LMX2354
PLLatinum Fractional N RF/ Integer N IF Dual Low Power
Frequency Synthesizer
LMX2354 2.5 GHz/550 MHz
LMX2354 PLLatinum Fractional N RF/ Integer N IF Dual Low Power Frequency Synthesizer
August 2001
General Description
The LMX2354 is part of a family of monolithic integrated
fractional N/Integer N frequency synthesizers designed to be
used in a local oscillatorsubsystem for a radio transceiver. It
is fabricated using National’s 0.5 µ ABiC V silicon BiCMOS
process. The LMX2354 contains quadruple modulus prescalers along with modulo 15 or 16 fractional compensation
circuitry in theRF divider. The LMX2354 provides a continuous divide ratio of 80 to 32767 in 16/17/20/21
(1.2 GHz–2.5 GHz) fractional mode and 40 to 16383 in
8/9/12/13 (550 MHz–1.2 GHz) fractional mode. The IF circuitry for the LMX2354 contains an 8/9prescaler, and is fully
programmable. Using a fractional N phase locked loop technique, the LMX2354 can generate very stable low noise
control signals for UHF and VHF voltage controlled oscillators (VCOs).
For the RF PLL, a highly flexible 16 level programmable
charge pump supplies output current magnitudes from 100
µA to 1.6 mA. Two uncommitted CMOS outputs can be used
to provide external control signals, or configured to FastLock
mode. Serial dataistransferredintotheLMX2354 via a three
wire interface (Data, LE, Clock). Supply voltage can range
from 2.7V to 5.5V. The LMX2354 family features very low
current consumption; typically LMX2354 (2.5 GHz) — 7.0
mA. The LMX2354 are available in a 24-pin TSSOP surface
mount plastic package and 24-pin CSP.
Features
n Pin compatible/functional equivalent to the LMX2350
n Enhanced Low Noise Fractional Engine
n 2.7V to 5.5V operation
n Low current consumption
LMX2354: I
n Programmable or logical power down mode:
I
= 5 µA typical at 3V
CC
n Modulo 15 or 16 fractional RF N divider supports ratios
of 1, 2, 3, 4, 5, 8, 15, or 16
n Programmable charge pump current levels
RF 100 µA to 1.6 mA in 100 µA steps
IF 100 µA or 800 µA
n Digital filtered lock detect
n Available in 24-pin TSSOP and 24-pin CSP
= 7 mA typical at 3V
CC
Applications
n Portable wireless communications (PCS/PCN, cordless)
n Dual mode cellular telephone systems
n Zero blind slot TDMA systems
n Spread spectrum communication systems (CDMA)
n Cable TV Tuners (CATV)
124OUT0OProgrammable CMOS output. Level of the output is controlled by IF_N [17] bit.
21V
CC
RF
—RF PLL power supply voltage input. Must be equal to VccIF. May range from
2.7V to 5.5V. Bypass capacitors should be placed as close as possible to this
pin and be connected directly to the ground plane.
32V
43CP
P
RF
o
RF
—Power supply for RF charge pump. Must be ≥ V
ORF charge pump output. Connected to a loop filter for driving the control input
and V
CC
RF
.
CC
IF
of an external VCO.
54GND—Ground for RF PLL digital circuitry.
65fin RFIRF prescaler input. Small signal input from the VCO.
76fin RF
IRF prescaler complimentary input. A bypass capacitor should be placed as
close as possible to this pin and be connected directly to the ground plane.
87GND—Ground for RF PLL analog circuitry.
98OSC
RF
IDual mode oscillator output or RF R counter input. Has a VCC/2 input threshold
when configured as an input and can be driven from an external CMOS or TTL
logic gate.
109OSC
IF
IOscillator input which can be configured to drive both the IF and RF R counter
inputs or only the IF R counter depending on the state of the OSC
programming bit. (See functional description 1.1 and programming description
3.1.)
1110Fo/LDOMultiplexed output of N or R divider and RF/IF lock detect. CMOS output. (See
programming description 3.1.5.)
1211RF_ENIRF PLL Enable. Powers down RF N and R counters, prescaler, and
®
TRI-STATE
charge pump output when LOW. Bringing RF_EN high powers up
RF PLL depending on the state of RF_CTL_WORD. (See functional description
1.9.)
1312IF_ENIIF PLL Enable. Powers down IF N and R counters, prescaler, and TRI-STATE
charge pump output when LOW. Bringing IF_EN high powers up IF PLL
depending on the state of IF_CTL_WORD. (See functional description 1.9.)
1413CLOCKIHigh impedance CMOS Clock input. Data for the various counters is clocked
into the 24-bit shift register on the rising edge.
1514DATAIBinary serial data input. Data entered MSB first. The last two bits are the
control bits. High impedance CMOS input.
