Auto Shutdown Reduces Power Linearly
at Lower Sample Rates
■
10-Bit Upgrade to 8-Bit LTC1196/LTC1198
■
SPI and MICROWIRETM Compatible Serial I/O
■
Low Cost
U
O
PPLICATI
A
■
High Speed Data Acquisition
■
Portable or Compact Instrumentation
■
Low Power or Battery-Operated Instrumentation
S
DUESCRIPTIO
The LTC®1197/LTC1197L/LTC1199/LTC1199L are
10-bit A/D converters with sampling rates up to 500kHz.
They have 2.7V (L) and 5V versions and are offered in
8-pin MSOP and SO packages. Power dissipation is typically only 2.2mW at 2.7V (25mW at 5V) during full speed
operation. The automatic power down reduces supply
current linearly as sample rate is reduced. These 10-bit,
switched-capacitor, successive approximation ADCs include a sample-and-hold. The LTC1197/LTC1197L have a
differential analog input with an adjustable reference pin.
The LTC1199/LTC1199L offer a software-selectable
2-channel MUX.
The 3-wire serial I/O, MSOP and SO-8 packages, 2.7V
operation and extremely high sample rate-to-power ratio
make these ADCs ideal choices for compact, low power
high speed systems.
These circuits can be used in ratiometric applications or
with external references. The high impedance analog
inputs and the ability to operate with reduced spans below
1V full scale (LTC1197/LTC1197L) allow direct connection to signal sources in many applications, eliminating
the need for gain stages.
, LTC and LT are registered trademarks of Linear Technology Corporation.
MICROWIRE is a trademark of National Semiconductor Corporation.
U
O
A
PPLICATITYPICAL
Single 2.7V Supply, 250ksps, 10-Bit Sampling ADC
1µF
2.7V
LTC1197L
ANALOG INPUT
0V TO 2.7V RANGE
1
CS
2
+IN
3
–IN
4
GND
8
VCC
7
CLK
6
D
OUT
5
V
REF
1197/99 TA01
SERIAL DATA LINK TO
ASIC, PLD, MPU, DSP
OR SHIFT REGISTERS
Supply Current vs Sampling Frequency
10000
1000
SUPPLY CURRENT (µA)
100
0.1
10
1
0.1
0.01
SAMPLING FREQUENCY (kHz)
f
CLK
VCC = 5V
= 7.2MHz
VCC = 2.7V
f
CLK
1
= 3.5MHz
10
100
1197/99 G03
1000
1
Page 2
LTC1197/LTC1197L
LTC1199/LTC1199L
A
W
O
LUTEXI T
S
A
WUW
ARB
U
G
I
S
(Notes 1, 2)
Supply Voltage (VCC) ............................................... 12V
Voltage
Analog Input .....................GND – 0.3V to V
CC
+ 0.3V
Digital Input ................................ GND – 0.3V to 12V
Digital Output ....................GND – 0.3V to V
CC
+ 0.3V
Power Dissipation..............................................500mW
Storage Temperature Range ................. –65°C to 150°C
WU
/
PACKAGE
CS
+IN
–IN
GND
8-LEAD PLASTIC MSOP
T
JMAX
O
RDER IFORATIO
TOP VIEW
1
2
3
4
MS8 PACKAGE
= 150°C, θJA = 210°C/W
8
7
6
5
V
CLK
D
V
CC
OUT
REF
ORDER PART
NUMBER
LTC1197LCMS8
MS8 PART MARKINGS8 PART MARKING
LTBL
Operating Temperature Range
LTC1197C/LTC1197LC
LTC1199C/LTC1199LC........................... 0°C to 70°C
LTC1197I/LTC1197LI
LTC1199I/LTC1199LI ........................ –45°C to 85°C
Lead Temperature (Soldering, 10 sec)................. 300°C
U
ORDER PART
TOP VIEW
1
CS
2
+IN
3
–IN
4
GND
S8 PACKAGE
8-LEAD PLASTIC SO
T
= 150°C, θJA = 175°C/W
JMAX
8
V
CC
7
CLK
6
D
OUT
5
V
REF
NUMBER
LTC1197CS8
LTC1197IS8
LTC1197LCS8
LTC1197LIS8
1197
1197I
1197L
1197LI
TOP VIEW
8
CS
1
CH0
2
CH1
3
GND
4
MS8 PACKAGE
8-LEAD PLASTIC MSOP
T
= 150°C, θJA = 210°C/W
JMAX
Consult factory for Military grade parts.
V
CC
7
CLK
6
D
OUT
5
D
IN
WUW
ORDER PART
NUMBER
LTC1199LCMS8
CS
CH0
CH1
GND
MS8 PART MARKINGS8 PART MARKING
LTCM
TOP VIEW
1
2
3
4
S8 PACKAGE
8-LEAD PLASTIC SO
T
= 150°C, θJA = 175°C/W
JMAX
8
V
CC
7
CLK
6
D
OUT
5
D
IN
UUU
ORDER PART
NUMBER
LTC1199CS8
LTC1199IS8
LTC1199LCS8
LTC1199LIS8
1199
1199I
1199L
1199LI
RECO E DED OPERATI G CO DITIO S
SYMBOL PARAMETERCONDITIONSMINTYPMAXMINTYPMAXUNITS
V
CC
VCC = 5V Operation
f
CLK
t
CYC
t
SMPL
t
hCS
Supply Voltage4946V
Clock Frequency●0.057.20.057.2MHz
Total Cycle Time1416CLK
Analog Input Sampling Time1.51.5CLK
Hold Time CS Low After Last CLK↑1313ns
LTC1197LTC1199
2
Page 3
LTC1197/LTC1197L
LTC1199/LTC1199L
WUW
UUU
RECO E DED OPERATI G CO DITIO S
LTC1197LTC1199
SYMBOL PARAMETERCONDITIONSMINTYPMAXMINTYPMAXUNITS
VCC = 5V Operation
t
suCS
t
hDI
t
suDI
t
WHCLK
t
WLCLK
t
WHCS
t
WLCS
SYMBOL PARAMETERCONDITIONSMINTYPMAXMINTYPMAXUNITS
V
CC
VCC = 2.7V Operation
f
CLK
t
CYC
t
SMPL
t
hCS
t
suCS
t
hDI
t
suDI
t
WHCLK
t
WLCLK
t
WHCS
t
WLCS
Setup Time CS↓ Before First CLK↑2626ns
(See Figures 1, 2)
Hold Time DIN After CLK↑LTC119926ns
Setup Time DIN Stable Before CLK↑LTC119926ns
CLK High Timef
CLK Low Timef
CS High Time Between Data Transfer Cycles3232ns
CS Low Time During Data Transfer1315CLK
Supply Voltage2.742.74V
Clock Frequency●0.013.50.013.5MHz
Total Cycle Time1416CLK
Analog Input Sampling Time1.51.5CLK
Hold Time CS Low After Last CLK↑4040ns
Setup Time CS↓ Before First CLK↑7878ns
(See Figures 1, 2)
Hold Time DIN After CLK↑LTC1199L78ns
Setup Time DIN Stable Before CLK↑LTC1199L78ns
CLK High Timef
CLK Low Timef
CS High Time Between Data Transfer Cycles9696ns
CS Low Time During Data Transfer1315CLK
CLK
CLK
CLK
CLK
= f
= f
= f
= f
CLK(MAX)
CLK(MAX)
CLK(MAX)
CLK(MAX)
40%40%1/f
40%40%1/f
LTC1197LLTC1199L
40%40%1/f
40%40%1/f
CLK
CLK
CLK
CLK
UW
U
CONVERTER AND MULTIPLEXER CHARACTERISTICS
VCC = 5V, V
PARAMETERCONDITIONSMINTYPMAXMINTYPMAXUNITS
Offset Error●±2±2LSB
Linearity Error(Note 3)●±1±1LSB
Gain Error●±4±4LSB
No Missing Codes Resolution●1010Bits
Analog Input RangeV
Reference Input RangeLTC1197, VCC ≤ 6V0.2VCC + 0.05VV
Analog Input Leakage Current(Note 4)●±1±1µA
REF
= 5V, f
CLK
= f
CLK(MAX)
as defined in Recommended Operating Conditions, unless otherwise noted.
