Datasheet LMU18JC45, LMU18JC35 Datasheet (LOGIC)

Page 1
DEVICES INCORPORATED
LMU18
16 x 16-bit Parallel Multiplier
LMU18
DEVICES INCORPORATED
FEATURES DESCRIPTION
❑❑
35 ns Worst-Case Multiply Time
❑❑ ❑❑
Low Power CMOS Technology
❑❑ ❑❑
Full 32-bit Output Port —
❑❑
No Multiplexing Required
❑❑
Two’s Complement, Unsigned, or
❑❑
Mixed Operands
❑❑
Three-State Outputs
❑❑ ❑❑
84-pin PLCC, J-Lead
❑❑
The LMU18 is a high-speed, low power 16-bit parallel multiplier. The LMU18 is an 84-pin device which provides simultaneous access to all outputs.
The LMU18 produces the 32-bit product of two 16-bit numbers. Data present at the A inputs, along with the TCA control bit, is loaded into the A register on the rising edge of CLK. B data and the TCB control bit are similarly loaded. Loading of the A and B registers is controlled
LMU18 BLOCK DIAGRAM
A
15-0
16 16
CLK ENA ENB
RND
TCA TCB
A REGISTER B REGISTER
16 x 16-bit Parallel Multiplier
by the ENA and ENB controls. When HIGH, these controls prevent appli­cation of the clock to the respective register. The TCA and TCB controls specify the operands as two’s com­plement when HIGH, or unsigned magnitude when LOW.
RND is loaded on the rising edge of CLK, providing either ENA or ENB are LOW. RND, when HIGH, adds ‘1’ to the most significant bit position of the least significant half of the product. Subsequent truncation of the 16 least significant bits produces a result correctly rounded to 16-bit precision.
At the output, the Right Shift control (RS)
B
15-0
selects either of two output formats. RS LOW produces a 31-bit product with a copy of the sign bit inserted in the MSB postion of the least significant half. RS HIGH gives a full 32-bit product. Two 16-bit output registers are provided to hold the most and least significant halves of the result (MSP and LSP) as defined by RS. These registers are loaded on the rising edge of CLK, subject to the ENR control. When ENR is HIGH, clock­ing of the result registers is prevented.
RS
FT
ENR
MSPSEL
REGISTER
R
31
32
FORMAT ADJUST
16 16
REGISTERRESULT
OEM OEL
16
R
31-16
R
15-0
1
16
For asynchronous output these registers may be made transparent by setting the feed through control (FT) HIGH and ENR LOW.
The two halves of the product may be routed to a single 16-bit three-state output port (MSP) via a multiplexer. MSPSEL LOW causes the MSP outputs to be driven by the most significant half of the result. MSPSEL HIGH routes the least significant half of the result to the MSP pins. The MSB of the result is avail­able in both true and complemented form to aid implementation of higher precision multipliers.
