, LTC and LT are registered trademarks of Linear Technology Corporation.
LTBiCMOS is a trademark of Linear Technology Corporation
RE
S
O
U
S
DUESCRIPTIO
The LTC®1282 is a 6µs, 140ksps, sampling 12-bit A/D
converter that draws only 12mW from a single 3V or dual
±3V supply. This easy-to-use device comes complete with
1.14µ s sample-and-hold, precision reference and internally trimmed clock. Unipolar and bipolar conversion
modes provide flexibility for various applications. They are
built with LTBiCMOSTM switched capacitor technology.
The LTC1282 has a 25ppm/°C (max) internal reference
and converts 0V to 2.5V unipolar inputs from a single 3V
supply. With ±3V supplies its input range is ±1.25V with
two’s complement output format. Maximum DC specifications include ±0.5LSB INL, ±0.75LSB DNL and 25ppm/°C
full-scale drift over temperature. Outstanding AC performance includes 69dB S/(N + D) and 77dB THD at the
Nyquist input frequency of 70kHz.
The internal clock is trimmed for 6µs maximum conver-
sion time. The clock automatically synchronizes to each
sample command eliminating problems with asynchronous clock noise found in competitive devices. A high
speed parallel interface eases connections to FIFOs, DSPs
and microprocessors.
U
O
A
PPLICATITYPICAL
Single 3V Supply, 140ksps, 12-Bit Sampling A/D Converter
1.20V
V
REF
OUTPUT
10µF
+
8- OR 12-BIT
PARALLEL BUS
ANALOG INPUT
(0V TO 2.5V)
0.1µF
1
2
3
4
5
6
7
8
9
10
11
12
LTC1282
AIN
V
REF
AGND
D11(MSB)
D10
D9
D8
D7
D6
D5
D4
DGND
V
V
BUSY
RD
HBEN
NC
NC
D0/8
D1/9
D2/10
D3/11
24
DD
SS
CS
23
22
21
20
19
18
17
16
15
14
13
+
µP CONTROL
LINES
10µF
1282 TA01
Effective Bits and Signal-to-(Noise + Distortion)
3V
0.1µF
12
11
10
9
8
7
6
5
4
3
2
ENOBs (EFFECTIVE NUMBER OF BITS)
1
0
1k
vs Input Frequency
f
= 140kHz
SAMPLE
INPUT FREQUENCY (Hz)
10k
NYQUIST
FREQUENCY
100k
LTC1282 • TA02
74
68
62
56
S/(N + D) (dB)
50
1
Page 2
LTC1282
O
A
(Notes 1 and 2)
LUTEXI T
S
W
A
WUW
ARB
U
G
I
S
Supply Voltage (VDD).............................................. 12V
Negative Supply Voltage (VSS)................... –6V to GND
Total Supply Voltage (VDD to VSS) .......................... 12V
Analog Input Voltage
(Note 3) .............................. VSS – 0.3V to VDD + 0.3V
Digital Input Voltage (Note 4) ........... VSS – 0.3V to 12V
Digital Output Voltage
(Note 3) .............................. VSS – 0.3V to VDD + 0.3V
Power Dissipation............................................. 500mW
Specified Temperature Range (Note 14)..... 0°C to 70°C
Operating Temperature Range
LTC1282AC, LTC1282BC ......................... 0°C to 70°C
Storage Temperature Range ................ –65°C to 150°C
Lead Temperature (Soldering, 10 sec)................. 300°C
U
CO
VERTER
CCHARA TERIST
With Internal Reference (Notes 5 and 6)
ICS
WU
/
PACKAGE
A
IN
V
REF
AGND
D11 (MSB)
D10
D9
D8
D7
D6
D5
D4
DGND
N PACKAGE
24-LEAD PDIP
T
JMAX
T
JMAX
Consult factory for Industrial and Military grade parts. (Note 14)
O
RDER IFORATIO
TOP VIEW
1
2
3
4
5
6
7
8
9
10
11
12
24-LEAD PLASTIC SO WIDE
= 110°C, θJA = 100°C/W (N)
= 110°C, θJA = 130°C/W (SW)
VDD
24
V
23
BUSY
22
CS
21
RD
20
HBEN
19
NC
18
NC
17
D0/8
16
D1/9
15
D2/10
14
D3/11
13
SW PACKAGE
ORDER
PART NUMBER
SS
LTC1282ACN
LTC1282BCN
LTC1282ACSW
LTC1282BCSW
U
LTC1282ALTC1282B
PARAMETERCONDITIONSMINTYPMAXMINTYPMAXUNITS
Resolution (No Missing Codes)●1212Bits
Integral Linearity Error(Note 7)±1/2±1LSB
Commercial
Military
Differential Linearity ErrorCommercial●±3/4±1LSB
Military
Offset Error(Note 8)±3±4LSB
Gain Error±10±15LSB
Gain Error TempcoI
Power Supply Rejection(Note 9) VDD ±10%±0.3±0.3LSB
W
U
IC
DY
A
SYMBOLPARAMETERCONDITIONSMINTYPMAXUNITS
S/(N + D)Signal-to-Noise Plus Distortion Ratio10kHz/70kHz Input Signal71/69dB
THDTotal Harmonic Distortion10kHz/70kHz Input Signal, Up to 5th Harmonic–82/–77dB
IMDIntermodulation Distortionf
ACCURACY
Peak Harmonic or Spurious Noise10kHz/70kHz Input Signal–82/–77dB
Full Power Bandwidth4MHz
Full Linear Bandwidth (S/(N + D) ≥ 68dB)200kHz
High Level Input VoltageV
Low Level Input VoltageVDD = 2.7V●0.45V
Digital Input CurrentVIN = 0V to V
Digital Input Capacitance5pF
High Level Output VoltageVDD = 2.7V
Low Level Output VoltageVDD = 2.7V
High Z Output Leakage D11-D0/8V
High Z Output Capacitance D11-D0/8CS High (Note 12 )●15pF
Output Source CurrentV
Output Sink CurrentV
Maximum Sampling Frequency Commercial (Note 13)●140kHz
Conversion Time Commercial●6.0µs
CS to RD Setup Time●0ns
RD↓ to BUSY↓ DelayCL = 50pF140200ns
Data Access Time After RD↓CL = 20pF (Note 13)100180ns
RD Pulse Width(Note 13)●t
CS to RD Hold Time(Note 13)●0ns
Data Setup Time After BUSY↑(Note 13)6085ns
Bus Relinquish Time(Note 13)4060120ns
HBEN to RD Setup Time(Note 13)●0ns
HBEN to RD Hold Time(Note 13)●0ns
Delay Between RD Operations●40ns
Delay Between Conversions Commercial (Note 13)●1140450ns
Aperture Delay of Sample-and-Hold30ns
(Note 5)
LTC1282A/LTC1282B
Military (Note 13)●120kHz
Military●6.5µs
Commercial
Military●260ns
Commercial
Military●220ns
CL = 100pF (Note 13)110200ns
Commercial
Military●260ns
Commercial
Military●120ns
Commercial
Military●40150ns
Military (Note 13)●1500ns
●230ns
●200ns
●240ns
3
●110ns
●40130ns
ns
The
● indicates specifications which apply over the full operating
temperature range; all other limits and typicals T
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2: All voltage values are with respect to ground with DGND and
AGND wired together (unless otherwise noted).