1615LEILoad Enable high impedance CMOS input. Data stored in the shift registers is
loaded into one of the 4 internal latches when LE goes HIGH. (See functional
description 1.7.)
1716GND—Ground for IF analog circuitry.
1817fin IF
IIF prescaler complimentary input. A bypass capacitor should be placed as
close as possible to this pin and be connected directly to the ground plane.
1918fin IFIIF prescaler input. Small signal input from the VCO.
2019GND—Ground for IF digital circuitry.
2120CPo
IF
OIF charge pump output. For connection to a loop filter for driving the input of an
external VCO.
2221V
2322V
PIF
CC
IF
—Power supply for IF charge pump. Must be ≥ V
CC
—IF power supply voltage input. Must be equal to V
RF
CC
and V
RF
.
CC
IF
. Input may range from
2.7V to 5.5V. Bypass capacitors should be placed as close as possible to this
pin and be connected directly to the ground plane.
2423OUT1OProgrammable CMOS output. Level of the output is controlled by IF_N [18] bit.
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Absolute Maximum Ratings (Notes 1, 2)
LMX2354
Power Supply VoltageV
ParameterSymbol
CC
RF
V
CC
IF
Vp
RF
Vp
IF
MinTypMax
−0.36.5V
−0.36.5V
−0.36.5V
−0.36.5V
Voltage on any pin with GND = 0VVi−0.3V
Value
+ 0.3V
CC
Storage Temperature RangeTs−65+150C˚
Lead Temperature (Solder 4 sec.)T
L
+260C˚
Recommended Operating Conditions
ParameterSymbol
Power Supply VoltageV
Operating TemperatureT
Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended tobe functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The
guaranteed specifications apply only for the test conditions listed.
Note 2: This Device is a high performance RF integrated circuit with an ESD rating
be done at ESD-free workstations.
CC
RF
V
CC
IF
V
pRF
V
pIF
A
MinTypMax
2.75.5V
V
CC
RF
V
CC
V
CC
−40+85˚C
<
2kV and is ESD sensitive. Handling and assembly of this device should only
Value
V
CC
RF
5.5V
5.5V
Units
Units
V
Electrical Characteristics (V
All min/max specifications are guaranteed by design, or test, or statistical methods.
=V
=V
=V
cc
cc
RF
P
IF
RF
= 3.0V; −40˚C<T
P
IF
SymbolParameterConditions
<
+85˚C except as specified)
A
Value
MinTypMax
Units
GENERAL
I
CC
Power Supply CurrentRF and IF6.08.5mA
IF Only1.12.0mA
I
CC-PWDN
f
RFRF Operating Frequency0.52.5GHz
in
f
IFIF Operating Frequency10550MHz
in
f
OSC
Power Down CurrentRF_EN = IF_EN = LOW2050µA
Oscillator FrequencyNo load on OSC
RF
250MHz
fφPhase Detector FrequencyRF and IF10MHz
Pf
in RF
Pf
in IF
V
OSC
RF Input SensitivityVCC= 3.0V−150dBm
V
= 5.0V−100dBm
CC
IF Input Sensitivity2.7V ≤ VCC≤ 5.5V−100dBm
Oscillator SensitivityOSCIF, OSC
RF
0.5V
CC
V
PP
CHARGE PUMP
ICPo-
ICPo-
ICPo-
ICPo-
source RF
sink RF
source RF
sink RF
RF Charge Pump Output
Current (see Programming
Description 3.2.2)
VCPo Vp/2, RF_CP_WORD =
0000
VCPo = Vp/2, RF_CP_WORD =
0000
VCPo = Vp/2, RF_CP_WORD =
1111
VCPo = Vp/2, RF_CP_WORD =
1111
−100µA
100µA
−1.6mA
1.6mA
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LMX2354
Electrical Characteristics (V
=V
=V
=V
cc
cc
RF
P
IF
RF
= 3.0V; −40˚C<T
P
IF
<
A
All min/max specifications are guaranteed by design, or test, or statistical methods. (Continued)
SymbolParameterConditions
ICPo-
source IF
ICPo-
sink IF
ICPo-
source IF
ICPo-
sink IF
ICPo-
Tri
RF ICPovs. ICPo-
sink
source
ICPo vs. VCPoCP Current vs. Voltage
ICPo vs. TCP Current vs
V
CP
IF Charge Pump Output
Current (see Programming
Description 3.1.4)
Data to Clock Setup TimeSee Data Input Timing50ns
Data to Clock Hold TimeSee Data Input Timing10ns
Clock Pulse Width HighSee Data Input Timing50ns
Clock Pulse Width LowSee Data Input Timing50ns
Clock to Load Enable Set
Up Time
See Data Input Timing
50ns
Load Enable Pulse WidthSee Data Input Timing50ns
RF
+85˚C except as specified)
Value
Units
3.510%
510%
8%
2*V
CC
−0.5
V
V
CC
V
V
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Charge Pump Current Specification Definitions
LMX2354
I1 = CP sink current at VDo=Vp−∆V
I2 = CP sink current at V
I3 = CP sink current at V
I4 = CP source current at V
I5 = CP source current at V
I6 = CP source current at V
Do
Do
= Vp/2
= ∆V
=Vp−∆V
Do
= Vp/2
Do
= ∆V
Do
∆V = Voltage offset from positive and negative rails. Dependent on VCO tuning range relative to V
Note 4: I
||6|}]
Note 5: I
Note 6: I
25˚C|]/||5@25˚C|*100%
vs VDo= Charge Pump Output Current magnitude variation vs Voltage = [1⁄
Do
*
100%
vs I
Do-sink
Do
Do-source
vs TA= Charge Pump Output Current magnitude variation vs Temperature = [||2@temp| − ||2@25˚C|]/||2@25˚C|*100% and [||5@temp| − ||5
= Charge Pump Output Current Sink vs Source Mismatch = [||2| − ||5|]/[1⁄
*
2
{||1| − ||3|}]/[1⁄
20004823
and ground. Typical values are between 0.5V and 1.0V.