LTC1197LTC1199
–0.05V to VCC + 0.05V
LTC1197, V
> 6V0.26V
CC
3
Page 4
LTC1197/LTC1197L
LTC1199/LTC1199L
UW
U
CONVERTER AND MULTIPLEXER CHARACTERISTICS
VCC = 2.7V, V
PARAMETERCONDITIONSMINTYPMAXMINTYPMAXUNITS
Offset Error●±2±2LSB
Linearity Error(Note 3)●±1±1LSB
Gain Error●±4±4LSB
No Missing Codes Resolution●1010Bits
Analog Input RangeV
Reference Input RangeLTC1197L0.2VCC + 0.05VV
Analog Input Leakage Current(Note 4)●±1±1µA
= 2.5V (LTC1197L), f
REF
CLK
= f
CLK(MAX)
as defined in Recommended Operating Conditions, unless otherwise noted.
as defined in Recommended Operating Conditions, unless otherwise noted.
LTC1197LTC1199
Conversion Time (See Figures 1, 2)●1.41.4µs
Maximum Sampling Frequency●500450kHz
Delay Time, CLK↑ to D
Delay Time, CS↑ to D
Delay Time, CLK↓ to D
Time Output Data RemainsC
Data Valid C
OUT
Hi-Z●7515075150ns
OUT
EnabledC
OUT
= 20pF68786878ns
LOAD
= 20pF●40684068ns
LOAD
= 20pF●25552555ns
LOAD
●100100ns
Valid After CLK↑
D
Rise TimeC
OUT
D
Fall TimeC
OUT
= 20pF●10201020ns
LOAD
= 20pF●10201020ns
LOAD
Input CapacitanceAnalog Input On Channel2020pF
Analog Input Off Channel55pF
Digital Input55pF
VCC = 2.7V, V
= 2.5V, f
REF
CLK
= f
CLK(MAX)
as defined in Recommended Operating Conditions, unless otherwise noted.
LTC1197LLTC1199L
SYMBOLPARAMETERCONDITIONSMINTYPMAXMINTYPMAXUNITS
t
CONV
f
SMPL(MAX)
t
dDO
t
dis
t
en
t
hDO
Conversion Time (See Figures 1, 2)●2.92.9µs
Maximum Sampling Frequency●250210kHz
Delay Time, CLK↑ to D
Delay Time, CS↑ to D
Delay Time, CLK↓ to D
Time Output Data RemainsC
Data Valid C
OUT
Hi-Z●120250120250ns
OUT
EnabledC
OUT
= 20pF130180130180ns
LOAD
= 20pF●100200100200ns
LOAD
= 20pF●4512045120ns
LOAD
●250250ns
Valid After CLK↑
t
r
t
f
C
IN
D
Rise TimeC
OUT
D
Fall TimeC
OUT
= 20pF●15401540ns
LOAD
= 20pF●15401540ns
LOAD
Input CapacitanceAnalog Input On Channel2020pF
Analog Input Off Channel55pF
Digital Input55pF
The ● denotes specifications which apply over the full operating
temperature range.
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 3: Integral nonlinearity is defined as deviation of a code from a
straight line passing through the actual endpoints of the transfer curve.
The deviation is measured from the center of the quantization band.
Note 4: Channel leakage current is measured after the channel selection.
Note 2: All voltage values are with respect to GND.
6
Page 7
LPER
FREQUENCY (kHz)
0
AMPLITUDE (dB)
–40
–20
–30
–10
0
1197/99 G06
–60
–80
–50
–70
–90
–100
50
100150200250
f
SMPL
= 500kHz
f
IN
= 97.045898kHz
FREQUENCY (kHz)
0
AMPLITUDE (dB)
–20
–30
–40
–50
–60
–70
–80
–90
–100
–10
0
1197/99 G09
50
100150200250
f
SMPL
= 500kHz
f
IN1
= 97.045898kHz
f
IN2
= 102.905273kHz
F
O
Supply Current vs Clock Rate*
20
18
16
14
12
10
8
6
SUPPLY CURRENT (mA)
4
2
0
10
VCC = 9V
VCC = 5V
VCC = 2.7V
100100010000
FREQUENCY (kHz)
R
ATYPICA
1197/99 G01
UW
CCHARA TERIST
E
C
Supply Current vs Supply Voltage
16
f
= 3.5MHz
CLK
= 25°C
T
14
A
12
10
8
6
SUPPLY CURRENT (mA)
4
2
0
3
10
2
SUPPLY VOLTAGE (V)
ICS
ACTIVE
MODE
SHUTDOWN
MODE
56789
4
1197/99 G02
LTC1197/LTC1197L
LTC1199/LTC1199L
80
70
60
50
40
30
20
10
0
10000
SHUTDOWN CURRENT (nA)
1000
100
10
SUPPLY CURRENT (µA)
1
0.1
0.01
Supply Current
vs Sampling Frequency
VCC = 5V
= 7.2MHz
f
CLK
VCC = 2.7V
= 3.5MHz
f
CLK
0.1
SAMPLING FREQUENCY (kHz)
10
1
100
1000
1197/99 G03
*Part is continuously sampling, spending only a minimum amount of time in shutdown.
INL Plot
1.0
0.5
0
INL (LSBs)
–0.5
–1.0
0
VCC = V
f
T
= 5V
REF
= 7.2MHz
CLK
= 25°C
A
128 256 384 512
640 768 896 1024
CODE
1197/99 G04
ENOBs vs FrequencyIntermodulation Distortion Plot
10
9
8
7
6
5
ENOBs
4
3
2
1
0
1
VCC = 2.7V
= 250kHz
f
SMPL
VCC = 5V
= 500kHz
f
SMPL
101001000
FREQUENCY (kHz)
1197/99 G07
DNL Plot
1.0
VCC = V
REF
= 7.2MHz
f
CLK
= 25°C
T
A
0.5
0
DNL (LSBs)
–0.5
–1.0
0
128 256 384 512
THD vs Frequency
0
TA = 25°C
–10
–20
–30
–40
THD (dB)
–50
–60
–70
–80
f
SMPL
10
= 5V
640 768 896 1024
CODE
= 2.7V
V
CC
= 250kHz
VCC = 5V
f
SMPL
1001000
FREQUENCY (kHz)
LTC1197 4096 Point FFT
1197/99 G26
= 500kHz
1197/99 G08
7
Page 8
LTC1197/LTC1197L
SUPPLY VOLTAGE (V)
0
CHANGE IN GAIN ERROR (LSBs)
0.2
0.6
1.0
4
1197/99 G12
–0.2
–0.6
0
0.4
0.8
–0.4
–0.8
–1.0
1
2
3
5
V
REF
= 2.5V
f
CLK
= 3.5MHz
SUPPLY VOLTAGE (V)
0
CHANGE IN GAIN ERROR (LSBs)
–2.0
1.0
0.5
0
1.5
2.0
2
4
59
1197/99 G15
–1.5
–1.0
–0.5
13
6
7
8
V
REF
= 4V
f
CLK
= 7MHz
T
A
= 25°C
LTC1199/LTC1199L
LPER
F
O
R
ATYPICA
UW
CCHARA TERIST
E
C
ICS
LTC1197L Change in Linearity
vs Supply Voltage
1.0
V
= 2.5V
REF
0.8
= 3.5MHz
f
CLK
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
CHANGE IN LINEARITY (LSBs)
–0.8
–1.0
1
0
2
SUPPLY VOLTAGE (V)
LTC1197 Change in Linearity
vs Supply Voltage
1.0
V
= 4V
REF
0.8
f
= 7MHz
CLK
= 25°C
T
A
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
CHANGE IN LINEARITY (LSBs)
–0.8
–1.0
13
2
0
SUPPLY VOLTAGE (V)
59
4
3
6
4
1197/99 G10
7
8
1197/99 G13
LTC1197L Change in Offset
vs Supply Voltage
2.0
V
= 2.5V
REF
= 3.5MHz
f
1.5
CLK
1.0
0.5
0
–0.5
–1.0
CHANGE IN OFFSET (LSBs)
–1.5
5
–2.0
1
0
SUPPLY VOLTAGE (V)
3
4
2
5
1197/99 G11
LTC1197 Change in Offset
vs Supply Voltage
2.0
V
= 4V
REF
= 7MHz
f
1.5
CLK
= 25°C
T
A
1.0
0.5
0
–0.5
–1.0
CHANGE IN OFFSET (LSBs)
–1.5
–2.0
123456789
0
SUPPLY VOLTAGE (V)
1197/99 G14
LTC1197L Change in Gain Error
vs Supply Voltage
LTC1197 Change in Gain Error
vs Supply Voltage
LTC1197 Linearity Error
vs Reference Voltage
2.0
1.5
1.0
0.5
LINEARITY ERROR (LSBs)
0
0
8
VCC = 5V
= 7.2MHz
f
CLK
= 25°C
