amplitude of all other fre­quency components at the A/D output. The output is band limited to frequencies from above DC and below half the sampling frequency. Figure 11 shows a typical SINAD of 87dB with a 100kHz sampling rate and a 1kHz input.
where V1 is the RMS amplitude of the fundamental frequency and V2 through VN are the amplitudes of the second through Nth harmonics.
Board Layout, Power Supplies and Decoupling
Wire wrap boards are not recommended for high resolu­tion or high speed A/D converters. To obtain the best performance from the LTC1605-1/LTC1605-2, a printed circuit board is required. Layout for the printed circuit board should ensure the digital and analog signal lines are separated as much as possible. In particular, care should be taken not to run any digital track alongside an analog signal track or underneath the ADC. The analog input should be screened by AGND.
Figures 12 through 15 show a layout for a suggested evaluation circuit which will help obtain the best perfor­mance from the 16-bit ADC. Additional information re­garding the evaluation circuit and Gerber files for the PC board layout are available from Linear Technology or your local sales office. Pay particular attention to the design of the analog and digital ground planes. The DGND pin of the LTC1605-1/LTC1605-2 can be tied to the analog ground plane. Placing the bypass capacitor as close as possible to the power supply, the reference and reference buffer output is very important. Low imped­ance common returns for these bypass capacitors are essential to low noise operation of the ADC, and the PC track width for these lines should be as wide as possible. Also, since any potential difference in grounds between the signal source and ADC appears as an error voltage in series with the input signal, attention should be paid to reducing the ground circuit impedance as much as possible. The digital output latches and the onboard sampling clock have been placed on the digital ground plane. The two ground planes are tied together at the power supply ground connection.
Figure 11. LTC1605-2 Nonaveraged 4096-Point FFT Plot
FREQUENCY (kHz)
0
MAGNITUDE (dB)
1605-1/2 G07/F11
5 10 15 20 25 30 35 40 45 50
0 –10 –20 –30 –40 –50 –60 –70 –80 –90
–100 –110 –120 –130
f
SAMPLE
= 100kHz
f
IN
= 1kHz SINAD = 87dB THD = 101.1dB SNR = 87.2dB
Total Harmonic Distortion
Total Harmonic Distortion (THD) is the ratio of the RMS sum of all harmonics of the input signal to the fundamen­tal itself. The out-of-band harmonics alias into the fre­quency band between DC and half the sampling fre­quency. THD is expressed as:
THD = 20log
V
2
2
+ V
3
2
+ V
4
2
... + V
N
2
V
1
Page 13
13
LTC1605-1/LTC1605-2
APPLICATIONS INFORMATION
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Figure 12. Component Side Silkscreen for the Suggested LTC1605-1/LTC1605-2 Evaluation Circuit
ANALOG
GROUND PLANE
ANALOG
GROUND PLANE
DIGITAL
GROUND PLANE
Figure 13. Bottom Side Showing Analog Ground Plane
Figure 14. Component Side Showing Separate Analog and Digital Ground Plane