CC
*
2
{||1| + ||3|}]*100% and [1⁄
*
2
{||2| + ||5|}]*100%
*
2
{||4| − ||6|}]/[1⁄
*
2
{||4| +
@
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RF Sensitivity Test Block Diagram
LMX2354
Note: N = 10,000 R = 50 P = 16
Note: Sensitivity limit is reached when the error of the divided RF output, F
Typical Performance Characteristics
ICCvs V
LMX2354
Charge Pump Current vs CPOVoltage
RF_CP_WORD = 0000 and 0111
IF CP_GAIN_8 = 0 and 1
CC
2000482520004827
LD, is ≥ 1 Hz.
o
TRI-STATE vs
I
CPO
CP
Voltage
O
Charge Pump Current vs CP
RF_CP_WORD = 0011 and 1111
Voltage
O
20004824
20004828
20004829
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Typical Performance Characteristics (Continued)
LMX2354
Sink vs Source Mismatch
(See (Note 6) under Charge Pump Current
Specification Definitions)
20004830
RF Input Impedance
V
= 2.7V to 5.5V, fIN= 550 MHz to
CC
2.5 GHz (f
Capacitor = 100 pF)
IN
IF Input Impedance
V
= 2.7V to 5.5V, fIN= 50 MHz to
CC
550 MHz (f
Capacitor = 100 pF)LMX2354 RF Sensitivity vs Frequency
IN
20004831
20004833
20004832
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Typical Performance Characteristics (Continued)
IF Input Sensitivity vs FrequencyOscillator Input Sensitivity vs Frequency
LMX2354
20004835
20004836
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Functional Description
1.0 GENERAL
LMX2354
The basic phase-lock-loop (PLL) configuration consists of a
high-stability crystal reference oscillator, a frequency synthesizer such as the National Semiconductor LMX2354, a voltage controlled oscillator (VCO), and a passive loop filter. The
frequency synthesizer includes a phase detector, current
mode charge pump, as well as programmable reference [R]
and feedback [N] frequency dividers. The VCO frequency is
established by dividing the crystal reference signal down via
the R counter to obtain a frequency that sets thecomparison
frequency. This reference signal, f
input of a phase/frequency detector and compared with another signal, f
, the feedback signal, which was obtained by
p
dividing the VCO frequency down by way of the N counter
and fractional circuitry. The phase/frequency detector’s current source outputs pump charge into the loop filter, which
then converts the charge into the VCO’s control voltage. The
phase/frequency comparator’s function is to adjust the voltage presented to the VCO until the feedback signal’s frequency (and phase) match that of the reference signal.
When this ‘phase-locked’ condition exists, the RF VCO’s
frequency will be N+F times that of the comparison frequency, where N is the integer divide ratio and F is the
fractional component. The fractional synthesis allows the
phase detector frequency to be increased while maintaining
the same frequency step size for channel selection. The
division value N is thereby reduced giving a lower phase
noise referred to the phase detector input, and the comparison frequency is increased allowing faster switching times.
1.1 REFERENCE OSCILLATOR INPUTS
The reference oscillator frequency for the RF and IF PLLs is
provided by an external reference through the OSC
OSC
pin. OSCIF/OSCRFblock can operate 50 MHz with
RF
an input sensitivity of 0.5 Vpp. The OSC bit (see programming description 4.1.1), selects whether the oscillator input
pins OSC
and OSCRFdrive the IF and RF R counters
IF
separately or by a common input signal path. When an
external TCXO is connected only at the OSC
not at the OSC
pin, the TCXO drives both IF R counter
RF
, is then presented to the
r
IF
pin and
IF
input pin and
and RF R counter. When configured as separate inputs, the
pin drives the IF R counter while the OSCRFdrives
OSC
IF
the RF R counter. The inputs have a V
/2 input threshold
CC
and can be driven from anexternal CMOS or TTL logic gate.