T
A
1
REFERENCE VOLTAGE (V)
2
3
4
1197/99 F16
LTC1197 Offset Error
vs Reference Voltage
2.5
2.0
1.5
1.0
OFFSET ERROR (LSBs)
0.5
5
0
1
0
2
REFERENCE VOLTAGE (V)
3
VCC = 5V
= 7.2MHz
f
CLK
= 25°C
T
A
4
5
1197/99 G17
LTC1197 Gain Error
vs Reference Voltage
2.0
1.5
1.0
GAIN ERROR (LSBs)
0.5
0
1
0
REFERENCE VOLTAGE (V)
VCC = 5V
= 7.2MHz
f
CLK
= 25°C
T
A
3
4
2
5
1197/99 F18
Page 9
LPER
TEMPERATURE (°C)
–55 –30
–1.0
–1.2
–1.4
GAIN ERROR (LSBs)
0
–54570
1197/99 G21
–0.2
–0.4
–0.6
–0.8
2095 120
VCC = 5V
V
REF
= 5V
f
CLK
= 7.2MHz
TEMPERATURE (°C)
0
LEAKAGE CURRENT (nA)
1
10
100
100
1197/99 G24
0.1
0.01
0.001
25
50
75
125
V
REF
= 5V
V
CC
= 5V
ON CHANNEL
OFF CHANNEL
F
O
R
ATYPICA
UW
CCHARA TERIST
E
C
LTC1197/LTC1197L
LTC1199/LTC1199L
ICS
0.5
0.4
0.3
0.2
LINEARITY ERROR (LSBs)
0.1
0
–55 –30
1000
100
10
1
MINIMUM CLOCK FREQUENCY (kHz)
0.1
–55
100
10
1
ACQUISITION TIME (µs)
0.1
*As the CLK frequency is decreased from 2MHz, minimum CLK frequency (∆error ≤ 0.1LSB)
represents the frequency at which a 0.1LSB shift in any code translation from its 2MHz value
is first detected.
Linearity vs Temperature
VCC = 5V
= 5V
V
REF
= 7.2MHz
f
CLK
–54570
2095 120
TEMPERATURE (°C)
Minimum Clock Frequency for
0.1LSB Error* vs Temperature
V
= 5V
REF
= 5V
V
CC
–35 –15 5 25
TEMPERATURE (°C)
45 65 85 105 125
Acquisition Time
vs Source Resistance
VCC = V
= 5V
REF
= 25°C
T
A
+
R
SOURCE
V
IN
1001000
+INPUT
COM
SOURCE RESISTANCE (Ω)
1197/99 G19
1197/99 G22
10000
1197/99 G25
Offset vs Temperature
0
VCC = 5V
–0.1
–0.2
–0.3
–0.4
–0.5
–0.6
–0.7
OFFSET VOLTAGE (LSBs)
–0.8
–0.9
–1.0
V
REF
f
CLK
–55 –30
= 5V
= 7.2MHz
–54570
2095 120
TEMPERATURE (°C)
Digital Input Threshold
vs Supply Voltage
5
TA = 25°C
4
3
2
LOGIC THRESHOLD (V)
1
0
2
0
4
SUPPLY VOLTAGE (V)
Maximum Clock Frequency
vs Supply Voltage
11
V
= 2.5V
REF
10
= 25°C
T
A
9
8
7
6
5
4
3
2
MAXIMUM CLOCK FREQUENCY (MHz)
1
0
2
3
19
0
4
5
SUPPLY VOLTAGE (V)
†
Maximum CLK frequency represents the clock frequency at which a 0.1LSB shift in the error
at any code transition from its 3.5MHz value is first detected.
1197/99 G20
6
8
10
1197/99 G23
10000
1000
MAXIMUM CLOCK FREQUENCY (kHz)
6
7
8
10
1197/99 G26
Gain Error vs Temperature
Input Channel Leakage Current
vs Temperature
Maximum Clock Frequency
vs Source Resistance
V
REF
= 25°C
T
A
V
+INPUT
IN
–INPUT
–
R
SOURCE
100
100
SOURCE RESISTANCE (Ω)
100010000
= V
†
CC =
5V
1197/99 G27
9
Page 10
LTC1197/LTC1197L
LTC1199/LTC1199L
U
UU
PI FU CTIO S
CS (Pin 1): Chip Select Input. A logic low on this input
enables the LTC1197/LTC1197L/LTC1199/LTC1199L.
Power shutdown is activated when CS is brought high.
+IN, CH0 (Pin 2): Analog Input. This input must be free of
noise with respect to GND.
–IN, CH1 (Pin 3): Analog Input. This input must be free of
noise with respect to GND.
GND (Pin 4): Analog Ground. GND should be tied directly
to an analog ground plane.
V
(Pin 5): LTC1197/LTC1197L Reference Input. The
REF
reference input defines the span of the A/D converter and
must be kept free of noise with respect to GND.
W
BLOCK
IDAGRA
DIN (Pin 5):
LTC1199/LTC1199L Digital Data Input. The
A/D configuration word is shifted into this input.
D
(Pin 6): Digital Data Output. The A/D conversion
OUT
result is shifted out of this output.
CLK (Pin 7): Shift Clock. This clock synchronizes the serial
data transfer.
VCC (Pin 8):
Positive Supply. This supply must be kept
free of noise and ripple by bypassing directly to the
analog ground plane. For LTC1199/LTC1199L, V
REF
is
tied internally to this pin.
+IN (CH0)
–IN (CH1)
V
CC
BIAS AND
SHUTDOWN CIRCUIT
C
SMPL
GNDPIN NAMES IN PARENTHESES
–
+
MICROPOWER
COMPARATOR
CAPACITIVE DAC
V
REF
CSCLK
(DIN)
SERIAL PORT
SAR
REFER TO THE LTC1199/LTC1199L
D
OUT
10
Page 11
TEST CIRCUITS
D
OUT
WAVEFORM 1
(SEE NOTE 1)
V
IH
t
dis
90%
10%
D
OUT
WAVEFORM 2
(SEE NOTE 2)
CS
NOTE 1: WAVEFORM 1 IS FOR AN OUTPUT WITH INTERNAL CONDITIONS SUCH
THAT THE OUTPUT IS HIGH UNLESS DISABLED BY THE OUTPUT CONTROL
NOTE 2: WAVEFORM 2 IS FOR AN OUTPUT WITH INTERNAL CONDITIONS SUCH
THAT THE OUTPUT IS LOW UNLESS DISABLED BY THE OUTPUT CONTROL
1197/99 TC05
123456
D
IN
CLK
D
OUT
START
t
en
1197/99 TC06
CS
LTC1197/LTC1197L
LTC1199/LTC1199L
Load Circuit for t
TEST POINT
D
OUT
3k
20pF
Voltage Waveforms for D
V
t
hDO
IH
t
dDO
D
CLK
OUT
dDO
, tr, tf, t
OUT
and t
dis
VCC t
t
dis
en
WAVEFORM 2, t
dis
WAVEFORM 1
Delay Time, t
1197/99 TC02
1197/99 TC01
dDO
Voltage Waveforms for D
D
OUT
en
t
r
Voltage Waveforms for t
V
OH
V
OL
Rise and Fall Times, tr, t
OUT
t
f
dis
1197/99 TC04
f
V
OH
V
OL
LTC1197/LTC1197L ten Voltage Waveforms
CS
CLK
D
OUT
t
en
LTC1199/LTC1199L ten Voltage Waveforms
4321
1197/99 TC03
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LTC1199/LTC1199L
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OVERVIEW
The LTC1197/LTC1197L/LTC1199/LTC1199L are 10-bit
switched-capacitor A/D converters. These sampling ADCs
typically draw 5mA of supply current when sampling up to
500kHz (800µA at 2.7V sampling up to 250kHz). Supply
current drops linearly as the sample rate is reduced (see
Supply Current vs Sample Rate in the Typical Performance Characteristics). The ADCs automatically power
down when not performing a conversion, drawing only
leakage current. They are packaged in 8-pin MSOP and SO
packages. The LTC1197L/LTC1199L operate on a single
supply ranging from 2.7V to 4V. The LTC1197 operates on
a single supply ranging from 4V to 9V while the LTC1199
operates from 4V to 6V.
