Datasheet LTC1282 Datasheet (Linear Technology)

Page 1
LTC1282
3V 140ksps 12-Bit
Sampling A/D Converter
with Reference
EATU
F
Single Supply 3V or ±3V Operation
140ksps Throughput Rate
12mW (Typ) Power Dissipation
On-Chip 25ppm/°C Reference
Internal Synchronized Clock; No Clock Required
High Impedance Analog Input
69dB S/(N + D) and 77dB THD at Nyquist
±0.5LSB INL and ±0.75LSB DNL Max (A Grade)
2.7V Guaranteed Minimum Supply Voltage
ESD Protected On All Pins
24-Pin Narrow PDIP and SW Packages
0V to 2.5V or ±1.25V Input Ranges
PPLICATI
A
3V Powered Systems
High Speed Data Acquisition
Digital Signal Processing
Multiplexed Data Acquisition Systems
Audio and Telecom Processing
Spectrum Analysis
, LTC and LT are registered trademarks of Linear Technology Corporation.
LTBiCMOS is a trademark of Linear Technology Corporation
RE
S
O
U S
DUESCRIPTIO
The LTC®1282 is a 6µs, 140ksps, sampling 12-bit A/D converter that draws only 12mW from a single 3V or dual ±3V supply. This easy-to-use device comes complete with
1.14µ s sample-and-hold, precision reference and inter­nally trimmed clock. Unipolar and bipolar conversion modes provide flexibility for various applications. They are built with LTBiCMOSTM switched capacitor technology.
The LTC1282 has a 25ppm/°C (max) internal reference and converts 0V to 2.5V unipolar inputs from a single 3V supply. With ±3V supplies its input range is ±1.25V with two’s complement output format. Maximum DC specifica­tions include ±0.5LSB INL, ±0.75LSB DNL and 25ppm/°C full-scale drift over temperature. Outstanding AC perfor­mance includes 69dB S/(N + D) and 77dB THD at the Nyquist input frequency of 70kHz.
The internal clock is trimmed for 6µs maximum conver- sion time. The clock automatically synchronizes to each sample command eliminating problems with asynchro­nous clock noise found in competitive devices. A high speed parallel interface eases connections to FIFOs, DSPs and microprocessors.
U
O
A
PPLICATITYPICAL
Single 3V Supply, 140ksps, 12-Bit Sampling A/D Converter
1.20V V
REF
OUTPUT
10µF
+
8- OR 12-BIT
PARALLEL BUS
ANALOG INPUT
(0V TO 2.5V)
0.1µF
1 2 3 4 5 6 7 8
9 10 11 12
LTC1282
AIN V
REF
AGND D11(MSB) D10 D9 D8 D7 D6 D5 D4 DGND
V V
BUSY
RD
HBEN
NC
NC D0/8 D1/9
D2/10 D3/11
24
DD SS
CS
23 22 21 20 19 18 17 16 15 14 13
+
µP CONTROL LINES
10µF
1282 TA01
Effective Bits and Signal-to-(Noise + Distortion)
3V
0.1µF
12 11 10
9 8 7 6 5 4 3 2
ENOBs (EFFECTIVE NUMBER OF BITS)
1 0
1k
vs Input Frequency
f
= 140kHz
SAMPLE
INPUT FREQUENCY (Hz)
10k
NYQUIST
FREQUENCY
100k
LTC1282 • TA02
74 68 62 56
S/(N + D) (dB)
50
1
Page 2
LTC1282
O
A
(Notes 1 and 2)
LUTEXI T
S
W
A
WUW
ARB
U G
I
S
Supply Voltage (VDD).............................................. 12V
Negative Supply Voltage (VSS)................... –6V to GND
Total Supply Voltage (VDD to VSS) .......................... 12V
Analog Input Voltage
(Note 3) .............................. VSS – 0.3V to VDD + 0.3V
Digital Input Voltage (Note 4) ........... VSS – 0.3V to 12V
Digital Output Voltage
(Note 3) .............................. VSS – 0.3V to VDD + 0.3V
Power Dissipation............................................. 500mW
Specified Temperature Range (Note 14)..... 0°C to 70°C
Operating Temperature Range
LTC1282AC, LTC1282BC ......................... 0°C to 70°C
Storage Temperature Range ................ –65°C to 150°C
Lead Temperature (Soldering, 10 sec)................. 300°C
U
CO
VERTER
CCHARA TERIST
With Internal Reference (Notes 5 and 6)
ICS
WU
/
PACKAGE
A
IN
V
REF
AGND
D11 (MSB)
D10
D9 D8 D7 D6 D5 D4
DGND
N PACKAGE
24-LEAD PDIP
T
JMAX
T
JMAX
Consult factory for Industrial and Military grade parts. (Note 14)
O
RDER I FOR ATIO
TOP VIEW
1 2 3 4 5 6 7 8
9 10 11 12
24-LEAD PLASTIC SO WIDE
= 110°C, θJA = 100°C/W (N)
= 110°C, θJA = 130°C/W (SW)
VDD
24
V
23
BUSY
22
CS
21
RD
20
HBEN
19
NC
18
NC
17
D0/8
16
D1/9
15
D2/10
14
D3/11
13
SW PACKAGE
ORDER
PART NUMBER
SS
LTC1282ACN LTC1282BCN LTC1282ACSW LTC1282BCSW
U
LTC1282A LTC1282B
PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS
Resolution (No Missing Codes) 12 12 Bits Integral Linearity Error (Note 7) ±1/2 ±1 LSB
Commercial Military
Differential Linearity Error Commercial ±3/4 ±1 LSB
Military
Offset Error (Note 8) ±3 ±4 LSB
Gain Error ±10 ±15 LSB Gain Error Tempco I Power Supply Rejection (Note 9) VDD ±10% ±0.3 ±0.3 LSB
W
U
IC
DY
A
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
S/(N + D) Signal-to-Noise Plus Distortion Ratio 10kHz/70kHz Input Signal 71/69 dB THD Total Harmonic Distortion 10kHz/70kHz Input Signal, Up to 5th Harmonic –82/–77 dB
IMD Intermodulation Distortion f
ACCURACY
Peak Harmonic or Spurious Noise 10kHz/70kHz Input Signal –82/–77 dB
Full Power Bandwidth 4 MHz Full Linear Bandwidth (S/(N + D) 68dB) 200 kHz
= 0 ±5 ±25 ±10 ±45 ppm/°C
OUT(REF)
(Note 10) VSS ±10% ±0.1 ±0.1 LSB
(Note 5)
±1/2 ±1 LSB
±3/4 ±1 LSB
±1 ±1 LSB
±4 ±6 LSB
LTC1282A/LTC1282B
= 19.0kHz, f
IN1
= 20.6kHz –78 dB
IN2
2
Page 3
LTC1282
IA
U PUT
(Note 5)
LTC1282A/LTC1282B
3V VDD 3.6V, –3.3V VSS –2.5V (Bipolar Mode) ±1.25 V
During Conversions (Hold Mode) 5 pF
U
IN
IN
IN
ACQ
U
LOG
Analog Input Range (Note 11) 2.7V VDD 3.6V (Unipolar Mode) 0 to 2.5 V
Analog Input Leakage Current CS = High ±1 µA Analog Input Capacitance Between Conversions (Sample Mode) 63 pF
Sample-and-Hold Commercial 0.45 1.14 µs Acquisition Time Military 1.5 µs