1.2 REFERENCE DIVIDERS (R COUNTERS)
The RF and IF R Counters areclocked through the oscillator
block either separately or in common. The maximum frequency is 50 MHz. Both R Counters are 15-bit CMOS
counters with a divide range from 3 to 32,767. (See programming description 4.1.3.)
1.3 PROGRAMMABLE DIVIDERS (N COUNTERS)
The RF and IF N Counters are clocked by the small signal fin
RF and fin IF input pins respectively. The RF N Counter can
be configured as a fractional or fully integer counter. The
LMX2354 RF N counter is 19 bits with 15 bits integer divide
and 4 bits fractional.The integer part is configured asa 2-bit
A Counter, a 2-bit B Counter and a 11-bit C Counter. The
LMX2354 is capable of operating from 500 MHz to 1.2 GHz
with the 8/9/12/13 prescaler offering a continuous integer
divide range from 40 to 16,383 in fractional mode and 24 to
262143 in full integer mode. The LMX2354 is capable of
operating from 1.2 GHz to 2.5 GHz with the 16/17/20/21
prescaler offering a continuous integer divide range from 80
to 32,767 in fractional mode and 48to 52,4287 infull integer
mode. The RF counters for the LMX2354 also contain fractional compensation, programmable in either 1/15 or 1/16
modes. The LMX2354 IF N counter is 15-bit integer divider
configured with a 3-bit A Counter and a 12-bit B Counter
offering a continuous integer divide range from 56 to 32,767
over the frequency range of 10 MHz to 550 MHz. The IF N
counter does not include fractional compensation. The
tables below show the differences between the LMX2354 in
integer mode and in quadruple modulus prescaler with P =
16/17/20/21. Also, the tables show that the bit used for the
lower modulus prescaler values is different between the
LMX2350 and the LMX2354. For the LMX2350 bit N
(MSB of the A Word) is used for the 16/17 modulus and for
the LMX2354 bit N
<8>
=0 is used for the 8/9/12/13 modu-
lus. So if the LMX2354 is replacing a LMX2350 then bits
<8>
N
and N<9>need to be swapped.
LMX2354 RF N Counter Register in Fractional Mode with P = 16/17/20/21:
C WordB WordA WordFractional Word
N19181716151413121110987654321
1–47Divide ratios less than 48 are impossible since it is required that C ≥3These bits are used for
48–79Some of these values are legal divide ratios, some are not
80* 0000000 01010000
81 0000000 01010001
the fractional word when
the part is operated in
fractional mode
...
10560000100 00100000
... ....... ........
32,7671111111 11111111
*
Minimum continuous divide ratio is P•[MAX{A,B}+2]
<9>
=0
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Functional Description (Continued)
LMX2354 RF N Counter Register in Fractional Mode with P = 8/9/12/13
C WordB WordA WordFractional Word
N19181716151413121110987654321
1–23Divide ratios less than 24 are impossible since it is required that C ≥3These bits are used for
24–39Some of these values are legal divide ratios, some are not
40* 0000000 01010000
41 0000000 01010001
...
2720000010 00100000
... ....... ........
16,3831111111 11110111
*
Minimum continuous divide ratio is P•[MAX{A,B}+2]
1.3.1 Prescaler
The RF and IF inputs to the prescaler consist of fin and /fin;
which are complimentary inputs to differential pair amplifiers.
The complimentary inputs are internally coupled to ground
with a 10 pF capacitor. These inputs are typically AC coupled
to ground through external capacitors as well. The input
buffer drives the A counter’s ECL D-type flip flops in a dual
modulus configuration.An 8/9/12/13 or 16/17/20/21 prescale
ratio can be selected for the LMX2354. The IF circuitry for
both the LMX2354 contains an 8/9 prescaler. The prescaler
clocks the subsequent CMOS flip-flop chain comprising the
fully programmableA and B counters.
charge pump output, CPo, to Vcc (pump-up) or ground
(pump-down). When locked, CPo is primarily in a
TRI-STATE
®
mode with small corrections. The RF charge
pump output current magnitude is programmable from
100 µA to 1.6 mA in 100 µA steps as shown in table in
programming description 4.2.2. The IF charge pump is set to
either 100 µA or 800 µA levels using bit IF_R [19] (see
programming description 4.1.4).