These ADCs contain a 10-bit, switched-capacitor ADC, a
sample-and-hold and a serial port (see Block Diagram).
Although they share the same basic design, the LTC1197/
LTC1197L and LTC1199/LTC1199L differ in some respects. The LTC1197/LTC1197L have a differential input
and have an external reference input pin. They can measure signals floating on a DC common mode voltage and
can operate with reduced spans down to 200mV. Reducing the span allows it to achieve 200µV resolution. The
LTC1199/LTC1199L have a 2-channel input multiplexer
with the reference connected to the supply (VCC) pin. They
can convert the input voltage of either channel with respect to ground or the difference between the voltages of
the two channels.
SERIAL INTERFACE
The LTC1199/LTC1199L communicate with microprocessors and other external circuitry via a synchronous, half
duplex, 4-wire serial interface while the LTC1197/
LTC1197L use a 3-wire interface (see Operating Sequence
in Figures 1 and 2). These interfaces are compatible with
both SPI and MICROWIRE protocols without requiring any
additional glue logic (see MICROPROCESSOR INTERFACES: Motorola SPI).
DATA TRANSFER
The CLK synchronizes the data transfer with each bit being
transmitted and captured on the rising CLK edge in both
transmitting and receiving systems. The LTC1199/
LTC1199L first receives input data and then transmits
back the A/D conversion result (half duplex). Because of
the half-duplex operation, DIN and D
may be tied
OUT
together allowing transmission over just three wires: CS,
CLK and DATA (DIN/D
OUT
).
Data transfer is initiated by a falling chip select (CS) signal.
After CS falls the LTC1199/LTC1199L look for a start bit on
the DIN input. After the start bit is received, the 3-bit input
word is shifted into the DIN input which configures the
LTC1199/LTC1199L and starts the conversion. After two
null bits, the result of the conversion is output on the D
OUT
line in MSB-first format. At the end of the data exchange
CS should be brought high. This resets the LTC1199/
LTC1199L in preparation for the next data exchange.
Bringing CS high after the conversion also minimizes
supply current if CLK is left running.
12
t
(14 CLKs )*
CYC
CS
t
suCS
CLK
D
OUT
1
HI-Z
t
SMPL
(1.5 CLKs)
*AFTER COMPLETING THE DATA TRANSFER, IF FURTHER CLOCKS ARE APPLIED WITH CS LOW,
THE ADC WILL OUTPUT ZEROS INDEFINITELY
NULL
BITS
Figure 1. LTC1197/LTC1197L Operating Sequence
B7B8B9
B6
t
CONV
(10.5 CLKs)
12
111098765432
t
dDO
B4B5
B3
B1
B2
1413
B0*
POWER
DOWN
1
Hi-Z
1197/99 F01
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LTC1197/LTC1197L
LTC1199/LTC1199L
PPLICATI
A
CS
CLK
D
IN
D
OUT
U
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IFORATIO
t
suCS
SGL/
DIFF
ODD/
SIGN
DUMMY
t
SMPL
(1.5 CLKs)
START
HI-Z
*AFTER COMPLETING THE DATA TRANSFER, IF FURTHER CLOCKS ARE APPLIED WITH CS LOW,
THE ADC WILL OUTPUT ZEROS INDEFINITELY
WU
t
en
NULL
BITS
U
t
(16 CLKs)*
CYC
t
dDO
B8B9
DON’T CARE
B6B7
t
CONV
(10.5 CLKs)
B5
Figure 2. LTC1199/LTC1199L Operating Sequence
14131211109876543211516
B1B2B3B4
B0*
POWER
DOWN
1
Hi-Z
1197/99 F02
The LTC1197/LTC1197L do not require a configuration
input word and have no DIN pin. A falling CS initiates data
transfer as shown in the LTC1197/LTC1197L operating
sequence. After CS falls, the second CLK pulse enables
D
. After two null bits, the A/D conversion result is output
OUT
on the D
line in MSB-first format. Bringing CS high
OUT
resets the LTC1197/LTC1197L for the next data exchange
and minimizes the supply current if CLK is continuously
running.
INPUT DATA WORD (LTC1199/LTC1199L ONLY)
The LTC1199 4-bit data word is clocked into the DIN input
on the rising edge of the clock after CS goes low and the
start bit has been recognized. Further inputs on the DIN pin
are then ignored until the next CS cycle. The input word is
defined as follows:
SGL/
ODD/
SIGN
DUMMYSTART
1197/99 AI01
DIFF
ADDRESS
MUX
Start Bit
The first “logical one” clocked into the DIN input after CS
goes low is the start bit. The start bit initiates the data
transfer and all leading zeros that precede this logical one
will be ignored. After the start bit is received the remaining
bits of the input word will be clocked in. Further inputs on
the DIN pin are then ignored until the next CS cycle.
Multiplexer (MUX) Address
The bits of the input word following the start bit assign the
MUX configuration for the requested conversion. For a
given channel selection, the converter will measure the
voltage between the two channels indicated by the “+” and
“–” signs in the selected row of the following table. In
single-ended mode, all input channels are measured with
respect to GND. Only the + inputs have sample-and-holds.
Signals applied at the – inputs must not change more than
the required accuracy during the conversion.
Multiplexer Channel Selection
MUX ADDRESS
SGL/DIFF
1
1
0
0
ODD/SIGN
CHANNEL #
1
+
–
+
GND
–
–
1197/99 AI02
0
+
0
1
0
1
+
–
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Dummy Bit
The dummy bit is a placeholder that extends the acquisition time of the ADC. This bit can be either high or low and
does not affect the conversion of the ADC.
Operation with DIN and D
Tied Together
OUT
The LTC1199/LTC1199L can be operated with DIN and
D
tied together. This eliminates one of the lines
OUT
required to communicate to the microprocessor (MPU).
Data is transmitted in both directions on a single wire. The
processor pin connected to this data line should be
configurable as either an input or an output. The LTC1199/
LTC1199L will take control of the data line and drive it low
on the 4th falling CLK edge after the start bit is received
(see Figure 3). Therefore the processor port line must be
switched to an input before this happens to avoid a
conflict.
In the Typical Applications section, there is an example of
interfacing the LTC1199/LTC1199L with D
IN
and D
OUT
tied together to the Intel 8051 MPU.
Unipolar Transfer Curve
The LTC1197/LTC1197L/LTC1199/LTC1199L are permanently configured for unipolar only. The input span and
code assignment for this conversion type are shown in the
following figures for a 5V reference.