UU
A
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
I C
t
I TER AL REFERE CE CHARACTERISTICS (Note 5)
LTC1282BLTC1282A
PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS
V
Output Voltage I
REF
V
Output Tempco I
REF
V
Line Regulation 2.7V VDD 3.6V 0.55 0.55 LSB/V
REF
V
Load Regulation 0V |I
REF
U
DIGITAL I PUTS A D DIGITAL OUTPUTS
= 0 1.1900 1.200 1.210 1.190 1.200 1.210 V
OUT
= 0 ±5 ±25 ±10 ±45 ppm/°C
OUT
–3.6V V
–2.7V 0.02 0.02 LSB/V
SS
| 1mA 3 3 LSB/mA
OUT
U
(Note 5)
LTC1282A/LTC1282B
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
IH
V
IL
I
IN
C
IN
V
OH
V
OL
I
OZ
C
OZ
I
SOURCE
I
SINK
POWER REQUIRE E TS
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
DD
V
SS
I
DD
I
SS
P
D
High Level Input Voltage V Low Level Input Voltage VDD = 2.7V 0.45 V Digital Input Current VIN = 0V to V Digital Input Capacitance 5pF High Level Output Voltage VDD = 2.7V
Low Level Output Voltage VDD = 2.7V
High Z Output Leakage D11-D0/8 V High Z Output Capacitance D11-D0/8 CS High (Note 12 ) 15 pF Output Source Current V Output Sink Current V
U
W
= 3.6V 1.9 V
DD
DD
IO = –10µA 2.6 V IO = –200µA 2.3 V
IO = 160µA 0.05 V IO = 1.6mA 0.10 0.4 V
= 0V to VDD, CS High ±10 µA
OUT
= 0V –4.5 mA
OUT
= V
OUT
DD
±10 µA
4.5 mA
(Note 5)
LTC1282A/LTC1282B
Positive Supply Voltage Unipolar Mode (Note 13) 2.7 3.6 V
Bipolar Mode (Note 13) 3.0 3.6 V Negative Supply Voltage Bipolar Operation (Note 13) –3.6 –2.5 V Positive Supply Current f Negative Supply Current f Power Dissipation f
= 140ksps 4 7.8 mA
SAMPLE
= 140ksps 0.03 0.15 mA
SAMPLE
= 140ksps 12 24 mW
SAMPLE
3
Page 4
LTC1282
W
U
TI I G CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
f
SAMPLE(MAX)
t
CONV
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
t
9
t
10
t
11
t
12
Maximum Sampling Frequency Commercial (Note 13) 140 kHz
Conversion Time Commercial 6.0 µs
CS to RD Setup Time 0ns RD to BUSY Delay CL = 50pF 140 200 ns
Data Access Time After RD CL = 20pF (Note 13) 100 180 ns
RD Pulse Width (Note 13) t CS to RD Hold Time (Note 13) 0ns Data Setup Time After BUSY (Note 13) 60 85 ns
Bus Relinquish Time (Note 13) 40 60 120 ns
HBEN to RD Setup Time (Note 13) 0ns HBEN to RD Hold Time (Note 13) 0ns Delay Between RD Operations 40 ns Delay Between Conversions Commercial (Note 13) 1140 450 ns
Aperture Delay of Sample-and-Hold 30 ns
(Note 5)
LTC1282A/LTC1282B
Military (Note 13) 120 kHz
Military 6.5 µs
Commercial
Military 260 ns
Commercial
Military 220 ns
CL = 100pF (Note 13) 110 200 ns
Commercial
Military 260 ns
Commercial
Military 120 ns
Commercial
Military 40 150 ns
Military (Note 13) 1500 ns
230 ns
200 ns
240 ns
3
110 ns
40 130 ns
ns
The
indicates specifications which apply over the full operating
temperature range; all other limits and typicals T Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired. Note 2: All voltage values are with respect to ground with DGND and
AGND wired together (unless otherwise noted). Note 3: When these pin voltages are taken below V
will be clamped by internal diodes. This product can handle input currents greater than 60mA below VSS or above VDD without latchup.
Note 4: When these pin voltages are taken below V by internal diodes. This product can handle input currents greater than 60mA below VSS without latchup. These pins are not clamped to VDD.
Note 5: V mode, f
Note 6: Linearity, offset and full-scale specifications apply for unipolar and bipolar modes.
Note 7: Integral nonlinearity is defined as the deviation of a code from a straight line passing through the actual endpoints of the transfer curve. The deviation is measured from the center of the quantization band.
= 3V, VSS = 0V for unipolar mode and VSS = –3V for bipolar
DD
= 140kHz, tr = tf = 5ns unless otherwise specified.
SAMPLE
= 25°C.
A
or above VDD, they
SS
they will be clamped
SS
4
Note 8: Bipolar offset is the different voltage measured from –0.5LSB when the output code flickers between 0000 0000 0000 and 1111 1111
1111. Note 9: Full-scale change when V
–3V (Bipolar Mode).
Note 10: Full-scale change when VDD = 3V. Note 11: The LTC1282 can perform unipolar and bipolar conversions.
When V mode with input voltage of 0V to 2.5V. When VSS is taken negative (i.e. V
–2.5V), the ADC will convert in bipolar mode with an input voltage of ±1.25V. AIN must not exceed VDD or fall below VSS by more than 50mV for
specified accuracy.
Note 12: Guaranteed by design, not subject to test. Note 13: Recommended operating conditions. Note 14: Commercial grade parts are designed to operate over the
temperature range of –40°C to 85°C but are neither tested nor guaranteed beyond 0°C to 70°C. Industrial grade parts specified and tested over –40°C to 85°C are available on special request. Consult factory.
is grounded (i.e. –0.1V VSS), the ADC will convert in unipolar
SS
= 0V (Unipolar Mode) or
SS
SS
Page 5
W
U
TI I G CHARACTERISTICS
LTC1282
(Note 5)
Slow Memory Mode, Parallel Read Timing Diagram
CS
t
1
t
5
RD
t
2
t
CONV
BUSY
t
7
NEW DATA
DB11 TO DB0
DATA
HOLD
t
3
t
12
OLD DATA
DB11 TO DB0
t
6
TRACK
Slow Memory Mode, Two Byte Read Timing Diagram
HBEN
t
8
CS
t
1
RD
t
BUSY
DATA
HOLD
2
t
3
t
12
t
CONV
OLD DATA
DB7 TO DB0
ROM Mode, Parallel Read Timing Diagram
CS
t
1
t
10
t
11
BUSY
DATA
HOLD
t
5
t
7
TRACK
t
9
t
6
LTC1282 • TC01
NEW DATA
DB7 TO DB0
RD
t
1
t
t
2
t
3
OLD DATA 
DB11 TO DB0
t
12
t
8
t
1
t
10
t
11
4
t
CONV
t
3
t
5