Note 3: When these pin voltages are taken below V
will be clamped by internal diodes. This product can handle input currents
greater than 60mA below VSS or above VDD without latchup.
Note 4: When these pin voltages are taken below V
by internal diodes. This product can handle input currents greater than
60mA below VSS without latchup. These pins are not clamped to VDD.
Note 5: V
mode, f
Note 6: Linearity, offset and full-scale specifications apply for unipolar and
bipolar modes.
Note 7: Integral nonlinearity is defined as the deviation of a code from a
straight line passing through the actual endpoints of the transfer curve.
The deviation is measured from the center of the quantization band.
= 3V, VSS = 0V for unipolar mode and VSS = –3V for bipolar
Note 8: Bipolar offset is the different voltage measured from –0.5LSB
when the output code flickers between 0000 0000 0000 and 1111 1111
1111.
Note 9: Full-scale change when V
–3V (Bipolar Mode).
Note 10: Full-scale change when VDD = 3V.
Note 11: The LTC1282 can perform unipolar and bipolar conversions.
When V
mode with input voltage of 0V to 2.5V. When VSS is taken negative (i.e. V
≤ –2.5V), the ADC will convert in bipolar mode with an input voltage of
±1.25V. AIN must not exceed VDD or fall below VSS by more than 50mV for
specified accuracy.
Note 12: Guaranteed by design, not subject to test.
Note 13: Recommended operating conditions.
Note 14: Commercial grade parts are designed to operate over the
temperature range of –40°C to 85°C but are neither tested nor guaranteed
beyond 0°C to 70°C. Industrial grade parts specified and tested over
–40°C to 85°C are available on special request. Consult factory.
is grounded (i.e. –0.1V ≤ VSS), the ADC will convert in unipolar
SS
= 0V (Unipolar Mode) or
SS
SS
Page 5
W
U
TI I G CHARACTERISTICS
LTC1282
(Note 5)
Slow Memory Mode, Parallel Read Timing Diagram
CS
t
1
t
5
RD
t
2
t
CONV
BUSY
t
7
NEW DATA
DB11 TO DB0
DATA
HOLD
t
3
t
12
OLD DATA
DB11 TO DB0
t
6
TRACK
Slow Memory Mode, Two Byte Read Timing Diagram
HBEN
t
8
CS
t
1
RD
t
BUSY
DATA
HOLD
2
t
3
t
12
t
CONV
OLD DATA
DB7 TO DB0
ROM Mode, Parallel Read Timing Diagram
CS
t
1
t
10
t
11
BUSY
DATA
HOLD
t
5
t
7
TRACK
t
9
t
6
LTC1282 • TC01
NEW DATA
DB7 TO DB0
RD
t
1
t
t
2
t
3
OLD DATA
DB11 TO DB0
t
12
t
8
t
1
t
10
t
11
4
t
CONV
t
3
t
5
t
7
t
4
NEW DATA
DB11 TO DB8
t
1
t
11
t
2
t
3
t
12
t
9
t
5
t
10
t
7
t
5
t
4
t
CONV
NEW DATA
DB11 TO DB0
t
12
t
7
LTC1282 • TC02
TRACK
HBEN
BUSY
DATA
HOLD
TRACK
RD
LTC1282 • TC03
ROM Mode, Two Byte Read Timing Diagram
t
8
t
9
t
8
CS
t
1
t
4
t
2
t
3
OLD DATA
DB7 TO DB0
t
12
t
t
5
t
CONV
7
t
1
t
4
t
11
t
3
NEW DATA
DB11 TO DB8
t
9
t
5
t
7
t
8
t
1
t
10
t
4
t
2
t
3
t
9
t
5
t
7
NEW DATA
DB7 TO DB0
t
12
LTC1282 • TC04
5
Page 6
LTC1282
TEMPERATURE (°C)
–50
0
SUPPLY CURRENT (mA)
1
3
4
5
10
7
0
50
75
LTC1282 • TPC03
2
8
9
6
–25
25
100
125
f
SAMPLE
= 160kHz
V
DD
= 3V
FREQUENCY (Hz)
0
–120
AMPLITUDE (dB)
–100
–80
–60
–40
20k40k
60k
80k
LTC1282 • TPC09
–20
0
10k30k50k
70k
f
SAMPLE
= 160kHz
f
IN1
= 19.0kHz
f
IN2
= 20.6kHz
V
DD
= 3V
UNIPOLAR
LPER
Integral Nonlinearity
1
F
O
R
ATYPICA
UW
CCHARA TERIST
E
C
Differential Nonlinearity
1
ICS
Supply Current (IDD)
vs Temperature
0.5
0
–0.5
INTEGRAL NONLINEARITY ERROR (LSBs)
–1
0
512 1024 1536 2048
2560 3072 3584 4096
CODE
Supply Current (IDD)
vs Supply Voltage
20
f
= 160kHz
SAMPLE
18
= 25°C
T
A
16
14
12
10
8
6
SUPPLY CURRENT (mA)
4
2
0
2.5
3
SINGLE
SUPPLY
4
3.5
SUPPLY VOLTAGE (V)
DUAL
SUPPLIES
LTC1282 • TPC01
4.5
LTC1282 • TPC04
0.5
0
–0.5
DIFFERENTIAL NONLINEARITY ERROR (LSBs)
–1
0
512 1024 1536 2048
ENOBs and S/(N + D)
vs Input Frequency
12
11
10
9
8
7
6
5
4
3
2
EFFECTIVE NUMBER OF BITS (ENOBs)
1
0
5
1k100k1M10M
UNIPOLAR
(0V – 2.5V INPUT)
f
= 160kHz
SAMPLE
= ±2.7V BIPOLAR
V
S
= 3V UNIPOLAR
V
S
10k
INPUT FREQUENCY (Hz)
2560 3072 3584 4096
CODE
BIPOLAR
(±1.25V
INPUT)
LTC1282 • TPC05
LTC1282 • TPC02
74
68
62
56
50
Distortion vs Input Frequency
(Unipolar)
S/(N + D) (dB)
0
f
= 160kHz
SAMPLE
–10
3V SUPPLY
UNIPOLAR
–20
–30
–40
–50
–60
–70
–80
–90
AMPLITUDE (dB BELOW THE FUNDAMENTAL)
–100
1k100k1M10M
10k
INPUT FREQUENCY (Hz)
THD
3rd HARMONIC
2nd HARMONIC
LTC1282 • TPC06
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
AMPLITUDE (dB BELOW THE FUNDAMENTAL)
–100