1.6 VOLTAGE DOUBLER
The V
supply over a rangeof V
pin is normally driven from an external power
pRF
to 5.5V to providecurrent for the
CC
RF charge pump circuit. An internal voltage doubler circuit
1.3.2 Fractional Compensation
The fractional compensation circuitry of the LMX2354 RF
dividers allows the user to adjust the VCO’s tuning resolution
in 1/16 or 1/15 increments ofthe phase detector comparison
frequency. A 4-bit register is programmed with the fractions
desired numerator, while another bit selects between fractional 15 and 16 modulo base denominator (see programming description 5.2.3).An integer average is accomplished
by using a 4-bit accumulator. A variable phase delay stage
compensates for the accumulated integer phase error, minimizing the charge pump duty cycle, and reducing spurious
levels. This technique eliminates the need for compensation
current injection in to the loop filter. Overflow signals generated by the accumulator are equivalent to 1 full VCO cycle,
and result in a pulse swallow.
connected between the V
nately allows V
=3V(±10%) users to run the RF charge
CC
CC
pump circuit at close to twice the V
The voltage doubler mode is enabled by setting the V2_EN
bit (RF_R [22]) to a HIGH level. The voltage doubler’s
charge pump driver originates from the RF oscillator input
(OSC
). The average delivery current of thedoubler is less
RF
than the instantaneous current demand of the RF charge
pump when active and is thus not capable of sustaining a
continuous out of lock condition. A large external capacitor
connected to V
(≈0.1 µF) is therefore needed to control
pRF
power supply droop when changing frequencies.
1.7 MICROWIRE
™
SERIAL INTERFACE
The programmable functions are accessed through the MICROWIRE serial interface. The interface is made of 3 func-
1.4 PHASE/FREQUENCY DETECTOR
The RF and IF phase/frequency detectors are driven from
their respective N and R counter outputs. The phase detector outputs control the charge pumps. The polarity of the
pump-up or pump-down control is programmed using
RF_PD_POL or IF_PD_POL depending on whether RF/IF
VCO characteristics are positive or negative (see programming descriptions 4.1.4 and 4.2.2). The phase detector also
tions: clock, data and latch enable (LE). Serial data for the
various counters is clocked in from data on the rising edge of
clock, into the 24-bit shift register. Data isentered MSBfirst.
The last two bits decode the internal register address. On the
rising edge of LE, data stored in the shift register is loaded
into one of the 4 appropriate latches (selected by address
bits). A complete programming description is included in the
following sections.
receives a feedback signal from the charge pump, in order to
eliminate dead zone.
the fractional word when
the part is operated in
fractional mode
and V
supply pins alter-
pRF
power supply voltage.
CC
LMX2354
1.5 CHARGE PUMP
The phase detector’s current source outputs pump charge
into an external loop filter, which then converts the charge
into the VCO’s control voltage. The charge pumps steer the
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Functional Description (Continued)
1.8 Fo/LD MULTIFUNCTION OUTPUT
LMX2354
The Fo/LD output pin can deliver several internal functions
including analog/digital lock detects, and counter outputs.
See programming description 4.1.5 for more details.
1.8.1 Lock Detect
A digital filtered lock detect function is included with each
phase detector through an internal digital filter to produce a
logic level output available on the Fo/LD output pin if selected. The lock detect output is high when the error between
the phase detector inputs is less than 15 ns for 5 consecutive
comparison cycles. The lock detect output is low when the
error between the phase detector outputs is more than 30ns
for one comparison cycle. An analog lock detect signal is
also selectable. The lock detect output is always low when
the PLL is in power down mode. See programming descriptions 4.1.5, 5.6–5.8 for more details.
RF_EN pin controls the RF PLL; IF_EN pin controls the IF
PLL. When both pins are high, the power down bits determine the state of power control (see programming description 5.2.1.2).Activation of any PLL power down mode results
in the disabling of the respective N counter and de-biasing of
its respective fin input (to a high impedance state). The R
counter functionality also becomes disabled whenthe power
down bit is activated. The reference oscillator block powers
down and the OSC
pin reverts to a high impedance state
IF
when both RF and IF enable pins or power down bit’s are
asserted,
unless the V2_EN bit (RF_R[22]) is high
down forces the respective charge pump and phase comparator logic to a TRI-STATE condition. A power down
counter reset function resets both N and R counters. Upon
powering up the N counter resumes counting in “close”
alignment with the R counter (The maximum error is one
prescaler cycle). The MICROWIRE control register remains
active and capable of loading and latching in data during all
of the power down modes.
1.9 POWER CONTROL
Each PLL is individually power controlled by device enable
pins or MICROWIRE power down bits. The enable pins
override the power down bits
except for the V2_EN bit
. The
2.0 Major Differences between the LMX2354 and the LMX2350/52
LMX2350/52LMX2354
OSC
IF
Low modulus prescale (Note 7)5-bit A counter, so if 16/17 prescale, bit-5 is
RF PrescalerLMX2350—32/33 or 16/17LMX2354—16/17/20/21 or 8/9/12/13
Note 7: If the LMX2354 is replacing a LMX2350/52 in a design, and you are using the lower modulus prescale value (16/17 on the LMX2350 changes to 8/9/12/13
on the LMX2354), the unused prescaler bit of the LMX2350/52 needs to shift down one bit from N
Supports resonator mode.Does not support resonator mode.
