Datasheet LP62S1024BX-70LLIF, LP62S1024BU-70LLI, LP62S1024BM-70LLI, LP62S1024BM-55LLI, LP62S1024BX-55LLI Datasheet (AMIC)

LP62S1024B-I Series

Preliminary 128K X 8 BIT LOW VOLTAGE CMOS SRAM

Document Title
128K X 8 BIT LOW VOLTAGE CMOS SRAM

Revision History

Rev. No. History Issue Date Remark

0.0 Initial issue May 30, 2002 Preliminary

0.1 Add 32L Pb-Free TSSOP package type October 2, 2002

PRELIMINARY (October, 2002, Version 0.1) AMIC Technology, Corp.

LP62S1024B-I Series

Preliminary 128K X 8 BIT LOW VOLTAGE CMOS SRAM

Features General Description

n Power supply range: 2.7V to 3.6V
n Access times: 55/70 ns (max.)
n Current:

Very low power version: Operating: 30mA(max.)

Standby: 5uA (max.)

n Full static operation, no clock or refreshing required
n All inputs and outputs are directly TTL-compatible
n Common I/O using three-state output
n Output enable and two chip enable inputs for easy

application

n Data retention voltage: 2V (min.)
n Available in 32-pin SOP, TSOP, TSSOP (8 X 13.4mm)

forward type and 36-pin CSP packages

The LP62S1024B-I is a low operating current 1,048,576­bit static random access memory organized as 131,072
words by 8 bits and operates on a low power voltage: 2.7V
to 3.6V. It is built using AMIC's high performance CMOS
process.
Inputs and three-state outputs are TTL compatible and
allow for direct interfacing with common system bus
structures.
Two chip enable inputs are provided for POWER-DOWN
and device enable and an output enable input is included
for easy interfacing.
Data retention is guaranteed at a power supply voltage as
low as 2V.

Product Family

Product Family Operating

Temperature

LP62S1024B

1. Typical values are measured at VCC = 3.0V, TA = 25°C and not 100% tested.

2. Data retention current VCC = 2.0V.

-40°C ~ +85°C

VCC

Range

2.7V~3.6V 55ns / 70ns

Speed

Data Retention

(ICCDR, Typ.)

0.05µA 0.08µA

Power Dissipation

Standby

(ISB1, Typ.)

Operating
(ICC2, Typ.)

1.5mA

Package

Type

32L SOP

32L TSOP

32L TSSOP

36B µBGA

PRELIMINARY (October, 2002, Version 0.1) 1 AMIC Technology, Corp.

LP62S1024B-I Series

Pin Configurations

nn SOP nn TSOP/TSSOP nn CSP (Chip Size Package)
36-pin Top View

1

NC

A16

2

A14

3

A12

4

A7

5

A6

6

A5

7

A4

8

A3

9
10

A2

11

A1
A0

12

I/O1

13

I/O2

14

3

I/O

15
16 17

Block Diagram

VCC

32

A15

31

CE2

30

WE

29

A13

28

LP62S1024BM-I

A8

27

A9

26

A11

25

OE

24

A10

23
22

CE1
I/O8

21

I/O7

20

6

I/O

19

5

I/O

18

I/O4GND

Pin No.
Pin

Name
Pin No.
Pin

Name

A0

A14

A15

16

(LP62S1024BX-I)

17

1 2A93 4 5 6 7 8 9 10 11 12 13 14

A8 A13 CE2 A15 VCC NC

A11 WE

A3 A2 A1 A0 I/O1I/O

ROW

DECODER

2

1

LP62S1024BV-I

32

A16 A14 A12 A7 A6

I/O

3

GND I/O4I/O5I/O6I/O

MEMORY ARRAY

7

512 X 2048

I/O

8

CE1

302928272625242219 2120 231817

A0

A

I/O5

B

I/O6

C

GND

D

VCC

E

I/O7

F

I/O8

G

A9 A10OEA11

H

15 16

A5 A4

31 32

A10 OE

A1A2CE2

WE

NC A5

NC NC

CE1

VCC
GND

A7

A15

A8
I/O1
I/O2

VCC
GND

I/O3
I/O4

A3 A6
A4

A16
A12 A13 A14

654321

A16

I/O1

INPUT DATA

CIRCUIT

COLUMN I/O

I/O8

CE2
CE1

OE

WE

CONTROL

CIRCUIT

PRELIMINARY (October, 2002, Version 0.1) 2 AMIC Technology, Corp.

