Datasheet LMH6733MQX, LMH6733 Datasheet (NSC)

January 2007
LMH6733 Single Supply, 1.0 GHz, Triple Operational Amplifier
General Description
The LMH6733 is a triple, wideband, operational amplifier de­signed specifically for use where high speed and low power are required. Input voltage range and output voltage swing are optimized for operation on supplies as low as 3V and up to ±6V. Benefiting from National’s current feedback architec­ture, the LMH6733 offers a gain range of ±1 to ±10 while providing stable operation without external compensation, even at unity gain. These amplifiers provide 650 MHz small signal bandwidth at a gain of 2 V/V , a low 2.1 nV/
input referred noise and only consume 5.5 mA (per amplifier) from a single 5V supply.
The LMH6733 is offered in a 16-Pin SSOP package with flow through pinout for ease of layout and is also pin compatible with the LMH6738. Each amplifier has an individual shutdown pin.
Features
Supply range 3 to 12V single supply
Supply range ±1.5V to ±6V split supply
1.0 GHz −3 dB small signal bandwidth (AV = +1, VS = ±5V)
650 MHz −3 dB small signal bandwidth (AV = +2, VS = 5V)
Low supply current (5.5 mA per op amp, VS = 5V)
2.1 nV/
input noise voltage
3750 V/μs slew rate
70 mA linear output current
CMIR and output swing to 1V from each supply rail
Applications
HDTV component video driver
High resolution projectors
Flash A/D driver
D/A transimpedance buffer
Wide dynamic range IF amp
Radar/communication receivers
DDS post-amps
Wideband inverting summer
Line driver
Connection Diagram
16-Pin SSOP
20199110
Top View
Ordering Information
Package Part Number Package Marking Transport Media NSC Drawing
16-pin SSOP
LMH6733MQ
LH6733MQ
95 Units/Rail
MQA16
LMH6733MQX 2.5k Units Tape and Reel
VIP10™ is a trademark of National Semiconductor Corporation.
© 2007 National Semiconductor Corporation 201991 www.national.com
LMH6733 Single Supply, 1.0 GHz, Triple Operational Amplifier
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
ESD Tolerance (Note 2) Human Body Model 2000V Machine Model 200V Supply Voltage (V+ - V–)
13.2V
I
OUT
(Note 3)
Common Mode Input Voltage ±V
CC
Maximum Junction Temperature +150°C Storage Temperature Range −65°C to +150°C
Soldering Information Infrared or Convection (20 sec.) 235°C Wave Soldering (10 sec.) 260°C Storage Temperature Range −65°C to +150°C
Operating Ratings (Note 1)
Thermal Resistance
Package
(θJC)
(θJA)
16-Pin SSOP 36°C/W 120°C/W Temperature Range (Note 4) −40°C +85°C Supply Voltage (V+ - V–) 3V to 12V
5V Electrical Characteristics (Note 5)
AV = +2, VCC = 5V, RL = 100Ω, RF = 340Ω; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
Frequency Domain Performance
UGBW −3 dB Bandwidth Unity Gain, V
OUT
= 200 mV
PP
870
MHz
SSBW −3 dB Bandwidth
V
OUT
= 200 mVPP, RL = 100Ω
650
MHz
SSBW
V
OUT
= 200 mVPP, RL = 150Ω
685
LSBW V
OUT
= 2 V
PP
480
0.1 dBBW0.1 dB Gain Flatness V
OUT
= 200 mV
PP
320 MHz
Time Domain Response
TRS Rise and Fall Time
(10% to 90%)
2V Step 0.8 ns
SR Slew Rate 2V Step 1900 V/µs
t
s
Settling Time to 0.1% 2V Step 10 ns
t
e
Enable Time From Disable = Rising Edge 10 ns
t
d
Disable Time From Disable = Falling Edge 15 ns
Distortion
HD2L 2nd Harmonic Distortion 2 VPP, 10 MHz −63 dBc
HD3L 3rd Harmonic Distortion 2 VPP, 10 MHz −73 dBc
Equivalent Input Noise
V
N
Non-Inverting Voltage >10 MHz 2.1
nV/
I
CN
Inverting Current >10 MHz 18.6
pA/
N
CN
Non-Inverting Current >10 MHz 26.9
pA/
Video Performance
DG Differential Gain
4.43 MHz, RL = 150Ω
0.03 %
DP Differential Phase
4.43 MHz, RL = 150Ω
0.025 deg
Static, DC Performance
VIO Input Offset Voltage (Note 7) 0.4 2.0
2.5
mV
IBN Input Bias Current (Note 7) Non-Inverting 2 16.7 28
32
µA
IBI Input Bias Current (Note 7) Inverting 1.0 17
19
μA
PSRR Power Supply Rejection Ratio
