LMC6041
CMOS Single Micropower Operational Amplifier
LMC6041 CMOS Single Micropower Operational Amplifier
December 1994
General Description
Ultra-low power consumption and low input-leakage current
are the hallmarks of the LMC6041. Providing input currents
of only 2 fA typical, the LMC6041 can operate from a single
supply, has output swing extending to each supply rail, and
an input voltage range that includes ground.
The LMC6041 is ideal for use in systems requiring ultra-low
power consumption. In addition, the insensitivity to latch-up,
high output drive, and output swing to ground without requiring external pull-down resistors make it ideal for
single-supply battery-powered systems.
Other applications for the LMC6041 include bar code reader
amplifiers, magnetic and electric field detectors, and
hand-held electrometers.
This device is built with National’s advanced Double-Poly
Silicon-Gate CMOS process.
See the LMC6042 for a dual, and the LMC6044 for a quad
amplifier with these features.
Connection Diagram
8-Pin DIP/SO
Ordering Information
Temperature
Range
−40˚C to +85˚C
8-PinLMC6041AIMM08ARail
Small Outline LMC6041IMTape and
8-PinLMC6041AINN08ERail
Molded DIPLM6041IN
Features
n Low supply current: 14 µA (Typ)
n Operates from 4.5V to 15.5V single supply
n Ultra low input current: 2 fA (Typ)
n Rail-to-rail output swing
n Input common-mode range includes ground
Applications
n Battery monitoring and power conditioning
n Photodiode and infrared detector preamplifier
n Silicon based transducer systems
n Hand-held analytic instruments
n pH probe buffer amplifier
n Fire and smoke detection systems
n Charge amplifier for piezoelectric transducers
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Differential Input Voltage
Supply Voltage (V
Output Short Circuit to V
Output Short Circuit to V
+−V−
)16V
−
+
Lead Temperature
(Soldering, 10 sec.)260˚C
Storage Temperature Range−65˚C to +150˚C
Junction Temperature110˚C
ESD Tolerance (Note 4)500V
Current at Input Pin
±
Supply Voltage
(Note 2)
(Note 11)
±
5mA
Current at Output Pin
Current at Power Supply Pin35 mA
Voltage at Input/Output Pin(V
+
) + 0.3V, (V−) − 0.3V
±
18 mA
Power Dissipation(Note 3)
Operating Ratings
Temperature Range
LMC6041AI, LMC6041I−40˚C ≤ T
Supply Voltage4.5V ≤ V
Power Dissipation(Note 9)
Thermal Resistance (θ
) (Note 10)
JA
8-Pin DIP101˚C/W
8-Pin SO165˚C/W
≤ +85˚C
J
+
≤ 15.5V
Electrical Characteristics
Unless otherwise specified, all limits guaranteed for T
5V, V
−
=
0V, V
=
1.5V, V
CM
+
=
/2, and R
V
O
>
1M unless otherwise specified.
L
=
=
T
25˚C. Boldface limits apply at the temperature extremes. V
Phase Margin60Deg
Input-ReferredF=1 kHz83nV/√Hz
Voltage Noise
i
n
Input-ReferredF=1 kHz0.0002pA/√Hz
Current Noise
T.H.D.Total HarmonicF=1 kHz, A
DistortionR
=
L
±
5V Supply
V
100 kΩ,V
=
−5
=
2V
O
pp
0.01
%
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=
Page 4
AC Electrical Characteristics (Continued)
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating conditions indicate conditions for which the device is
intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The
guaranteed specifications apply only for the test conditions listed.
Note 2: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the
maximum allowed junction temperature of 110˚C. Output currents in excess of
Note 3: The maximum powerdissipationisa function of T
−TA)/θJA.
Note 4: Human body model, 1.5 kΩ in series with 100 pF.
Note 5: Typical Values represent the most likely parametric norm.
Note 6: All limits are guaranteed at room temperature (standard type face) or at operating temperature extremes (bold face type).
+
=
Note 7: V
+
=
Note 8: V
Note 9: For operating at elevated temperatures the device must be derated based on the thermal resistance θ
Note 10: All numbers apply for packages soldered directly into a PC board.
Note 11: Do not connect output to V
=
15V, V
15V. Connected as Voltage Follower with 10V step input. Number specified in the slower of the positive and negative slew rates.
CM
7.5V and R
connected to 7.5V. For Sourcing tests, 7.5V ≤ VO≤ 11.5V. For Sinking tests, 2.5V ≤ VO≤ 7.5V.
L
+
when V+is greater than 13V or reliability may be adversely affected.
, θJA, and TA. The maximum allowable power dissipation at any ambient temperature is P
J(max)
±
30 mA over long term may adversely affect reliability.
=
with P
JA
(T
D
J−TA
)/θJA.