Page 14
14
LTC1605-1/LTC1605-2
D15
+
3
U6A
74HC221
A
B
Q
Q
CEXT
R21, 2k
RCEXT
15
1
2
4
13
CLK
1605-1/2 F15
D15
D14
U1
LTC1605-1
LTC1605-2
D13
D12
D11
C5
0.1µF
R19
33.2k
1%
C3
0.1µF
C16
1000pF
C4
2.2µF
C2
2.2µF
EXT INTV
REF
JP1
C17
10µF
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
6
7
8
9
10
11
12
13
15
16
17
18
19
20
21
D0
D15 D15
D14
D13
D12
D11
D10D9D8
2345678
9
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
4
R20
1K
3
U4B
74HC04
65
U4C
74HC04
C1
15PF
22
1
2
3
4
5
14
23
24
25
26
27
28
V
IN
Q0
U2
74HC574
19
D0
Q1
18
D1
Q2
17
D2
Q3
16
D3
Q4
15
D4
Q5
14
D5
Q6
13
D6
Q7
12
12
U4A
74HC04
D71 OC
11
CLK
2
76543
U7
74HC160
CLR
LOAD
RCO
15
2
3
JP3
1
EXT
CLK
INT
2
3
JP5
1
V
CC
CS
GND
ENP
10
ENT
QD
11
D
QC
12
C
QB
13
B
QA
14
A
2
U8
1MHz, OSC
OUT
3
GND
1
NA
E2
GND
V
IN
7V TO 15V
E1
U5
LT1121
D16
MBR0520
C6
22µF
10V
GND
13
2
V
IN
V
IN
4
U9
LT1019-2.5
TRIM
5
GND
1
NC12INPUT
3
876
TEMP
NC2
HEATER
OUT
1
9
CLK
D0D1D2D3D4D5D6
D7
2345678
9
Q0
U3
74HC574
19
D0
Q1
18
D1
Q2
17
D2
Q3
16
D3
Q4
15
D4
Q5
14
D5
Q6
13
D6
Q7
12
D71 OC
11
CLK
AGND1
REF
CAP
AGND2
DGND
BYTE
R/C
CS
BUSY
V
ANAVDIG
C8
0.1µF
C7
10µF
V
KK
V
CC
V
KK
V
KK
V
DD
V
CC
R16
20
C9
0.1µF
C10
0.1µF
DIGITAL I.C. BYPASSING
C11
0.1µF
C12
0.1µF
V
CC
C13
0.1µF
C14
0.1µF
C15
10µF
2
3
JP4
1
REVERSE
BYTE
NORNAL
V
CC
V
CC
V
CC
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
GND
GND
CLK
D15
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
R8, 1.2k
D8
R9, 1.2k
D9
R10, 1.2k
D10
R11, 1.2k
D11
R12, 1.2k
D12
R13, 1.2k
D13
R14, 1.2k
D14
R15, 1.2k
R0, 1.2k
D0
R1, 1.2k
D1
R2, 1.2k
D2
R3, 1.2k
D3
R4, 1.2k
D4
R5, 1.2k
D5
R6, 1.2k
D6
R7, 1.2k
D7
JP2
LED
ENABLE
1011
U4E
74HC04
81
2
9
EXT_CLK
J1
1
2
A
IN
J2
R17
51
U4D
74HC04
R18
200
1%
APPLICATIONS INFORMATION
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Figure 15. LTC1605-1 Suggested Evaluation Circuit Schematic
Page 15
15
LTC1605-1/LTC1605-2
The circuit in Figure 16 is an example showing the LTC1605 16-bit A/D converter and LTC1391 8-channel MUX con­nected to a 68HC11 controller. The LTC1605’s 16-bit data output is read in two 8-bit bytes using Pins 6 (MSB, Bit7) through 13 (Bit8, Bit0), connected to the HC11’s PORTC. The MUX’s 4-bit serial address data is sent using the controller’s SPI.
The process to convert a channel’s input signal is shown in sample listing A. It begins with shifting in the MUX’s channel data while the SS signal is a logic high. The MUX channel address is latched on the falling edge of SS and the
chosen channel’s input is applied at the LTC1605’s input, Pin 1. Through the processor’s PORTA, a low-going pulse is applied to the LTC1605’s R/C pin, initiating a conver­sion. The processor then monitors the BUSY output. When this signal becomes a logic high, signaling the end of conversion, the processor reads the high byte of the conversion through PORTC. The low byte is read through PORTC when the processor changes the BYTE signal to a logic high. The timing relationship of the control signals and data are shown in Figure 17.