1k100k1M10M
6
Distortion vs Input Frequency
(Bipolar)
f
= 140kHz
SAMPLE
±3V SUPPLIES
BIPOLAR
THD
10k
INPUT FREQUENCY (Hz)
2nd HARMONIC
3rd HARMONIC
LTC1282 • TPC07
Power Supply Feedthrough
vs Ripple Frequency
0
f
= 140kHz
SAMPLE
–10
(V
V
DD
–20
–30
–40
–50
–60
AMPLITUDE OF
–70
–80
POWER SUPPLY FEEDTHROUGH (dB)
–90
–100
1k
RIPPLE
(V
V
SS
RIPPLE
DGND (V
RIPPLE
10k100k1M
RIPPLE FREQUENCY (Hz)
Intermodulation Distortion Plot
= 2.5mV)
= 2.5mV)
= 250mV)
LTC1282 • TPC08
Page 7
LPER
INPUT FREQUENCY (Hz)
–80
AMPLITUDE (dB)
–60
–40
–20
0
10010k100k1M
LTC1282 • TPC12
–100
1k
–90
–70
–50
–30
–10
f
SAMPLE
= 160kHz
V
DD
= 3V
UNIPOLAR
TEMPERATURE (°C)
–50
0
MAGNITUDE OF OFFSET VOLTAGE CHANGE (LSBs)
2
5
0
50
75
LTC1282 • TPC15
1
4
3
–25
25
100
125
f
SAMPLE
= 140kHz
V
DD
= 2.7V
TEMPERATURE (°C)
–50
0
MAGNITUDE OF
DIFFERENTIAL NONLINEARITY CHANGE (LSBs)
0.2
0.5
0
50
75
LTC1282 • TPC18
0.1
0.4
0.3
–25
25
100
125
f
SAMPLE
= 140kHz
V
DD
= 2.7V
F
O
R
ATYPICA
UW
CCHARA TERIST
E
C
LTC1282
ICS
S/(N + D) vs Input Frequency and
Amplitude (Unipolar, VDD = 3V)
80
VIN = 0dB
70
60
VIN = –20dB
50
40
30
20
VIN = –60dB
10
SIGNAL/(NOISE + DISTORTION) (dB)
0
1k100k1M10M
10k
INPUT FREQUENCY (Hz)
f
SAMPLE
UNIPOLAR
Reference Voltage
vs Load Current
1.220
VDD = 3V
1.215
1.210
1.205
1.200
1.195
1.190
1.185
REFERENCE VOLTAGE (V)
1.180
1.175
1.170
–5
–4
–3
LOAD CURRENT (mA)
–2
–1
Change in Gain Error
vs Temperature
5
f
= 140kHz
SAMPLE
= 2.7V
V
DD
4
= 160kHz
LTC1282 • TPC10
0
LTC1282 • TPC13
S/(N + D) vs Input Frequency and
Amplitude (Bipolar, ±3V Supplies)
80
VIN = 0dB
70
60
VIN = –20dB
50
40
30
20
VIN = –60dB
10
SIGNAL/(NOISE + DISTORTION) (dB)
0
1k100k1M10M
10k
INPUT FREQUENCY (Hz)
f
SAMPLE
= 160kHz
LTC1282 • TPC10
S/(N +D) vs Input Frequency vs
Source Resistance (Bipolar)
80
70
60
50
40
30
20
VDD = 3V
10
SIGNAL/(NOISE + DISTORTION) (dB)
V
BIPOLAR
0
1
1k100k1M10M
RS = 1k
= –3V
SS
10k
INPUT FREQUENCY (Hz)
RS = 50Ω
RS = 500Ω
RS = 5k
LTC1282 • TPC14
Change in Integral Nonlinearity
(INL) vs Temperature
0.5
f
= 140kHz
SAMPLE
= 2.7V
V
DD
0.4
Spurious Free Dynamic Range
vs Input Frequency
Change in Offset Voltage
vs Temperature
Change in Differential
Nonlinearity (DNL) vs Temperature
3
2
1
MAGNITUDE OF GAIN ERROR CHANGE (LSBs)
0
–50
–25
25
0
TEMPERATURE (°C)
50
75
100
LTC1282 • TPC16
125
0.3
0.2
MAGNITUDE OF
0.1
INTEGRAL NONLINEARITY CHANGE (LSBs)
0
–50
0
–25
TEMPERATURE (°C)
50
25
75
100
LTC1282 • TPC17
125
7
Page 8
LTC1282
SUPPLY VOLTAGE (V)
2
0
MAGNITUDE OF GAIN ERROR CHANGE (LSBs)
1
2
3
4
5
2.5
33.54
LTC1282 • TPC20
4.55
f
SAMPLE
= 140kHz
LPER
F
O
R
ATYPICA
UW
CCHARA TERIST
E
C
ICS
Change in Offset Voltage
vs Supply Voltage
1
f
= 140kHz
SAMPLE
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
MAGNITUDE OF OFFSET VOLTAGE CHANGE (LSBs)
2
2.5
3.54
3
SUPPLY VOLTAGE (V)
4.5
LTC1282 • TPC19
Change in Integral Nonlinearity
(INL) vs Supply Current
0.5
f
= 140kHz
SAMPLE
0.4
0.3
Change in Gain Error
vs Supply Voltage
5
Change in Differential Nonlinearity
(DNL) vs Supply Current
0.5
f
= 140kHz
SAMPLE
0.4
0.3
0.2
MAGNITUDE OF
0.1
INTEGRAL NONLINEARITY CHANGE (LSBs)
0
2
33.54
2.5
SUPPLY VOLTAGE (V)
4.55
LTC1282 • TPC21
0.2
MAGNITUDE OF
0.1
DIFFERENTIAL NONLINEARITY CHANGE (LSBs)
0
2
33.54
2.5
SUPPLY VOLTAGE (V)
4.55
LTC1282 • TPC22
8
Page 9
UUU
PI FU CTIO S
A
(Pin 1): Analog Input. 0V to 2.5V (Unipolar), ±1.25V
IN
(Bipolar).
V
(Pin 2): +1.20V Reference Output. Bypass to
REF
AGND (10µF tantalum in parallel with 0.1µF ceramic).
AGND (Pin 3): Analog Ground.
D11-D4 (Pins 4 to 11): Three-State Data Outputs. D11
is the Most Significant Bit.
DGND (Pin 12): Digital Ground.
D3/11-D0/8 (Pins 13 to 16): Three-State Data Outputs.
NC (Pins 17 and 18): No Connection.
HBEN (Pin 19): High Byte Enable Input. This pin is used
to multiplex the internal 12-bit conversion result into
the lower bit outputs (D7 and D0/8). See Table 1. HBEN
also disables conversion start when HIGH.
LTC1282
RD (Pin 20): READ Input. This active low signal starts a
conversion when CS and HBEN are low. RD also enables
the output drivers when CS is low.
CS (Pin 21): The CHIP SELECT Input must be low for the
ADC to recognize RD and HBEN inputs.
BUSY (Pin 22): The BUSY Output shows the converter
status. It is low when a conversion is in progress.
