LM8272 Dual
RRIO, High Output Current & Unlimited Cap Load Op
Amp in Miniature Package
LM8272 Dual RRIO, High Output Current & Unlimited Cap Load Op Amp in Miniature Package
General Description
The LM8272 is a Rail-to-Rail input and output Op Amp which
can operate with a wide supply voltage range. This device
has high output current drive, greater than Rail-to-Rail input
common mode voltage range, unlimited capacitive load drive
capability while requiring only 0.95mA/channel supply current. It is specifically designed to handle the requirements of
flat panel TFT panel V
being suitable for other low power, and medium speed applications which require ease of use and enhanced performance over existing devices.
Greater than Rail-to-Rail input common mode voltage range
with 50dB of Common Mode Rejection, allows high side and
low side sensing, among many applications, without having
any concerns over exceeding the range and no compromise
in accuracy. Exceptionally wide operating supply voltage
range of 2.5V to 24V alleviates any concerns over functionality under extreme conditions and offers flexibility of use in
multitude of applications. In addition, most device parameters are insensitive to power supply variations; this design
enhancement is yet another step in simplifying its usage.
n GBWP15MHz
n Wide supply voltage range2.5V to 24V
n Slew rate15V/µs
n Supply current/channel0.95mA
n Cap load toleranceUnlimited
n Output short circuit current
n Output current (1V from rails)
n Input common mode voltage0.3V beyond rails
n Input voltage noise15nV/
n Input current noise1.4pA/
±
130mA
±
65mA
Applications
n TFT-LCD flat panel V
n A/D converter buffer
n High side/low side sensing
n Headphone amplifier
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
LM8272 Dual
ESD Tolerance
Differential+/−10V
V
IN
Output Short Circuit Duration(Notes 3, 11)
Supply Voltage (V
Voltage at Input/Output pinsV
Storage Temperature Range−65˚C to +150˚C
+-V−
)27V
2KV (Note 2)
200V(Note 9)
+
+0.3V, V−−0.3V
Junction Temperature (Note 4)+150˚C
Soldering Information:
Infrared or Convection (20 sec.)235˚C
Wave Soldering (10 sec.)260˚C
Operating Ratings
Supply Voltage (V+-V−)2.5V to 24V
Junction Temperature Range(Note 4)−40˚C to +85˚C
Package Thermal Resistance, θ
8-Pin MSOP235C/W
,(Note 4)
JA
5V Electrical Characteristics
Unless otherwise specified, all limited guaranteed for TJ= 25˚C, V+= 5V, V−= 0V, VCM= 0.5V, VO=V+/2, and
>
1MΩ to V−. Boldface limits apply at the temperature extremes.
CMRRCommon Mode Rejection RatioVCMstepped from 0V to 12V8874
+
+PSRRPositive Power Supply Rejection RatioV
−PSRRNegative Power Supply Rejection
from 4.5V to 13V, VCM= 0.5V10078
85—dB
Ratio
>
CMVRInput Common-Mode Voltage RangeCMRR
50dB−0.3−0.1
12.312.1
A
VOL
V
O
I
SC
Large Signal Voltage GainVO=1Vto11V
= 10kΩ to V+/2
R
L
Output Swing
High
Output Swing
Low
Output Short Circuit CurrentSourcing to V
RL10kΩ to V+/211.811.7
I
SOURCE
R
I
SINK
= 5mA11.611.5
= 10kΩ to V+/20.250.3
L
= 5mA.40.45
−
8374
130110
VID= 200mV (Note 10)
Sinking to V
+
130110
VID= 200mV (Note 10)
I
I
OUT
S
Output CurrentVID=±200mV, VO= 1V from rails
Supply Current (Both Channel)No load, VCM= 0.5V1.92.4
SRSlew Rate
(Note 8)
R
OUT
f
u
Close Loop Output ResistanceAV= +1, f = 100KHz3—Ω
Unity Gain FrequencyVI= 10mVp, RL=2kΩ to V+/28—MHz
= +1, VI= 10VPP,CL= 10pF15—
A
V
A
= +1, VI= 10VPP,CL= 0.1µF1—
V
±
65—mA
GBWPGain-Bandwidth Productf = 50KHz15—MHz
Phi
m
GMGain MarginV
Phase MarginVI= 10mVp, RL=2kΩ to V+/257—Deg
= 10mVp, RL=2kΩ to V+/220—dB
I
Limit
(Note 6)
+/− 9
±
2.00
±
2.80
550
72
74
0
12.0
70
2.9
Units
mV
max
µA
max
nA
max
dB
min
dB
min
V
max
V
min
dB
min
V
min
V
max
mA
min
mA
max
V/µs
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Page 4
12V Electrical Characteristics (Continued)
Unless otherwise specified, all limited guaranteed for TJ= 25˚C, V+= 12V, V−= 0V, VCM= 6V, VO= 6V, and
>
1MΩ to V−. Boldface limits apply at the temperature extremes.
