LM66 Electrical Characteristics
The following specifications apply for V+= 2.7 VDC, and V
REF
load current = 50 µA unless otherwise specified. Boldface lim-
its apply for TA=TJ=T
MIN
to T
MAX
; all other limits TA=TJ= 25˚C unless otherwise specified.
Symbol Parameter Conditions Typical Limits Units
(Note 6) (Note 7) (Limits)
V
+
Power Supply
I
S
Supply Current V+= +10V 250 µA (max)
V
+
= +2.7V 250 µA (max)
Digital Output(s)
I
OUT(“1”)
Logical “1” Output Leakage
Current
V+= +5.0V
1 µA (max)
V
OUT(“0”)
Logical “0” Output Voltage I
OUT
= +50 µA 0.4 V (max)
Note 1: Absolute MaximumRatings indicate limitsbeyond which damageto the devicemay occur.Operating Ratingsindicate conditions forwhich the deviceis functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteedspecifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
Note 2: When the input voltage(V
I
) at anypin exceeds the power supply (V
I
<
GND or V
I
>
V+), the currentat that pin should be limitedto 5 mA. The 20mA maxi-
mum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four.
Note 3: The maximum power dissipation must be derated at elevated temperaturesand is dictated by T
Jmax
(maximum junction temperature), θJA(junction to am-
bient thermal resistance) andT
A
(ambient temperature). Themaximum allowable power dissipation at any temperatureis PD=(T
Jmax–TA
)/θJAor the number given
in the Absolute Maximum Ratings, whichever is lower. For this device, T
Jmax
= 125˚C. For this device the typical thermal resistance (θJA) of the different package
types when board mounted follow:
Package Type θ
JA
M08A 110˚C/W
Note 4: The humanbody model isa 100 pFcapacitor discharge througha 1.5 kΩresistor into each pin. Themachine model isa 200 pFcapacitor dischargeddirectly
into each pin.
Note 5: See AN450“Surface Mounting Methods andTheir Effects onProduct Reliability” or thesection titled “Surface Mount”found in any post1986 National Semiconductor Linear Data Book for other methods of soldering surface mount devices.
Note 6: Typicals are at T
J=TA
= 25˚C and represent most likely parametric norm.
Note 7: Limits are guaranteed to National’s AOQL(Average Outgoing Quality Level).
LM66
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