Unipolar Transfer Curve
1 1 1 1 1 1 1 1 1 1
1 1 1 1 1 1 1 1 1 0
•
•
•
0 0 0 0 0 0 0 0 0 1
0 0 0 0 0 0 0 0 0 0
0V
1LSB
V
REF
– 2LSB
V
REF
– 1LSB
V
REF
1197/99 AI03
V
IN
Unipolar Output Code
INPUT VOLTAGE
= 5.000V)
OUTPUT CODE
1 1 1 1 1 1 1 1 1 1
1 1 1 1 1 1 1 1 1 0
•
•
0 0 0 0 0 0 0 0 0 1
0 0 0 0 0 0 0 0 0 0
INPUT VOLTAGE
V
– 1LSB
REF
V
– 2LSB
REF
•
•
1LSB
0V
(V
REF
4.99512V
4.99023V
•
•
4.88mV
0V
1197/99 AI04
ACHIEVING MICROPOWER PERFORMANCE
With typical operating currents of 5mA (LTC1197/
LTC1199) at 5V and 0.8mA (LTC1197L/LTC1199L) at
2.7V it is possible for these ADCs to achieve true
micropower performance by taking advantage of the
automatic shutdown between conversions. In systems
DATA (D
14
CS
1
CLK
)STARTSGL/DIFFODD/SIGNDUMMYB9NULL BITSB8
IN/DOUT
MPU CONTROLS DATA LINE AND SENDS
MUX ADDRESS TO LTC1199/LTC1199L
Figure 3. LTC1199/LTC1199L Operation with DIN and D
234
PROCESSOR MUST RELEASE
DATA LINE AFTER 4TH RISING CLK
AND BEFORE THE 4TH FALLING CLK
LTC1199/LTC1199L CONTROL DATA LINE
AND SEND A/D RESULT BACK TO MPU
LTC1199/LTC1199L TAKE CONTROL OF
DATA LINE ON 4TH FALLING CLK
Tied Together
OUT
1197/99 F03
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that convert continuously, the LTC1197/LTC1197L/
LTC1199/LTC1199L will draw their normal operating power
continuously. Several things must be taken into account
to achieve micropower operation.
Shutdown
Figures 1 and 2 show the operating sequence of the
LTC1197/LTC1197L/LTC1199/LTC1199L. The converter
draws power when the CS pin is low and powers itself
down when that pin is high. If the CS pin is not taken all the
way to ground when it is low and not taken to VCC when it
is high, the input buffers of the converter will draw current.
This current may be tens of microamps. It is worthwhile to
bring the CS pin all the way to ground when it is low and
all the way to VCC when it is high to obtain the lowest
supply current.
When the CS pin is high (= supply voltage), the converter
is in shutdown mode and draws only leakage current. The
status of the DIN and CLK inputs have no effect on supply
current during this time. There is no need to stop DIN and
CLK with CS = high, except the MPU may benefit.
Minimize CS Low Time
In systems that have significant time between conversions, lowest power drain will occur with the minimum CS
low time. Bringing CS low, transferring data as quickly as
possible, and then returning CS high will result in the
lowest possible current drain. This minimizes the amount
of time the device draws power. Even though the device
draws more power at high clock rates, the net power is less
because the device is on for a shorter time.
S
IFORATIO
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Lower Supply Voltage
For lower supply voltages, LTC offers the LTC1197L/
LTC1199L. These pin compatible devices offer specified
performance to 2.7V supplies.
OPERATING ON OTHER THAN 5V SUPPLIES
The LTC1197 operates from 4V to 9V supplies and the
LTC1199 operates from 4V to 6V supplies. The LTC1197L/
LTC1199L operate from 2.7V to 4V supplies. To use these
parts at other than 5V supplies a few things must be kept
in mind.
Bypassing
At higher supply voltages, bypass capacitors on VCC and
V
if applicable, need to be increased beyond what is
REF
necessary for 5V. For a 9V supply a 10µF tantalum in
parallel with a 0.1µF ceramic is recommended.
Input Logic Levels
The input logic levels of CS, CLK and DIN are made to meet
TTL threshold levels on a 5V supply. When the supply
voltage varies, the input logic levels also change. For the
ADC to sample and convert correctly, the digital inputs
have to meet logic low and high levels relative to the
operating supply voltage (see typical curve of Digital Input
Logic Threshold vs Supply Voltage). If achieving micropower consumption is desirable, the digital inputs
must go rail-to-rail between VCC and ground (see ACHIEVING MICROPOWER PERFORMANCE section).
Clock Frequency
D
Loading
OUT
Capacitive loading on the digital output can increase
power consumption. A 100pF capacitor on the D
can add 200µA to the supply current at a 7.2MHz clock
frequency. The extra 200µA goes into charging and dis-
charging the load capacitor. The same goes for digital lines
driven at a high frequency by any logic. The C • V • f currents
must be evaluated and the troublesome ones minimized.
OUT
pin
The maximum recommended clock frequency is 7.2MHz
for the LTC1197/LTC1199 running off a 5V supply and
3.5MHz for the LTC1197L/LTC1199L running off a 2.7V
supply. With the supply voltage changing, the maximum
clock frequency for the devices also changes (see the
typical curve of Maximum Clock Rate vs Supply Voltage).
If the maximum clock frequency is used, care must be
taken to ensure that the device converts correctly.
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Mixed Supplies
It is possible to have a microprocessor running off a 5V
supply and communicate with the ADC operating on 3V or
9V supplies. The requirement to achieve this is that the
outputs of CS, CLK and DIN from the MPU have to be able
to trip the equivalent inputs of the ADC and the output of
the ADC must be able to toggle the equivalent input of the
MPU (see typical curve of Digital Input Logic Threshold vs
Supply Voltage). With the LTC1197 operating on a 9V
supply, the output of D
may go between 0V and 9V. The
OUT
9V output may damage the MPU running off a 5V supply.
The way to solve this problem is to have a resistor divider
on D
(Figure 4) and connect the center point to the
OUT
MPU input. It should be noted that to get full shutdown, the
CS input of the ADC must be driven to the VCC voltage. This
would require adding a level shift circuit to the CS signal
in Figure 4.
9V
SAMPLE-AND-HOLD
The LTC1197/LTC1197L/LTC1199/LTC1199L provide a
built-in sample-and-hold (S/H) function to acquire signals. The S/H of the LTC1197/LTC1197L acquires input
signals for the “+” input relative to the “–” input during the
t
time (see Figure 1). However the S /H of the LTC1199/
SMPL
LTC1199L can sample input signals from the “+” input
relative to ground and from the “–” input relative to ground
in addition to acquiring signals from the “+” input relative
to the “–” input (see Figure 5) during t
SMPL
.
Single-Ended Inputs
The sample-and-hold of the LTC1199/LTC1199L allows
conversion of rapidly varying signals. The input voltage is
sampled during the t
time as shown in Figure 5. The
SMPL
sampling interval begins as the ODD/SGN bit is shifted in
and continues until the falling CLK edge after the dummy
bit is received. On this falling edge, the S/H goes into hold
mode and the conversion begins.
OPTIONAL
LEVEL SHIFT
CS
DIFFERENTIAL INPUTS
COMMON MODE RANGE
0V TO 6V
Figure 4. Interfacing a 9V-Powered LTC1197 to a 5V System
+IN
–IN
GND
LTC1197
V
CC
CLK
D
OUT
V
REF
4.7µF
9V
4.7k
MPU
(e.g. 8051)
P1.4
P1.3
P1.2
4.7k6V
5V
1197/99 F04
BOARD LAYOUT CONSIDERATIONS
Grounding and Bypassing
The LTC1197/LTC1197L/LTC1199/LTC1199L should be
used with an analog ground plane and single point grounding techniques. The GND pin should be tied directly to the
ground plane. The VCC pin should be bypassed to the
ground plane using a 1µ F tantalum capacitor with leads as
short as possible. All analog inputs should be referenced
directly to the single point ground. Digital inputs and
outputs should be shielded from and/or routed away from
the reference and analog circuitry.
Differential Inputs
With differential inputs, the ADC no longer converts just a
single voltage but rather the difference between two voltages. In this case, the voltage on the selected “+” input is
still sampled and held and therefore may be rapidly time
varying just as in single-ended mode. However, the voltage on the selected “–” input must remain constant and be
free of noise and ripple throughout the conversion time.
Otherwise, the differencing operation may not be performed accurately. The conversion time is 10.5 CLK cycles.