Multipliers
08/16/2000–LDS.18-O
Page 2
DEVICES INCORPORATED
FIGURE 1A.INPUT FORMATS
LMU18
16 x 16-bit Parallel Multiplier
AIN BIN
Fractional Two’s Complement (TCA, TCB = 1)
15 14 13 2 1 0
0
–2
2–12
–2
(Sign)
15 14 13 2 1 0
–2
(Sign)
15
2142
13
15 14 13 2 1 0
–12–22–3
2
15 14 13 2 1 0
15214213
2
FIGURE 1B.OUTPUT FORMATS
–132–142–15
2
–2
(Sign)
0
2–12
Integer Two’s Complement (TCA, TCB = 1)
15 14 13 2 1 0
15 14 13 2 1 0
22212
0
–2
(Sign)
15
2142
Unsigned Fractional (TCA, TCB = 0)
15 14 13 2 1 0
–142–152–16
2
–12–22–3
2
Unsigned Integer (TCA, TCB = 0)
15 14 13 2 1 0
22212
0
15214213
2
–2
13
–132–142–15
2
22212
–142–152–16
2
22212
0
0
MSP LSP
Fractional Two’s Complement (RS = 0)
31 30 29 18 17 16
0
–2
(Sign)
2–12
–2
–132–142–15
2
Fractional Two’s Complement (RS = 1)
31 30 29 18 17 16
1
–2
(Sign)
202
–1
–122–132–14
2
Integer Two’s Complement (RS = 1)
31 30 29 18 17 16
–2
(Sign)
31
2302
29
2182172
31 30 29 18 17 16
–12–22–3
2
–142–152–16
2
31 30 29 18 17 16 2312302
29
2182172
15 14 13 2 1 0
–2
(Sign)
15 14 13 2 1 0
2
15 14 13 2 1 0
16
2152142
Unsigned Fractional (RS = 1)
15 14 13 2 1 0
2
Unsigned Integer (RS = 1)
15 14 13 2 1 0
16
2152142
0
–162–17
2
–152–162–17
–172–182–19
–282–292–30
2
–282–292–30
2
13
13
22212
–302–312–32
2
22212
0
0
Multipliers
2
08/16/2000–LDS.18-O
Page 3
DEVICES INCORPORATED
LMU18
16 x 16-bit Parallel Multiplier
MAXIMUM RATINGS
Storage temperature ........................................................................................................... –65°C to +150°C
Operating ambient temperature........................................................................................... –55°C to +125°C
VCC supply voltage with respect to ground............................................................................ –0.5 V to +7.0V
Input signal with respect to ground ........................................................................................ –3.0 V to +7.0 V
Signal applied to high impedance output ............................................................................... –3.0 V to +7.0 V
Output current into low outputs............................................................................................................. 25 mA
Latchup current ............................................................................................................................... > 400 mA
OPERATING CONDITIONS
Active Operation, Commercial 0°C to +70°C 4.75 V VCC ≤ 5.25 V Active Operation, Military –55°C to +125°C 4.50 V VCC 5.50V
ELECTRICAL CHARACTERISTICS
Above which useful life may be impaired (Notes 1, 2, 3, 8)
To meet specified electrical and switching characteristics
Mode Temperature Range (Ambient) Supply Voltage
Over Operating Conditions (Note 4)
Symbol Parameter Test Condition Min Typ Max Unit
VOH Output High Voltage VCC = Min., IOH = –2.0 mA 2.4 V VOL Output Low Voltage VCC = Min., IOL = 8.0 mA 0.5 V VIH Input High Voltage 2.0 VCC V VIL Input Low Voltage (Note 3) 0.0 0.8 V IIX Input Current Ground VIN VCC (Note 12) ±20 µA IOZ Output Leakage Current Ground VOUT VCC (Note 12) ±20 µA ICC1 VCC Current, Dynamic (Notes 5, 6) 25 45 mA ICC2 VCC Current, Quiescent (Note 7) 1.5 mA
Multipliers
3
08/16/2000–LDS.18-O
Page 4
DEVICES INCORPORATED
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
4
SWITCHING CHARACTERISTICS
LMU18
16 x 16-bit Parallel Multiplier
COMMERCIAL OPERATING RANGE (0°C to +70°C)
Symbol Parameter Min Max Min Max Min Max Min Max tMC Clocked Multiply Time 65 45 35 20
tMUC Unclocked Multiply Time 85 65 55 30 tPW Clock Pulse Width 15 15 15 9 tS Input Setup Time 15 15 12 11 tH Input Hold Time 5 5 5 1 tD Output Delay 30 30 28 18 tSEL Output Select Delay 25 25 25 18 tENA Three-State Output Enable Delay (Note 11) 25202018 tDIS Three-State Output Disable Delay (Note 11) 24202018