4-bit A/B counters, so if 8/9/12/13, bit-4 is
the unused place holder.
the unused place holder.
LMX2352—16/17 or 8/9
Similar structure to the LMX2350/52, but with
be turned off.
some modifications for improved phase noise
and spurs. Fractional Compensation can be
turned off.
<9>
to N<8>.
. Power
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Programming Description
3.0 INPUT DATA REGISTER
The descriptions below describe the 24-bit data register loaded through the MICROWIRE Interface. The data register is used to
program the 15-bit IF_R counter register, and the 15-bit RF_R counter register, the 15-bit IF_N counter register, and the 19-bit
RF_N counter register. The data format of the 24-bit data register is shown below. The control bits CTL [1:0] decode the internal
register address. On the rising edge of LE, data stored in the shift register is loaded into one of 4 appropriate latches (selected
by address bits). Data is shifted in MSB first
FRAC TEST
RF_R DLL_MODEV2_ENRF_CP_WORDRF_R_CNTR1 0
RF_NRF_CTL_WORDC_WORDB_WORDA_WORD FRAC_CNTR1 1
DATA Location
c2
LMX2354
4.0 PROGRAMMABLE REFERENCE DIVIDERS
4.1 IF_R REGISTER
If the Control Bits (CTL [1:0]) are 0 0, when data is transferred from the 24-bit shift register into a latch when LE is transitioned
high. This registerdetermines the IF R counter value, IF Charge pumpcurrent, FoLD pin output, fractonal modulus, and oscillator
mode.
The OSC bit, IF_R [23], selects whether the oscillator inputs OSC
a common input signal path. When OSC=0,theOSC
When the OSC = 1, the OSC
pin drives both R counters.
IF
pin drives the IF R counter while the OSCRFpin drives the RF R counter.
IF
and OSCRFdrive the IF and RF R counters separately or by
IF
4.1.2 FRAC_16(IF_R[22])
The FRAC_16 bit, IF_R [22], is used toset the fractional compensation at either 1/16 and 1/15 resolution. WhenFRAC-16 is set
to one, the fractional modulus is set to 1/16 resolution, and FRAC_16 = 0 corresponds to 1/15 (See section 5.2.3).
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Programming Description (Continued)
4.1.3 15-BIT PROGRAMMABLE REFERENCE DIVIDER RATIO (R COUNTER)(IF_R[2]–IF_R[16])
LMX2354
Divide
Ratio
32,767111111111111111
Notes: Divide ratio: 3 to 32,767 (Divide ratios less than 3 are prohibited).
RF_R_CNTR/IF_R_CNTR These bits select the divide ratio of the programmable reference dividers.
4.1.4 IF_CP_WORD(IF_R[17]–IF_R[18])
CP_GAIN_8IF_PD_POL
CP_GAIN_8 is used to toggle the IF charge pump current magnitude between 1X mode (100 µA typical) and 8X mode (800 µA
typical).
IF_PD_POL is set to one when IF VCO characteristics are positive. When IF VCO frequency decreases with increasing control
voltage IF_PD_POL should set to 0.
14131211109876543210
3000000000000011
4000000000000100
••••••••••••••••
BITLOCATIONFUNCTION01
CP_GAIN_8IF_R [18]IF Charge Pump
IF_PD_POLIF_R [17]IF Phase Detector
IF_R_CNTR/RF_R_CNTR
1X8X
Current Gain
NegativePositive
Polarity
4.1.5 FoLD* Programming Truth Table(IF_R[19]–IF_R[21])
FoLDFo/LD OUTPUT STATE
0 0 0IF and RF Analog Lock Detect
1 0 0IF Digital Lock Detect
0 1 0RF Digital Lock Detect
1 1 0IF and RF Digital Lock Detect
0 0 1IF R counter
1 0 1IF N counter
0 1 1RF R counter
1 1 1RF N counter
*FoLD - Fout/Lock Detect PROGRAMMING BITS
4.2 RF_R Register
If the Control Bits (CTL[1:0]) are 1 0, data is transferred from the 24-bit shift register into the RF_R register latch which sets the
RF PLL’s 15-bit R counter divide ratio.The divide ratio is programmedusing the RF_R_CNTRword as shown in table4.1.3. The
divide ratio must be ≥ 3. The bits used to control the voltage doubler (V2_EN) and RF Charge Pump (RF_CP_WORD) are
detailed in 4.2.2.