Therefore, a change in the “–” input voltage during this
interval can cause conversion errors. For a sinusoidal
voltage on the “–” input this error would be:
V
ERROR (MAX)
= V
• 2 • π • f(“–”) • 10.5/f
PEAK
CLK
Where f(“–”) is the frequency of the “–” input voltage,
V
is its peak amplitude and f
PEAK
CLK. In most cases V
will not be significant. For a
ERROR
is the frequency of the
CLK
60Hz signal on the “–” input to generate a 1/4LSB error
(1.22mV) with the converter running at CLK = 7.2MHz, its
peak value would have to be 2.22V.
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LTC1197/LTC1197L
LTC1199/LTC1199L
PPLICATI
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CLK
D
D
OUT
“+” INPUT
“–” INPUT
U
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CS
IN
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SGL/DIFFSTARTDUMMYODD/SGNDON‘T CARE
SAMPLEHOLD
“+” INPUT MUST
SETTLE DURING
THIS TIME
t
SMPL
1ST BIT TEST “–” INPUT MUST
SETTLE DURING THIS TIME
t
CONV
1197/99 F05
Figure 5. LTC1199/LTC1199L “+” and “–” Input Settling Windows
ANALOG INPUTS
Because of the capacitive redistribution A/D conversion
techniques used, the analog inputs of the LTC1197/
LTC1197L/LTC1199/LTC1199L have capacitive switching
input current spikes. These current spikes settle quickly
and do not cause a problem if source resistances are less
than 200Ω or high speed op amps are used (e.g., the
LT®1224, LT1191, LT1226 or LT1215). However, if large
source resistances are used or if slow settling op amps
drive the inputs, take care to ensure that the transients
caused by the current spikes settle completely before the
conversion begins.
“+” Input Settling
The input capacitor of the LTC1197/LTC1197L is switched
onto the “+” input in the falling edge of CS and the sample
time continues until the second falling CLK edge (see
Figure 1). However, the input capacitor of the LTC1199/
LTC1199L is switched onto “+” input after ODD/SGN is
clocked into the ADC and remains there until the fourth
falling CLK edge (see Figure 5). The sample time is 1.5 CLK
cycles before conversion starts. The voltage on the “+”
“+”
+
R
SOURCE
+
V
IN
R
SOURCE
–
V
IN
INPUT
C1
“–”
–
INPUT
C2
LTC1197/LTC1197L
LTC1199/LTC1199L
RON = 200Ω
C
IN
= 20pF
1197/99 F06
Figure 6. Analog Equivalent Circuit
input must settle completely within t
perform an accurate conversion. Minimizing R
for the ADC to
SMPL
SOURCE
+
and C1 will improve the input settling time (see Figure 6).
If a large “+” input source resistance must be used, the
sample time can be increased by using a slower CLK
frequency.
“–” Input Settling
At the end of t
, the input capacitor switches to the
SMPL
“–” input and conversion starts (see Figures 1 and 5).
During the conversion the “+” input voltage is effectively
“held” by the sample-and-hold and will not affect the
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LTC1199/LTC1199L
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conversion result. However, it is critical that the “–” input
voltage settles completely during the first CLK cycle of the
conversion time and be free of noise. Minimizing R
SOURCE
–
and C2 will improve settling time (see Figure 6). If a large
“–” input source resistance must be used, the time allowed
for settling can be extended by using a slower CLK
frequency.
Input Op Amps
When driving the analog inputs with an op amp it is
important that the op amp settle within the allowed time
(see Figure 5). Again, the “+” and “–” input sampling times
can be extended as described above to accommodate
slower op amps. High speed op amps such as the LT1224,
LT1191, LT1226 or LT1215 can be made to settle well even
with the minimum settling window of 200ns which occurs
at the maximum clock rate of 7.2MHz.
Source Resistance
The analog inputs of the LTC1197/LTC1197L/LTC1199/
LTC1199L look like a 20pF capacitor (CIN) in series with a
200Ω resistor (RON) as shown in Figure 6. CIN gets
switched between the selected “+” and “–” inputs once
during each conversion cycle. Large external source resistors and capacitors will slow the settling of the inputs. It is
important that the overall RC time constants be short
enough to allow the analog inputs to completely settle
within the allowed time.
RC Input Filtering
It is possible to filter the inputs with an RC network as
shown in Figure 7. For large values of CF (e.g., 1µF), the
capacitive input switching currents are averaged into a net
DC current. Therefore, a filter should be chosen with a
small resistor and large capacitor to prevent DC drops
across the resistor. The magnitude of the DC current is
approximately IDC = 20pF(VIN/t
) and is roughly pro-
CYC
portional to VIN. When running at the minimum cycle time
of 2µ s, the input current equals 50µA at VIN = 5V. In this
case a filter resistor of 10Ω will cause 0.1LSB of full-scale
error. If a larger filter resistor must be used, errors can be
eliminated by increasing the cycle time.
Input Leakage Current
Input leakage currents can also create errors if the source
resistance gets too large. For instance, the maximum
input leakage specification of 1µA (at 85°C) flowing through
a source resistance of 1k will cause a voltage drop of 1mV
or 0.2LSB. This error will be much reduced at lower
temperatures because leakage drops rapidly (see typical
curve of Input Channel Leakage Current vs Temperature).
REFERENCE INPUTS
The voltage on the reference input of the LTC1197/
LTC1197L defines the voltage span of the A/D converter.
The reference input transient capacitive switching currents are due to the switched-capacitor conversion technique used in these ADCs (see Figure 8). During
each bit
test of the conversion (every CLK cycle), a capacitive
current spike will be generated on the reference pin by the
ADC. These current spikes settle quickly and do not cause
a problem.
Reduced Reference Operation
The minimum reference voltage of the LTC1199 is 4V and
the minimum reference voltage of the LTC1199L is 2.7V
because the VCC supply and reference are internally tied
together. However, the LTC1197/LTC1197L can operate
with reference voltages below 1V.
18
I
R
VIN
DC
FILTER
C
F
Figure 7. RC Input Filtering
“
+
”
LTC1199
–
”
“
1197/99 F07
REF
5
R
OUT
V
REF
Figure 8. Reference Input Equivalent Circuit
GND
4
EVERY CLK CYCLE
R
ON
LTC1197
5pF TO 25pF
1197/99 F08
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LTC1199/LTC1199L
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The effective resolution of the LTC1197/LTC1197L can be
increased by reducing the input span of the converter. The
LTC1197/LTC1197L exhibits good linearity and gain over
a wide range of reference voltages (see typical curves of
Linearity and Full-Scale Error vs Reference Voltage). However, care must be taken when operating at low values of
V
because of the reduced LSB step size and the
REF
resulting higher accuracy requirement placed on the converter. The following factors must be considered when
operating at low V
1. Offset
2. Noise
3. Conversion speed (CLK frequency)
Offset with Reduced V
The offset of the LTC1197/LTC1197L has a larger effect on
the output code when the ADC is operated with reduced
reference voltage. The offset (which is typically a fixed
voltage) becomes a larger fraction of an LSB as the size of
the LSB is reduced. The typical curve of LTC1197 Offset
Error vs Reference Voltage shows how offset in LSBs is
related to reference voltage for a typical value of VOS. For
example, a VOS of 1mV which is 0.2LSB with a 5V reference
becomes 1LSB with a 1V reference and 5LSBs with a 0.2V
reference. If this offset is unacceptable, it can be corrected
digitally by the receiving system or by offsetting the “–”
input of the LTC1197/LTC1197L.
Noise with Reduced V
The total input referred noise of the LTC1197/LTC1197L
can be reduced to approximately 200µV peak-to-peak
using a ground plane, good bypassing, good layout techniques and minimizing noise on the reference inputs. This
noise is insignificant with a 5V reference but will become
a larger fraction of an LSB as the size of the LSB is reduced.
For operation with a 5V reference, the 200µV noise is
only 0.04LSB peak-to-peak. In this case, the LTC1197/
values.
REF
S
I FORATIO
REF
REF
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LTC1197L noise will contribute virtually no uncertainty
to the output code. However, for reduced references, the
noise may become a significant fraction of an LSB and
cause undesirable jitter in the output code. For example,
with a 1V reference, this same 200µV noise is 0.2LSB
peak-to-peak. This will reduce the range of input voltages over which a stable output code can be achieved. If
the reference is further reduced to 200mV, the 200µ V of
noise becomes equal to 1LSB and a stable code may be
difficult to achieve. In this case averaging readings may
be necessary.
