Datasheet LOC112PTR, LOC112P, LOC112, LOC112STR, LOC112S Datasheet (CLARE)

1

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LOC112

DS-LOC112-R2

Linear Optocouplers

Applications

Features Description

Approvals

Ordering Information

Pin Configuration

LOC112 is a linear optocoupler for use in telecom, med­ical and power supply isolation circuits. They are available
in 8 pin DIP, surface mount or flatpack packages.

• Modem Transformer Replacement With No

Insertion Loss

• Digital Telephone Isolation

• Power Supply Feedback Voltage/Current

• Medical Sensor Isolation

• Audio Signal Interfacing

• Isolation of Process Control Transducers

• UL Recognized: File Number E76270

• CSA Certified: File Number LR 43639-10

• BSI Certified:

• BS EN 60950:1992 (BS7002:1992)

Certificate #:7344

• BS EN 41003:1993

Certificate #:7344

• 8 Pin Flatpack or DIP Package (PCMCIA Compatible)

• Couples Analog and Digital Signals

• Wide Bandwidth (>200kHz)

• High Gain Stability

• Low Input/Output Capacitance

• Low Power Consumption

• 0.01% Servo Linearity

• THD 87dB Typical

• Machine Insertable, Wave Solderable

• Surface Mount and Tape Reel Versions Available

• VDE Compatible

Part # Description

LOC112 8 Pin DIP (50/Tube)
LOC112P 8 Pin Flatpack (50/Tube)
LOC112PTR 8 Pin Flatpack (1000/Reel)
LOC112S 8 Pin Surface Mount (50/Tube)
LOC112STR 8 Pin Surface Mount (1000/Reel)

LOC112 Pinout

Ð LED

+ LED

+V

cc

1

I

1

NC

NC

+V

cc

2

I

2

1

2

3

4

8

7

6

5

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LOC112

Rev. 2

Absolute Maximum Ratings are stress ratings. Functional
operation of the device at these or any other conditions
beyond those indicated in the operational sections of this
data sheet is not implied. Exposure of the device to the
absolute maximum ratings for an extended period may
degrade the device and effect its reliability.

Absolute Maximum Ratings (@ 25

o

C)

2

Electrical Characteristics

PARAMETER CONDITIONS SYMBOL MIN TYP MAX UNITS

Input Characteristics @ 25°C1

LED Voltage Drop I

F

=2-10mA V

F

0.9 1.2 1.4 V

Reverse LED Current V

R

=5V I

R

- - 10 µA

Reverse LED Voltage - V

R

-- 5V

Forward LED Current - I

F

- - 100 mA

Coupler/Detector

Characteristics @ 25°C

Dark Current I

F

=0mA, VCC=15V I

D

-1 25nA

K1, Servo Gain (I

1/IF

)I

F

=2-10mA, VCC=15V K1 0.004 0.007 0.030 -

K2, Forward Gain (I

2/IF

)I

F

=2-10mA, VCC=15V K2 0.004 0.007 0.030

K3, Transfer Gain (K

2/K1

)

1

IF=2-10mA, VCC=15V K3 0.733 1.0 1.072 -

∆K3, Transfer Gain Linearity

1

IF=2-10mA ∆K3 - - 1.0 -%

(non-servoed)
K3 Temperature Coefficient I

F

=2-10mA, V

det

=-5V ∆K3/∆T - 0.005 - %/°C

Common Mode V=20V

P-P

, RL=2KΩ, CMRR - 130 - dB

Rejection Ratio F=100Hz
Total Harmonic Distortion F

O

=350Hz, 0dBm THD -96 -87 -80 dB

Frequency Response Photoconductive BW - 200 - kHz

Operation (-3dB)

Photovoltaic BW 40 - kHz

Operation (-3dB)

Input/Output Capacitance - C

I/O

-3 -pF

Input/Output Isolation V

I/O

3750 - - V

RMS

1

LOC111 and LOC112 Bins D,E,F,G.

Parameter Min Typ Max Units

Input Power Dissipation - - 1501mW
Input Control Current - - 100 mA
Peak (10ms) - - 1 A
Total Package Dissipation - - 8002mW
Isolation Voltage

Input to Output
SOIC Package 3750 - - V

RMS

Operational Temperature -40 +85°C
Storage Temperature -40 - +125°C
Soldering Temperature - - +220

°

C
(10 Seconds Max)
Flatpack Package - - +260

°

C

1

Derate Linearly 1.33 mW/°C

2

Derate Linearly 6.67 mW/°C

K3 Sorted Bins

Bin A = 0.550-0.605
Bin B = 0.606-0.667
Bin C = 0.668-0.732
Bin D = 0.733-0.805
Bin E = 0.806-0.886
Bin F = 0.887-0.974
Bin G = 0.975-1.072
Bin H = 1.073-1.179
Bin I = 1.180-1.297
Bin J = 1.298-1.426

•

The LOC110/LOC111/LOC112 are shipped in anti-static tubes of 50
pieces. Each tube will contain one K3 sorted bin.

•

Bin designation marked on each device (A-J).

•

Orders for the LOC110 product will be shipped using bins available at
the date of the order. Any bin (A-J) can be shipped.

•

For customers requiring selected bins D

E F G we offer part num-

bers LOC111 or LOC112.

LOC112

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Rev. 2

3

Performance Data

*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact
our application department.

35

LED Forward Voltage (VF)

30

25

20

15

10

LED Current (mA)

5
0

1

Servo-Photocurrent vs.

140

100

Servo-Photocurrent (µA)

LED Current & Temperature

120

80

60

40

20

0

024

LOC112

LED Current (IF) vs.