t
7
t
4
NEW DATA
DB11 TO DB8
t
1
t
11
t
2
t
3
t
12
t
9
t
5
t
10
t
7
t
5
t
4
t
CONV
NEW DATA
DB11 TO DB0
t
12
t
7
LTC1282 • TC02
TRACK
HBEN
BUSY
DATA
HOLD
TRACK
RD
LTC1282 • TC03
ROM Mode, Two Byte Read Timing Diagram
t
8
t
9
t
8
CS
t
1
t
4
t
2
t
3
OLD DATA
DB7 TO DB0
t
12
t
t
5
t
CONV
7
t
1
t
4
t
11
t
3
NEW DATA
DB11 TO DB8
t
9
t
5
t
7
t
8
t
1
t
10
t
4
t
2
t
3
t
9
t
5
t
7
NEW DATA
DB7 TO DB0
t
12
LTC1282 • TC04
5
Page 6
LTC1282
TEMPERATURE (°C)
–50
0
SUPPLY CURRENT (mA)
1
3
4
5
10
7
0
50
75
LTC1282 • TPC03
2
8
9
6
–25
25
100
125
f
SAMPLE
= 160kHz
V
DD
= 3V
FREQUENCY (Hz)
0
–120
AMPLITUDE (dB)
–100
–80
–60
–40
20k 40k
60k
80k
LTC1282 • TPC09
–20
0
10k 30k 50k
70k
f
SAMPLE
= 160kHz
f
IN1
= 19.0kHz
f
IN2
= 20.6kHz
V
DD
= 3V
UNIPOLAR
LPER
Integral Nonlinearity
1
F
O
R
ATYPICA
UW
CCHARA TERIST
E
C
Differential Nonlinearity
1
ICS
Supply Current (IDD) vs Temperature
0.5
0
–0.5
INTEGRAL NONLINEARITY ERROR (LSBs)
–1
0
512 1024 1536 2048
2560 3072 3584 4096
CODE
Supply Current (IDD) vs Supply Voltage
20
f
= 160kHz
SAMPLE
18
= 25°C
T
A
16 14 12 10
8 6
SUPPLY CURRENT (mA)
4 2 0
2.5
3
SINGLE
SUPPLY
4
3.5
SUPPLY VOLTAGE (V)
DUAL SUPPLIES
LTC1282 • TPC01
4.5
LTC1282 • TPC04
0.5
0
–0.5
DIFFERENTIAL NONLINEARITY ERROR (LSBs)
–1
0
512 1024 1536 2048
ENOBs and S/(N + D) vs Input Frequency
12 11 10
9 8 7 6 5 4 3 2
EFFECTIVE NUMBER OF BITS (ENOBs)
1 0
5
1k 100k 1M 10M
UNIPOLAR
(0V – 2.5V INPUT)
f
= 160kHz
SAMPLE
= ±2.7V BIPOLAR
V
S
= 3V UNIPOLAR
V
S
10k
INPUT FREQUENCY (Hz)
2560 3072 3584 4096
CODE
BIPOLAR (±1.25V INPUT)
LTC1282 • TPC05
LTC1282 • TPC02
74 68 62 56 50
Distortion vs Input Frequency (Unipolar)
S/(N + D) (dB)
0
f
= 160kHz
SAMPLE
–10
3V SUPPLY UNIPOLAR
–20 –30 –40 –50 –60 –70 –80 –90
AMPLITUDE (dB BELOW THE FUNDAMENTAL)
–100
1k 100k 1M 10M
10k
INPUT FREQUENCY (Hz)
THD
3rd HARMONIC 2nd HARMONIC
LTC1282 • TPC06
0 –10 –20 –30 –40 –50 –60 –70 –80 –90
AMPLITUDE (dB BELOW THE FUNDAMENTAL)
–100
1k 100k 1M 10M
6
Distortion vs Input Frequency (Bipolar)
f
= 140kHz
SAMPLE
±3V SUPPLIES BIPOLAR
THD
10k
INPUT FREQUENCY (Hz)
2nd HARMONIC
3rd HARMONIC
LTC1282 • TPC07
Power Supply Feedthrough vs Ripple Frequency
0
f
= 140kHz
SAMPLE
–10
(V
V
DD
–20 –30 –40 –50
–60
AMPLITUDE OF 
–70 –80
POWER SUPPLY FEEDTHROUGH (dB)
–90
–100
1k
RIPPLE
(V
V
SS
RIPPLE
DGND (V
RIPPLE
10k 100k 1M
RIPPLE FREQUENCY (Hz)
Intermodulation Distortion Plot
= 2.5mV)
= 2.5mV)
= 250mV)
LTC1282 • TPC08
Page 7
LPER
INPUT FREQUENCY (Hz)
–80
AMPLITUDE (dB)
–60
–40
–20
0
100 10k 100k 1M
LTC1282 • TPC12
–100
1k
–90
–70
–50
–30
–10
f
SAMPLE
= 160kHz
V
DD
= 3V
UNIPOLAR
TEMPERATURE (°C)
–50
0
MAGNITUDE OF OFFSET VOLTAGE CHANGE (LSBs)
2
5
0
50
75
LTC1282 • TPC15
1
4
3
–25
25
100
125
f
SAMPLE
= 140kHz
V
DD
= 2.7V
TEMPERATURE (°C)
–50
0
MAGNITUDE OF
DIFFERENTIAL NONLINEARITY CHANGE (LSBs)
0.2
0.5
0
50
75
LTC1282 • TPC18
0.1
0.4
0.3
–25
25
100
125
f
SAMPLE
= 140kHz
V
DD
= 2.7V
F
O
R
ATYPICA
UW
CCHARA TERIST
E
C
LTC1282
ICS
S/(N + D) vs Input Frequency and Amplitude (Unipolar, VDD = 3V)
80
VIN = 0dB
70
60
VIN = –20dB
50
40
30
20
VIN = –60dB
10
SIGNAL/(NOISE + DISTORTION) (dB)
0
1k 100k 1M 10M
10k
INPUT FREQUENCY (Hz)
f
SAMPLE
UNIPOLAR
Reference Voltage vs Load Current
1.220 VDD = 3V
1.215
1.210
1.205
1.200
1.195
1.190
1.185
REFERENCE VOLTAGE (V)
1.180
1.175
1.170
–5
–4
–3
LOAD CURRENT (mA)
–2
–1
Change in Gain Error vs Temperature
5
f
= 140kHz
SAMPLE
= 2.7V
V
DD
4
= 160kHz
LTC1282 • TPC10
0
LTC1282 • TPC13
S/(N + D) vs Input Frequency and Amplitude (Bipolar, ±3V Supplies)
80
VIN = 0dB
70
60
VIN = –20dB
50
40
30
20
VIN = –60dB
10
SIGNAL/(NOISE + DISTORTION) (dB)
0
1k 100k 1M 10M
10k
INPUT FREQUENCY (Hz)
f
SAMPLE
= 160kHz
LTC1282 • TPC10
S/(N +D) vs Input Frequency vs Source Resistance (Bipolar)
80
70
60
50
40
30
20
VDD = 3V
10
SIGNAL/(NOISE + DISTORTION) (dB)
V BIPOLAR
0
1
1k 100k 1M 10M
RS = 1k
= –3V
SS
10k
INPUT FREQUENCY (Hz)
RS = 50
RS = 500
RS = 5k
LTC1282 • TPC14
Change in Integral Nonlinearity (INL) vs Temperature
0.5 f
= 140kHz
SAMPLE
= 2.7V
V
DD
0.4
Spurious Free Dynamic Range vs Input Frequency
Change in Offset Voltage vs Temperature
Change in Differential Nonlinearity (DNL) vs Temperature
3
2
1
MAGNITUDE OF GAIN ERROR CHANGE (LSBs)
0
–50
–25
25
0
TEMPERATURE (°C)
50
75
100
LTC1282 • TPC16
125
0.3
0.2
MAGNITUDE OF
0.1
INTEGRAL NONLINEARITY CHANGE (LSBs)
0
–50
0
–25
TEMPERATURE (°C)
50
25
75
100
LTC1282 • TPC17
125
7
Page 8
LTC1282
SUPPLY VOLTAGE (V)
2
0
MAGNITUDE OF GAIN ERROR CHANGE (LSBs)
1
2
3
4
5
2.5
3 3.5 4
LTC1282 • TPC20
4.5 5
f
SAMPLE
= 140kHz
LPER
F
O
R
ATYPICA
UW
CCHARA TERIST
E
C
ICS
Change in Offset Voltage vs Supply Voltage
1
f
= 140kHz
SAMPLE
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1 0
MAGNITUDE OF OFFSET VOLTAGE CHANGE (LSBs)
2
2.5
3.5 4
3
SUPPLY VOLTAGE (V)
4.5
LTC1282 • TPC19
Change in Integral Nonlinearity (INL) vs Supply Current
0.5 f
= 140kHz
SAMPLE
0.4
0.3
Change in Gain Error vs Supply Voltage
5
Change in Differential Nonlinearity (DNL) vs Supply Current
0.5 f
= 140kHz
SAMPLE
0.4
0.3
0.2
MAGNITUDE OF
0.1
INTEGRAL NONLINEARITY CHANGE (LSBs)
0
2
3 3.5 4
2.5 SUPPLY VOLTAGE (V)
4.5 5
LTC1282 • TPC21
0.2
MAGNITUDE OF
0.1
DIFFERENTIAL NONLINEARITY CHANGE (LSBs)
0
2
3 3.5 4
2.5 SUPPLY VOLTAGE (V)
4.5 5
LTC1282 • TPC22
8
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UU U
PI FU CTIO S
A
(Pin 1): Analog Input. 0V to 2.5V (Unipolar), ±1.25V
IN
(Bipolar).