LP62S1024B-I Series

Pin Descriptions - SOP

Pin No. Symbol Description

1 NC No Connection

2 - 12, 23,

25 - 28, 31

13 - 15,

17 - 21

16 GND Ground

22

24

29

30 CE2 Chip Enable

32 VCC Power Supply

A0 - A16 Address Inputs

I/O1 - I/O8 Data Input/Outputs

CE1

OE

WE

Chip Enable

Output Enable

Write Enable

Pin Description - CSP

Pin Description – TSOP/TSSOP

Pin No. Symbol Description

1 - 4, 7,

10 - 20, 31

5

6 CE2 Chip Enable

8 VCC Power Supply

9 NC No Connection

21 - 23,

25 - 29

24 GND Ground

30

32

A0 - A16 Address Inputs

WE

I/O1 - I/O8 Data Input/Outputs

CE1

OE

Write Enable

Chip Enable

Output Enable

Symbol Description Symbol Description

A0 - A16 Address Inputs NC No Connection

WE

OE

CE1

CE2 Chip Enable -- --

Write Enable I/O1 - I/O8 Data Input/Output

Output Enable VCC Power Supply

Chip Enable GND Ground

PRELIMINARY (October, 2002, Version 0.1) 3 AMIC Technology, Corp.

LP62S1024B-I Series

Recommended DC Operating Conditions

(TA = -40°C to +85°C)

Symbol Parameter Min. Typ. Max. Unit

VCC Supply Voltage 2.7 3.0 3.6 V
GND Ground 0 0 0 V

VIH Input High Voltage 2.2 - VCC + 0.3 V
VIL Input Low Voltage -0.3 - +0.6 V

CL Output Load - - 30 pF

TTL Output Load - - 1 -

Absolute Maximum Ratings*

VCC to GND .............................................. -0.5V to +4.6V

IN, IN/OUT Volt to GND.....................-0.5V to VCC +0.5V

Operating Temperature, Topr...................-40°C to +85°C

Storage Temperature, Tstg..................... -55°C to +125°C

Temperature Under Bias, Tbias................-10°C to +85°C

Power Dissipation, PT ...............................................0.7W

*Comments

Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of this
device at these or any other conditions above those
indicated in the operational sections of this specification
is not implied or intended. Exposure to the absolute
maximum rating conditions for extended periods may
affect device reliability.

DC Electrical Characteristics (TA = -40°C to +85°C, VCC = 2.7V to 3.6V, GND = 0V)

Symbol Parameter LP62S1024B-55LLI/70LLI Unit Conditions

Min. Max.

ILI

ILO

ICC

ICC1

ICC2

Input Leakage Current

Output Leakage Current

Active Power Supply
Current

Dynamic Operating
Current

- 1

- 1

- 3 mA

- 30

- 3 mA

µA

µA

mA

VIN = GND to VCC

CE1 = VIH or CE2 = VIL

or OE = VIH or WE = VIL

VI/O = GND to VCC

CE1 = VIL, CE2 = VIH

II/O = 0mA
Min. Cycle, Duty = 100%

CE1 = VIL, CE2 = VIH

II/O = 0mA

CE1 = VIL, CE2 = VIH
VIH = VCC, VIL = 0V
f = 1 MHZ, II/O = 0mA

PRELIMINARY (October, 2002, Version 0.1) 4 AMIC Technology, Corp.

LP62S1024B-I Series

CE1

OE WE

DC Electrical Characteristics (continued)

Symbol Parameter

Min. Max.

ISB - 0.5 mA

Standby Power Supply Current

ISB1

VOL Output Low Voltage - 0.4 V IOL = 2.1mA

VOH Output High Voltage 2.2 - V IOH = -1.0mA

LP62S1024B-55LLI/70LLI

- 5

Unit Conditions

VCC ≤ 3.3V

CE1 = VIH or CE2 =VIL

VCC ≤ 3.3V

µA

CE1 ≥ VCC - 0.2V or
CE2 ≤ 0.2V
VIN ≥ 0V

Truth Table

Mode

Standby
X L X X High Z ISB, ISB2

H X X X High Z ISB, ISB1

CE2

I/O Operation Supply Current

Output Disable L H H H High Z ICC, ICC1, ICC2

Read L H L H DOUT ICC, ICC1, ICC2

Write L H X L DIN ICC, ICC1, ICC2

Note: X = H or L

Capacitance (TA = 25°C, f = 1.0MHz)

Symbol Parameter Min. Max. Unit Conditions

CIN* Input Capacitance 6 pF VIN = 0V

CI/O* Input/Output Capacitance 8 pF VI/O = 0V

* These parameters are sampled and not 100% tested.