This noise data was taken in a very clean setup. Any setupinduced noise (noise or ripple on VCC, V
to the internal noise. The lower the reference voltage to be
used, the more critical it becomes to have a clean, noisefree setup.
Conversion Speed with Reduced V
With reduced reference voltages the LSB step size is
reduced and the LTC1197/LTC1197L internal comparator
overdrive is reduced. Therefore, it may be necessary to
reduce the maximum CLK frequency when low values of
V
are used.
REF
Input Divider
It is OK to use an input divider on the reference input of the
LTC1197/LTC1197L as long as the reference input can be
made to settle within the bit time at which the clock is
running. When using a larger value resistor divider on the
reference input the “–” input should be matched with an
equivalent resistance.
Bypassing Reference Input with Divider
Bypassing the reference input with a divider is also possible. However, care must be taken to make sure that the
DC voltage on the reference input will not drop too much
below the intended reference voltage.
or VIN) will add
REF
REF
19
Page 20
LTC1197/LTC1197L
LTC1199/LTC1199L
PPLICATI
A
U
O
S
IFORATIO
WU
U
Signal-to-Noise Ratio
T
he signal-to-noise ratio (SNR) is the ratio between the
RMS amplitude of the fundamental input frequency to
the RMS amplitude of all other frequency components at
the A/D output. This includes distortion as well as noise
products and for this reason it is sometimes referred to
as signal-to-noise + distortion [S/(N + D)]. The output is
band limited to frequencies from DC to one half the
sampling frequency. Figure 9 shows spectral content
from DC to 250kHz which is 1/2 the 500kHz sampling
rate.
0
–10
–20
–30
–40
–50
–60
AMPLITUDE (dB)
–70
–80
–90
–100
50
0
100150200250
FREQUENCY (kHz)
Effective Number of Bits
The effective number of bits (ENOBs) is a measurement of
the resolution of an ADC and is directly related to the
S/(N + D) by the equation:
ENOB = [S/(N + D) –1.76]/6.02
where S/(N + D) is expressed in dB. At the maximum
sampling rate of 500kHz the LTC1197 maintains 9.5
ENOBs or better to 200kHz. Above 200kHz the ENOBs
gradually decline, as shown in Figure 10, due to increasing
second harmonic distortion. The noise floor remains
approximately 100dB.
f
= 500kHz
SMPL
= 97.045898kHz
f
IN
1197/99 G06
20
Figure 9. This Clean FFT of a 97kHz Input Shows Remarkable
Performance for an ADC Sampling at the 500kHz Rate
10
ENOBs
9
8
7
6
5
4
3
2
1
0
1
VCC = 2.7V
= 250kHz
f
SMPL
VCC = 5V
= 500kHz
f
SMPL
101001000
FREQUENCY (kHz)
1197/99 G07
Figure 10. Dynamic Accuracy is Maintained
Up to an Input Frequency of 200kHz for the
LTC1197 and 50kHz for the LTC1197L
Page 21
LTC1197/LTC1197L
LTC1199/LTC1199L
U
O
PPLICATITYPICAL
SA
MICROPROCESSOR INTERFACES
The LTC1197/LTC1197L/LTC1199/LTC1199L can interface directly (without external hardware to most popular
microprocessor (MPU) synchronous serial formats (see
Table 1). If an MPU without a dedicated serial port is used,
then three or four of the MPU’s parallel port lines can be
programmed to form the serial link. Included here is one
serial interface example and one example showing a
parallel port programmed to form the serial interface.
Table 1. Microprocessor with Hardware Serial Interfaces
Compatible with the LTC1197/LTC1197L/LTC1199/LTC1199L
The MC68HC05C4 has been chosen as an example of an
MPU with a dedicated serial port. This MPU transfers data
MSB-first and in 8-bit increments. With two 8-bit transfers, the A/D result is read into the MPU. The first 8-bit
transfer sends the DIN word to the LTC1199 and clocks the
two ADC MSBs (B9 and B8) into the MPU. The second 8bit transfer clocks the next 8 bits, B7 through B0, of the
ADC into the MPU.
ANDing the first MPU received byte with 03Hex clears the
six MSBs. Notice how the position of the start bit in the D
IN
word is used to position the A/D result so that it is rightjustified in two memory locations.
TM
TM
MICROWIRE and MICROWIRE/PLUS are trademarks of
National Semiconductor Corp.
21
Page 22
LTC1197/LTC1197L
LTC1199/LTC1199L
PPLICATITYPICAL
START
BIT
MPU TRANSMIT
WORD
CS
D
CLK
IN
1
STARTDUMMY
U
O
SA
Data Exchange Between LTC1199 and MC68HC05C4
BYTE 1BYTE 2 (DUMMY)
SGL/
DIFF
SGL/
DIFF
ODD/
SIGN
DUMMY
ODD/
SIGN
XXXX
XXXXXXXX
DON‘T CARE
X = DON‘T CARE
D
OUT
MPU RECEIVED
WORD
????00B9B8
B9B8B7B6 B5B4B3 B2B1 B0
Hardware and Software Interface to Motorola MC68HC05C4
C0
SCK
MC68HC05C4
MISO
MOSI
1197/99 TA04
MSB
BYTE 1
LSB
BYTE 2
1197/99 TA05
ANALOG
INPUTS
LOCATION A
LOCATION A + 1
CS
LTC1199
D
from LTC1199 Stored in MC68HC05C4
OUT
000000B9B8
B7B6B5B4B3 B2B1B0
CLK
D
IN
D
OUT
B7B6 B5B4B3B2B1B0
2ND TRANSFER1ST TRANSFER
1197/99 TA03
LABELMNEMONICCOMMENTS
STARTBCLRnBit 0 Port C goes low (CS goes low)
LDALoad LTC1199 D
STALoad LTC1199 D
word into ACC
IN
word into SPI from ACC
IN
Transfer begins
TSTTest status of SPIF
BPLLoop to previous instruction if not done
with transfer
LDALoad contents of SPI data register
into ACC (D
OUT
MSBs)
STAStart next SPI cycle
ANDClear 6 MSBs of the first D
OUT
word
STAStore in memory location A (MSBs)
TSTTest status of SPIF
BPLLoop to previous instruction if not done
with transfer
BSETnSet B0 of Port C (CS goes high)
LDALoad contents of SPI data register into
OUT
LSBs)
ACC. (D
STAStore in memory location A + 1 (LSBs)
22
Page 23
LTC1197/LTC1197L
LTC1199/LTC1199L
U
O
PPLICATITYPICAL
SA
Interfacing to the Parallel Port of the
Intel 8051 Family
The Intel 8051 has been chosen to demonstrate the
interface between the LTC1199 and parallel port microprocessors. Normally the CS, CLK and DIN signals would
be generated on three port lines and the D
signal read
OUT
on a fourth port line. This works very well. However, we
will demonstrate here an interface with the DIN and D
OUT
of the LTC1199 tied together as described in the
SERIAL INTERFACE section. This saves one wire.
The 8051 first sends the start bit and MUX address to the
LTC1199 over the data line connected to P1.2. Then P1.2
is reconfigured as an input (by writing to it a one) and
the 8051 reads back the 8-bit A/D result over the same
data line.