V
(Pin 2): +1.20V Reference Output. Bypass to
REF
AGND (10µF tantalum in parallel with 0.1µF ceramic).
AGND (Pin 3): Analog Ground. D11-D4 (Pins 4 to 11): Three-State Data Outputs. D11
is the Most Significant Bit.
DGND (Pin 12): Digital Ground. D3/11-D0/8 (Pins 13 to 16): Three-State Data Outputs. NC (Pins 17 and 18): No Connection. HBEN (Pin 19): High Byte Enable Input. This pin is used
to multiplex the internal 12-bit conversion result into the lower bit outputs (D7 and D0/8). See Table 1. HBEN also disables conversion start when HIGH.
LTC1282
RD (Pin 20): READ Input. This active low signal starts a conversion when CS and HBEN are low. RD also enables the output drivers when CS is low.
CS (Pin 21): The CHIP SELECT Input must be low for the ADC to recognize RD and HBEN inputs.
BUSY (Pin 22): The BUSY Output shows the converter status. It is low when a conversion is in progress.
VSS (Pin 23): Bipolar Mode — Negative Supply, –3V. Bypass to AGND with 0.1µF ceramic.
Unipolar Mode — Tie to DGND.
V
(Pin 24): Positive Supply, 3V. Bypass to AGND (10µ F
DD
tantalum in parallel with 0.1µF ceramic).
Table 1. Data Bus Output, CS and RD = LOW
Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 Pin 10 Pin 11 Pin 13 Pin 14 Pin 15 Pin 16
MNEMONIC* D11 D10 D9 D8 D7 D6 D5 D4 D3/11 D2/10 D1/9 D0/8 HBEN = LOW DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 HBEN = HIGH DB11 DB10 DB9 DB8 LOW LOW LOW LOW DB11 DB10 DB9 DB8 *D11...D0/8 are the ADC data output pins.
DB11...DB0 are the 12-bit conversion results, DB11 is the MSB.
TEST CIRCUITS
Load Circuits for Output Float Delay
5V
3k
DBN
3k 10pF 10pF
DGND
(A) V
TO Hi-Z (B) VOL TO Hi-Z
OH
DGND
1282 TC02
DBN
Load Circuits for Access Time
3k C
DGND
(A) Hi-Z TO V AND VOL TO VOH, (t6)
L
, (t3)
OH
DBN
5V
(B) Hi-Z TO V AND V
OH
3k
C
L
DGND
, (t3)
OL
TO VOL, (t6)
1282 TC01
DBN
9
Page 10
LTC1282
UU W
FU TIO AL BLOCK DIAGRA
C
SAMPLE
A
IN
SAMPLE
HOLD
SAMPLE
COMPARATOR
+
V
V
DD
(–3V FOR BIPOLAR MODE,
SS
AGND FOR UNIPOLAR MODE)
12-BIT
CAPACITIVE
DAC
INTERNAL
DGNDAGND
WU
CLOCK
U
PPLICATI
A
V
REF(OUT)
1.2V
REFERENCE
U
O
S
I FOR ATIO
CONVERSION DETAILS
The LTC1282 uses a successive approximation and an internal sample-and-hold circuitry to convert an analog signal to a 12-bit parallel or 2-byte output. The ADC is complete with a precision reference and an internal clock. The control logic provides easy interface to microproces­sors and DSPs. Please refer to the Digital Interface section for the data format.
Conversion start is controlled by the CS, RD and HBEN inputs. At the start of conversion the successive approxi­mation register (SAR) is reset and the three-state data outputs are enabled. Once a conversion cycle has begun it cannot be restarted.
During conversion, the internal 12-bit capacitive DAC output is sequenced by the SAR from the most significant bit (MSB) to the least significant bit (LSB). Referring to Figure 1, the AIN input connects to the sample-and-hold capacitor during the sample phase, and the comparator offset is nulled by the feedback switch. In this sample phase, a minimum delay of 1.14µs will provide enough time for the sample-and-hold capacitor to acquire the analog signal. During the convert phase, the comparator
12
SUCCESSIVE 
APPROXIMATION
REGISTER
12
OUTPUT
LATCHES
CONTROL
LOGIC
D11
•
•
• D0/8 BUSY CS
RD HBEN
LTC1282 • FBD
feedback switch opens, putting the comparator into the compare mode. The input switch switches C
SAMPLE
ground, injecting the analog input charge to the summing junction. This input charge is successively compared with the binary-weighted charges supplied by the capacitive DAC. Bit decisions are made by the high speed comparator. At the end of a conversion, the DAC output balances the A input charge. The SAR contents (a 12-bit data word) which represent the AIN are loaded into the 12-bit latch.
SAMPLE
C
SAMPLE
A
IN
HOLD
SAMPLE
C
DAC
V
DAC
DAC
Figure 1. AIN Input
SI
+
COMPARATOR
LTC1282 • F01
S A R
12-BIT LATCH
to
IN
10
Page 11
LTC1282
INPUT FREQUENCY (Hz)
2
EFFECTIVE NUMBER OF BITS (ENOBs)
4
6
8
10
1k 100k 1M 10M
LTC1282 • F03
0
10k
12
1
3
5
7
9
11
50
62
74
56
68
S/(N + D) (dB)
f
SAMPLE
= 160kHz
V
S
= ±2.7V BIPOLAR
BIPOLAR (±1.25V INPUT)
PPLICATI
A
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S
I FOR ATIO
WU
U
DYNAMIC PERFORMANCE
The LTC1282 has exceptionally high speed sampling capa­bility. FFT (Fast Fourier Transform) test techniques are used to characterize the ADC’s frequency response, distor­tion and noise at the rated throughput. By applying a low distortion sine wave and analyzing the digital output using an FFT algorithm, the ADC’s spectral content can be examined for frequencies outside the fundamental. Figure 2 shows a typical LTC1282 FFT plot.
Signal-to-(Noise + Distortion) Ratio
The Signal-to-Noise plus Distortion Ratio [S/(N + D)] is the ratio between the RMS amplitude of the fundamental input frequency to the RMS amplitude of all other frequency components at the A/D output. The output is band limited to frequencies from above DC and below half the sampling frequency. Figure 2 shows a typical LTC1282 FFT plot.
0
–20
f
= 160kHz
SAMPLE
= 3V
V
DD
UNIPOLAR
Figure 3. ENOBs and S/(N + D) vs Input Frequency
Total Harmonic Distortion
Total Harmonic Distortion (THD) is the ratio of the RMS sum of all harmonics of the input signal to the fundamental itself. The out-of-band harmonics alias into the frequency band between DC and half the sampling frequency. THD is expressed as:
–40
–60
AMPLITUDE (dB)
–80
–100
–120
10 30
0
Figure 2. LTC1282 Nonaveraged, 1024 Point FFT Plot
Effective Number of Bits
The Effective Number of Bits (ENOBs) is a measurement of the resolution of an ADC and is directly related to S/(N + D) by the equation:
N = [S/(N + D) – 1.76]/6.02 where N is the Effective Number of Bits of resolution and
S/(N + D) is expressed in dB. At the maximum sampling rate of 140kHz the LTC1282 maintains 11.3 ENOBs at 70kHz input frequency. Refer to Figure 3.