PRELIMINARY (October, 2002, Version 0.1) 5 AMIC Technology, Corp.

LP62S1024B-I Series

AC Characteristics (TA = -40°C to +85°C, VCC = 2.7V to 3.6V)

Symbol Parameter

Min. Max. Min. Max.

Read Cycle

tRC Read Cycle Time 55 - 70 - ns
tAA Address Access Time - 55 - 70 ns

tACE1

tACE2 CE2 - 55 - 70 ns

tOE Output Enable to Output Valid - 30 - 35 ns

tCLZ1

tCLZ2 CE2 10 - 10 - ns

tOLZ Output Enable to Output in Low Z 5 - 5 - ns

tCHZ1

tCHZ2 CE2 0 20 0 25 ns

tOHZ Output Disable to Output in High Z 0 20 0 25 ns

Chip Enable Access Time

Chip Enable to Output in Low Z

Chip Disable to Output in High Z

CE1

CE1

CE1

LP62S1024B-55LLI LP62S1024B-70LLI

- 55 - 70 ns

10 - 10 - ns

0 20 0 25 ns

Unit

tOH Output Hold from Address Change 5 - 10 - ns

Write Cycle

tWC Write Cycle Time 55 - 70 - ns
tCW Chip Enable to End of Write 50 - 60 - ns

tAS Address Setup Time 0 - 0 - ns
tAW Address Valid to End of Write 50 - 60 - ns
tWP Write Pulse Width 40 - 50 - ns
tWR Write Recovery Time 0 - 0 - ns

tWHZ Write to Output in High Z 0 25 0 25 ns

tDW Data to Write Time Overlap 25 - 30 - ns
tDH Data Hold from Write Time 0 - 0 - ns

tOW Output Active from End of Write 5 - 5 - ns

Notes: tCHZ1, tCHZ2, tOHZ, and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are
not referred to output voltage levels.

PRELIMINARY (October, 2002, Version 0.1) 6 AMIC Technology, Corp.

LP62S1024B-I Series

Timing Waveforms

Read Cycle 1

Address

DOUT

(1, 2, 4)

tRC

tAA

tOH

tOH

Read Cycle 2

CE1

DOUT

Read Cycle 3

CE2

(1, 3, 4, 6)

(1, 4, 7, 8)

tACE1

5

tCLZ1

tCHZ1

5

tACE2

5

tCLZ2

5

tCHZ2

DOUT

PRELIMINARY (October, 2002, Version 0.1) 7 AMIC Technology, Corp.

LP62S1024B-I Series

Timing Waveforms (continued)

Read Cycle 4

Address

(1)

tRC

tAA

OE

CE1

CE2

DOUT

tCLZ1

tCLZ2

tOE

5

tOLZ

tACE1

5

tACE2

5

tCHZ2

tOH

tCHZ1

5

5

tOHZ

5

Notes: 1. WE is high for Read Cycle.

2. Device is continuously enabled CE1 = VIL and CE2 = VIH.

3. Address valid prior to or coincident with CE1 transition low.

4. OE = VIL.

5. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.

6. CE2 is high.

7. CE1 is low.

8. Address valid prior to or coincident with CE2 transition high.

PRELIMINARY (October, 2002, Version 0.1) 8 AMIC Technology, Corp.

LP62S1024B-I Series

Timing Waveforms (continued)

Write Cycle 1
(Write Enable Controlled)

Address

(6)

tWC

CE1

CE2

WE

DOUT

DIN

tAW

5

tCW

(4)

(4)

1

tAS

tWHZ

tWP

2

tDW

tWR

tDH

3

tOW

PRELIMINARY (October, 2002, Version 0.1) 9 AMIC Technology, Corp.

LP62S1024B-I Series

Timing Waveforms (continued)

Write Cycle 2
(Chip Enable Controlled)

tWC

Address

3

CE1

tAW tWR

5

tCW

(4)

1

tAS

CE2

WE

DIN

DOUT

(4)

5

tCW

2

tWP

tWHZ

tDW

7

tDH

Notes: 1. tAS is measured from the address valid to the beginning of Write.

2. A Write occurs during the overlap (tWP) of a low CE1, a high CE2 and a low WE .

3. tWR is measured from the earliest of CE1 or WE going high or CE2 going low to the end of the Write cycle.

4. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transition or after
the WE transition, outputs remain in a high impedance state.

5. tCW is measured from the later of CE1 going low or CE2 going high to the end of Write.

6. OE is continuously low. ( OE = VIL)

7. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.

PRELIMINARY (October, 2002, Version 0.1) 10 AMIC Technology, Corp.

LP62S1024B-I Series

AC Test Conditions

Input Pulse Levels 0.4V to 2.4V

Input Rise and Fall Time 5 ns

Input and Output Timing Reference Levels 1.5V

Output Load See Figures 1 and 2

TTL

CL

30pF

* Including scope and jig. * Including scope and jig.

CL

TTL

5pF

Figure 1. Output Load Figure 2. Output Load for tCLZ1,
tCLZ2, tOHZ, tOLZ, tCHZ1,
tCHZ2, tWHZ, and tOW

Data Retention Characteristics (TA = -40°C to 85°C)

Symbol Parameter Min. Max. Unit Conditions

VDR1 2.0 3.6 V

VCC for Data Retention

VDR2

ICCDR1

2.0 3.6 V

-

3*

Data Retention Current

ICCDR2

-

3*

µA

µA

CE1 ≥ VCC - 0.2V

CE2 ≤ 0.2V,

VCC = 2V,

CE1 ≥ VCC - 0.2V,

VIN ≥ 0V

VCC = 2V,
CE2 ≤ 0.2V,
VIN ≥ 0V

tCDR Chip Disable to Data Retention Time 0 - ns

See Retention Waveform

tR Operation Recovery Time 5 - ms

* LP62S1024B-55LLI/70LLI ICCDR: max. 3µA at TA = 0°C to + 40°C

PRELIMINARY (October, 2002, Version 0.1) 11 AMIC Technology, Corp.

LP62S1024B-I Series

CE1

Low VCC Data Retention Waveform (1) (

Controlled)

DATA RETENTION MODE

VCC

CE1

3.0V

tCDR

VIH

VDR ≥ 2V

CE1 ≥ VDR - 0.2V

Low VCC Data Retention Waveform (2) (CE2 Controlled)

DATA RETENTION MODE

VCC

CE2

3.0V

tCDR

VIL

VDR ≥ 2V

CE2 ≤ 0.2V

3.0V
tR

VIH

3.0V
tR

VIL

PRELIMINARY (October, 2002, Version 0.1) 12 AMIC Technology, Corp.

LP62S1024B-I Series

Ordering Information

Part No. Access Time (ns)

LP62S1024BM-55LLI 32L SOP

LP62S1024BV-55LLI 32L TSOP

55 30 5

LP62S1024BX-55LLI 32L TSSOP

LP62S1024BX-55LLIF 32L Pb-Free TSSOP

LP62S1024BU-55LLI

LP62S1024BM-70LLI 32L SOP

LP62S1024BV-70LLI 32L TSOP

70 30 5

LP62S1024BX-70LLI 32L TSSOP

LP62S1024BX-70LLIF 32L Pb-Free TSSOP

LP62S1024BU-70LLI

Operating Current

Max. (mA)

Standby Current

Max. (µµA)

Package

36L CSP

36L CSP

PRELIMINARY (October, 2002, Version 0.1) 13 AMIC Technology, Corp.

LP62S1024B-I Series

Package Information

SOP (W.B.) 32L Outline Dimensions unit: inches/mm

1

s

Seating Plane

1732

E

HE

16

b

D

A

y

e

D

A1 A2

Symbol Dimensions in inches Dimensions in mm

A 0.118 Max. 3.00 Max.
A1 0.004 Min. 0.10 Min.
A2 0.106±0.005 2.69±0.13

b 0.016 +0.004 0.41 +0.10

-0.002

c 0.008 +0.004 0.20 +0.10

-0.002 -0.05
D 0.805 Typ. (0.820 Max.) 20.45 Typ. (20.83 Max.)
E 0.445±0.010 11.30±0.25

e 0.050 ±0.006 1.27±0.15

e1 0.525 NOM. 13.34 NOM.

HE 0.556±0.010 14.12±0.25

L 0.031±0.008 0.79±0.20

LE 0.055±0.008 1.40±0.20

S 0.044 Max. 1.12 Max.

y 0.004 Max. 0.10 Max.
θ 0° ~ 10° 0° ~ 10°

See Detail F

Detail F

e1

-0.05

e1

L

~

~

c

LE

Notes:

1. The maximum value of dimension D includes end flash.

2. Dimension E does not include resin fins.

3. Dimension e1 is for PC Board surface mount pad pitch design
reference only.

4. Dimension S includes end flash.

PRELIMINARY (October, 2002, Version 0.1) 14 AMIC Technology, Corp.