VSS (Pin 23): Bipolar Mode — Negative Supply, –3V.
Bypass to AGND with 0.1µF ceramic.
Unipolar Mode — Tie to DGND.
V
(Pin 24): Positive Supply, 3V. Bypass to AGND (10µ F
MNEMONIC*D11D10D9D8D7D6D5D4D3/11D2/10D1/9D0/8
HBEN = LOWDB11DB10DB9DB8DB7DB6DB5DB4DB3DB2DB1DB0
HBEN = HIGHDB11DB10DB9DB8LOWLOWLOWLOWDB11DB10DB9DB8
*D11...D0/8 are the ADC data output pins.
DB11...DB0 are the 12-bit conversion results, DB11 is the MSB.
TEST CIRCUITS
Load Circuits for Output Float Delay
5V
3k
DBN
3k10pF10pF
DGND
(A) V
TO Hi-Z(B) VOL TO Hi-Z
OH
DGND
1282 TC02
DBN
Load Circuits for Access Time
3kC
DGND
(A) Hi-Z TO V
AND VOL TO VOH, (t6)
L
, (t3)
OH
DBN
5V
(B) Hi-Z TO V
AND V
OH
3k
C
L
DGND
, (t3)
OL
TO VOL, (t6)
1282 TC01
DBN
9
Page 10
LTC1282
UUW
FU TIO AL BLOCK DIAGRA
C
SAMPLE
A
IN
SAMPLE
HOLD
SAMPLE
COMPARATOR
–
+
V
V
DD
(–3V FOR BIPOLAR MODE,
SS
AGND FOR UNIPOLAR MODE)
12-BIT
CAPACITIVE
DAC
INTERNAL
DGNDAGND
WU
CLOCK
U
PPLICATI
A
V
REF(OUT)
1.2V
REFERENCE
U
O
S
IFORATIO
CONVERSION DETAILS
The LTC1282 uses a successive approximation and an
internal sample-and-hold circuitry to convert an analog
signal to a 12-bit parallel or 2-byte output. The ADC is
complete with a precision reference and an internal clock.
The control logic provides easy interface to microprocessors and DSPs. Please refer to the Digital Interface section
for the data format.
Conversion start is controlled by the CS, RD and HBEN
inputs. At the start of conversion the successive approximation register (SAR) is reset and the three-state data
outputs are enabled. Once a conversion cycle has begun
it cannot be restarted.
During conversion, the internal 12-bit capacitive DAC
output is sequenced by the SAR from the most significant
bit (MSB) to the least significant bit (LSB). Referring to
Figure 1, the AIN input connects to the sample-and-hold
capacitor during the sample phase, and the comparator
offset is nulled by the feedback switch. In this sample
phase, a minimum delay of 1.14µs will provide enough
time for the sample-and-hold capacitor to acquire the
analog signal. During the convert phase, the comparator
12
SUCCESSIVE
APPROXIMATION
REGISTER
12
OUTPUT
LATCHES
CONTROL
LOGIC
D11
•
•
•
D0/8
BUSY
CS
RD
HBEN
LTC1282 • FBD
feedback switch opens, putting the comparator into the
compare mode. The input switch switches C
SAMPLE
ground, injecting the analog input charge to the summing
junction. This input charge is successively compared with
the binary-weighted charges supplied by the capacitive
DAC. Bit decisions are made by the high speed comparator.
At the end of a conversion, the DAC output balances the A
input charge. The SAR contents (a 12-bit data word) which
represent the AIN are loaded into the 12-bit latch.
SAMPLE
C
SAMPLE
A
IN
HOLD
SAMPLE
C
DAC
V
DAC
DAC
Figure 1. AIN Input
SI
–
+
COMPARATOR
LTC1282 • F01
S
A
R
12-BIT
LATCH
to
IN
10
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LTC1282
INPUT FREQUENCY (Hz)
2
EFFECTIVE NUMBER OF BITS (ENOBs)
4
6
8
10
1k100k1M10M
LTC1282 • F03
0
10k
12
1
3
5
7
9
11
50
62
74
56
68
S/(N + D) (dB)
f
SAMPLE
= 160kHz
V
S
= ±2.7V BIPOLAR
BIPOLAR
(±1.25V
INPUT)
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DYNAMIC PERFORMANCE
The LTC1282 has exceptionally high speed sampling capability. FFT (Fast Fourier Transform) test techniques are
used to characterize the ADC’s frequency response, distortion and noise at the rated throughput. By applying a low
distortion sine wave and analyzing the digital output using
an FFT algorithm, the ADC’s spectral content can be
examined for frequencies outside the fundamental. Figure
2 shows a typical LTC1282 FFT plot.
Signal-to-(Noise + Distortion) Ratio
The Signal-to-Noise plus Distortion Ratio [S/(N + D)] is the
ratio between the RMS amplitude of the fundamental input
frequency to the RMS amplitude of all other frequency
components at the A/D output. The output is band limited
to frequencies from above DC and below half the sampling
frequency. Figure 2 shows a typical LTC1282 FFT plot.
0
–20
f
= 160kHz
SAMPLE
= 3V
V
DD
UNIPOLAR
Figure 3. ENOBs and S/(N + D) vs Input Frequency
Total Harmonic Distortion
Total Harmonic Distortion (THD) is the ratio of the RMS
sum of all harmonics of the input signal to the fundamental
itself. The out-of-band harmonics alias into the frequency
band between DC and half the sampling frequency. THD is
expressed as:
–40
–60
AMPLITUDE (dB)
–80
–100
–120
1030
0
Figure 2. LTC1282 Nonaveraged, 1024 Point FFT Plot
Effective Number of Bits
The Effective Number of Bits (ENOBs) is a measurement of
the resolution of an ADC and is directly related to
S/(N + D) by the equation:
N = [S/(N + D) – 1.76]/6.02
where N is the Effective Number of Bits of resolution and
S/(N + D) is expressed in dB. At the maximum sampling
rate of 140kHz the LTC1282 maintains 11.3 ENOBs at
70kHz input frequency. Refer to Figure 3.
2040
FREQUENCY (kHz)
60
50
70
LT1282 • F02
2
2
THD = 20log
√V
2
+ V
3
+ V
V
1
2
4
... + V
2
N
where V1 is the RMS amplitude of the fundamental frequency and V2 through VN are the amplitudes of the
second through Nth harmonics. The typical THD specification in the Dynamic Accuracy table includes the 2nd
80
through 5th harmonics. With a 70kHz input signal, the
LTC1282 has a typical –82dB THD as shown in Figure 4.
0
f
= 140kHz
SAMPLE
–10
±3V SUPPLIES
BIPOLAR
–20
–30
–40
–50
–60
–70
–80
–90
AMPLITUDE (dB BELOW THE FUNDAMENTAL)
–100
1k100k1M10M
THD
10k
INPUT FREQUENCY (Hz)
3rd HARMONIC
2nd HARMONIC
LTC1282 • F04
Figure 4. Distortion vs Input Frequency (Bipolar)
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Intermodulation Distortion
If the ADC input signal consists of more than one spectral
component, the ADC transfer function nonlinearity can
produce intermodulation distortion (IMD) in addition to
THD. IMD is the change in one sinusoidal input caused by
the presence of another sinusoidal input at a different
frequency.