MILITARY OPERATING RANGE (–55°C to +125°C)
Symbol Parameter Min Max Min Max Min Max tMC Clocked Multiply Time 75 55 45 25 tMUC Unclocked Multiply Time 95 85 65 38 tPW Clock Pulse Width 20 15 15 10 tS Input Setup Time 15 15 12 12 tH Input Hold Time 5 5 5 2 tD Output Delay 35 35 33 20 tSEL Output Select Delay 30 30 30 20 tENA Three-State Output Enable Delay (Note 11)25202020 tDIS Three-State Output Disable Delay (Note 11)24202020
Notes 9, 10 (ns)
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Notes 9, 10 (ns)
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65
75
LMU18–
*
45 35 20
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*
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LMU18–
*
55
*
45
*
25
*
SWITCHING WAVEFORMS
INPUT
ENA, ENB
ENR
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*DISCONTINUED SPEED GRADE
CLOCK
MSPSEL
OEM
OEL
31-0
R
t
S
t
H
t
t
S
t
PW
t
DIS
t
PW
t
MC
HIGH IMPEDANCE
4
t
MUC
t
ENA
H
t
PW
t
D
t
SEL
Multipliers
08/16/2000–LDS.18-O
Page 5
DEVICES INCORPORATED
S1
I
OH
I
OL
V
TH
C
L
DUT
OE
0.2 V
t
DIS
t
ENA
0.2 V
1.5 V 1.5 V
3.5V Vth
1
Z
0
Z
Z
1
Z
0
1.5 V
1.5 V
0V Vth
VOL*
V
OH
*
V
OL
*
V
OH
*
Measured V
OL
with IOH = –10mA and IOL = 10mA
Measured V
OH
with IOH = –10mA and IOL = 10mA
NOTES
LMU18
16 x 16-bit Parallel Multiplier
1. Maximum Ratings indicate stress specifications only. Functional oper­ation of these products at values beyond those indicated in the Operating Condi­tions table is not implied. Exposure to maximum rating conditions for ex­tended periods may affect reliability.
2. The products described by this spec­ification include internal circuitry de­signed to protect the chip from damag­ing substrate injection currents and ac­cumulations of static charge. Neverthe­less, conventional precautions should be observed during storage, handling, and use of these circuits in order to avoid exposure to excessive electrical stress values.
3. This device provides hard clamping of transient undershoot and overshoot. In­put levels below ground or above VCC will be clamped beginning at –0.6 V and VCC + 0.6 V. The device can withstand indefinite operation with inputs in the range of –0.5 V to +7.0 V. Device opera­tion will not be adversely affected, how­ever, input current levels will be well in excess of 100 mA.
9. AC specifications are tested with input transition times less than 3 ns, output reference levels of 1.5 V (except
tDIS test), and input levels of nominally
0 to 3.0 V. Output loading may be a resistive divider which provides for specified IOH and IOL at an output voltage of VOH min and VOL max respectively. Alternatively, a diode bridge with upper and lower current sources of IOH and IOL respectively, and a balancing voltage of 1.5 V may be used. Parasitic capacitance is 30 pF minimum, and may be distributed.
This device has high-speed outputs ca­pable of large instantaneous current pulses and fast turn-on/turn-off times. As a result, care must be exercised in the testing of this device. The following measures are recommended:
a. A 0.1 µF ceramic capacitor should be installed between VCC and Ground leads as close to the Device Under Test (DUT) as possible. Similar capacitors should be installed between device VCC and the tester common, and device ground and tester common.
11. For the tENA test, the transition is measured to the 1.5 V crossing point with datasheet loads. For the tDIS test, the transition is measured to the ±200mV level from the measured steady-state output voltage with ±10mA loads. The balancing volt­age, VTH, is set at 3.5 V for Z-to-0 and 0-to-Z tests, and set at 0 V for Z­to-1 and 1-to-Z tests.