(Note 7)
+PSRR 59
59
61
dB
−PSRR 58
57
61
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LMH6733
Symbol Parameter Conditions Min Typ Max Units
CMRR Common Mode Rejection Ratio
(Note 7)
52
51.5
54.5 dB
XTLK Crosstalk Input Referred, f = 10 MHz, Drive
Channels A,C Measure Channel B
−80 dB
I
CC
Supply Current (Note 7) All Three Amps Enabled, No Load 16.7 18 mA
Supply Current Disabled V
+
RL =
1.54 1.8 mA
Supply Current Disabled V
RL =
0.75 1.8 mA
Miscellaneous Performance
RIN+ Non-Inverting Input Resistance 200
k
CIN+ Non-Inverting Input Capacitance 1 pF
RIN− Inverting Input Impedance Output Impedance of Input Buffer. 27
R
O
Output Impedance DC 0.05
V
O
Output Voltage Range (Note 7)
RL = 100Ω
1.25-3.75
1.3-3.7
1.12-3.88 V
RL =
1.11-3.89
1.15-3.85
1.03-3.97
CMIR Common Mode Input Range
(Note 7)
CMRR > 40 dB 1.1-3.9
1.2-3.8
1.0–4.0 V
I
O
Linear Output Current (Notes 3, 7)
VIN = 0V, V
OUT
< ±42 mV ±50 ±60 mA
I
SC
Short Circuit Current (Note 6) VIN = 2V Output Shorted to Ground 170 mA
I
IH
Disable Pin Bias Current High Disable Pin = V
+
−72
μA
I
IL
Disable Pin Bias Current Low Disable Pin = 0V −360
μA
V
DMAX
Voltage for Disable
Disable Pin V
DMAX
3.2 V
V
DMIM
Voltage for Enable
Disable Pin V
DMIN
3.6 V
±5V Electrical Characteristics (Note 5)
AV = +2, VCC = ±5V, RL = 100Ω, RF = 383Ω; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
Frequency Domain Performance
UGBW −3 dB Bandwidth Unity Gain, V
OUT
= 200 mV
PP
1000 MHz
SSBW −3 dB Bandwidth
V
OUT
= 200 mVPP, RL = 100Ω
830
MHz
SSBW
V
OUT
= 200 mVPP, RL = 150Ω
950
LSBW V
OUT
= 2 V
PP
600
0.1 dB BW 0.1 dB Gain Flatness V
OUT
= 200 mV
PP
350
MHz
Time Domain Response
TRS Rise and Fall Time
(10% to 90%)
2V Step 0.7
ns
TRL 5V Step 0.8
SR Slew Rate 4V Step 3750 V/µs
t
s
Settling Time to 0.1% 2V Step 10 ns
t
e
Enable Time From Disable = Rising Edge 10 ns
t
d
Disable Time From Disable = Falling Edge 15 ns
Distortion
HD2L 2nd Harmonic Distortion 2 VPP, 10 MHz −72 dBc
HD3L 3rd Harmonic Distortion 2 VPP, 10 MHz −63 dBc
Equivalent Input Noise
V
N
Non-Inverting Voltage >10 MHz 2.1
nV/
I
CN
Inverting Current >10 MHz 18.6
pA/
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LMH6733
Symbol Parameter Conditions Min Typ Max Units
N
CN
Non-Inverting Current >10 MHz 26.9
pA/
Video Performance
DG Differential Gain
4.43 MHz, RL = 150Ω
0.03 %
DP Differential Phase
4.43 MHz, RL = 150Ω
0.03 Deg
Static, DC Performance
VIO Input Offset Voltage (Note 7) 0.6 2.2
2.5
mV
IBN Input Bias Current (Note 7) Non-Inverting −14
−19
3.5 19
24
µA
IBI Input Bias Current (Note 7) Inverting 5 23
26
μA
PSRR Power Supply Rejection Ratio
(Note 7)
+PSRR 59 61.5
dB
−PSRR 58 61
CMRR Common Mode Rejection Ratio
(Note 7)
53
52.5
55
dB
XTLK Crosstalk Input Referred, f = 10 MHz, Drive
Channels A,C Measure Channel B
−80 dB
I
CC
Supply Current (Note 7) All Three Amps Enabled, No Load 19.5 20.8
22.0
mA
Supply Current Disabled V
+
RL =
1.54 1.8 mA
Supply Current Disabled V
RL =
0.75 1.8 mA
Miscellaneous Performance
RIN+ Non-Inverting Input Resistance 200
k
CIN+ Non-Inverting Input Capacitance 1 pF
RIN− Inverting Input Impedance Output Impedance of Input Buffer 30
R
O
Output Impedance DC 0.05
V
O
Output Voltage Range (Note 7)
RL = 100Ω
±3.55
±3.5
±3.7
V
RL =
±3.85 ±4.0
CMIR Common Mode Input Range
(Note 7)
CMRR > 43 dB ±3.9
±3.8
±4.0 V
I
O
Linear Output Current (Notes 3, 7)
VIN = 0V, V
OUT
< ±42 mV 70 ±80 mA
I
SC
Short Circuit Current (Note 6) VIN = 2V Output Shorted to Ground 237 mA
I
IH
Disable Pin Bias Current High Disable Pin = V
+
−72
μA
I
IL
Disable Pin Bias Current Low Disable Pin = 0V −360
μA
V
DMAX
Voltage for Disable
Disable Pin V
DMAX
3.2 V
V
DMIM
Voltage for Enable
Disable Pin V
DMIN
3.6 V
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications, see the Electrical Characteristics tables.