R
L
SymbolParameterCondition
LM8272 Dual
−3dB BWSmall Signal -3db BandwidthA
e
n
Input-Referred Voltage Noisef = 2KHz, RS=50Ω15—nV/
= +1, RL=2kΩ to V+/212.5—
V
= +1, RL= 600Ω to V+/210.5—
V
A
= +10, RL= 600Ω to V+/21.0—
V
(Note 5)
Typ
Limit
(Note 6)
Units
MHzA
i
n
f
max
THD+NTotal Harmonic Distortion +NoiseA
CT Rej.Cross-Talk Rejectionf = 5MHz, Driver R
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Rating indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human body model, 1.5kΩ in series with 100pF.
Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the
maximum allowed junction temperature of 150˚C.
Note 4: The maximum power dissipation is a function of T
P
D
Note 5: Typical Values represent the most likely parametric norm.
Note 6: All limits are guaranteed by testing or statistical analysis.
Note 7: Positive current corresponds to current flowing into the device.
Note 8: Slew rate is the slower of the rising and falling slew rates. Connected as a Voltage Follower.
Note 9: Machine Model, 0Ω is series with 200pF.
Note 10: Short circuit test is a momentary test. See Note 11.
Note 11: Output short circuit duration is infinite for V
Note 12: Offset voltage average drift determined by dividing the change in V
Input-Referred Current Noisef = 2KHz1.4—pA/
Full Power BandwidthZL= (20pF || 10kΩ)toV+/2300—KHz
= +2, RL=2kΩ to V+/2
V
=8VPP,VS=±5V
V
O
(max), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is
=(TJ(max) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.
J
≤ 6V at room temperature and below. For V
S
at temperature extremes into the total temperature change.
OS
= 10kΩ to V+/268—dB
L
>
6V, allowable short circuit duration is 1.5ms.