ANALOG
INPUTS
LTC1199
CS
CLK
D
OUT
D
IN
MUX ADDRESS
A/D RESULT
P1.4
P1.3
P1.2
8051
1197/99 TA06
LABELMNEMONIC OPERANDCOMMENTS
MOVA, #FFHDIN word for LTC1199
SETBP1.4Make sure CS is high
CLRP1.4CS goes low
MOVR4, #04Load counter
LOOP 1RLCARotate D
CLRP1.3CLK goes low
MOVP1.2, COutput D
SETBP1.3CLK goes high
DJNZR4, LOOP 1Next bit
MOVP1, #04Bit 2 becomes an input
CLRP1.3CLK goes low
MOVR4, #0AHLoad counter
LOOPMOVC, P1.2Read data bit into Carry
RLCARotate data bit into ACC
SETBP1.3CLK goes high
CLRP1.3CLK goes low
DJNZR4, LOOPNext bit
MOVR2, AStore MSBs in R2
MOVC, P1.2Read data bit into Carry
SETBP1.3CLK goes high
CLRP1.3CLK goes low
CLRAClear ACC
RLCARotate data bit from Carry to
ACC
MOVC, P1.2Read data bit into Carry
RRCARotate right into ACC
RRCARotate right into ACC
MOVR3, AStore LSBs in R3
SETBP1.4CS goes high
bit into Carry
IN
bit into Carry
IN
DATA (D
D
from LTC1199 Stored in 8051 RAM
OUT
MSB
R2
B9B8B7B6B5B4B3B2
LSB
R3
B1B0000000
CS
1
CLK
)
IN/DOUT
START
AS AN INPUT AFTER THE 4TH RISING
CLK AND BEFORE THE 4TH FALLING CLK
SGL/
DIFF
8051 P1.2 OUTPUTS DATA
TO LTC1199
8051 P1.2 RECONFIGURED
1197/99 TA07
234
ODD/
DUMMY
SIGN
B9
B8B7B6B5B4B3B2B1B0
LTC1199 TAKES CONTROL OF DATA LINE
ON 4TH FALLING CLK
LTC1199 SENDS A/D RESULT
BACK TO 8051 P1.2
1197/99 TA08
23
Page 24
LTC1197/LTC1197L
LTC1199/LTC1199L
PPLICATITYPICAL
O
U
SA
A “Quick Look” Circuit for the LTC1197
Users can get a quick look at the function and timing of
the LTC1197 by using the following simple circuit (Figure
11). V
is tied to VCC. VIN is applied to the +IN input and
REF
the –IN input is tied to the ground. CS is driven at 1/16
the clock rate by the 74HC161 and D
The output data from the D
pin can be viewed on an
OUT
V
IN
outputs the data.
OUT
1µF
+
CS
+IN
–IN
GND
LTC1197
D
V
VCC
CLK
OUT
REF
5V
10k
10k
D
CLK CS
OUT
TO OSCILLOSCOPE
oscilloscope that is set up to trigger on the falling edge
of CS (Figure 12). Note that after the LSB is clocked out,
the LTC1197 clocks out zeros until CS goes high. Also
note that with the resistor divider on D
the output
OUT
goes midway between VCC and ground when in the high
impedance mode.
CLR
V
74HC161
CC
RC
QA
QB
QC
QD
T
LOAD
CLK
A
B
C
D
P
GND
CLK IN 7.2MHz MAX
5V
1197/99 F11
Figure 11. “Quick Look” Circuit for the LTC1197
CS
CLK
D
OUT
HIGH
IMPEDANCE
2 NULL
MSB
BITS
(B9)
VERTICAL: 5V/DIV
HORIZONTAL: 10µs/DIV
LSB
(B0)
FILL
ZEROES
Figure 12. Scope Photo of the LTC1197 “Quick Look” Circuit
Waveforms Showing A/D Output 1001001001 (249
HEX
)
24
Page 25
LTC1197/LTC1197L
LTC1199/LTC1199L
U
O
PPLICATITYPICAL
SA
Resistive Touchscreen Interface
Figure 13 shows the LTC1199 in a 4-wire resistive touchscreen application. Transistor pairs Q1-Q3, Q2-Q4 apply
5V and ground to the X axis and Y axis, respectively. The
LTC1199, with its 2-channel multiplexer, digitizes the
voltage generated by each axis and transmits the conversion results to the system’s processor through a serial
5V
R7
R6
100k
TOUCH SENSE
4.7k
+
Y
–
X
R9
100k
–
Y
+
X
1000pF
R8
4.7k
74HC14
C6
Q3
2N2222A
R10
4.7k
R11
100k
Q2
2N2907
C5
1000pF
Q4
2N2222A
interface. RC combinations R1C1, R2C2 and R3C3 form
lowpass filters that attenuate noise from possible sources
such as the processor clock, switching power supplies
and bus signals. The 74HC14 inverter is used to detect
screen contact both during a conversion sequence and to
trigger its start. Using the single channel LTC1197, 5-wire
resistive touchscreens are as easily accommodated.
R3
10Ω
+
C3
8
VCC
7
CLK
6
D
OUT
5
D
IN
2N2907
C7
1000pF
R7
Q1
C4
1000pF
R12
100k
100k
R6
4.7k
R1
100Ω
R2
100Ω
C1
1µF
C2
1µF
10µF
LTC1199
1
CS
2
CH0
3
CH1
4
GND
CHIP SELECT
SERIAL CLK
DATA IN
DATA OUT
Figure 13. The LTC1199 Digitizes Resistive Touchscreen X and Y Axis Voltages. The ADC’s Auto Shutdown Feature
Helps Maximize Battery Life in Portable Touchscreen Equipment
1197/99 F13
25
Page 26
LTC1197/LTC1197L
LTC1199/LTC1199L
PPLICATITYPICAL
O
U
SA
Battery Current Monitor
The LTC1197L/LTC1199L are ideal for 3V systems. Figure 14 shows a 2.7V to 4V battery current monitor that
draws only 45µA at 3V from the battery it monitors,
sampling at a 1Hz rate. To minimize supply current, the
microprocessor uses the LTC1152 SHDN pin to turn on
the op amp prior to making a measurement and then turn
it off after the measurement has been made. The battery
current is sensed with the 0.005Ω resistor and amplified
500pF
2.7V
TO 4V
L
O
A
0.005Ω
D
2A FULL
SCALE
2k
–
SHDN
LTC1152
+
240k
by the LTC1152. The LTC1197L digitizes the amplifier
output and sends it to the microprocessor in serial
format. After each sample the LTC1197L automatically
powers down. The LT1004 provides the full-scale reference for the ADC. The circuit’s 45µA supply current is
dominated by the reference and the op amp. The circuit
can be located near the battery and data transmitted
serially to the microprocessor.
+
1µF
56kTO µP
LT1004-1.2
100Ω
1µF
1
2
3
4
LTC1197L
CS
+IN
–IN
GND
D
V
VCC
CLK
OUT
REF
0.1µF
8
7
6
5
Figure 14. This 0A to 2A Battery Current Monitor Draws Only 45µA from a 3V Battery
26
Page 27
PACKAGE DESCRIPTIO
LTC1197/LTC1197L
LTC1199/LTC1199L
U
Dimensions in inches (millimeters), unless otherwise noted.
MS8 Package
8-Lead Plastic MSOP
(LTC DWG # 05-08-1660)
0.118 ± 0.004*
(3.00 ± 0.10)
8
7
6
5
0.192 ± 0.004
(4.88 ± 0.10)
12
3
0.040 ± 0.006
SEATING
PLANE
(1.02 ± 0.15)
0.012
(0.30)
0.007
(0.18)
0.021 ± 0.004
(0.53 ± 0.01)
*DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
0° – 6° TYP
S8 Package
8-Lead Plastic Small Outline (Narrow 0.150)
(LTC DWG # 05-08-1610)
0.189 – 0.197*
(4.801 – 5.004)
7
8
0.118 ± 0.004**
(3.00 ± 0.10)
4
0.006 ± 0.004
(0.15 ± 0.10)
0.025
(0.65)
TYP
5
6
MSOP08 0596
0.010 – 0.020
(0.254 – 0.508)
0.008 – 0.010
(0.203 – 0.254)
*
DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**
DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
× 45°
0°– 8° TYP
0.016 – 0.050
0.406 – 1.270
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.228 – 0.244
(5.791 – 6.197)
0.053 – 0.069
(1.346 – 1.752)
0.014 – 0.019
(0.355 – 0.483)
0.150 – 0.157**
(3.810 – 3.988)
1
3
2
4
(0.101 – 0.254)
0.050
(1.270)
TYP
0.004 – 0.010
SO8 0996
27
Page 28
LTC1197/LTC1197L
LTC1199/LTC1199L
RELATED PARTS
PART NUMBERSAMPLE RATEPOWER DISSIPATIONDESCRIPTION
8-Bit, Pin Compatible Serial Output ADCs