20 40
FREQUENCY (kHz)
60
50
70
LT1282 • F02
2
2
THD = 20log
V
2
+ V
3
+ V
V
1
2
4
... + V
2
N
where V1 is the RMS amplitude of the fundamental fre­quency and V2 through VN are the amplitudes of the second through Nth harmonics. The typical THD specifi­cation in the Dynamic Accuracy table includes the 2nd
80
through 5th harmonics. With a 70kHz input signal, the LTC1282 has a typical –82dB THD as shown in Figure 4.
0
f
= 140kHz
SAMPLE
–10
±3V SUPPLIES BIPOLAR
–20 –30 –40 –50 –60 –70 –80 –90
AMPLITUDE (dB BELOW THE FUNDAMENTAL)
–100
1k 100k 1M 10M
THD
10k
INPUT FREQUENCY (Hz)
3rd HARMONIC
2nd HARMONIC
LTC1282 • F04
Figure 4. Distortion vs Input Frequency (Bipolar)
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Intermodulation Distortion
If the ADC input signal consists of more than one spectral component, the ADC transfer function nonlinearity can produce intermodulation distortion (IMD) in addition to THD. IMD is the change in one sinusoidal input caused by the presence of another sinusoidal input at a different frequency.
If two pure sine waves of frequencies fa and fb are applied to the ADC input, nonlinearities in the ADC transfer func­tion can create distortion products at sum and difference frequencies of mfa ± nfb, where m and n = 0, 1, 2, 3, etc. For example, the 2nd order IMD terms include (fa + fb) and (fa – fb) while the 3rd order IMD terms include (2fa + fb), (2fa – fb), (fa + 2fb), and (fa – 2fb) if the two input sine waves are equal in magnitude, the value (in decibels) of the 2nd order. IMD products can be expressed by the follow­ing formula:
IMD (fa ± fb) = 20log
Amplitude at (fa ± fb)
Amplitude at fa
Figure 5 shows the IMD performance at a 20kHz input.
0
–20
–40
–60
–80
AMPLITUDE (dB)
f
SAMPLE
= 19.0kHz
f
IN1
= 20.6kHz
f
IN2
= 3V
V
DD
UNIPOLAR
= 160kHz
Full Power and Full Linear Bandwidth
The full power bandwidth is that input frequency at which the amplitude of the reconstructed fundamental is re­duced by 3dB for a full-scale input signal.
The full linear bandwidth is the input frequency at which the S/(N + D) has dropped to 68dB (11 effective bits). The LTC1282 has been designed to optimize input bandwidth, allowing the ADC to undersample input signals with fre­quencies above the converter’s Nyquist Frequency.
Driving the Analog Input
The analog input of the LTC1282 is easy to drive. It draws only one small current spike while charging the sample­and-hold capacitor at the end of conversion. During con­version the analog input draws no current. The only requirement is that the amplifier driving the analog input must settle after the small current spike before the next conversion starts. Any op amp that settles in 1.14µs to small current transients will allow maximum speed opera­tion. If slower op amps are used, more settling time can be provided by increasing the time between conversions. Suitable devices capable of driving the ADC’s AIN input include the LT®1190/LT1191, LT1007, LT1220, LT1223 and LT1224 op amps.
The analog input tolerates source resistance very well. Here again, the only requirement is that the analog input must settle before the next conversion starts. For larger source resistance, full accuracy can be obtained if more time is allowed between conversions.
–100
–120
0
Figure 5. Intermodulation Distortion Plot
20 40
10 30 50
FREQUENCY (kHz)
60
70
LTC1282 • F05
80
Peak Harmonic or Spurious Noise
The peak harmonic or spurious noise is the largest spec­tral component excluding the input signal and DC. This value is expressed in decibels relative to the RMS value of a full-scale input signal.
12
Internal Reference
The LTC1282 has an on-chip, temperature compensated, curvature corrected, bandgap reference which is factory trimmed to 1.20V. It is internally connected to the DAC and is available at pin 2 to provide up to 0.3mA current to an external load.
For minimum code transition noise the reference output should be decoupled with a capacitor to filter wideband noise from the reference (10µ F tantalum in parallel with a
0.1µ F ceramic).
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LTC1282
PPLICATI
A
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Overdriving the Internal Reference
The V
pin can be driven above its normal value with a
REF
DAC or other means to provide input span adjustment. Figure 6 shows an LT1006 op amp driving the reference pin. The V
pin must be driven to at least 1.25V to
REF
prevent conflict with the internal reference. The reference should be driven to no more than 1.44V in unipolar mode or 2.88V for bipolar mode to keep the input span within the single 3V or ±3V supplies.
INPUT RANGE
±1.033V
REF(OUT)
Figure 6. Driving the V
+
LT1006
V
1.25V
REF(OUT)
3
10µF
with the LT1006 Op Amp
REF
A
IN
LTC1282
V
REF
AGND
LTC1282 • F06
V
3V
DD
–3V
V
SS
natural binary with 1LSB = FS/4096 = 2.5V/4096 = 0.61mV. Figure 9 shows the input/output transfer characteristics for the LTC1282 in bipolar operation. The full scale for LTC1282 in bipolar mode is still 2.5V and 1LSB = 0.61mV.
= 2.5V
FS
111...111
111...110
111...101
111...100
OUTPUT CODE
000...011
000...010
000...001
000...000
Figure 8. LTC1282 Unipolar Transfer Characteristic
1LSB = FS/4096
UNIPOLAR ZERO
0V
1
LSB
INPUT VOLTAGE (V)
FS – 1LSB
LTC1282 • F8
Figure 7 shows a typical reference, the LT1019A-2.5 connected to the LTC1282 operating in bipolar mode. This will provide an improved drift (due to the 5ppm/°C of the LT1019A-2.5) and a ±2.604V full scale.
INPUT RANGE
±2.60V
5V
V
IN
V
OUT
LT1019A-2.5
GND
V
3V
DD
3
A
IN
LTC1282
V
REF
+
10µF
AGND
LTC1282 • F07
–3V
V
SS
Figure 7. Supplying a 2.5V Reference Voltage to the LTC1282 with the LT1019A-2.5
UNIPOLAR/BIPOLAR OPERATION AND ADJUSTMENT
Figure 8 shows the ideal input/output characteristics for the LTC1282. The code transitions occur midway be­tween successive integer LSB values (i.e., 0.5LSB,
1.5LSBs, 2.5LSBs, FS – 1.5LSBs). The output code is
011...111
011...110
000...001
000...000
111...111
111...110
OUTPUT CODE
100...010
100...001
100...000
BIPOLAR
ZERO
FS = 2.5V 1LSB = FS/4096
–1
0V
1
LSB
INPUT VOLTAGE (V)
LSB
FS/2 – 1LSB–FS/2
LTC1282 • F09
Figure 9. LTC1282 Bipolar Transfer Characteristic
Unipolar Offset and Full-Scale Adjustment
In applications where absolute accuracy is important, offset and full-scale errors can be adjusted to zero. Figure 10 shows the extra components required for full-scale error adjustment. If both offset and full-scale adjust­ments are needed, the circuit in Figure 11 can be used. Offset should be adjusted before full scale. To adjust
13
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LTC1282
PPLICATI
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offset, apply 0.305mV (i.e., 0.5LSB) at V1 and adjust the op amp offset voltage until the LTC1282 output code flickers between 0000 0000 0000 and 0000 0000 0001. For zero full-scale error, apply an analog input of 2.49909V (i.e., FS – 1.5
LSBs or last code transition) at the input and adjust the full-scale trim until the LTC1282 output code flickers between 1111 1111 1110 and 1111 1111 1111.