S
0.02—%
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Page 5
Typical Performance Charateristics
VOSDistributionVOSvs. VCMfor 3 Representative Units
101308A210130830
VOSvs. VCMfor 3 Representative UnitsVOSvs. VCMfor 3 Representative Units
LM8272 Dual
1013082910130831
VOSvs. VSfor 3 Representative UnitsVOSvs. VSfor 3 Representative Units
10130884
10130883
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Page 6
Typical Performance Charateristics (Continued)
V
vs. VSfor 3 Representative UnitsIBvs. V
OS
LM8272 Dual
1013088210130871
IBvs. V
S
ISvs. V
S
CM
101308A3
ISvs. V
CM
10130875
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ISvs. V
10130872
S
10130874
Page 7
Typical Performance Charateristics (Continued)
I
vs. V
S
S
LM8272 Dual
CMRR vs. Frequency
10130873
10130887
+PSRR vs. Frequency−PSRR vs. Frequency
1013088810130889
Open Loop Gain/Phase for Various SuppliesClosed Loop Frequency Response for Various Gains
10130893
10130896
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Page 8
Typical Performance Charateristics (Continued)
LM8272 Dual
Closed Loop Frequency Response for Various GainsClosed Loop Frequency Response for Various Gains R
10130895
10130894
Maximum Output Swing vs. Load (1% Distortion)Maximum Output Swing vs. Frequency (1% Distortion)
L
10130876
Closed Loop Small Signal Frequency Response for
Various C
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L
10130886
10130877
Overshoot vs. Cap Load
10130878
Page 9
Typical Performance Charateristics (Continued)
LM8272 Dual
Settling Time (
V
±
1%) & Slew Rate vs. Cap LoadV
10130879
from V−vs. I
OUT
SINK
Step Response for Various Amplitudes
from V+vs. I
OUT
SOURCE
10130898
101308A0
10130897
Step Response for Various AmplitudesLarge Signal Step Response for Various Cap Loads
101308A1
10130899
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Page 10
Typical Performance Charateristics (Continued)
THD+N vs. Input Amplitude for Various FrequencyInput Referred Noise Density
LM8272 Dual
1013089210130880
Closed Loop Output Impedance vs. FrequencyCrosstalk Rejection vs. Frequency
10130885
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10130881
Page 11
Application Notes
BLOCK DIAGRAM AND OPEATIONAL DESCRIPTION
A) INPUT STAGE:
As can be seen from the simplified schematic in Figure 1, the
input stage consists of two distinct differential pairs (Q1-Q2
and Q3-Q4) in order to accommodate the full Rail-to-Rail
input common mode voltage range. The voltage drop across
R5, R6, R7 and R8 is kept to less than 200mV in order to
allow the input to exceed the supply rails. Q13 acts as a
switch to steer current away from Q3-Q4 and into Q1-Q2, as
the input increases beyond 1.4 of V
signal path from the bottom stage differential pair to the top
one and causes a subsequent increase in the supply current.
In transitioning from one stage to another, certain input stage
parameters (V
OS,Ib,IOS,en
on which differential pair is “on” at the time. Input Bias
current, I
, will change in value and polarity as the input
b
crosses the transition region. In addition, parameter such as
PSRR and CMRR which involve the input offset voltage will
also be effected by changes in V
pair transition region.
FIGURE 1. Simplified Schematic Diagram
The input stage is protected with the combination of R9-R10
and D1, D2, D3 and D4 against differential input overvoltages. This fault condition could otherwise harm the differential pairs or cause offset voltage shift in case of prolonged over voltage. As shown in Figure 2, if this voltage
±
reaches approximately
1.4V at 25˚C, the diodes turn on
and current flow is limited by the internal series resistors (R9
and R10). The Absolute Maximum Rating of
tial on V
still needs to be observed. With temperature
IN
variation, the point were the diodes turn on will change at the
rate of 5mV/˚C
+
. This in turn shifts the
, and in) are determined based
across the differential
CM
10130870
±
10V differen-
101308A4
FIGURE 2. Input Stage Current vs. Differential Input
Voltage
B) OUTPUT STAGE:
The output stage (see Figure 1) is comprised of complimentary NPN and PNP common-emitter stages to permit voltage
swing to within a V
of either supply rail. Q9 supplies the
ce(sat)
sourcing and Q10 supplies the sinking current load. Output
current limiting is achieved by limiting the V
of Q9 and Q10;
ce
using this approach to current limiting, alleviates the draw
back to the conventional scheme which requires one V
reduction in output swing.