BITLOCATIONFUNCTION01
DLL_MODERF_R [23]Delay Line Loop
Calibration Mode
V2_ENRF_R [22]RF_Voltage Doubler
Enable
Note 1. V2_EN bit when set high enables the voltage doubler for the RF Charge Pump supply.
Note 2. DLL_MODE bit should be set to one for normal usage.
4.2.2 RF_CP_WORD(RF_R[17]–RF_R[21])
CP_8XCP_4XCP_2XCP_1XRF_PD_POL
RF_PD_POL ( RF_R[17] )should beset toone when RF VCO characteristics are positive. When RF VCO frequency decreases
with increasing control voltage RF_PD_POL should be set to zero.
CP_1X, CP_2X, CP_4X, and CP_8X are used to step the RF Charge Pump output current magnitude from 100 µA to 1.6 mAin
100 µAsteps as shown in the table below.
RF Charge Pump Output Truth Table
ICPo µA (typ)
1000000
2000001
3000010
4000011
CP8X
RF_R[21]
CP4X
RF_R[20]
DisabledEnabled
• ••••
9001000
• ••••
16001111
SlowFast
CP2X
RF_R[19]
RF_R[18]
CP1X
LMX2354
5.0 Programmable Dividers (N Counters)
5.1 IF_N REGISTER
If the Control Bits (CTL [1:0]) are 0 1, data is transferred from the 24-bit shift register into the IF_N register latch which sets the
PLL’s15-bit programmable N counter valueand various control functions.The IF_N counter consists ofthe 3-bit swallow counter
(A counter), and the 12-bit programmable counter (B counter). Serial data format is shown below in tables 5.1.3 and 5.1.4. The
divide ratio (IF_NB_CNTR) mustbe ≥ 3.The divide ratio is programmed usingthe bits IF_N_CNTRas shown in tables 5.1.2and
5.1.3. The minimum continuous divide ratio is 56. The CMOS [3:0] bits program the 2 CMOS outputs detailed in section 5.1.2, and
Test Bit IF_N[19] controls the fractional spur compensation and should be set to 0 for normal operation. If the test bit is set to 1,
then the fractional spurs become much worse, but the phase noise improves about 5 dB.
When the Fastlock bit is set to 1, OUT_0and OUT_1 are don’t care bits.Fastlock mode utilizes the OUT0 and OUT1output pins
to synchronously switch between active low and TRI-STATE. The OUT0 = LOW state occurs whenever the RF loop’s CP_8X is
selected HIGH while the Fastlock bit is set HIGH (see programmingdescription 4.2.2). The OUT0 pin reverts to TRI-STATE when
the CP_8X bit is LOW. Similarly for the IF loop, the synchronous activation of OUT1 = LOW or TRI-STATE, is dependent on
whether the CP_GAIN_8 is high or low respectively (see programming description 4.1.4).
LOWHIGH
LOWHIGH
Compensation
5.1.4 3-BIT IF SWALLOW COUNTER DIVIDE RATIO (IF A COUNTER)(IF_N[2]−IF_N[4])
Swallow CountIF_NA_CNTR
5.1.5 12-BIT IF PROGRAMMABLE COUNTER DIVIDE RATIO (IF B COUNTER)(IF_N[5]–IF_N[16])
IF_NB_CNTR
Divide
11109876543210
Ratio
3000000000011
4000000000100
•••••••••••••
4095111111111111
Note: Divide ratio: 3 to 4095 (Divide ratios less than 3 are prohibited)
IF_NB_CNTR ≥ IF_NA_CNTR
N divider continuous integer divide ratio 56 to 32,767.
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Programming Description (Continued)
5.2 RF_N Register
If the control bits (CTL[2:0]) are 1 1, data is transferred from the 24-bit shift register into the RF_N register latch which sets the
RF PLL’s programmable N counter register and various control functions. The RF N counter consists of a 2-bit A counter, 2-bit B
counter, 11-bit C counter, and a 4-bit fractional counter. For proper operation, C_WORD^MAX{A_WORD, B_WORD}+2. Serial
data format is shown below.
MSBLSB
RF_CTL_WORD
[2:0]
2321 2010 9876 52 10
5.2.1.1 RF_CTL_WORD(RF_N[21]–RF_N[23])
MSBLSB
RF_CNT_RSTPWDN_RFPRESC_SEL
5.2.1.2 RF/IF Control Word Truth Table
IF_CNT_RST/RF_CNT_RSTIF/RF counter resetNormal OperationReset
PWDN_IF/PWDN_RFIF/RF power downPowered upPowered down
PWDN_MODEPower down mode
The Counter Reset enable bit when activated allows the reset of both N and R counters. Upon powering up, the N counter
resumes counting in “close” alignment with the R counter (the maximum error is one prescaler cycle).
