Datasheet LS833, LS832, LS831, LS830 Datasheet (Linear Integrated System Linear Systems)

Page 1
Linear Integrated Systems
Linear Integrated Systems
4042 Clipper Court, Fremont, CA 94538 • TEL: (510) 490-9160 • FAX: (510) 353-0261
1 7
35
BOTTOM VIEW
2 6
22 X 20 MILS
S1 G2
D2
D1
G1 S2
S1 G2
D1 D2
ELECTRICAL CHARACTERISTICS @ 25°C (unless otherwise noted) SYMBOL CHARACTERISTICS LS830 LS831 LS832 LS833 UNITS CONDITIONS
|∆V
GS1-2
/∆T| max. Drift vs. Temperature 5 10 20 75 µV/°CVDG= 10V ID= 30µA
TA= -55°C to +125°C
|V
GS1-2
| max. Offset Voltage 25 25 25 25 mV VDG= 10V ID= 30µA
-IG max Operating 0.1 0.1 0.1 0.5 pA
-IG max High Temperature 0.1 0.1 0.1 0.5 nA TA= +125°C
-I
GSS
At Full Conduction 0.2 0.2 0.2 1.0 pA
-I
GSS
High Temperature 0.5 0.5 0.5 1.0 nA VGS= 0 VGS= -20V
T
A
= +125°C
ULTRA LOW LEAKAGE LOW DRIFT
MONOLITHIC DUAL
N-CHANNEL JFET
LS830 LS831 LS832 LS833
FEATURES
ULTRA LOW DRIFT |∆V
GS1-2
/∆T|= 5µV/°C max.
ULTRA LOW LEAKAGE I
G
= 80fA TYP.
LOW NOISE e
n
= 70nV/√Hz TYP.
LOW CAPACITANCE C
ISS
= 3pf MAX.
ABSOLUTE MAXIMUM RATINGS NOTE 1
@ 25°C (unless otherwise noted)
Maximum Temperatures
Storage Temperature -65° to +150°C Operating Junction Temperature +150°C
Maximum Voltage and Current for Each Transistor NOTE 1
-V
GSS
Gate Voltage to Drain or Source 40V
-V
DSO
Drain to Source Voltage 40V
-I
G(f)
Gate Forward Current 10mA
-I
G
Gate Reverse Current 10µA
Maximum Power Dissipation
Device Dissipation @ Free Air - Total 40mW @ +125°C
SYMBOL CHARACTERISTICS MIN. TYP. MAX. UNITS CONDITIONS
BV
GSS
Breakdown Voltage 40 60 -- V VDS= 0 ID= 1nA
BV
GGO
Gate-to-Gate Breakdown 40 -- -- V IG= 1nA ID= 0 IS= 0
TRANSCONDUCTANCE
Y
fss
Full Conduction 70 300 500 µmho VDG= 10V VGS= 0 f= 1kHz
Y
fs
Typical Operation 50 100 200 µmho VDG= 10V ID= 30µA f= 1kHz
|Y
fs1-2/Yfs
| Mismatch -- 1 5 %
DRAIN CURRENT
I
DSS
Full Conduction 60 400 1000 µAVDG= 10V VGS= 0
|I
DSS1-2/IDSS
| Mismatch at Full Conduction -- 2 5 %
GATE VOLTAGE
VGS(off) or V
P
Pinchoff Voltage 0.6 2 4.5 V VDS= 10V ID= 1nA
V
GS
Operating Range -- -- 4 V VDG= 10V ID= 30µA
GATE CURRENT
I
GGO
Gate-to-Gate Leakage -- 1 -- pA VGG= 20V
Page 2
Linear Integrated Systems
4042 Clipper Court, Fremont, CA 94538 • TEL: (510) 490-9160 • FAX: (510) 353-0261
SYMBOL CHARACTERISTICS MIN. TYP. MAX. UNITS CONDITIONS
OUTPUT CONDUCTANCE
Y
OSS
Full Conduction -- -- 5 µmho VDG= 10V VGS= 0
Y
OS
Operating -- -- 0.5 µmho VDG= 10V ID= 30µA
|Y
OS1-2
| Differential -- -- 0.1 µmho
COMMON MODE REJECTION
CMR -20 log |∆V
GS1-2
/∆VDS|--90--dB∆V
DS
= 10 to 20V ID= 30µA
CMR -20 log |∆V
GS1-2
/∆VDS|--90--dB∆V
DS
= 5 to 10V ID= 30µA
NOISE
NF Figure -- -- 1 dB V
DS
= 10V VGS= 0 RG= 10MΩ
f= 100Hz NBW= 6Hz
e
n
Voltage -- 20 70 nV/√Hz VDG= 10V ID= 30µA f= 10Hz
NBW= 1Hz
CAPACITANCE
C
ISS
Input -- -- 3 pF VDS= 10V VGS= 0 f= 1MHz
C
RSS
Reverse Transfer -- -- 1.5 pF VDS= 10V VGS= 0 f= 1MHz
C
DD
Drain-to-Drain -- -- 0.1 pF VDG= 10V ID= 30µA
NOTES:
1. These ratings are limiting values above which the serviceability of any semiconductor may be impaired.
TO-71
Six Lead
0.230
0.209
DIA.
DIA.
0.195
0.175
0.030 MAX.
0.500 MIN.
0.150
0.115
0.019
0.016
DIA.
6 LEADS
3
2
1
8
4
5
6
0.046
0.036
45°
0.048
0.028
0.100
0.050
7
TO-78
0.335
0.370
0.305
0.335
0.016
0.019
0.165
0.185
0.040
MAX.
DIM. A
0.016
0.021 DIM. B
MIN. 0.500
0.200
0.100
0.100
0.028
0.034
45°
1
2
3
4
5
6
7
8
0.029
0.045
SEATING
PLANE
S1 1
2 3 45
6
7
8
D1 SS G1 S2
G2
SS
D2
P-DIP
S1 1
2 3 45
6
7
8
D1 SS G1
S2
G2 SS D2
0.150
0.158
(3.81) (4.01)
0.188
0.197
0.228
0.244
(5.79) (6.20)
SOIC
0.320
0.290
(8.13) (7.37)
0.405 MAX.
(10.29)
(4.78) (5.00)
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