The frequency compensation circuit includes Miller capacitors from collector to base of each output transistor (see
Figure 1,C
comp9
and C
). At light capacitive loads, the
comp10
high frequency gain of the output transistors is high, and the
Miller effect increases the effective value of the capacitors
thereby stabilizing the Op Amp. Large capacitive loads
greatly decrease the high frequency gain of the output transistors thus lowering the effective internal Miller capacitance
- the internal pole frequency increases at the same time a
low frequency pole is created at the Op Amp output due to
the large load capacitor. In this fashion, the internal dominant
pole compensation, which works by reducing the loop gain to
less than 0dB when the phase shift around the feedback
loop is more than 180˚, varies with the amount of capacitive
load and becomes less dominant when the load capacitor
has increased enough. Hence the Op Amp is very stable
even at high values of load capacitance resulting in the
uncharacteristic feature of stability under all capacitive loads.
−
C) OUTPUT VOLTAGE SWING CLOSE TO V
:
The LM8272’s output stage design allows voltage swings to
within millivolts of either supply rail for maximum flexibility
and improved useful range. Because of this design architecture, as can be seen from Figure 1 diagram, with Output
approaching either supply rail, either Q9 or Q10 CollectorBase junction reverse bias will decrease. With output less
than a V
from either rail, the corresponding output transis-
be
tor operates near saturation. In this mode of operation, the
transistor will exhibit higher junction capacitance and lower f
which will reduce Phase Margin. With the Noise Gain (NG =
1 + Rf/Rg, Rf & Rg are external gain setting resistors) of 2 or
higher, there is sufficient Phase Margin that this reduction (in
Phase Margin) is of no consequence. However, with lower
LM8272 Dual
be
t
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Page 12
Application Notes (Continued)
Noise Gain (
supply rail, if the output loading is light, the Phase Margin
reduction could result in unwanted oscillations.
LM8272 Dual
In the case of the LM8272, due to inherent architectural
specifics, the oscillation occurs only with respect to Q10
when output swings to within 150mV of V
collector current is larger than its idle value of a few microamps, the Phase Margin loss becomes insignificant. In this
case, 300µA is the required Q10 collector current to remedy
this situation. Therefore, when all the aforementioned critical
conditions are present at the same time (NG
150mV from supply rails, & output load is light) it is possible
to ensure stability by adding a load resistor to the output to
provide the necessary Q10 minimum Collector Current
(300µA).
For 12V (or
tor from the output to V
current and ensure stability. This is equivalent to about 15%
increase in total quiescent power dissipation.
DRIVING CAPACTIVE LOADS:
The LM8272 is specifically designed to drive unlimited capacitive loads without oscillations (see Settling Time and
Overshoot vs. Cap Load plots in the typical performance
characteristics section). In addition, the output current handling capability of the device allows for good slewing characteristics even with large capacitive loads (Settling Time
and Slew Rate vs. Cap Load plot). The combination of these
features is ideal for applications such as TFT flat panel
buffers, A/D converter input amplifiers, etc.
However, as in most Op Amps, addition of a series isolation
resistor between the Op Amp and the capacitive load improves the settling and overshoot performance.
Output current drive is an important parameter when driving
capacitive loads. This parameter will determine how fast the
output voltage can change. Referring to the Settling Time
and Slew Rate vs. Cap Load plots (typical performance
characteristics section), two distinct regions can be identified. Below about 10,000pF, the output Slew Rate is solely
determined by the Op Amp’s compensation capacitor value
and available current into that capacitor. Beyond 10nF, the
Slew Rate is determined by the Op Amp’s available output
current. An estimate of positive and negative slew rates for
loads larger than 100nF can be made by dividing the short
circuit current value by the capacitor.
<
2) and with less than 150mV voltage to the
−
. However, if Q10
±
6V) operation, for example, add a 39kΩ resis-
+
to cause 300µA output sinking
ing to loads tied between the output and ground. In each
case, the intersection of the device plot at the appropriate
temperature with the load line would be the typical output
swing possible for that load. For example, a 600Ω load can
accommodate an output swing to within 100mV of V
250mV of V
+
(VS=±5V) corresponding to a typical 9.65V
−
and to
PP
unclipped swing.