R1
50
V
1
R2 10k
ADDITIONAL PINS OMITTED FOR CLARITY ±20LSB TRIM RANGE
Figure 10. Full-Scale Adjust Circuit
R1
ANALOG
INPUT
0V TO 2.5V
10k
 R2
10k
10k
5V
R9 20
Figure 11. Unipolar Offset and Full-Scale Adjust Circuit
R5 10k
+
+
A1
FULL-SCALE
R4
100
ADJUST
R4 100k
R3 100k
R6 400
R5
4.3k FULL-SCALE ADJUST
R7
100k
5V
A
IN
LTC1282
AGND
LTC1282 • F10
R8 10k OFFSET ADJUST
A
IN
LTC1282
LTC1282 • F11
ANALOG
INPUT
±1.25V
R1
10k
R2 10k
+
A
5V
R8 20k OFFSET ADJUST
IN
LTC1282
LTC1282 • F12
R4 100k
R5
4.3k FULL-SCALE ADJUST
R3
R7
100k
100k
R6 200
–5V
Figure 12. Bipolar Offset and Full-Scale Adjust Circuit
error adjustment is achieved by trimming the offset ad­justment of Figure 12 while the input voltage is 0.5LSB below ground. This is done by applying an input voltage of –0.305mV (– 0.5LSB for LTC1282) to the input in Figure 12 and adjusting R8 until the ADC output code flickers between 0000 0000 0000 and 1111 1111 1111. For full­scale adjustment, an input voltage of 1.24909V (FS –
1.5LSBs for LTC1282) is applied to the input and R5 is adjusted until the output code flickers between 0111 1111 1110 and 0111 1111 1111.
BOARD LAYOUT AND BYPASSING
The LTC1282 is easy to use. To obtain the best perfor­mance from the device, a printed circuit board is recom­mended. Layout for the printed circuit board should en­sure that digital and analog signal lines are separated as much as possible. In particular, care should be taken not to run any digital track alongside an analog signal track or underneath the ADC. The analog input should be screened by AGND.
Bipolar Offset and Full-Scale Adjustment
Bipolar offset and full-scale errors are adjusted in a similar fashion to the unipolar case. Figure 10 shows the extra components required for full-scale error adjust­ment. If both offset and full-scale adjustments are needed, the circuit in Figure 12 can be used. Again, bipolar offset must be adjusted before full-scale error. Bipolar offset
14
High quality tantalum and ceramic bypass capacitors should be used at the VDD and V
pins as shown in Figure
REF
13. In bipolar mode, a 0.1µF ceramic provides adequate bypassing for the VSS pin. The capacitors must be located as close to the pins as possible. The traces connecting the pins and the bypass capacitors must be kept short and should be made as wide as possible.
Page 15
LTC1282
LTC1282
3V ADC
3V
LTC1282 • F14
ADC OUTPUTS
0V TO 3V
5V
ADC INPUTS
0V TO 5V
TTL INPUT LEVELS
CMOS OUTPUT LEVELS
5V
LOGIC
LTC ESD
CLAMP
PPLICATI
A
Noise:
Input signal leads to AIN and signal return leads
U
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S
I FOR ATIO
1
ANALOG
INPUT
CIRCUITRY
+
WU
A
IN
AGND V
3 2 24 12
ANALOG GROUND PLANE
Figure 13. Power Supply Grounding Practice
U
LTC1282
REF
0.1µF
from AGND (Pin 3) should be kept as short as possible to minimize input noise coupling. In applications where this is not possible, a shielded cable between source and ADC is recommended. Also, since any potential difference in grounds between the signal source and ADC appears as an error voltage in series with the input signal, attention should be paid to reducing the ground circuit imped­ances
as much as possible.
DIGITAL SYSTEM
VDDDGND
10µF10µF
0.1µF
GROUND CONNECTION TO DIGITAL CIRCUITRY
LTC1282 • F13
DIGITAL INTERFACE
The ADC is designed to interface with microprocessors as a memory mapped device. The CS and RD control inputs are common to all peripheral memory interfacing. The HBEN input serves as a data byte select for 8-bit proces­sors and is normally either connected to the microproces­sor address bus or grounded.
Connecting to 5V Logic Systems
A single point analog ground separate from the logic system ground should be established with an analog ground plane at pin 3 (AGND) or as close as possible to the ADC, as shown in Figure 13. Pin 12 ( DGND) and all other analog grounds should be connected to this single analog ground point. No other digital grounds should be con­nected to this analog ground point. Low impedance analog and digital power supply common returns are essential to low noise operation of the ADC and the foil width for these tracks should be as wide as possible.
In applications where the ADC data outputs and control signals are connected to a continuously active micropro­cessor bus, it is possible to get errors in conversion results. These errors are due to feedthrough from the microprocessor to the successive approximation com­parator. The problem can be eliminated by forcing the microprocessor into a WAIT state during conversion or by using three-state buffers to isolate the ADC data bus.
The LTC1282 interfaces well to 5V logic because the ESD clamps on the inputs do not clamp to the positive supply (see Figure 14). Inputs of 0V to 5V do not bother the ADC at all. In addition, the 0V to 3V outputs of the 3V ADC are more than adequate to meet TTL input levels in the 5V logic. (5V logic with CMOS input levels requires a level shift.)
Figure 14. 3V ADC ESD Protection Handles 0V to 5V Swings Easily
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LTC1282
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Internal Clock
The LTC1282 has an internal clock that eliminates the need for synchronization between the external clock and the CS and RD signals found in other ADCs. The internal clock is factory trimmed to achieve a typical conversion time of
5.5µs, and a maximum conversion time over the full operating temperature range of 6.0µ s. No external adjust­ments are required and, with the guaranteed maximum acquisition time of 1.14µs, throughput performance of 140ksps is assured.
Timing and Control
Conversion start and data read operations are controlled by three digital inputs: HBEN, CS and RD. Figure 15 shows the logic structure associated with these inputs. The three signals are internally gated so that a logic “0” is required on all three inputs to initiate a conversion. Once initiated it cannot be restarted until the conversion is complete. Converter status is indicated by the BUSY output, and this is low while conversion is in progress.
HBEN
RD
LTC1282
19
21
CS
20
FLIP
FLOP
CLEAR
BUSY
QD
CONVERSION  START (RISING EDGE TRIGGER)
initiates a conversion and data is read when conversion is complete. The second is the ROM Mode which does not require microprocessor WAIT states. A READ operation brings CS and RD low which initiates a conversion and reads the previous conversion result.
Data Format
The output format can be either a complete parallel load for 16-bit microprocessors or a two byte load for 8-bit micro­processors. Data is always right justified (i.e., LSB is the most right-hand bit in a 16-bit word). For a two byte read, only data outputs D7...D0/8 are used. Byte selection is governed by the HBEN input which controls an internal digital multiplexer. This multiplexes the 12-bits of conver­sion data onto the lower D7...D0/8 outputs (4MSBs or 8MSBs) where it can be read in two read cycles. The 4MSBs always appear on D11...D8 whenever the three­state output drivers are turned on.
Slow Memory Mode, Parallel Read (HBEN = LOW)
Figure 16 and Table 2 show the timing diagram and data bus status for Slow Memory Mode, Parallel Read. CS and RD going low trigger a conversion and the ADC acknowl­edges by taking BUSY low. Data from the previous conver­sion appears on the three-state data outputs. BUSY re­turns high at the end of conversion when the output latches have been updated and the conversion result is placed on data outputs D11...D0/8.
ACTIVE HIGH
ACTIVE HIGH
D11....D0/8 ARE THE ADC DATA OUTPUT PINS
*
DB11....DB0 ARE THE 12-BIT CONVERSION RESULTS
Figure 15. Internal Logic for Control Inputs CS, RD and HBEN
ENABLE THREE-STATE OUTPUTS
D11....D0/8 = DB11....DB0
ENABLE THREE-STATE OUTPUTS
D11....D8 = DB11....DB8
D7....D4 = LOW
D3/11....D0/8 = DB11....DB8
LTC1282 • F15
There are two modes of operation as outlined by the timing diagrams of Figures 16 to 19. Slow Memory Mode is designed for microprocessors which can be driven into a WAIT state. A READ operation brings CS and RD low which
16
Slow Memory Mode, Two Byte Read
For a two byte read, only 8 data outputs D7...D0/8 are used. Conversion start procedure and data output status for the first read operation are identical to Slow Memory Mode, Parallel Read. See Figure 17 timing diagram and Table 3 data bus status. At the end of the conversion, the low data byte (D7...D0/8) is read from the ADC. A second READ operation with the HBEN high, places the high byte on data outputs D3/11...D0/8 and disables conversion start.