Sample Listing A
************************************************************************* * * * This example program selects the an LTC1391 MUX channel, initiates a* * conversion, and retrieves conversion data. It stores the 16-bit data* * in two consecutive memory locations. The program is designed for use* * with the LTC1605’s /CS tied to ground (see timing diagram in * * Figure 17). * * * ************************************************************************* * ***************************************** * 68HC11 register definitions * ***************************************** * PORTA EQU $1000 Parallel port A * Use Bit0 as an input for the LTC1605’s /BUSY signal * Use Bit3 as an output driving the LTC1605’s BYTE * input PIOC EQU $1002 Parallel I/O control register * “STAF,STAI,CWOM,HNDS, OIN, PLS, EGA,INVB” PORTC EQU $1003 Port C data register * “Bit7,Bit6,Bit5,Bit4,Bit3,Bit2,Bit1,Bit0” DDRC EQU $1007 Port D data direction register * “Bit7,Bit6,Bit5,Bit4,Bit3,Bit2,Bit1,Bit0” * 1 = output, 0 = input PORTD EQU $1008 Port D data register * “ - , - , SS* ,CSK ;MOSI,MISO,TxD ,RxD “ DDRD EQU $1009 Port D data direction register SPCR EQU $1028 SPI control register * “SPIE,SPE ,DWOM,MSTR;SPOL,CPHA,SPR1,SPR0” SPSR EQU $1029 SPI status register * “SPIF,WCOL, - ,MODF; - , - , - , - “ SPDR EQU $102A SPI data register; Read-Buffer; Write-Shifter * * RAM variables to hold the LTC1605’s 14 conversion result * DIN1 EQU $00 This memory location holds the LTC1605’s bits 15 - 08 DIN2 EQU $01 This memory location holds the LTC1605’s bits 07 - 00 MUX EQU $02 This memory location holds the MUX address data *
TYPICAL APPLICATIO S
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Page 16
16
LTC1605-1/LTC1605-2
***************************************** * Start GETDATA Routine * ***************************************** *
ORG $C000 Program start location INIT1 LDAA #$03 0,0,0,0,0,0,1,1 * “STAF=0,STAI=0,CWOM=0,HNDS=0, OIN=0, PLS=0, EGA=1,INVB=1”
STAA PIOC Ensures that the PIOC register’s status is the same * as after a reset, necessary of simple Port D manipulation
LDAA #$00 0,0,0,0,0,0,0,0 * “Bits 7 - 0 are used as inputs for the LTC1605’s data
STAA DDRC Direction of PortD’s bit are now set as inputs
LDAA #$2F -,-,1,0;1,1,1,1 * -, -, SS*-Hi, SCK-Lo, MOSI-Hi, MISO-Hi, X, X
STAA PORTD Keeps SS* a logic high when DDRD, Bit5 is set
LDAA #$38 -,-,1,1;1,0,0,0
STAA DDRD SS* , SCK, MOSI are configured as Outputs * MISO, TxD, RxD are configured as Inputs * DDRD’s Bit5 is a 1 so that port D’s SS* pin is a general output
LDAA #$50
STAA SPCR The SPI is configured as Master, CPHA = 0, CPOL = 0 * and the clock rate is E/2 * (This assumes an E-Clock frequency of 4MHz. For higher * E-Clock frequencies, change the above value of $50 to a * value that ensures the SCK frequency is 2MHz or less.) GETDATAPSHX
PSHY
PSHA * ***************************************** * Setup indecies * ***************************************** *
LDX #$0 The X register is used as a pointer to the memory * locations that hold the conversion data
LDY #$1000 * ***************************************** * Ensure that a logic high is applied * * to the LTC1391’s /CS and the * * LTC1605’s R/C pins * ***************************************** *
BSET PORTD,Y %00100000 This sets the SS* output bit to a logic * high, ensuring that the LTC1391’s CS* * input is a logic high while clocking * MUX address data into the LTC1391
BSET PORTA,Y %00010000 This sets the R/C* output bit to a logic * high, ensuring that the LTC1605’s R/C* * input is a logic high before initiating * a conversion
*****************************************
TYPICAL APPLICATIO S
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Page 17
17
LTC1605-1/LTC1605-2
* Retrieve the MUX address from memory * * and send it to the LTC1391 * ***************************************** *
LDAA MUX Retrieve the MUX address from memory
ORAA #$08 Enable the selected MUX address
STAA SPDR Select the MUX channel WAIT1 LDAA SPSR This loop waits for the SPI to complete a serial * transfer/exchange by reading the SPI Status Register
BPL WAIT1 The SPIF (SPI transfer complete flag) bit is the SPSR’s * MSB and is set to one at the end of an SPI transfer. The * branch will occur while SPIF is a zero.