<
2, V
OUT
<
10130890
FIGURE 3. Steady State Output Sourcing
Characteristics with Load Lines
ESTIMATING THE OUTPUT VOLTAGE SWING
It is important to keep in mind that the steady state output
current will be less than the current available when there is
an input overdrive present. For steady state conditions, Fig-ure 3 and Figure 4 plots can be used to predict the output
swing. These plots also show several load lines correspond-
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10130891
FIGURE 4. Steady State Output Sinking Characteristics
with Load Lines
Page 13
LM8272 Dual
Application Notes (Continued)
OUTPUT SHORT CIRCUIT CURRENT AND
DISSIPATION ISSUES:
The LM8272 output stage is designed for maximum output
current capability. Even though momentary output shorts to
ground and either supply can be tolerated at all operating
voltages, longer lasting short conditions can cause the junction temperature to rise beyond the absolute maximum rating of the device, especially at higher supply voltage conditions. Below supply voltage of 6V, output short circuit
condition can be tolerated indefinitely.
With the Op Amp tied to a load, the device power dissipation
consists of the quiescent power due to the supply current
flow into the device, in addition to power dissipation due to
the load current. The load portion of the power itself could
include an average value (due to a DC load current) and an
AC component. DC load current would flow if there is an
output voltage offset, or the output AC average current is
non-zero, or if the Op Amp operates in a single supply
application where the output is maintained somewhere in the
range of linear operation. Therefore:
P
total=PQ+PDC+PAC
PQ=IS·V
P
DC=IO
P
AC
S
·(Vr-Vo)DC Load Power
= See Table 1 belowAC Load Power
where:
: Supply Current
I
S
: Total Supply Voltage (V+-V−)
V
S
V
: Average Output Voltage
O
:V+for sourcing and V−for sinking current
V
r
Table 1 below shows the maximum AC component of the
load power dissipated by the Op Amp for standard Sinusoidal, Triangular, and Square Waveforms:
Op Amp Quiescent Power
Dissipation
TABLE 1. Normalized AC Power Dissipated in the
Output Stage for Standard Waveforms
PAC(W.Ω/V2)
SinusoidalTriangularSquare
50.7 x 10
−3
46.9 x 10
The table entries are normalized to V
−3
62.5 x 10
2
/RL. To figure out the
S
−3
AC load current component of power dissipation, simply
multiply the table entry corresponding to the output waveform by the factor V
2
/RL. For example, with±12V supplies,
S
a 600Ω load, and triangular waveform power dissipation in
the output stage is calculated as:
= (46.9 x 10−3) · [242/600] = 45.0mW
P
AC
OTHER APPLICATION HINTS:
The use of supply decoupling is mandatory in most applications. As with most relatively high speed/high output current
Op Amps, best results are achieved when each supply line is
decoupled with two capacitors; a small value ceramic capacitor (∼0.01µF) placed very close to the supply lead in
>
addition to a large value Tantalum or Aluminum (
4.7µF).
The large capacitor can be shared by more than one device
if necessary. The small ceramic capacitor maintains low
supply impedance at high frequencies while the large capacitor will act as the charge “bucket” for fast load current
spikes at the Op Amp output. The combination of these
capacitors will provide supply decoupling and will help keep
the Op Amp oscillation free under any load.
LM8272 ADVANTAGES:
Compared to other Rail-to-Rail Input/Output devices, the
LM8272 offers several advantages such as:
Improved cross over distortion
•
Nearly constant supply current throughout the output
•
voltage swing range and close to either rail.
Nearly constant Unity gain frequency (fu) and Phase
•
Margin (Phi
) for all operating supplies and load condi-
m
tions.
No output phase reversal under input overload condition.
•
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Page 14
Physical Dimensions inches (millimeters)
unless otherwise noted
8-Pin MSOP
NS Package Number MUA08A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
labeling, can be reasonably expected to result in a
significant injury to the user.
National Semiconductor
Corporation
Americas
Email: support@nsc.com
LM8272 Dual RRIO, High Output Current & Unlimited Cap Load Op Amp in Miniature Package
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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