12. These parameters are only tested at the high temperature extreme, which is the worst case for leakage current.
FIGURE A. OUTPUT LOADING CIRCUIT
FIGURE B. THRESHOLD LEVELS
4. Actual test conditions may vary from those designated but operation is guar­anteed as specified.
5. Supply current for a given applica­tion can be accurately approximated by:
2
NCV F
where
4
N = total number of device outputs C = capacitive load per output V = supply voltage F = clock frequency
6. Tested with all outputs changing ev­ery cycle and no load, at a 5 MHz clock rate.
7. Tested with all inputs within 0.1 V of
VCC or Ground, no load.
8. These parameters are guaranteed but not 100% tested.
b. Ground and VCC supply planes must be brought directly to the DUT socket or contactor fingers.
c. Input voltages should be adjusted to compensate for inductive ground and VCC noise to maintain required DUT input levels relative to the DUT ground pin.
10. Each parameter is shown as a min­imum or maximum value. Input re­quirements are specified from the point of view of the external system driving the chip. Setup time, for example, is specified as a minimum since the exter­nal system must supply at least that much time to meet the worst-case re­quirements of all parts. Responses from the internal circuitry are specified from the point of view of the device. Output delay, for example, is specified as a maximum since worst-case operation of any device always provides data within that time.
5
Multipliers
08/16/2000–LDS.18-O
Page 6
DEVICES INCORPORATED
ORDERING INFORMATION
84-pin
LMU18
16 x 16-bit Parallel Multiplier
B B B B B B
ENB
CLK
OEL
GND
V
CC
R R R R R R R R R R
B9B8B7B6B5B4B3B2B1B0A0A1A2A3A4A5A6A7A8A9A
1234567
12
10
13
11
14
12
15
13
16
14
17
15
18 19 20 21 22 23
0
24
1
25
2
26
3
27
4
28
5
29
6
30
7
31
8
32
9
891011 78 77 76 75
36353433 50 51 52 53
15
R10R11R12R13R14R
CC
V
GND
84 83 82 81 80 79
Top
View
4443 45 46 47 493837 39 40 41 42
16R17R18R19R20R21R22R23R24R25R26R27R28
R
48
10
74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54
A
11
A
12
A
13
A
14
A
15
ENA RND TCA TCB V
CC
GND GND MSPSEL FT RS OEM ENR R
31
R
31
R
30
R
29
Speed
45 ns 35 ns
Plastic J-Lead Chip Carrier
(J3)
0°C to +70°C — COMMERCIAL SCREENING
LMU18JC45 LMU18JC35
Multipliers
6
08/16/2000–LDS.18-O
Page 7
DEVICES INCORPORATED
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
ORDERING INFORMATION
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84-pin
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12345
A
B
7
B
9
B
B
10
B
12
C
B
11
B
13
D
B
14
B
15
E
GND
CLK
OEL
F
ENB
V
0
R
G
2
R
1
R
H
R
5
R
4
J
R
8
R
6
K
R
R
10
R
7
L
R
12
R
9
R
6
B
4
B
1
B
B
6
B
5
B
8
3
B
2
A
1
B
0
A
0
Top View
Through Package
CC
(i.e., Component Side Pinout)
R
3
R
17
R
18
R
14
GND
V
11
R
15
13
CC
16
R
19
R
Discontinued Package
7 8 9 10 11
A
2
A
3
A
4
R
22
R
21
R
20
Ceramic Pin Grid Array
Speed
(G3)
0°C to +70°C — COMMERCIAL SCREENING
–55°C to +125°C — COMMERCIAL SCREENING
–55°C to +125°C — MIL-STD-883 COMPLIANT
7
16 x 16-bit Parallel Multiplier
A
5
A
7
A
8
A
11
A
6
A
9
A
10
A
13
A
12
A
14
A
15
ENA
V
CC
TCA
TCB
GND
GND
RND
FT
ENR
30
R
R
29
R
26
MSPSEL
OEM
31
R
R
31
R
28
Multipliers
RS
R
24
27
R
R
23
R
25
LMU18
08/16/2000–LDS.18-O
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