=
(T
D
J(max)
Typical Performance Characteristics V
Supply Current vs
Supply Voltage
DS011136-19
Input Bias Current
vs Input Common-Mode
Voltage
Offset Voltage vs
Temperature of Five
Representative Units
Input Common-Mode
Voltage Range vs
Temperature
=
±
S
7.5V, T
=
25˚C unless otherwise specified
A
Input Bias Current
vs Temperature
DS011136-20
DS011136-21
Output Characteristics
Current Sinking
DS011136-22
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DS011136-23
DS011136-24
Page 5
Typical Performance Characteristics V
specified (Continued)
=
±
7.5V, T
S
=
25˚C unless otherwise
A
Output Characteristics
Current Sourcing
CMRR vs Frequency
Open-Loop
Frequency Response
DS011136-25
DS011136-28
Input Voltage Noise
vs Frequency
CMRR vs Temperature
Gain and Phase
Responses vs
Load Capacitance
DS011136-26
DS011136-29
Power Supply Rejection
Ratio vs Frequency
DS011136-27
Open-Loop Voltage Gain
vs Temperature
DS011136-30
Gain and Phase
Responses vs
Temperature
DS011136-31
DS011136-32
DS011136-33
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Page 6
Typical Performance Characteristics V
specified (Continued)
=
±
S
7.5V, T
=
25˚C unless otherwise
A
Gain Error
(V
vs V
OUT
)
OS
Inverting Slew Rate
vs Temperature
DS011136-34
DS011136-37
Common-Mode Error vs
Common-Mode Voltage of
Three Representative Units
Non-Inverting Large
Signal Pulse Response
=
(A
+1)
V
DS011136-35
DS011136-38
Non-Inverting
Slew Rate
vs Temperature
DS011136-36
Non-Inverting Small
Signal Pulse Response
DS011136-39
Inverting Large-Signal
Pulse Response
DS011136-40
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Inverting Small Signal
Pulse Response
DS011136-41
Stability vs
Capacitive Load
=
(A
+1)
V
DS011136-42
Page 7
Typical Performance Characteristics V
specified (Continued)
Stability vs
Capacitive Load
=
±
(A
10)
V
DS011136-43
Applications Hints
AMPLIFIER TOPOLOGY
The LMC6041 incorporates a novel op-amp design topology
that enables it to maintain rail-to-rail output swing even when
driving a large load. Instead of relying on a push-pull unity
gain output buffer stage, the output stage is taken directly
from the internal integrator, which provides both low output
impedance and large gain. Special feed-forward compensation design techniques are incorporated to maintain stability
over a wider range of operating conditions than traditional
micropower op-amps. These features make the LMC6041
both easier to design with, and provide higher speed than
products typically found in this ultra-low power class.
COMPENSATING FOR INPUT CAPACITANCE
It is quite common to use large values of feedback resistance with amplifiers with ultra-low input current, like the
LMC6041.
Although the LMC6041 is highly stable over a wide range of
operating conditions, certain precautions must be met to
achieve the desired pulse response when a large feedback
resistor is used. Large feedback resistors and even small
values of input capacitance, due to transducers, photodiodes, and circuits board parasitics, reduce phase margins.
When high input impedance are demanded, guarding of the
LMC6041 is suggested. Guarding input lines will not only reduce leakage, but lowers stray input capacitance as well.
(See Printed-Circuit-Board Layout for High ImpedanceWork.)
=
±
7.5V, T
S
=
25˚C unless otherwise
A
The effect of input capacitance can be compensated for by
adding a capacitor. Adding a capacitor, C
back resistor (as in
Figure 1
) such that:
, around the feed-
f
or
≤ R2C
R
1CIN
f
Since it is often difficult to know the exact value of CIN,Cfcan
be experimentally adjusted so that the desired pulse response is achieved. Refer to the LMC660 and the LMC662
for a more detailed discussion on compensating for input capacitance.
CAPACITIVE LOAD TOLERANCE
Direct capacitive loading will reduce the phase margin of
many op-amps. A pole in the feedback loop is created by the
combination of the op-amp’s output impedance and the capacitive load. This pole induces phase lag at the unity-gain
crossover frequency of the amplifier resulting in either an oscillatory or underdamped pulse response. With a few external components, op amps can easily indirectly drive capacitive loads, as shown in
Figure 2
.
DS011136-5
FIGURE 1. Cancelling the Effect of Input Capacitance
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Page 8
Applications Hints (Continued)
DS011136-6
FIGURE 2. LMC6041 Noninverting Gain of 10 Amplifier,
Compensated to Handle Capacitive Loads
Figure 2
In the circuit of
loss of phase margin by feeding the high frequency component of the output signal back to the amplifier’s inverting input, thereby preserving phase margin in the overall feedback
loop.
