PREPARED BY:
APPROVED BY:
SHAR!FW$~~~~~;~.,
DG-001019
Jan/19/00
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.
13 pages
ELECTRONIC COMPONENTS GROUP
SHARP CORPORATION
‘-*+E’~SE~~T~ DMSION:
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SPECIFICATION
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DEVICE SPECIFICATION FOR
Light Emitting Diode
MODEL No.
LTlE9OA
/
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp’s consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting kom use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas;
[
* OA equipment * Audio visual equipment
* Home appliance
* Telecommunication equipment (Terminal) * Measuring equipment
* Tooling machines * Computers
I
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3), please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in fimction and precision, such as ;
[
* Transportation control and safety equipment (aircraft, train automobile etc.)
* Traffic signals * Gas leakage sensor breakers * Rescue and security equipment
l
Other safety equipment
I
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
I
* Space equipment * Telecommunication equipment (for trunk lines)
* Nuclear power control equipment * Medical equipment
1
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMERS APPROVAL
-
DATE:
BY:
Department General Manager of
Engineering Dept.,IB
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPORATION
1. Application
This specification applies to the light emitting diode device Model No. LTlESOA.
[GaP(Yellow-green)cbip LED device]
2. Outline dimensions and terminal
cormecti~n~
. ..-..............-....Refer to the attached sheet Page 2.
3. Ratings and characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 3-5.
3- 1. Absolute maximum ratings
3-2. Electra-optical characteristics
3-3. Derating Curve
3-4. Characteristics Diagram
4. Reliability
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 6.
4- 1. Test items and test conditions
4-2. Failure judgement criteria
5. Incoming inspection
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...*
Refer to the attached sheet Page 7.
5-I. hrspection method
5-2. Description of inspection and criteria
6. Taping specification
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*.......*.....*
Refer to the attached sheet Page 8-10.
6-1. Taping
6-2. Packing specification
6-3. Label
6-4. Luminous intensity rank
7. Soldering
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page Il.
7- 1. Reflow soldering
8
Precautionsforuse...............................................
Refer to the attached sheet Page 12.
8-1. Precautions matters for designing circuit
8-2. Cleaning method
9 Environment.....................................................
Refer to the attached sheet Page 12.
9-l. Ozonosphere destructive chemicals.
9-2. Bromic non-burning materials
2. Outline dimensions and terminal connections
3. 6
Cathcde mark(blacti
n
cc
-6
.
t
Terminal connection
,I;x
O-Anode
oc
athode
0-Q
unit
mm
Material
Finish
Drawing No.
PW:
Glass-Epoxy
Resin:
Epoxy
Au Plated
51201002
3. Ratings and characteristics
(Notel) Duty ratio=l/lO,Pulse width=O.lms
(Note2) Manual soldering Max3s
(Note 3)Measured by SHARP EG&G MODEL550(Radiometer/Photometersyste- (Tolerance : f 15%)
3-3. Derating Curve
Forward Cm-rent Derating Curve
Peak Forward Current Derating Curve
60
0
-25 0 25 50 7565100 125
Ambient Temperature Ta(“C)
Peak Forward Current vs. Duty Ratio
(Ta=259c)
$
60
j 50
E
40
E
6 30
-$j
20
2
g
10
+i k
0
-25 0 25 50 7565100 125
Ambient Temperature Ta(%)
I
l/loo
l/10 1 10
I
Duty Raito
34. Characteristics Diagram(typ) (Note I)
Forward Current vs.Forward Voltage
CTa=250C)
1 1.2 1.4 1.6 1.6 2 2.2 2.4
Forward Voltage VF(V)
R&he, Luminous Iitedy -a!. Forward CmmB
Cla=250C)
1000%
Forward Current IF(mA)
Relative Luminous Intensity
vs. Ambient Temperature
IIF=2omAI
loo0
Q
@
.2
E
Y
2 loo
0
.c
E
3
8
2
3
3 1ol"""""""""
-60 -40 -20 0 20 40 60 80 100 120
Ambient Temprature Ta(“C)
(Note 1) Above characteristic data are typical data and not a guarantteed data.
4. Reliability
The reliability of products shall be satisfied with items listed below.
4- 1. Test items and test conditions
I
Test items
I
Test conditions
Confidence level: 90%
temperature cycling I -25”c(3Omin)-+lOO”c(3Omin),3Otimes
High temp. and high
humidity storage
Ta=+60”C, 9O%RH, t-500h
High temperature storage Ta=lOO”C,t=SOOh
Low temperature storage I Ta=-25”C,t-500h
Operating test
Ta=25”C,I,=30mA,t=50Oh
Mechanical shock
15 ooom/s2, o.sms,
3times I *X&Y+Z direction
Variable f?equency I 200m/s2, 100-2 000-IOOHAsweepfor 4min.,
vibration 4times/*X.*Y.*Z direction
Soldering heat
Refer to the attached sheet,
Page 11/12 ltimes
n=22, c=o 10
n=22, c=o 10
n=22, c=o 10
n=22, c=o
10
n=22, C=O
10
n=ll, C=O 20
n=ll, C=O 20
n=ll, c=O 20
4-2. Failure judgement criteria * 1
Parameter Symbol Failure judgement criteria *2
Forward voltage
VF
VF > u&L. x 1.2
Reverse current
IR
IR > U.S.L. x 2.0
Luminous intensity
Iv The Grst stage value X 0.5 > Iv
* 1: Meas+g condition is in accordance with specification.
*2: U.S.L. is shown by Upper Specification Limit.
5. Incoming inspection
5- 1. Inspection method
A single sampling plan, normal inspection level S4 based on IS0 2859-l shall be adopted.