Note 2: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)
Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Note 3: The maximum output current (I
OUT
) is determined by device power dissipation limitations. See the Power Dissipation section of the Applications Information
for more details.
Note 4: The maximum power dissipation is a function of T
J(MAX)
, θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (T
J(MAX)
– TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.
Note 5: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA.
Note 6: Short circuit current should be limited in duration to no more than 10 seconds. See the Power Dissipation section of the Application Section for more details.
Note 7: Parameter 100% production tested at 25° C.
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LMH6733
Typical Performance Characteristics A
V
= +2, VCC = 5V, RL = 100Ω, RF = 340Ω; unless otherwise
specified).
Large Signal Frequency Response
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Large Signal Frequency Response
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Small Signal Frequency Response
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Frequency Response vs. V
OUT
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Frequency Response vs. Supply Voltage
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Gain Flatness
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LMH6733
Pulse Response
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Crosstalk vs. Frequency
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Distortion vs. Frequency
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Distortion vs. Output Voltage
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Small Signal Frequency Response vs. R
L
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Frequency Response vs. Capacitive Load
20199136
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LMH6733
Series Output Resistance vs. Capacitive Load
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PSRR vs. Frequency
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CMRR vs. Frequency
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Closed Loop Output Impedance |Z|
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Disabled Channel Isolation vs. Frequency
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Disable Timing
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LMH6733
DC Errors vs. Temperature
20199143
Open Loop Transimpedance
20199145
Input Noise vs. Frequency
20199146
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LMH6733
Typical Performance Characteristics A
V
= +2, VCC = ±5V, RL = 100Ω, RF = 383Ω; unless otherwise
specified).
Large Signal Frequency Response
20199122
Large Signal Frequency Response
20199123
Small Signal Frequency Response
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Frequency Response vs. V
OUT
20199125
Frequency Response vs. Supply Voltage
20199126
Gain Flatness
20199127
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LMH6733
Pulse Response
20199128
Crosstalk vs. Frequency
20199129
Distortion vs. Output Voltage
20199130
Distortion vs. Frequency
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DC Errors vs. Temperature
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LMH6733
Application Information
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FIGURE 1. Recommended Non-Inverting Gain Circuit
20199106
FIGURE 2. Recommended Inverting Gain Circuit
GENERAL INFORMATION
The LMH6733 is a high speed current feedback amplifier, op­timized for very high speed and low distortion. The LMH6733 has no internal ground reference so single or split supply con­figurations are both equally useful.