1.1

LED Forward Voltage (V)

1.2

LOC112

68

LED Current (mA)

1.3

0°C
25°C

50°C
70°C

85°C

LOC112

LED Current (IF) vs.

100

10

LED Current (mA)

1.4

1210

0.1

1.4

1.2

1.0

0.8

0.6

0.4

0.2

Normalized Servo-Photocurrent

LED Forward Voltage (VF)

1

1

0

024

1.1 1.2 1.3

LED Forward Voltage (V)

Normalized Servo-Photocurrent vs.

LED Current & Temperature

LOC112

68

LED Current (mA)

0°C
25°C

50°C
70°C

85°C

0.014

0.012

0.010

0.008

0.006

Servo Gain

0.004

0.002

1.4

1210

LED Forward Voltage Drop (V)

LED Current & Temperature

0

024

Typical LED Forward Voltage Drop vs.

1.7

1.6

1.5

1.4

1.3

1.2

1.1

1.0

0.9

-40

LOC112

Servo Gain vs.

0°C
25°C

50°C
70°C

85°C

68

LED Current (mA)

LOC112

Temperature

20mA
10mA

5mA

-15 10 35 60 85

Temperature (°C)

1210

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4

LOC112

Rev. 2

Dimensions

mm

(inches)

Mechanical Dimensions

8 Pin DIP Through Hole (Standard)

7.620 ± .254

(.300 ± .010)

3.302

7.239 TYP.
(.285)

(.130)

9.144 TYP.
(.360)

8 Pin Flatpack (“P” Suffix)

2.159 TYP.
(.085)

2.286 MAX.
(.090)

7.620 ± .254

(.300 ± .010)

.635 ± .127

(.025)

.203

(.008)

6.350 ± .127

(.250 ± .005)

6.350 ± .127
(.250 ± .005)

9.652 ± .381

(.380 ± .015)

2.540 ± .127

(.100 ± .005)

.457 ± .076

(.018 ± .003)

8.077 ± .127

(.318 ± .005 )

9.652 ± .381

(.380 ± .015)

2.540 ± .127
(.100 ± .005)

.457 ± .076

(.018 ± .003)

8.077 ± .127
(.318 ± .005)

9.144 ± .508

(.360 ± .020)

9.398 ± .127
(.370 ± .005)

PC Board Pattern
(Top View)

8-.800 DIA.

(8-.031 DIA.)

6.350 ± .127

(.250 ± .005)

2.540 ± .127

(.100 ± .005)

7.620 ± .127

(.300 ± .005)

PC Board Pattern
(Top View)

2.540 ± .127

(.100 ± .005)

1.193

(.047)

.787

(.031)

7.620 ± .127
(.300 ± .005)

8.763 ± .127

(.345 ± .005)

8 Pin DIP Surface Mount (“S” Suffix)

7.620 ± .254

(.300 ± .010)

4.445 ± .127

(.175 ± .005)

3.302

(.130)

.635 TYP.

(.025)

.254 TYP.

(.010)

6.350 ± .127

(.250 ± .005)

9.652 ± .381

(.380 ± .015)

2.540 ± .127

(.100 ± .005)

.457 ± .076

(.018 ± .003)

8.077 ± .127

(.318 ± .005)

9.525 ± .254

(.375 ± .010)

PC Board Pattern
(Top View)

1.905 ± .127

(.075 ± .005)

2.540 ± .127
(.100 ± .005)

1.498 ± .127

(.059 ± .005)

8.305 ± .127

(.327 ± .005)

CPC7581

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5

Rev. 2

Dimensions

mm

(inches)

Mechanical Dimensions

Tape and Reel Packaging for 8 Pin Flatpack Package

330.2 DIA.

Embossed Carrier

(13.00)

Top Cover
Tape Thickness
.102 MAX.
(.004)

Embossment

12.090
(.476)

6.731 MAX.
(.265)

.406 MAX.

(.016)

4.877
(.192)

Top Cover

Tape

1.753 ± 0.102
(.069 ± .004)

7.493 ± .102

(.295 ± .004)

.050R TYP.

Tape and Reel Packaging for 8 Pin Surface Mount Package

Embossed Carrier

330.2 DIA.
(13.00)

Top Cover
Tape Thickness
.102 MAX.
(.004)

12.090
(.476)

6.731 MAX.
(.265)

Top Cover

.406 MAX.

(.016)

4.877

(.192)

Tape

1.753 ± .102
(.069 ± .004)

7.493 ± .102
(.295 ± .004)

.050R TYP.

2.007 ± .102

(.079 ± .004)

11.988 ± .102
(.472 ± .004)

User Direction of Feed

2.007 ± .102

(.079 ± .004)

11.989 ± .102

(.472 ± .004)

1.498 ± .102
(.059 ± .004)

1.498 ± .102
(.059 ± .004)

3.987 ± .102
(.157 ± .004)

18

10.287 ± .102
(.405 ± .004)

3.987 ± .102
(.157 ± .004)

18

10.300 ± .102

(.405 ± .004)

16.002 ± .305
(.630 ± .012)

10.287
(.405)

1.549 ± .102
(.061 ± .004)

16.002 ± .305
(.630 ± .012)

10.300
(.405)

1.549 ± .102
(.061 ± .004)

Embossment

User Direction of Feed

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Worldwide Sales Offices

Specification: DS-LOC112-R2
©Copyright 2001, Clare, Inc.
All rights reserved. Printed in USA.
02/23/01

Clare cannot assume responsibility for use of any circuitry other
than circuitry entirely embodied in this Clare product. No circuit
patent licenses nor indemnity are expressed or implied. Clare
reserves the right to change the specification and circuitry, with­out notice at any time. The products described in this document
are not intended for use in medical implantation or other direct life
support applications where malfunction may result in direct phys­ical harm, injury or death to a person.