Capacitive load driving capability is enhanced by using a pull
up resistor to V
ducting 10 µA or more will significantly improve capacitive
load responses. The value of the pull up resistor must be determined based on the current sinking capability of the amplifier with respect to the desired output swing. Open loop gain
of the amplifier can also be affected by the pull up resistor
(see Electrical Characteristics).
, R1 and C1 serve to counteract the
+
(
Figure 3
). Typically a pull up resistor con-
ure 4
. To have a significant effect, guard rings should be
placed on both the top and bottom of the PC board. This PC
foil must then be connected to a voltage which is at the same
voltage as the amplifer inputs, since no leakage current can
flow between two points at the same potential. For example,
a PC board trace-to-pad resistance of 10
12
Ω, which is normally considered a very large resistance, could leak 5 pA if
the trace were a 5V bus adjacent to the pad of the input. This
would cause a 100 times degradation from the LMC6041’s
actual performance. However, if a guard ring is held within 5
mV of the inputs, then even a resistance of 10
cause only 0.05 pA of leakage current. See
11
Figure 5
Ω would
for typical connections of guard rings for standard op-amp
configurations.
DS011136-7
FIGURE 4. Example of Guard Ring
in P.C. Board Layout
DS011136-18
FIGURE 3. Compensating for Large
Capacitive Loads with a Pull Up Resistor
PRINTED-CIRCUIT-BOARD LAYOUT
FOR HIGH-IMPEDANCE WORK
It is generally recognized that any circuit which must operate
with less than 1000 pA of leakage current requires special
layout of the PC board. When one wishes to take advantage
of the ultra-low bias current of the LMC6041, typically less
than 2fA, it is essential to have an excellent layout. Fortunately, the techniques of obtaining low leakages are quite
simple. First, the user must not ignore the surface leakage of
the PC board, even though it may sometimes appear acceptably low, because under conditions of high humidity or dust
or contamination, the surface leakage will be appreciable.
To minimize the effect of any surface leakage, lay out a ring
of foil completely surrounding the LMC6041’s inputs and the
terminals of capacitors, diodes, conductors, resistors, relay
terminals, etc. connected to the op-amp’s inputs, as in
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Fig-
Page 9
Applications Hints (Continued)
DS011136-8
Inverting Amplifier
DS011136-9
Follower
DS011136-10
Non-Inverting Amplifier
FIGURE 5. Typical Connections of Guard Rings
The designer should be aware that when it is inappropriate
to lay out a PC board for the sake of just a few circuits, there
is another technique which is even better than a guard ring
on a PC board: Don’t insert the amplifier’s input pin into the
board at all, but bend it up in the air and use only air as an insulator. Air is an excellent insulator. In this case you may
have to forego some of the advantages of PC board construction, but the advantages are sometimes well worth the
effort of using point-to-point up-in-the-air wiring. See
6
.
Figure
Typical Single-Supply Applications
+
=
(V
5.0 V
)
DC
The extremely high input impedance, and low power consumption, of the LMC6041 make it ideal for applications that
require battery-powered instrumentation amplifiers. Examples of these type of applications are hand-held pH
probes, analytic medical instruments, magnetic field detectors, gas detectors, and silicon based pressure transducers.
DS011136-12
FIGURE 7. Two Op-Amp Instrumentation Amplifier
The circuit in
Figure 7
is recommended for applications
where the common-mode input range is relatively low and
the differential gain will be in the range of 10 to 1000. This
two op-amp instrumentation amplifier features an independent adjustment of the gain and common-mode rejection
trim, and a total quiescent supply current of less than 28 µA.
To maintain ultra-high input impedance, it is advisable to use
ground rings and consider PC board layout an important part
of the overall system design (see Printed-Circuit-Board Layout for High Impedance Work). Referring to
put voltages are represented as a common-mode input V
plus a differential input VD.
Figure 7
, the in-
CM
Rejection of the common-mode component of the input is
accomplished by making the ratio of R1/R2 equal to R3/R4.
So that where,
Asuggested design guideline is to minimize the difference of
value between R1 through R4. This will often result in improved resistor tempco, amplifier gain, and CMRR over temperature. If RN=R1=R2=R3=R4 then the gain equation
can be simplified:
(Input pins are lifted out of PC board and soldered directly to components.
All other pins connected to PC board.)
DS011136-11
FIGURE 6. Air Wiring
Due to the “zero-in, zero-out” performance of the LMC6041,
and output swing rail-rail, the dynamic range is only limited to
the input common-mode range of 0V to V
at room temperature. This feature of the LMC6041 makes it
–2.3V, worst case
S
an ideal choice for low-power instrumentation systems.
A complete instrumentation amplifier designed for a gain of
LMC6041 CMOS Single Micropower Operational Amplifier
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
National Semiconductor
Asia Pacific Customer
Response Group