If two pure sine waves of frequencies fa and fb are applied
to the ADC input, nonlinearities in the ADC transfer function can create distortion products at sum and difference
frequencies of mfa ± nfb, where m and n = 0, 1, 2, 3, etc.
For example, the 2nd order IMD terms include (fa + fb) and
(fa – fb) while the 3rd order IMD terms include (2fa + fb),
(2fa – fb), (fa + 2fb), and (fa – 2fb) if the two input sine
waves are equal in magnitude, the value (in decibels) of the
2nd order. IMD products can be expressed by the following formula:
IMD (fa ± fb) = 20log
Amplitude at (fa ± fb)
Amplitude at fa
Figure 5 shows the IMD performance at a 20kHz input.
0
–20
–40
–60
–80
AMPLITUDE (dB)
f
SAMPLE
= 19.0kHz
f
IN1
= 20.6kHz
f
IN2
= 3V
V
DD
UNIPOLAR
= 160kHz
Full Power and Full Linear Bandwidth
The full power bandwidth is that input frequency at which
the amplitude of the reconstructed fundamental is reduced by 3dB for a full-scale input signal.
The full linear bandwidth is the input frequency at which
the S/(N + D) has dropped to 68dB (11 effective bits). The
LTC1282 has been designed to optimize input bandwidth,
allowing the ADC to undersample input signals with frequencies above the converter’s Nyquist Frequency.
Driving the Analog Input
The analog input of the LTC1282 is easy to drive. It draws
only one small current spike while charging the sampleand-hold capacitor at the end of conversion. During conversion the analog input draws no current. The only
requirement is that the amplifier driving the analog input
must settle after the small current spike before the next
conversion starts. Any op amp that settles in 1.14µs to
small current transients will allow maximum speed operation. If slower op amps are used, more settling time can be
provided by increasing the time between conversions.
Suitable devices capable of driving the ADC’s AIN input
include the LT®1190/LT1191, LT1007, LT1220, LT1223
and LT1224 op amps.
The analog input tolerates source resistance very well.
Here again, the only requirement is that the analog input
must settle before the next conversion starts. For larger
source resistance, full accuracy can be obtained if more
time is allowed between conversions.
–100
–120
0
Figure 5. Intermodulation Distortion Plot
2040
103050
FREQUENCY (kHz)
60
70
LTC1282 • F05
80
Peak Harmonic or Spurious Noise
The peak harmonic or spurious noise is the largest spectral component excluding the input signal and DC. This
value is expressed in decibels relative to the RMS value of
a full-scale input signal.
12
Internal Reference
The LTC1282 has an on-chip, temperature compensated,
curvature corrected, bandgap reference which is factory
trimmed to 1.20V. It is internally connected to the DAC and
is available at pin 2 to provide up to 0.3mA current to an
external load.
For minimum code transition noise the reference output
should be decoupled with a capacitor to filter wideband
noise from the reference (10µ F tantalum in parallel with a
0.1µ F ceramic).
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LTC1282
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Overdriving the Internal Reference
The V
pin can be driven above its normal value with a
REF
DAC or other means to provide input span adjustment.
Figure 6 shows an LT1006 op amp driving the reference
pin. The V
pin must be driven to at least 1.25V to
REF
prevent conflict with the internal reference. The reference
should be driven to no more than 1.44V in unipolar mode
or 2.88V for bipolar mode to keep the input span within the
single 3V or ±3V supplies.
INPUT RANGE
±1.033V
REF(OUT)
Figure 6. Driving the V
+
LT1006
–
V
≥ 1.25V
REF(OUT)
3Ω
10µF
with the LT1006 Op Amp
REF
A
IN
LTC1282
V
REF
AGND
LTC1282 • F06
V
3V
DD
–3V
V
SS
natural binary with 1LSB = FS/4096 = 2.5V/4096 = 0.61mV.
Figure 9 shows the input/output transfer characteristics
for the LTC1282 in bipolar operation. The full scale for
LTC1282 in bipolar mode is still 2.5V and 1LSB = 0.61mV.
= 2.5V
FS
111...111
111...110
111...101
111...100
OUTPUT CODE
000...011
000...010
000...001
000...000
Figure 8. LTC1282 Unipolar Transfer Characteristic
1LSB = FS/4096
UNIPOLAR
ZERO
0V
1
LSB
INPUT VOLTAGE (V)
FS – 1LSB
LTC1282 • F8
Figure 7 shows a typical reference, the LT1019A-2.5
connected to the LTC1282 operating in bipolar mode. This
will provide an improved drift (due to the 5ppm/°C of the
LT1019A-2.5) and a ±2.604V full scale.
INPUT RANGE
±2.60V
5V
V
IN
V
OUT
LT1019A-2.5
GND
V
3V
DD
3Ω
A
IN
LTC1282
V
REF
+
10µF
AGND
LTC1282 • F07
–3V
V
SS
Figure 7. Supplying a 2.5V Reference Voltage
to the LTC1282 with the LT1019A-2.5
UNIPOLAR/BIPOLAR OPERATION AND ADJUSTMENT
Figure 8 shows the ideal input/output characteristics for
the LTC1282. The code transitions occur midway between successive integer LSB values (i.e., 0.5LSB,
1.5LSBs, 2.5LSBs, FS – 1.5LSBs). The output code is
011...111
011...110
000...001
000...000
111...111
111...110
OUTPUT CODE
100...010
100...001
100...000
BIPOLAR
ZERO
FS = 2.5V
1LSB = FS/4096
–1
0V
1
LSB
INPUT VOLTAGE (V)
LSB
FS/2 – 1LSB–FS/2
LTC1282 • F09
Figure 9. LTC1282 Bipolar Transfer Characteristic
Unipolar Offset and Full-Scale Adjustment
In applications where absolute accuracy is important,
offset and full-scale errors can be adjusted to zero. Figure
10 shows the extra components required for full-scale
error adjustment. If both offset and full-scale adjustments are needed, the circuit in Figure 11 can be used.
Offset should be adjusted before full scale. To adjust
13
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LTC1282
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offset, apply 0.305mV (i.e., 0.5LSB) at V1 and adjust the
op amp offset voltage until the LTC1282 output code
flickers between 0000 0000 0000 and 0000 0000 0001.
For zero full-scale error, apply an analog input of 2.49909V
(i.e., FS – 1.5
LSBs or last code transition) at the input and
adjust the full-scale trim until the LTC1282 output code
flickers between 1111 1111 1110 and 1111 1111 1111.