BCLR PORTD,Y %00100000 This forces a logic low on PORTD’s SS*, * latching the MUXes data * ***************************************** * Initiate a LTC1605 conversion * ***************************************** *
BCLR PORTA,Y %00010000 Initiate a conversion
BSET PORTA,Y %00010000 This sets the LTC1605’s R/C* to a logic * high * ***************************************** * Set the LTC1605’s BYTE input low to * * ensure that the high byte is present * * during the first read * ***************************************** *
LDAA PORTA Get the contents of Port A
ANDA #%11110111 Set Bit3 low
STAA PORTA Set the LTC1605’s BYTE input low * ***************************************** * The next short loop ensures that the * * LTC1605’s conversion is finished * * before starting the data transfer* ***************************************** * CONVENDLDAA PORTA Retrieve the contents of port A
ANDA #%00000001 Look at Bit0 * Bit0 = Lo; the LTC1605’s conversion is not * complete * Bit0 = Hi; the LTC1605’s conversion is complete
BEQ CONVEND Branch to the loop’s beginning while Bit7 * remains low *
TYPICAL APPLICATIO S
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Page 18
18
LTC1605-1/LTC1605-2
************************************************************************* * This routine retrieves the LTC1605’s 16-bit data using two 8-bit * * reads. The BYTE input is manipulated through Port A’s Bit3. During * * the first read when BYTE is low, the upper byte is read and stored in * * DIN1.During the second read when BYTE is high, the lower byte is * * read and stored in DIN2. * ************************************************************************* *
LDAA PORTC Retrieve the LTC1605’s high byte
STAA DIN1 Store the high byte
LDAA PORTA Get the contents of Port A
ORAA #%00001000 Set Bit3 high
STAA PORTA Set the LTC1605’s BYTE input high
LDAA PORTC Retrieve the LTC1605’s low byte
STAA DIN2 Store the high byte
PULA Restore the A register
PULY Restore the Y register
PULX Restore the X register
RTS
V
DIG
V
ANA
LTC1605-1 LTC1605-2
D7/D15 D6/D14 D5/D13 D4/D12 D3/D11 D2/D10
D1/D9 D0/D8
28 27 6 7 8 9 10 11 12 13 18
V
+
D
LTC1391
V
D
OUT
D
IN
CS
DLK
DGND
16
15
14
5V
0.1µF
13
12
11
10
9
M0S1 SS SPI CLK
1
2
3
4
5
6
7
8
S0
S1
S2
S3
S4
S5
S6
S7
17 16 15 26 25
R/C
24
BYTE
23
PORTC, BIT7 PORTC, BIT6 PORTC, BIT5 PORTC, BIT4 PORTC, BIT3 PORTC, BIT2 PORTC, BIT1 PORTC, BIT0
PORTA, BIT0
PORTA, BIT4 PORTA, BIT3
20 19 14
1605-1/2 F16
1
4
5
3
22 21
V
IN
CAP
AGND2
DGND
REF
2
AGND1
BUSY
CS
2.2µF
0.1µF
0.1µF
5V
5V
8
1
3
2
4
2.2µF
33.2k 1%
200
1%
10µF
1µF
5V
+
+
+
USE FOR LTC1605-2
1/2 LT1630
–5V SUPPLY FOR LTC1605-2
Figure 16. 8-Channel, 16-Bit Data Acquisition System with Interface to the 68HC11
TYPICAL APPLICATIO S
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Page 19
19
LTC1605-1/LTC1605-2
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen­tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
G Package
28-Lead Plastic SSOP (0.209)
(LTC DWG # 05-08-1640)
Dimensions in inches (millimeters) unless otherwise noted.