Activation of the PLL power down bits result in the disabling of the respective N counter divider and de-biasing of its respective
fin inputs (to a high impedance state). The respective R counter functionality also becomes disabled when the power down bit is
activated. The OSC
forces the respective charge pump and phase comparator logic to a TRI-STATE condition. The MICROWIRE control register
remains active and capable of loading and latching in data during all of the power down modes.
Both synchronous and asynchronous power down modes are available with the LMX235x family in order to adapt to different
types of applications. The powerdown mode bit IF_N[21] is used to select between synchronous and asynchronous power down.
The MICROWIRE control register remains active and capable of loading and latching in data during all of the power down modes.
Synchronous Power Down Mode
One of the PLL loops can be
asserting its power down bit(IF_N[22] or RF_N[22]= 1). The powerdown function isgated by thecharge pump. Once the power
down bit is loaded, the part will go into power down mode upon the completion of a charge pump pulse event.
Asynchronous Power Down Mode
One of the PLL loops can be
then asserting its power down bit (IF_N[22]or RF_N[22] =1). The power down function isNOT gated by thecharge pump. Once
the power down bit is loaded, the part will go into power down mode immediately.
Prescaler select is usedto set the RF prescaler. The LMX2354 containsquadruple modulus prescalers. It usesthe 16/17/20/21
prescaler mode to operate at 1.2 GHz–2.5 GHz. In addition, it can use the 8/9/12/13 prescaler to operate at 550 MHz–1.2 GHz.
pin reverts to a high impedance state when both RF and IF power down bits are asserted. Power down
IF
synchronously
asynchronously
powered down by first setting the power down mode bit HIGH (IF_N[21] = 1) and then
powered down by first setting the power down mode bit LOW (IF_N[21] = 0) and
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Programming Description (Continued)
5.2.2 N REGISTER— (8/9/12/13) PRESCALER OPERATING IN FRACTIONAL MODE(RF_N[6]–RF_N[20])
LMX2354
Divide
Ratio
1–23Divide Ratios Less than 24 are impossible since it is required that C
24–39Some of these N values are Legal Divide Ratios, some are not
40000000001010000
41000000001010001
..............0...
16383111111111110111
N REGISTER— (16/17/20/21) PRESCALER OPERATING IN FRACTIONAL MODE(RF_N[6]–RF_N[20])
Divide
Ratio
1–47Divide Ratios Less than 48 are impossible since it is required that C
48–79Some of these N values are Legal Divide Ratios, some are not
The LMX2354 contains a quadrature modulus prescaler, consisting of a prescaler, A counter, B counter andC counter. Once the
N value is known, the A, B, and C values can be calculated by:
C = N div P
B=(N–C
A = N mod 4
For the divide ratio to be legal, it is also required:
>
C
fvco = [N + F] x [fosc/R]
N=P
F:Fractional ratio (contents of FRAC_CNTR divided by the fractional modulus)
f
vco
C:Preset value of the C counter
B:Preset value of the B counter
A:Preset value of the A counter
f
osc
R:Preset divide ratio of binary 15-bit programmable reference counter (3 to 32,767)
P:Preset modulus of quadrature modulus prescaler
P) div 4
•
=max {A, B} + 2
C+4•B+A
•
: Output frequency of external voltage controlled oscillator (VCO)
: Output frequency of the external reference frequency oscillator
Note: Data shifted into register on clock rising edge. Data is shifted in MSB first.
TEST CONDITIONS: The Serial Data Input Timing is tested using a symmetrical waveform around V
with amplitudes of 2.2V
@
VCC=2.7V and 2.6V@VCC= 5.5V.
20004803
/2. The test waveform has an edge rate of 0.6 V/ns
CC
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Programming Description (Continued)
5.5 LOCK DETECT DIGITAL FILTER
LMX2354
The Lock Detect Digital Filter compares the difference between the phase of the inputs of the phase detector to a RC generated
delay of approximately 15 ns. To enter the locked state (Lock = HIGH) the phase error must be less than the 15 ns RC delay for
5 consecutive reference cycles. Once in lock (Lock = HIGH), the RC delay is changed to approximately 30ns. To exit the locked
state (Lock = LOW), the phase error must become greater than the 30 ns RC delay. When the PLL is in the power down mode,
Lock is forced LOW. A flow chart of the digital filter is shown at right.
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20004804
Programming Description (Continued)
5.6 ANALOG LOCK DETECT FILTER
When the Fo/LD output is configured in analog lock detect mode an external lock detect circuit is needed in order to provide a
steady LOW signal when the PLL is in the locked state. A typical circuit is shown below.
LMX2354 PLLatinum Fractional N RF/ Integer N IF Dual Low Power Frequency Synthesizer
Chip Scale Package
For Tape and Reel (2500 Units per Reel)
Order Number LMX2354SLBX
NS Package Number SLB24A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
labeling, can be reasonably expected to result in a
significant injury to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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