5-2. Description of inspection and criteria
JO.
Inspection items
Criteria
Defect
AQL
1 Radiation color
Not correct
2 Taping
Product inserted in reverse direction
Major
defect
0.1%
3 Solderability 1
Plating abnormality observed over 50% or
greater percentage * 1
4
Electra-optical
characteristics
Not conforming to, the specification
5 Outline dimensions
Not conforming to the specification
6 Appearance
Dust : @ 0.8mm or more
Thread dust : 2Smm or more in length and 0.25mm or
more in width
Air bubbles : 4 0.8mm or more
Scratch : 2.5mm or more in length and 0.25mm or more in
width
However&e product is qualified as a good unit if the
scrach does not touch the Auwire.when seen from the front.
Resin barr : Over the unspecified tolerance
Minor
defect
0.4%
Resin ond plated crack :0.3mrn or more
7 Solderability 2
could solder 50% or greater and less than 90% out of
judgement area * 1
. _
6-l .Taping
6-I-l.Shape and dimension of tape(TYP.)
ension exe
6-I-2.Shape and dimension of reel(TYP.)
Parameter Symbol ~Dimaasio~/
Remarks
6-l-3 .Taping specification
6-2-2.Strage
conditions
Temperature : 5 to 30°C Humidity : less than 6O%RH
*Recommendable conditions:
0 in taping
Temprature:60”C to 65”C,Time:36 to 48 hours
@ in individual (on PWB or metallic tray)
Temprature:100°Cto1200C ,Time:2 to 3 hours
(2) Cover tape strength against peeling:F=O.l-UN( 6 =lOOor less)
Cover tape
t ’ - ‘Tape speed :
5mm/s
<- Forward
Carrier tape
(3) Tape strength against bending:
The radius of bending circle should be 30mm or more.
If it is less than 3Omm, the cover may peel.
(4) Jointing of tape:
There should not be joint of cover tape or carrier tape.
(5) Quantity per reel:
Average 3,OOOpcs. per reel
(6) Mass per product:
Average 0.02g I product
(7)Mass per packing:
Average 15Og I packing
(8) Others: @ There should not be missing above continuous three products.
@ Products should be easily taken out.
@ Products should not be attached to the cover tape at peeling.
6-2. Packing specification
6-2-l. Dampproof package
In other to avoid the absorption of humidity in transport and storage,
the products are packed
in aluminum sleeve.
Label
6-2-3.Treatment after opening
(1) Please make a soldering within 15 days after opening under following condition;
Temperature : 5 to 30°C Humidity : less than 6O%RH
(2) In case the devices are not used for a long time after opening ,tbe storage in dry box is recommendable.
Or it is better to repack the devices with a desiccative by tbe sealer and put them in the some storage
conditions as 6-2-2. Then they should be used within 15 days.
(3) Please make a soldering after a following baking treatment if unused term should be over the conditions of (2)
PART No.
- Model number
- Quantityofproducts
3T No.IW9819
+ EL4J C-3 Bar code
- Lot m&ber(Notel) and Luminous rank
- Production Cm@’
(Note l)Lot number indication
0 Production plant code(to be indicated alphabetically)
@ Prod&ion lot(smgle or double figures)
@ Year of production(the last two figures of the year)
@ Month of production
(to be indicated alphabetically with January corresponding to A)
L
@ Date of production(0 l-3 1)
64Luminous intensity rank (Note2) (Note3)
A
B
C
D
,!
I
Luminous intensity Unit
13.6 - 22.1
16.3 - 265
19.6
- 31.7
23.5 - 38.2
mcd
Ta=25”C)
Condition
Ir=2OmA
I
I 1 58.5 - 95.0
J
1 70.2 -
(114.0)
(Tolerance : f 15%)
(Note 2) Not ask the delivery ratio of each rank.
(Note 3)
In case of the distribution of the hrminous intensity shift to high, at that point new upper rank is
prescribed and lower rank is delete.
7- 1 Jteflow soldering
(1) It is not recommended to exceed the soldering temperature and time shown below.
Caused by substrate- bend or the other mechanical stress during reflow soldering
may happen Au wire disconnection etc. Therefore please check and study your
solder reflow machine’s beat condition.
(2) Reflow soldering temper&u-e profile
to be done under the following condition.
Time(s)
Recommendable Thermal Model
(3) Recommendable Metal Mask pattern for screen print
Recommend OSmm to 0.7mm thickness metal mask
for screen print. Caused by solder reflow condition,
solder paste, substrate and the other material etc.,
may change solderability.
Please check and study actual solderability before
usage.
/ -.
Center of the product
._
J I
w
c\i
* 1.75 - & 2 0 - _ 1.75 ~
I --
-
Recommended soldar pattern (U&mm)
Jad19IOO
8. Precautions for use
8- 1. Precautions matters for designing circuit
This product is not designed as electromagnetic and ionized-particle radiation resistant
8-2. Cleaning method
Please use only the following types of solvenL”water”
Recommend conditions:
RT. 4OkHz,3OW/l, time is less than 3 minutes
Please check the effect on the product from ultrasonic bath, ultrasonic output, duration, board size method.
and product mounting
Please test the cleaning method under actual conditions and check for abnormalities before actual use.
9. Enviromnent
9- 1. Ozonosphere destructive chemicals.
(1) The product doesn’t contain following substance.
(2) The product doesn’t have a production line whose process requires following substance.
Restricted part: CFCs,haloneqCCl.+Trichloroethane(Methychloroform)
9-2. Bromic non-burning materials
The product doesn’t contain bromic non-burning materials(PBBOs,PBBs)
LT1E90A, surface mount, yellow-green, 3 mm x 3 mm, 670 nm, chip LED
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