Note the 4MSBs appear on data output D11...D8 during the two READ operations.
Page 17
LTC1282
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t
1
RDCSRD
BUSY
DATA
HOLD
TRACK
WU
t
2
t
3
t
12
t
CONV
OLD DATA DB11-DB0
U
t
6
NEW DATA
DB11-DB0
t
5
t
10
t
11
t
7
t
1
LTC1282 • F16
Figure 16. Slow Memory Mode, Parallel Read Timing Diagram
Table 2. Slow Memory Mode, Parallel Read Data Bus Status
Data Outputs D11 D10 D9 D8 D7 D6 D5 D4 D3/11 D2/10 D1/9 D0/8
Read DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
HBEN
RD
RD
BUSY
DATA
HOLD
TRACK
t
8
CS
t
1
t
2
t
3
t
12
t
CONV
OLD DATA
DB7-DB0
t
6
NEW DATA
DB7-DB0
t
9
t
5
t
t
7
t
8
t
1
t
4
10
t
11
t
3
NEW DATA
DB11-DB8
Figure 17. Slow Memory Mode, Two Byte Read Timing Diagram
Table 3. Slow Memory Mode, Two Byte Read Data Bus Status
Data Outputs D7 D6 D5 D4 D3/11 D2/10 D1/9 D0/8
First Read DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Second Read Low Low Low Low DB11 DB10 DB9 DB8
t
9
t
5
t
10
t
7
t
12
LTC1282 • F17
17
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A
Table 4. ROM Mode, Parallel Read Data Bus Status
Data Outputs D11 D10 D9 D8 D7 D6 D5 D4 D3/11 D2/10 D1/9 D0/8
First Read (Old Data) DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Second Read DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
S
I FOR ATIO
CS
RD
BUSY
DATA
HOLD
TRACK
Figure 18. ROM Mode, Parallel Read Timing Diagram (HBEN = LOW)
WU
t
1
t
t
2
t
3
OLD DATA DB11-DB0
t
4
t
t
12
U
5
t
CONV
7
t
1
t
t
11
t
2
t
3
NEW DATA DB11-DB0
t
t
5
t
CONV
7
LTC1282 • F18
4
t
12
ROM Mode, Parallel Read (HBEN = LOW)
The ROM Mode avoids placing a microprocessor into a WAIT state. A conversion is started with a READ operation, and the 12 bits of data from the previous conversion are available on data outputs D11...D0/8 (see Figure 18 and Table 4). This data may be disregarded if not required. A second READ operation reads the new data (DB11...DB0) and starts another conversion. A delay at least as long as the ADC’s conversion time plus the 1.0µ s minimum delay between conversions must be allowed between READ operations.
ROM Mode, Two Byte Read
As previously mentioned for a two byte read, only data outputs D7...D0/8 are used. Conversion is started in the normal way with a READ operation and the data output status is the same as the ROM mode, Parallel Read (see Figure 19 timing diagram and Table 5 data bus status). Two more READ operations are required to access the new conversion result. A delay equal to the ADC’s conversion
time must be allowed between conversion start and the second data READ operation. The second READ operation with HBEN high disables conversion start and places the high byte (4MSBs) on data outputs D3/11...D0/8. A third read operation accesses the low data byte (DB7...DB0) and starts another conversion. The 4MSBs appear on data outputs D11...D8 during all three read operations.
MICROPROCESSOR INTERFACING
The LTC1282 allows easy interfacing to digital signal processors as well as modern high speed, 8-bit or 16­bit microprocessors. Here are several examples.
TMS320C25
Figure 20 shows an interface between the LTC1282 and the TMS320C25.
The R/W signal of the DSP initiates a conversion and conversion results are read from the LTC1282 using the following instruction:
IN D, PA
18
Page 19
LTC1282
PPLICATI
A
HBEN
RD
RD
BUSY
DATA
HOLD
TRACK
U
O
S
I FOR ATIO
t
8
CS
t
1
t
t
2
t
3
OLD DATA
t
12
WU
t
9
t
4
DB7-DB0
5
t
CONV
t
7
U
t
8
t
1
t
3
t
4
NEW DATA
DB11-DB8
t
9
t
5
t
11
t
7
t
8
t
t
10
t
1
t
t
12
3
4
t
2
NEW DATA
DB7-DB0
LTC1282 • F19
t
9
t
5
t
7
Figure 19. ROM Mode Two Byte Read Timing Diagram
Table 5. ROM Mode, Two Byte Read Data Bus Status
Data Outputs D7 D6 D5 D4 D3/11 D2/10 D1/9 D0/8
First Read (Old Data) DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Second Read (New Data) Low Low Low Low DB11 DB10 DB9 DB8 Third Read (New Data) DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
A16
A1
IS
TMS320C25
READY
R/W
D16
D0
ADDITIONAL PINS OMITTED FOR CLARITY
ADDRESS BUS
ADDRESS
EN
DECODE
DATA BUS
Figure 20. TMS320C25 Interface
CS BUSY
RD D11
D0/8
LTC1282
LTC1282 • F20
HBEN
where D is Data Memory Address and PA is the PORT ADDRESS.
MC68000 Microprocessor
Figure 21 shows a typical interface for the MC68000. The LTC1282 is operating in the Slow Memory Mode. Assum­ing the LTC1282 is located at address C000, then the following single 16-bit MOVE instruction both starts a conversion and reads the conversion result:
Move.W $C000,D0
At the beginning of the instruction cycle when the ADC address is selected, BUSY and CS assert DTACK so that the MC68000 is forced into a WAIT state. At the end of conversion, BUSY returns high and the conversion result is placed in the D0 register of the microprocessor.
19
Page 20
LTC1282
DATA BUS
LTC1282 • F23
PORT ADDRESS BUS
D0
D11
DEN
PA0
PA2
TMS32010
ADDRESS
DECODE
EN
D0/8
D11
RD
CS
HBEN
LTC1282
LINEAR CIRCUITRY OMITTED FOR CLARITY
O
PPLICATI
A
A23
A1
AS
MC68000
DTACK
R/W
D11
D0
ADDITIONAL PINS OMITTED FOR CLARITY
U S
I FOR ATIO
ADDRESS BUS
ADDRESS
EN
DECODE
DATA BUS
WU
CS BUSY
RD D11
D0/8
U
LTC1282
HBEN
LTC1282 • F21
Figure 21. MC68000 Interface
8085A/Z80 Microprocessor
Figure 22 shows an LTC1282 interface for the Z80 and 8085A. The LTC1282 is operating in the Slow Memory Mode and a two byte read is required. Not shown in the figure is the 8-bit latch required to demultiplex the 8085A common address/data bus. A0 is used to assert HBEN so that an even address (HBEN = LOW) to the LTC1282 will start a conversion and read the low data byte. An odd address (HBEN = HIGH) will read the high data byte. This is accomplished with the single 16-bit LOAD instruction below.
This is a two byte read instruction which loads the ADC data (address B000) into the HL register pair. During the first read operation, BUSY forces the microprocessor to WAIT for the LTC1282 conversion. No WAIT states are inserted during the second read operation when the mi­croprocessor is reading the high data byte.
TMS32010 Microcomputer
Figure 23 shows an LTC1282/TMS32010 interface. The LTC1282 is operating in the ROM Mode. The interface is designed for a maximum TMS32010 clock frequency of 18MHz but will typically work over the full TMS32010 clock frequency range.