R1
50Ω
V
1
R2
10k
ADDITIONAL PINS OMITTED FOR CLARITY
±20LSB TRIM RANGE
Figure 10. Full-Scale Adjust Circuit
R1
ANALOG
INPUT
0V TO 2.5V
10k
R2
10k
10k
5V
R9
20Ω
Figure 11. Unipolar Offset and Full-Scale Adjust Circuit
R5
10k
+
–
+
–
A1
FULL-SCALE
R4
100Ω
ADJUST
R4
100k
R3
100k
R6
400Ω
R5
4.3k
FULL-SCALE
ADJUST
R7
100k
5V
A
IN
LTC1282
AGND
LTC1282 • F10
R8
10k
OFFSET
ADJUST
A
IN
LTC1282
LTC1282 • F11
ANALOG
INPUT
±1.25V
R1
10k
R2
10k
+
A
5V
R8
20k
OFFSET
ADJUST
IN
LTC1282
LTC1282 • F12
–
R4
100k
R5
4.3k
FULL-SCALE
ADJUST
R3
R7
100k
100k
R6
200Ω
–5V
Figure 12. Bipolar Offset and Full-Scale Adjust Circuit
error adjustment is achieved by trimming the offset adjustment of Figure 12 while the input voltage is 0.5LSB
below ground. This is done by applying an input voltage of
–0.305mV (– 0.5LSB for LTC1282) to the input in Figure
12 and adjusting R8 until the ADC output code flickers
between 0000 0000 0000 and 1111 1111 1111. For fullscale adjustment, an input voltage of 1.24909V (FS –
1.5LSBs for LTC1282) is applied to the input and R5 is
adjusted until the output code flickers between 0111 1111
1110 and 0111 1111 1111.
BOARD LAYOUT AND BYPASSING
The LTC1282 is easy to use. To obtain the best performance from the device, a printed circuit board is recommended. Layout for the printed circuit board should ensure that digital and analog signal lines are separated as
much as possible. In particular, care should be taken not
to run any digital track alongside an analog signal track or
underneath the ADC. The analog input should be screened
by AGND.
Bipolar Offset and Full-Scale Adjustment
Bipolar offset and full-scale errors are adjusted in a
similar fashion to the unipolar case. Figure 10 shows the
extra components required for full-scale error adjustment. If both offset and full-scale adjustments are needed,
the circuit in Figure 12 can be used. Again, bipolar offset
must be adjusted before full-scale error. Bipolar offset
14
High quality tantalum and ceramic bypass capacitors
should be used at the VDD and V
pins as shown in Figure
REF
13. In bipolar mode, a 0.1µF ceramic provides adequate
bypassing for the VSS pin. The capacitors must be located
as close to the pins as possible. The traces connecting the
pins and the bypass capacitors must be kept short and
should be made as wide as possible.
Page 15
LTC1282
LTC1282
3V ADC
3V
LTC1282 • F14
ADC OUTPUTS
0V TO 3V
5V
ADC INPUTS
0V TO 5V
TTL
INPUT
LEVELS
CMOS
OUTPUT
LEVELS
5V
LOGIC
LTC ESD
CLAMP
PPLICATI
A
Noise:
Input signal leads to AIN and signal return leads
U
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IFORATIO
1
ANALOG
INPUT
CIRCUITRY
+
–
WU
A
IN
AGNDV
322412
ANALOG GROUND PLANE
Figure 13. Power Supply Grounding Practice
U
LTC1282
REF
0.1µF
from AGND (Pin 3) should be kept as short as possible to
minimize input noise coupling. In applications where this
is not possible, a shielded cable between source and ADC
is recommended. Also, since any potential difference in
grounds between the signal source and ADC appears as
an error voltage in series with the input signal, attention
should be paid to reducing the ground circuit impedances
as much as possible.
DIGITAL
SYSTEM
VDDDGND
10µF10µF
0.1µF
GROUND CONNECTION
TO DIGITAL CIRCUITRY
LTC1282 • F13
DIGITAL INTERFACE
The ADC is designed to interface with microprocessors as
a memory mapped device. The CS and RD control inputs
are common to all peripheral memory interfacing. The
HBEN input serves as a data byte select for 8-bit processors and is normally either connected to the microprocessor address bus or grounded.
Connecting to 5V Logic Systems
A single point analog ground separate from the logic
system ground should be established with an analog
ground plane at pin 3 (AGND) or as close as possible to the
ADC, as shown in Figure 13. Pin 12 ( DGND) and all other
analog grounds should be connected to this single analog
ground point. No other digital grounds should be connected to this analog ground point. Low impedance analog
and digital power supply common returns are essential to
low noise operation of the ADC and the foil width for these
tracks should be as wide as possible.
In applications where the ADC data outputs and control
signals are connected to a continuously active microprocessor bus, it is possible to get errors in conversion
results. These errors are due to feedthrough from the
microprocessor to the successive approximation comparator. The problem can be eliminated by forcing the
microprocessor into a WAIT state during conversion or by
using three-state buffers to isolate the ADC data bus.
The LTC1282 interfaces well to 5V logic because the ESD
clamps on the inputs do not clamp to the positive supply
(see Figure 14). Inputs of 0V to 5V do not bother the ADC
at all. In addition, the 0V to 3V outputs of the 3V ADC are
more than adequate to meet TTL input levels in the 5V
logic. (5V logic with CMOS input levels requires a level
shift.)
The LTC1282 has an internal clock that eliminates the need
for synchronization between the external clock and the CS
and RD signals found in other ADCs. The internal clock is
factory trimmed to achieve a typical conversion time of
5.5µs, and a maximum conversion time over the full
operating temperature range of 6.0µ s. No external adjustments are required and, with the guaranteed maximum
acquisition time of 1.14µs, throughput performance of
140ksps is assured.
Timing and Control
Conversion start and data read operations are controlled
by three digital inputs: HBEN, CS and RD. Figure 15 shows
the logic structure associated with these inputs. The three
signals are internally gated so that a logic “0” is required
on all three inputs to initiate a conversion. Once initiated it
cannot be restarted until the conversion is complete.
Converter status is indicated by the BUSY output, and this
is low while conversion is in progress.
HBEN
RD
LTC1282
19
21
CS
20
FLIP
FLOP
CLEAR
BUSY
QD
CONVERSION
START (RISING
EDGE TRIGGER)
initiates a conversion and data is read when conversion is
complete. The second is the ROM Mode which does not
require microprocessor WAIT states. A READ operation
brings CS and RD low which initiates a conversion and
reads the previous conversion result.
Data Format
The output format can be either a complete parallel load for
16-bit microprocessors or a two byte load for 8-bit microprocessors. Data is always right justified (i.e., LSB is the
most right-hand bit in a 16-bit word). For a two byte read,
only data outputs D7...D0/8 are used. Byte selection is
governed by the HBEN input which controls an internal
digital multiplexer. This multiplexes the 12-bits of conversion data onto the lower D7...D0/8 outputs (4MSBs or
8MSBs) where it can be read in two read cycles. The
4MSBs always appear on D11...D8 whenever the threestate output drivers are turned on.