FEEDBACK RESISTOR SELECTION
One of the key benefits of a current feedback operational am­plifier is the ability to maintain optimum frequency response independent of gain by using the appropriate values for the feedback resistor (RF). The Electrical Characteristics and Typical Performance plots specify an RF of 340, a gain of +2 V/V and ±2.5V power supplies (unless otherwise speci­fied). Generally, lowering RF from its recommended value will peak the frequency response and extend the bandwidth while increasing the value of RF will cause the frequency response to roll off faster. Reducing the value of RF too far below its recommended value will cause overshoot, ringing and, even­tually, oscillation.
20199103
FIGURE 3. Recommended RF vs. Gain
See Figure 3 for selecting a feedback resistor value for gains of ±1 to ±10. Since each application is slightly different it is worth some experimentation to find the optimal RF for a given circuit. In general a value of RF that produces about 0.1 dB of peaking is the best compromise between stability and maxi­mal bandwidth. Note that it is not possible to use a current feedback amplifier with the output shorted directly to the in­verting input. The buffer configuration of the LMH6733 re­quires a 324 feedback resistor for stable operation.
The LMH6733 has been optimized for high speed operation. As shown in Figure 3 the suggested value for RF decreases for higher gains. Due to the impedance of the input buffer there is a practical limit for how small RF can go, based on the lowest practical value of RG. This limitation applies to both inverting and non-inverting configurations. For the LMH6733 the input resistance of the inverting input is approximately 30 and 20 is a practical (but not hard and fast) lower limit for RG. The LMH6733 begins to operate in a gain bandwidth limited fashion in the region where RG is nearly equal to the input buffer impedance. Note that the amplifier will operate with RG values well below 20, however results may be sub­stantially different than predicted from ideal models. In par­ticular the voltage potential between the inverting and non­inverting inputs cannot be expected to remain small.
Inverting gain applications that require impedance matched inputs may limit gain flexibility somewhat (especially if maxi­mum bandwidth is required). The impedance seen by the source is RG || RT (RT is optional). The value of RG is RF /gain. Thus for an inverting gain of −5 V/V and an optimal value for RF the input impedance is equal to 55. Using a termination resistor this can be brought down to match a 25 source; however, a 150 source cannot be matched. To match a 150 source would require using a 1050 feedback resistor and would result in reduced bandwidth.
For more information see Application Note OA-13 which de­scribes the relationship between RF and closed-loop frequen­cy response for current feedback operational amplifiers. The value for the inverting input impedance for the LMH6733 is approximately 30. The LMH6733 is designed for optimum performance at gains of +1 to +10 V/V and −1 to −9 V/V. Higher gain configurations are still useful; however, the band­width will fall as gain is increased, much like a typical voltage feedback amplifier.
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LMH6733
ACTIVE FILTER
The choice of reactive components requires much attention when using any current feedback operational amplifier as an active filter. Reducing the feedback impedance, especially at higher frequencies, will almost certainly cause stability prob­lems. Likewise capacitance on the inverting input should be avoided. See Application Notes OA-7 and OA-26 for more in­formation on Active Filter applications for Current Feedback Op Amps.
When using the LMH6733 as a low pass filter the value of RF can be substantially reduced from the value recommended in the RF vs. Gain charts. The benefit of reducing RF is in­creased gain at higher frequencies, which improves attenua­tion in the stop band. Stability problems are avoided because in the stop band additional device bandwidth is used to cancel the input signal rather than amplify it. The benefit of this change depends on the particulars of the circuit design. With a high pass filter configuration reducing RF will likely result in device instability and is not recommended.
20199107
FIGURE 4. Typical Video Application
20199108
FIGURE 5. Decoupling Capacitive Loads
DRIVING CAPACITIVE LOADS
Capacitive output loading applications will benefit from the use of a series output resistor R
OUT
. Figure 5 shows the use
of a series output resistor, R
OUT
, to stabilize the amplifier out­put under capacitive loading. Capacitive loads of 5 to 120 pF are the most critical, causing ringing, frequency response peaking and possible oscillation. The chart “Frequency Re­sponse vs. Capacitive Load” give a recommended value for selecting a series output resistor for mitigating capacitive loads. The values suggested in the charts are selected for .5 dB or less of peaking in the frequency response. This gives a good compromise between settling time and bandwidth. For applications where maximum frequency response is needed and some peaking is tolerable, the value of R
OUT
can be re-
duced slightly from the recommended values.