The LTC1282 is mapped at a port address. The following I/O instruction starts a conversion and reads the previous conversion result into data memory.
IN A,PA (PA = PORT ADDRESS)
When conversion is complete, a second I/O instruction reads the up-to-date data into memory and starts another conversion. A delay at least as long as the ADC conversion time must be allowed between I/O instructions.
For the 8085A LHLD (B000) For the Z80 LDHL, (B000)
A15
A0
MREQ
Z80
8085A
WAIT
RD
D7
LINEAR CIRCUITRY OMITTED FOR CLARITY
D0
Figure 22. 8085A and Z80 Interface
20
ADDRESS BUS
ADDRESS
EN
DECODE
DATA BUS
CS BUSY
RD D7
D0/8
A0
HBEN
LTC1282
Figure 23. TMS32010 Interface
LTC1282 • F22
Page 21
LTC1282
PPLICATI
A
U
O
S
I FOR ATIO
WU
U
MUXing with CD4051
The high input impedance of the LTC1282 provides an easy, cheap, fast, and accurate way to multiplex many channels of data through one converter. Figure 24 shows a low cost CD4051, one of the most common multiplex­ers connected to the LTC1282. The LTC1282’s input draws no DC input current so it can be accurately driven by the unbuffered MUX. The CD4520 counter increments the MUX channel after each sample is taken.
100ps Resolution Time Measurement with LTC1282
Figure 25 shows a circuit that precisely measures the difference in time between two events. It has a 400ns full scale and 100ps resolution. The start signal releases the ramp generator made up of the PNP current source and the
500pF capacitor. The circuit ramps until the stop signal shuts off the current source. The final value of the ramp represents the time between the start and stop
events. The LTC1282 digitizes this final value and out­puts the digital data.
3V
NO
BUFFER
REQUIRED
A
IN
LTC1282
Q2 Q1
COUNTER
Q0
BUSY
–3V
ENABLE
CD4520
RESET
D11
RD
•
•
D0 CS
µP OR
DSP
LTC1282 • F24
8 INPUT
CHANNELS
±1.25V
INPUT
VARIES
CD4051
V
SS
ABC
Figure 24. MUXing the LTC1282 with CD4051
65
1N457
LM134
45.3
1N457
45.3
START
STOP
5V
3.3V
10µF
V
DD
12-BIT DATA  OUTPUT
DATA  LATCH SIGNAL
20k
1N4148
100k
2N23692N2369
250pF POLYSTYRENE
1N4148
1k
10k
100pF
0.001µF
10µF
A
IN
10k
10pF
CS
REF
OUT
LTC1282
VSSGND
RD BUSY
LTC1282 • F25
65
200k
2N5771
74HC74
5V
D
CLK
5V
D
CLK
1k
Q
Q
CLR
Q
Q
CLR
74HC03
430
5V
1k
Figure 25. Time Measurement with the LTC1282
21
Page 22
LTC1282
PPLICATI
A
U
O
S
I FOR ATIO
WU
U
Other High Speed A/D Converters
LTC makes a family of high speed sampling ADCs for a variety of applications. Both single 5V and ±5V supply devices are available at high speeds. The high speed 12-bit family is summarized below.
300ksps and 500ksps 12-Bit Sampling A/D Converters
2.7µs Conversion 
Built-In
Sample & Hold
2.42V V
OUTPUT
ANALOG INPUT
REF
Reference  Output For
System Use
8- OR 12-BIT
PARALLEL BUS
Parallel Outputs
For The Fastest
Data Transfer Rates
Time
LTC1273/5/6
AIN V
+
REF
10µF0.1µF
AGND
BUSY D11 (MSB) D10 D9
HBEN D8 D7 D6 D5 D4
D2/10
DGND
D3/11
Reference On Board
V
DD
NC
10µF
CS
RD
µP CONTROL
LINES  
D0/8 D1/9
Only 75mW
5V
+
Power  Consumption
0.1µF
No Negative Supply Required for Unipolar Operation
Internal Clock No Crystal Required
Comparison of Specifications and Features
DEVICE SAMPLING S/(N + D) INPUT POWER POWER TYPE FREQ @ NYQUIST RANGE SUPPLY DISSIPATION
LTC1272 250kHz 65dB 0V-5V 5V 75mW LTC1273 300kHz 70dB 0V-5V 5V 75mW LTC1275 300kHz 70dB ±2.5V ±5V 75mW LTC1276 300kHz 70dB ±5V ±5V 75mW LTC1278 500kHz 70dB 0V-5V 5V 75mW
or ±2.5V or ±5V 6mW*
LTC1282 140kHz 68dB 0V-2.5V 3V 12mW
or ±1.25V or ±3V
*6mW power shutdown with instant wake up
22
Page 23
PACKAGEDESCRIPTI
O
U
Dimensions in inches (millimeters) unless otherwise noted.
N Package
24-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1510)
1.265*
(32.131)
MAX
24
0.255 ± 0.015* (6.477 ± 0.381)
123456
21
2223
20
7
89101911 12
151718
LTC1282
131416
0.300 – 0.325
(7.620 – 8.255)
0.009 – 0.015
(0.229 – 0.381)
+0.035
0.325
–0.015 +0.889
8.255
()
–0.381
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
0.020
(0.508)
MIN
0.125
(3.175)
MIN
0.130 ± 0.005
(3.302 ± 0.127)
SW Package
24-Lead Plastic Small Outline (Wide 0.300)
(LTC DWG # 05-08-1620)
NOTE 1
0.100 ± 0.010
(2.540 ± 0.254)
2324
0.045 – 0.065
(1.143 – 1.651)
0.598 – 0.614*
(15.190 – 15.600)
22 21 20 19 181716 15
0.018 ± 0.003
(0.457 ± 0.076)
1314
0.065
(1.651)
TYP
N24 1197
0.394 – 0.419
(10.007 – 10.643)
0.291 – 0.299** (7.391 – 7.595)
0.010 – 0.029
(0.254 – 0.737)
0.009 – 0.013
(0.229 – 0.330)
NOTE:
1. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS. THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS
DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
*
DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
**
 
NOTE 1
× 45°
0.016 – 0.050
(0.406 – 1.270)
0° – 8° TYP
0.093 – 0.104
(2.362 – 2.642)
2345678
1
0.050
(1.270)
TYP
0.014 – 0.019
(0.356 – 0.482)
TYP
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen­tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
910
11 12
0.037 – 0.045
(0.940 – 1.143)
0.004 – 0.012
(0.102 – 0.305)
S24 (WIDE) 0996
23
Page 24
LTC1282
RELATED PARTS
PART NUMBER RESOLUTION SPEED COMMENTS 16-Bit
LTC1604 16 333ksps ±2.5V Input Range, ±5V Supply LTC1605 16 100ksps ±10V Input Range, Single 5V Supply
14-Bit
LTC1419 14 800ksps 150mW, 81.5dB SINAD and 95dB SFDR LTC1416 14 400ksps 75mW, Low Power with Excellent AC Specs LTC1418 14 200ksps 15mW, Single 5V, Serial/Parallel I/O
12-Bit
LTC1410 12 1.25Msps 150mW, 71.5dB SINAD and 84dB THD LTC1415 12 1.25Msps 55mW, Single 5V Supply LTC1409 12 800ksps 80mW, 71.5dB SINAD and 84dB THD LTC1279 12 600ksps 60mW, Single 5V or ±5V Supply LTC1404 12 600ksps High Speed Serial I/O in SO-8 Package LTC1278-5 12 500ksps 75mW, Single 5V or ±5V Supply LTC1278-4 12 400ksps 75mW, Single 5V or ±5V Supply LTC1400 12 400ksps High Speed Serial I/O in SO-8 Package
24
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
www.linear-tech.com
LT/TP 1098 2K REV A • PRINTED IN USA
LINEAR TECHNOLOGY CORPORATION 1993
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