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查询LMA208C供应商
Filtronic
2-26 GHz PHEMT Amplifier
Solid State
LMA208C
Features
•
9dB Typical Gain
•
18dBm 1-dB Gain Compression Power
•
15dB Input/Output Return Loss T y p ica l
•
2-26GHz Frequency Bandwidth
•
DC Decoupled RF Input and Output
•
Chip Size : 1.986
•
Chip Thickness : 100µm
•
Pad Dimension : 100µm
mm
X1.082mm (.078”X.043”)
2
Description
The Filtronic LMA208C is a medium power PHEMT amplifier that operates from 2 to 26GHz. This 5-stage travelling wave amplifier provides
10dB nominal gain and 1-dB gain compression power output of greater than 19dBm. The LMA208C is designed for use as wideband driver
amplifer in ECM (Electronic Counter-Measure) and commercial communication system applications. Ground is provided to the circuitry
through vias to the backside metallization.
Electri cal Specificatio ns
(VDD=+4.0V, Zin=Zout=50Ω)
at T
a
=25
°C
Limit
Symbol Parameter Test Conditions Min. Typ. Max. Units
BW Operating Bandwidth 2 26 GHz
S21 Small Signal Gain (2-20GHz) @ .5Idss 7 9 dB
S21 Small Signal Gain (20-26GHz) @ .5Idss 6 7 dB
Idss Drain Current at Saturation Idss @ Vg=0 V 75 162 225 mA
∆
S21
RLin Input Return Loss -13 dB
RLout Output Return Loss -14 dB
S12 Reverse Isolation -30 dB
P-1dB 1-dB Gain Compression Power @ .5Idss 16 18 dBm
Psat Saturated Outpu t P o wer 21 dBm
Small Signal Gain Flatness
±
1.5
±
2.0 dB
Absolute Maximum Ratings
Symbol Parameter/Conditions Min. Max. Units
Vdd Drain Supply Voltage 7 Volts
Idd Total Drain Current 225 mA
Pin RF Input Power 12 dBm
Pt Power Dissipation 1.6 W
Tch Operating Channel Temperature 150
Tstg Storage Temperature -65 165
Tmax. Max. Assembly Temp.
(1 mi n. ma x.)
300
°
C
°
C
°
C
Note
s:
1. This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used whe n handling these devices.
2. Specifications subject to change without notice.
DSS 009 WC
Phone:
(408) 988-1845
Internet:
http://www.FiltronicSolidState.com
Fax:
(408) 970-9950
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Filtronic
2-26 GHz PHEMT Amplifier
Solid State
LMA208C
Assembly Diagram
1.) Recommended lea d b ond techniq ue is therm ocompression wedge b onding with 0.001” (25µm) diameter wire . The bond
tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is recommended.
Ultrasonic bonding is not recommended.
2.) The recommended die attach is an eutectic 80/20 Gold/Tin solder, using a stage temperature of 285-290°C. Maximum
time a t temperatu re is 1 minu te. Use of forming gas (90% N
3.) Bond on bond or stitch bond acceptable.
4.) Conductor over conductor accepta bl e. Conductors must n ot sh ort.
Phone:
(408) 988-1845
Internet:
http://www.FiltronicSolidState.com
, 10% H2 ) for best results.
2
DSS 009 WC
Fax:
(408) 970-9950
Page 3
Filtronic
2-26 GHz PHEMT Amplifier
Solid State
LMA208C
Mechanical Outline
Notes:
1.) Unless Otherwise specified.
2.) All units are i n micron (µm ).
3.) All bond pads are 100 X 100 µm
4.) Bias pad (V
Phone:
(408) 988-1845
) size i s 100 X 121.5 µm2.
DD
2
.
Internet:
DSS 009 WC
http://www.FiltronicSolidState.com
Fax:
(408) 970-9950
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