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LMH6733
20199132
FIGURE 6. AC Coupled Single Supply Video Amplifier
AC-COUPLED VIDEO
The LMH6733 can be used as an AC-coupled single supply video amplifier for driving 75 coax with a gain of 2. The input signal is nominally 0.7V or 1.0V for component YPRPB and RGB, depending on the presence of a sync. R1, R2, and R
3
simply set the input to the center of the input linear range while CIN AC couples the video onto the op amp’s input.
As can be seen in Figure 6, amplifier U1 is used in a positive gain configuration set for a closed loop gain of 2. The feed­back resistor RF is 340. The gain resistor is created from the parallel combination of RG and R4, giving a Thevenin equiv­alent of 340 connected to 2.5V.
The 75 back termination resistor RO divides the signal such that V
OUT
equals a buffered version of VIN. The back termi­nation will eliminate any reflection of the signal that comes from the load. The input termination resistor, RT, is optional – it is used only if matching of the incoming line is necessary. In some applications, it is recommended that a small valued ceramic capacitor be used in parallel with CO which is itself electrolytic because of its rather large value. The ceramic cap will tend to shunt the inductive behavior of this electrolytic cap, CO, at higher frequencies for an improved overall, low­impedance output.
INVERTING INPUT PARASITIC CAPACITANCE
Parasitic capacitance is any capacitance in a circuit that was not intentionally added. It comes about from electrical inter­action between conductors. Parasitic capacitance can be reduced but never entirely eliminated. Most parasitic capaci­tances that cause problems are related to board layout or lack of termination on transmission lines. Please see the section on Layout Considerations for hints on reducing problems due to parasitic capacitances on board traces. Transmission lines should be terminated in their characteristic impedance at both ends.
High speed amplifiers are sensitive to capacitance between the inverting input and ground or power supplies. This shows up as gain peaking at high frequency. The capacitor raises device gain at high frequencies by making RG appear smaller. Capacitive output loading will exaggerate this effect. In gen-
eral, avoid introducing unnecessary parasitic capacitance at both the inverting input and the output.
One possible remedy for this effect is to slightly increase the value of the feedback (and gain set) resistor. This will tend to offset the high frequency gain peaking while leaving other parameters relatively unchanged. If the device has a capaci­tive load as well as inverting input capacitance using a series output resistor as described in the section on “Driving Capac­itive Loads” will help.
LAYOUT CONSIDERATIONS
Whenever questions about layout arise, use the evaluation board as a guide. The LMH730275 is the evaluation board supplied with samples of the LMH6733.
To reduce parasitic capacitances ground and power planes should be removed near the input and output pins. Compo­nents in the feedback loop should be placed as close to the device as possible. For long signal paths controlled impedance lines should be used, along with impedance matching elements at both ends.
Bypass capacitors should be placed as close to the device as possible. Bypass capacitors from each rail to ground are ap­plied in pairs. The larger electrolytic bypass capacitors can be located farther from the device, the smaller ceramic capaci­tors should be placed as close to the device as possible. The LMH6733 has multiple power and ground pins for enhanced supply bypassing. Every pin should ideally have a separate bypass capacitor. Sharing bypass capacitors may slightly de­grade second order harmonic performance, especially if the supply traces are thin and /or long. In Figure 1 and Figure 2 CSS is optional, but is recommended for best second harmon­ic distortion. Another option to using CSS is to use pairs of .01 μF and .1 μF ceramic capacitors for each supply bypass.
VIDEO PERFORMANCE
The LMH6733 has been designed to provide excellent per­formance with production quality video signals in a wide va­riety of formats such as HDTV and High Resolution VGA. NTSC and PAL performance is nearly flawless. Best perfor­mance will be obtained with back terminated loads. The back
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LMH6733
termination reduces reflections from the transmission line and effectively masks transmission line and other parasitic ca­pacitances from the amplifier output stage. Figure 4 shows a typical configuration for driving a 75 cable. The amplifier is configured for a gain of two to make up for the 6 dB of loss in R
OUT
.