Slow Memory Mode, Parallel Read (HBEN = LOW)
Figure 16 and Table 2 show the timing diagram and data
bus status for Slow Memory Mode, Parallel Read. CS and
RD going low trigger a conversion and the ADC acknowledges by taking BUSY low. Data from the previous conversion appears on the three-state data outputs. BUSY returns high at the end of conversion when the output
latches have been updated and the conversion result is
placed on data outputs D11...D0/8.
ACTIVE HIGH
ACTIVE HIGH
D11....D0/8 ARE THE ADC DATA OUTPUT PINS
*
DB11....DB0 ARE THE 12-BIT CONVERSION RESULTS
Figure 15. Internal Logic for Control Inputs CS, RD and HBEN
ENABLE THREE-STATE OUTPUTS
D11....D0/8 = DB11....DB0
ENABLE THREE-STATE OUTPUTS
D11....D8 = DB11....DB8
D7....D4 = LOW
D3/11....D0/8 = DB11....DB8
LTC1282 • F15
There are two modes of operation as outlined by the timing
diagrams of Figures 16 to 19. Slow Memory Mode is
designed for microprocessors which can be driven into a
WAIT state. A READ operation brings CS and RD low which
16
Slow Memory Mode, Two Byte Read
For a two byte read, only 8 data outputs D7...D0/8 are used.
Conversion start procedure and data output status for the
first read operation are identical to Slow Memory Mode,
Parallel Read. See Figure 17 timing diagram and Table 3
data bus status. At the end of the conversion, the low data
byte (D7...D0/8) is read from the ADC. A second READ
operation with the HBEN high, places the high byte on data
outputs D3/11...D0/8 and disables conversion start.
Note
the 4MSBs appear on data output D11...D8 during the two
READ operations.
The ROM Mode avoids placing a microprocessor into a
WAIT state. A conversion is started with a READ operation,
and the 12 bits of data from the previous conversion are
available on data outputs D11...D0/8 (see Figure 18 and
Table 4). This data may be disregarded if not required. A
second READ operation reads the new data (DB11...DB0)
and starts another conversion. A delay at least as long as
the ADC’s conversion time plus the 1.0µ s minimum delay
between conversions must be allowed between READ
operations.
ROM Mode, Two Byte Read
As previously mentioned for a two byte read, only data
outputs D7...D0/8 are used. Conversion is started in the
normal way with a READ operation and the data output
status is the same as the ROM mode, Parallel Read (see
Figure 19 timing diagram and Table 5 data bus status).
Two more READ operations are required to access the new
conversion result. A delay equal to the ADC’s conversion
time must be allowed between conversion start and the
second data READ operation. The second READ operation
with HBEN high disables conversion start and places the
high byte (4MSBs) on data outputs D3/11...D0/8. A third
read operation accesses the low data byte (DB7...DB0)
and starts another conversion. The 4MSBs appear on data
outputs D11...D8 during all three read operations.
MICROPROCESSOR INTERFACING
The LTC1282 allows easy interfacing to digital signal
processors as well as modern high speed, 8-bit or 16bit microprocessors. Here are several examples.
TMS320C25
Figure 20 shows an interface between the LTC1282 and
the TMS320C25.
The R/W signal of the DSP initiates a conversion and
conversion results are read from the LTC1282 using the
following instruction:
IND, PA
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LTC1282
PPLICATI
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HBEN
RD
RD
BUSY
DATA
HOLD
TRACK
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t
8
CS
t
1
t
t
2
t
3
OLD DATA
t
12
WU
t
9
t
4
DB7-DB0
5
t
CONV
t
7
U
t
8
t
1
t
3
t
4
NEW DATA
DB11-DB8
t
9
t
5
t
11
t
7
t
8
t
t
10
t
1
t
t
12
3
4
t
2
NEW DATA
DB7-DB0
LTC1282 • F19
t
9
t
5
t
7
Figure 19. ROM Mode Two Byte Read Timing Diagram
Table 5. ROM Mode, Two Byte Read Data Bus Status
Data OutputsD7D6D5D4D3/11D2/10D1/9D0/8
First Read (Old Data)DB7DB6DB5DB4DB3DB2DB1DB0
Second Read (New Data)LowLowLowLowDB11DB10DB9DB8
Third Read (New Data)DB7DB6DB5DB4DB3DB2DB1DB0
A16
A1
IS
TMS320C25
READY
R/W
D16
D0
ADDITIONAL PINS OMITTED FOR CLARITY
ADDRESS BUS
ADDRESS
EN
DECODE
DATA BUS
Figure 20. TMS320C25 Interface
CS
BUSY
RD
D11
D0/8
LTC1282
LTC1282 • F20
HBEN
where D is Data Memory Address and PA is the PORT
ADDRESS.
MC68000 Microprocessor
Figure 21 shows a typical interface for the MC68000. The
LTC1282 is operating in the Slow Memory Mode. Assuming the LTC1282 is located at address C000, then the
following single 16-bit MOVE instruction both starts a
conversion and reads the conversion result:
Move.W $C000,D0
At the beginning of the instruction cycle when the ADC
address is selected, BUSY and CS assert DTACK so that
the MC68000 is forced into a WAIT state. At the end of
conversion, BUSY returns high and the conversion result
is placed in the D0 register of the microprocessor.
19
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LTC1282
DATA BUS
LTC1282 • F23
PORT ADDRESS BUS
D0
D11
DEN
PA0
PA2
TMS32010
ADDRESS
DECODE
EN
D0/8
D11
RD
CS
HBEN
LTC1282
LINEAR CIRCUITRY OMITTED FOR CLARITY
O
PPLICATI
A
A23
A1
AS
MC68000
DTACK
R/W
D11
D0
ADDITIONAL PINS OMITTED FOR CLARITY
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S
IFORATIO
ADDRESS BUS
ADDRESS
EN
DECODE
DATA BUS
WU
CS
BUSY
RD
D11
D0/8
U
LTC1282
HBEN
LTC1282 • F21
Figure 21. MC68000 Interface
8085A/Z80 Microprocessor
Figure 22 shows an LTC1282 interface for the Z80 and
8085A. The LTC1282 is operating in the Slow Memory
Mode and a two byte read is required. Not shown in the
figure is the 8-bit latch required to demultiplex the 8085A
common address/data bus. A0 is used to assert HBEN so
that an even address (HBEN = LOW) to the LTC1282 will
start a conversion and read the low data byte. An odd
address (HBEN = HIGH) will read the high data byte. This
is accomplished with the single 16-bit LOAD instruction
below.
This is a two byte read instruction which loads the ADC
data (address B000) into the HL register pair. During the
first read operation, BUSY forces the microprocessor to
WAIT for the LTC1282 conversion. No WAIT states are
inserted during the second read operation when the microprocessor is reading the high data byte.
TMS32010 Microcomputer
Figure 23 shows an LTC1282/TMS32010 interface. The
LTC1282 is operating in the ROM Mode. The interface is
designed for a maximum TMS32010 clock frequency of
18MHz but will typically work over the full TMS32010
clock frequency range.