LP62S1024B-I Series

Package Information

TSOP 32L TYPE I (8 X 20mm) Outline Dimensions unit: inches/mm

D

e

0.25

BSC

Detail "A"

°12.0

LE

b

A

θ

L

0.10(0.004) M

A2

E

HD

Detail "A"

y

D

c

GAUGE PLANE

A1

S

Symbol Dimensions in inches Dimensions in mm

A 0.047 Max. 1.20 Max.

A1 0.004±0.002 0.10±0.05
A2 0.039±0.002 1.00±0.05

b 0.008±0.001 0.20±0.03

c 0.006±0.001 0.15±0.02
D 0.724±0.004 18.40±0.10
E 0.315±0.004 8.00±0.10

e 0.020 TYP. 0.50 TYP.

HD 0.787±0.007 20.00±0.20

L 0.020±0.004 0.50±0.10

LE 0.031 TYP. 0.80 TYP.

S 0.0167 TYP. 0.425 TYP.
Y 0.004 Max. 0.10 Max.

θ 0° ~ 6° 0° ~ 6°

Notes:

1. The maximum value of dimension D includes end flash.

2. Dimension E does not include resin fins.

3. Dimension e1 is for PC Board surface mount pad pitch design
reference only.

4. Dimension S includes end flash.

PRELIMINARY (October, 2002, Version 0.1) 15 AMIC Technology, Corp.

LP62S1024B-I Series

Package Information

TSSOP 32L TYPE I (8 X 13.4mm) Outline Dimensions unit: inches/mm

e

0.25

BSC

Detail "A"

Detail "A"

°12.0

A

θ

L

LE

b

E

0.10MM

D

SEATING PLANE

A2

c

GAUGE PLANE

A1

D1

D

Detail "A"

S

Symbol Dimensions in inches Dimensions in mm

A 0.049 Max. 1.25 Max.

A1 0.002 Min. 0.05 Min.
A2 0.039±0.002 1.00±0.05

b 0.008±0.001 0.20±0.03

c 0.006±0.0003 0.15±0.008
E 0.315±0.004 8.00±0.10

e 0.020 TYP. 0.50 TYP.
D 0.528±0.008 13.40±0.20

D1 0.465±0.004 11.80±0.10

L 0.02±0.008 0.50±0.20

LE 0.0266 Min. 0.675 Min.

S 0.0109 TYP. 0.278 TYP.

y 0.004 Max. 0.10 Max.

θ 0° ~ 6° 0° ~ 6°

Notes:

1. The maximum value of dimension D includes end flash.

2. Dimension E does not include resin fins.

3. Dimension e1 is for PC Board surface mount pad pitch design
reference only.

4. Dimension S includes end flash.

PRELIMINARY (October, 2002, Version 0.1) 16 AMIC Technology, Corp.

LP62S1024B-I Series

Package Information

36LD CSP (6 x 8 mm) Outline Dimensions unit: mm

TOP VIEW

Ball*A1 CORNER

1 2 3 4 5 6

A

B
C
D
E
F
G
H

SIDE VIEW

A2

// 0.25 C

C

SEATING PLANE

(0.36)

0.10 C

A

A1

e

1

E

E

B e

A

0.20(4X)

BOTTOM VIEW

Ball#A1 CORNER

S

0.10 C
C

0.25SA B

b (36X)

D1

D

123456

A
B
C
D
E
F
G
H

Symbol

Dimensions in mm

MIN.

NOM. MAX.

A 1.00 1.10 1.20
A1 0.16 0.21 0.26
A2 0.48 0.53 0.58

D 5.80 6.00 6.20

E 7.80 8.00 8.20

D1 --- 3.75 ---

E1 --- 5.25 ---

e --- 0.75 ---

b 0.25 0.30 0.35

Note:

1. THE BALL DIAMETER, BALL PITCH, STAND-OFF & PACKAGE THICKNESS
ARE DIFFERENT FROM JEDEC SPEC MO192 (LOW PROFILE BGA FAMILY).

2. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.

3. DIMENSION b IS MEASURED AT THE MAXIMUM.

4. THEERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN THE EDGE OF
THE SOLDER BALL AND THE BODY EDGE.

PRELIMINARY (October, 2002, Version 0.1) 17 AMIC Technology, Corp.