20199102
FIGURE 7. Maximum Power Dissipation
POWER DISSIPATION
The LMH6733 is optimized for maximum speed and perfor­mance in the small form factor of the standard SSOP-16 package. To achieve its high level of performance, the LMH6733 consumes an appreciable amount of quiescent current which cannot be neglected when considering the total package power dissipation limit. The quiescent current con­tributes to about 40° C rise in junction temperature when no additional heat sink is used (VS = ±5V, all 3 channels on). Therefore, it is easy to see that proper precautions need to be taken in order to make sure the junction temperature’s ab­solute maximum rating of 150°C is not violated.
To ensure maximum output drive and highest performance, thermal shutdown is not provided. Therefore, it is of utmost importance to make sure that the T
JMAX
is never exceeded
due to the overall power dissipation (all 3 channels). With the LMH6733 used in a back-terminated 75 RGB ana-
log video system (with 2 VPP output voltage), the total power dissipation is around 305 mW of which 220 mW is due to the quiescent device dissipation (output black level at 0V). With no additional heat sink used, that puts the junction tempera­ture to about 120° C when operated at 85°C ambient.
To reduce the junction temperature many options are avail­able. Forced air cooling is the easiest option. An external add­on heat-sink can be added to the SSOP-16 package, or alternatively, additional board metal (copper) area can be uti­lized as heat-sink.
An effective way to reduce the junction temperature for the SSOP-16 package (and other plastic packages) is to use the copper board area to conduct heat. With no enhancement the
major heat flow path in this package is from the die through the metal lead frame (inside the package) and onto the sur­rounding copper through the interconnecting leads. Since high frequency performance requires limited metal near the device pins the best way to use board copper to remove heat is through the bottom of the package. A gap filler with high thermal conductivity can be used to conduct heat from the bottom of the package to copper on the circuit board. Vias to a ground or power plane on the back side of the circuit board will provide additional heat dissipation. A combination of front side copper and vias to the back side can be combined as well.
Follow these steps to determine the maximum power dissi­pation for the LMH6733:
1.
Calculate the quiescent (no-load) power: P
AMP
= ICC X
(VS), where VS = V+-V
2.
Calculate the RMS power dissipated in the output stage: PD (rms) = rms ((VS - V
OUT
) X I
OUT
) where V
OUT
and
I
OUT
are the voltage and the current across the external
load and VS is the total supply voltage
3.
Calculate the total RMS power: PT = P
AMP+PD
The maximum power that the LMH6733, package can dissi­pate at a given temperature can be derived with the following equation (See Figure 7):
P
MAX
= (150°C/W– T
AMB
)/ θJA, where T
AMB
= ambient tem-
perature (°C) and θJA = thermal resistance, from junction to ambient, for a given package (°C/W). For the SSOP package
θJA is 120°C/W.
ESD PROTECTION
The LMH6733 is protected against electrostatic discharge (ESD) on all pins. The LMH6733 will survive 2000V Human Body Model and 200V Machine Model events.
Under closed loop operation the ESD diodes have no affect on circuit performance. There are occasions, however, when the ESD diodes will be evident. If the LMH6733 is driven by a large signal while the device is powered down the ESD diodes will conduct.
The current that flows through the ESD diodes will either exit the chip through the supply pins or will flow through the de­vice, hence it is possible to power up a chip with a large signal applied to the input pins. Shorting the power pins to each other will prevent the chip from being powered up through the input.
EVALUATION BOARDS
National Semiconductor provides the following evaluation boards as a guide for high frequency layout and as an aid in device testing and characterization. Many of the datasheet plots were measured with these boards.
Device Package Evaluation Board
Part Number
LMH6733MQ SSOP LMH730275
A bare evaluation board can be ordered when a sample re­quest is placed with National Semiconductor.
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LMH6733
Physical Dimensions inches (millimeters) unless otherwise noted
16-Pin SSOP
NS Package Number MQA16
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LMH6733
Notes
LMH6733 Single Supply, 1.0 GHz, Triple Operational Amplifier
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