The LTC1282 is mapped at a port address. The following
I/O instruction starts a conversion and reads the previous
conversion result into data memory.
IN A,PA(PA = PORT ADDRESS)
When conversion is complete, a second I/O instruction
reads the up-to-date data into memory and starts another
conversion. A delay at least as long as the ADC conversion
time must be allowed between I/O instructions.
For the 8085ALHLD (B000)
For the Z80LDHL, (B000)
A15
A0
MREQ
Z80
8085A
WAIT
RD
D7
LINEAR CIRCUITRY OMITTED FOR CLARITY
D0
Figure 22. 8085A and Z80 Interface
20
ADDRESS BUS
ADDRESS
EN
DECODE
DATA BUS
CS
BUSY
RD
D7
D0/8
A0
HBEN
LTC1282
Figure 23. TMS32010 Interface
LTC1282 • F22
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LTC1282
PPLICATI
A
U
O
S
IFORATIO
WU
U
MUXing with CD4051
The high input impedance of the LTC1282 provides an
easy, cheap, fast, and accurate way to multiplex many
channels of data through one converter. Figure 24 shows
a low cost CD4051, one of the most common multiplexers connected to the LTC1282. The LTC1282’s input
draws no DC input current so it can be accurately driven
by the unbuffered MUX. The CD4520 counter increments
the MUX channel after each sample is taken.
100ps Resolution ∆Time Measurement with LTC1282
Figure 25 shows a circuit that precisely measures the
difference in time between two events. It has a 400ns full
scale and 100ps resolution. The start signal releases the
ramp generator made up of the PNP current source and
the
500pF capacitor. The circuit ramps until the stop
signal shuts off the current source. The final value of the
ramp represents the time between the start and stop
events. The LTC1282 digitizes this final value and outputs the digital data.
3V
NO
BUFFER
REQUIRED
A
IN
LTC1282
Q2
Q1
COUNTER
Q0
BUSY
–3V
ENABLE
CD4520
RESET
D11
RD
•
•
•
D0
CS
µP
OR
DSP
LTC1282 • F24
8 INPUT
CHANNELS
±1.25V
INPUT
VARIES
CD4051
V
SS
ABC
Figure 24. MUXing the LTC1282 with CD4051
65Ω
1N457
LM134
45.3Ω
1N457
45.3Ω
START↑
STOP↑
5V
3.3V
10µF
V
DD
12-BIT
DATA
OUTPUT
DATA
LATCH
SIGNAL
20k
1N4148
100k
2N23692N2369
250pF
POLYSTYRENE
1N4148
1k
10k
100pF
0.001µF
10µF
A
IN
10k
10pF
CS
REF
OUT
LTC1282
VSSGND
RD BUSY
LTC1282 • F25
65Ω
200k
2N5771
74HC74
5V
D
CLK
5V
D
CLK
1k
Q
Q
CLR
Q
Q
CLR
74HC03
430Ω
5V
1k
Figure 25. ∆ Time Measurement with the LTC1282
21
Page 22
LTC1282
PPLICATI
A
U
O
S
IFORATIO
WU
U
Other High Speed A/D Converters
LTC makes a family of high speed sampling ADCs for a
variety of applications. Both single 5V and ±5V supply
devices are available at high speeds. The high speed
12-bit family is summarized below.
300ksps and 500ksps 12-Bit Sampling A/D Converters
2.7µs Conversion
Built-In
Sample & Hold
2.42V
V
OUTPUT
ANALOG INPUT
REF
Reference
Output For
System Use
8- OR 12-BIT
PARALLEL BUS
Parallel Outputs
For The Fastest
Data Transfer Rates
Time
LTC1273/5/6
AIN
V
+
REF
10µF0.1µF
AGND
BUSY
D11 (MSB)
D10
D9
HBEN
D8
D7
D6
D5
D4
D2/10
DGND
D3/11
Reference On Board
V
DD
NC
10µF
CS
RD
µP CONTROL
LINES
D0/8
D1/9
Only 75mW
5V
+
Power
Consumption
0.1µF
No Negative
Supply Required
for Unipolar
Operation
Internal Clock
No Crystal
Required
Comparison of Specifications and Features
DEVICESAMPLINGS/(N + D)INPUTPOWERPOWER
TYPEFREQ@ NYQUIST RANGE SUPPLY DISSIPATION
Dimensions in inches (millimeters) unless otherwise noted.
N Package
24-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1510)
1.265*
(32.131)
MAX
24
0.255 ± 0.015*
(6.477 ± 0.381)
123456
21
2223
20
7
8910191112
151718
LTC1282
131416
0.300 – 0.325
(7.620 – 8.255)
0.009 – 0.015
(0.229 – 0.381)
+0.035
0.325
–0.015
+0.889
8.255
()
–0.381
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
0.020
(0.508)
MIN
0.125
(3.175)
MIN
0.130 ± 0.005
(3.302 ± 0.127)
SW Package
24-Lead Plastic Small Outline (Wide 0.300)
(LTC DWG # 05-08-1620)
NOTE 1
0.100 ± 0.010
(2.540 ± 0.254)
2324
0.045 – 0.065
(1.143 – 1.651)
0.598 – 0.614*
(15.190 – 15.600)
22 21 20 19 181716 15
0.018 ± 0.003
(0.457 ± 0.076)
1314
0.065
(1.651)
TYP
N24 1197
0.394 – 0.419
(10.007 – 10.643)
0.291 – 0.299**
(7.391 – 7.595)
0.010 – 0.029
(0.254 – 0.737)
0.009 – 0.013
(0.229 – 0.330)
NOTE:
1. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.
THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS
DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
*
DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
**
NOTE 1
× 45°
0.016 – 0.050
(0.406 – 1.270)
0° – 8° TYP
0.093 – 0.104
(2.362 – 2.642)
2345678
1
0.050
(1.270)
TYP
0.014 – 0.019
(0.356 – 0.482)
TYP
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
LTC141914800ksps150mW, 81.5dB SINAD and 95dB SFDR
LTC141614400ksps75mW, Low Power with Excellent AC Specs
LTC141814200ksps15mW, Single 5V, Serial/Parallel I/O
12-Bit
LTC1410121.25Msps150mW, 71.5dB SINAD and 84dB THD
LTC1415121.25Msps55mW, Single 5V Supply
LTC140912800ksps80mW, 71.5dB SINAD and 84dB THD
LTC127912600ksps60mW, Single 5V or ±5V Supply
LTC140412600kspsHigh Speed Serial I/O in SO-8 Package
LTC1278-512500ksps75mW, Single 5V or ±5V Supply
LTC1278-412400ksps75mW, Single 5V or ±5V Supply
LTC140012400kspsHigh Speed Serial I/O in SO-8 Package
24
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear-tech.com
LT/TP 1098 2K REV A • PRINTED IN USA
LINEAR TECHNOLOGY CORPORATION 1993
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