PACKAGE DESCRIPTION
U
G28 SSOP 1098
0.13 – 0.22
(0.005 – 0.009)
0
° – 8°
0.55 – 0.95
(0.022 – 0.037)
5.20 – 5.38** (0.205 – 0.212)
7.65 – 7.90
(0.301 – 0.311)
12345678 9 10 11 12 1413
10.07 – 10.33* (0.397 – 0.407)
2526 22 21 20 19 181716 1523242728
1.73 – 1.99
(0.068 – 0.078)
0.05 – 0.21
(0.002 – 0.008)
0.65
(0.0256)
BSC
0.25 – 0.38
(0.010 – 0.015)
NOTE: DIMENSIONS ARE IN MILLIMETERS DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.152mm (0.006") PER SIDE DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.254mm (0.010") PER SIDE
*
**
N28 1098
0.255 ± 0.015* (6.477 ± 0.381)
1.370* (34.789)
MAX
3456
7
8
9
10 11 122113 14
151618
171920
22
23
2425
26
2271
28
0.020
(0.508)
MIN
0.125
(3.175)
MIN
0.130 ± 0.005
(3.302 ± 0.127)
0.065
(1.651)
TYP
0.045 – 0.065
(1.143 – 1.651)
0.018 ± 0.003
(0.457 ± 0.076)
0.005
(0.127)
MIN
0.100
(2.54)
BSC
0.009 – 0.015
(0.229 – 0.381)
0.300 – 0.325
(7.620 – 8.255)
0.325
+0.035 –0.015
+0.889 –0.381
8.255
()
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
N Package
28-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1510)
Page 20
20
LTC1605-1/LTC1605-2
LINEAR TECHNOLOGY CORPORATION 1999
160512f LT/TP 0999 4K • PRINTED IN THE USA
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
www.linear-tech.com
PART NUMBER DESCRIPTION COMMENTS
LT®1019-2.5 Precision Bandgap Reference 0.05% Max, 5ppm/°C Max LTC1274/LTC1277 Low Power 12-Bit, 100ksps ADCs 10mW Power Dissipation, Parallel/Byte Interface LTC1415 Single 5V, 12-Bit, 1.25Msps ADC 55mW Power Dissipation, 72dB SINAD LTC1419 Low Power 14-Bit, 800ksps ADC True 14-Bit Linearity, 81.5dB SINAD, 150mW Dissipation LT1460-2.5 Micropower Precision Series Reference 0.075% Max, 10ppm/°C Max, Only 130µA Supply Current LTC1594/LTC1598 Micropower 4-/8-Channel 12-Bit ADCs Serial I/O, 3V and 5V Versions LTC1604 16-Bit, 333ksps Sampling ADC ±2.5V Input, 90dB SINAD, 100dB THD LTC1605 Low Power 100ksps 16-Bit ADC Single 5V, ±10V Inputs
RELATED PARTS
TYPICAL APPLICATIO
U
R/C
BUSY
BYTE
ADC
DATA
MUX
CS
MUX
DATA
HI BYTE LO BYTE
DATA 0 DATA 1
HI BYTE LO BYTE
HI BYTE LO BYTE
CH0 CH1 CH2
1605-1/2 F17
Figure 17. This Is the Timing Relationship Between the Selected MUX Channel, Its Conversion Data and the ADC and MUX Control Signals When Using the Sample Program In Listing 1. The Conversion Process Is Latency Free: the Data Is Always Generated Based On the Currently Selected MUX Input
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