The LM34 series are precision integrated-circuit temperature
sensors, whose output voltage is linearly proportional to the
Fahrenheit temperature. The LM34 thus has an advantage
over linear temperature sensors calibrated in degrees
Kelvin, as the user is not required to subtract a large constant voltage from its output to obtain convenient Fahrenheit
scaling. The LM34 does not require any external calibration
or trimming to provide typical accuracies of
temperature and
ture range. Low cost is assured by trimming and calibration
at the wafer level. The LM34’s low output impedance, linear
output, and precise inherent calibration make interfacing to
readout or control circuitry especially easy. It can be used
with single power supplies or with plus and minus supplies.
As it draws only 75 µA from its supply, it has very low
self-heating, less than 0.2˚F in still air. The LM34 is rated to
operate over a −50˚ to +300˚F temperature range, while the
LM34C is rated for a −40˚ to +230˚F range (0˚F with improved accuracy). The LM34 series is available packaged in
±
11⁄2˚F over a full −50 to +300˚F tempera-
1
±
⁄2˚F at room
Connection Diagrams
TO-46
Metal Can Package
(Note 1)
Plastic Package
hermetic TO-46 transistor packages, while the LM34C,
LM34CA and LM34D are also available in the plastic TO-92
transistor package. The LM34D is also available in an8-lead
surface mount small outline package.TheLM34isacomplement to the LM35 (Centigrade) temperature sensor.
Features
n Calibrated directly in degrees Fahrenheit
n Linear +10.0 mV/˚F scale factor
n 1.0˚F accuracy guaranteed (at +77˚F)
n Rated for full −50˚ to +300˚F range
n Suitable for remote applications
n Low cost due to wafer-level trimming
n Operates from 5 to 30 volts
n Less than 90 µA current drain
n Low self-heating, 0.18˚F in still air
n Nonlinearity only
n Low-impedance output, 0.4Ω for 1 mA load
FIGURE 2. Full-Range Fahrenheit Temperature Sensor
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Page 3
LM34
Absolute Maximum Ratings (Note 11)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage+35V to −0.2V
Output Voltage+6V to −1.0V
Output Current10 mA
Storage Temperature,
TO-46 Package−76˚F to +356˚F
TO-92 Package−76˚F to +300˚F
SO-8 Package−65˚C to +150˚C
LM34, LM34A−50˚F to +300˚F
LM34C, LM34CA−40˚F to +230˚F
LM34D+32˚F to +212˚F
Lead Temp.
DC Electrical Characteristics (Notes 2, 7)
LM34ALM34CA
ParameterConditionsTestedDesignTestedDesignUnits
TypicalLimitLimitTypicalLimitLimit(Max)
(Note 5)(Note 6)(Note 5)(Note 6)
Accuracy (Note 8)T
Nonlinearity (Note 9)T
Sensor GainT
= +77˚F
A
T
= 0˚F
A
T
A=TMAX
T
A=TMIN
MIN
MIN
≤ TA≤ T
≤ TA≤ T
MAX
MAX
±
0.4
±
0.6
±
0.8
±
0.8
±
0.35
+10.0+9.9,+10.0+9.9,mV/˚F, min
(Average Slope)+10.1+10.1mV/˚F, max
Load RegulationT
(Note 4)T
Line RegulationT
A
MIN
0 ≤ I
A
= +77˚F
L
= +77˚F
(Note 4)5V ≤ V
Quiescent CurrentV
(Note 10)V
= +5V, +77˚F75907590µA
S
= +5V131160116139µA
S
V
= +30V, +77˚F76927692µA
S
V
= +30V132163117142µA
S
Change of Quiescent4V ≤ V
Current (Note 4)5V ≤ V
≤ TA≤ T
MAX
≤ 1mA
≤ 30V
S
≤ 30V, +77˚F+0.52.00.52.0µA
S
≤ 30V+1.03.01.03.0µA
S
±
±
±
±
0.4
0.5
0.01
0.02
Temperature Coefficient+0.30+0.5+0.30+0.5µA/˚F
of Quiescent Current
Minimum TemperatureIn circuit of
for Rated AccuracyI
Long-Term StabilityT
=0
L
j=TMAX
Figure 1
,+3.0+5.0+3.0+5.0˚F
±
0.16
for 1000 hours
Note 2: Unless otherwise noted, these specifications apply: −50˚F ≤ Tj≤ + 300˚F for the LM34 and LM34A; −40˚F ≤ Tj≤ +230˚F for the LM34C and LM34CA; and
+32˚F ≤T
also apply from +5˚F to T
Note 3: Thermal resistance of the TO-46 package is 720˚F/W junction toambient and 43˚F/W junction to case. Thermal resistanceof the TO-92 package is 324˚F/W
junction to ambient. Thermal resistance of the small outline molded package is 400˚F/W junction to ambient. For additional thermal resistance information see table
in the Typical Applications section.
Note 4: Regulation ismeasured atconstant junctiontemperature usingpulse testing with a low duty cycle. Changes in output due to heating effects can be computed
by multiplying the internal dissipation by the thermal resistance.
Note 5: Tested limits are guaranteed and 100% tested in production.
Note 6: Design limits are guaranteed (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are not used to
calculate outgoing quality levels.
Note 7: Specification in BOLDFACE TYPE apply over the full rated temperature range.
DC Electrical Characteristics (Notes 2, 7) (Continued)
LM34
Note 8: Accuracy is defined as the error between the output voltage and 10 mV/˚F times the device’s case temperature at specified conditions of voltage, current,
and temperature (expressed in ˚F).
Note 9: Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line over the device’s rated temperature
range.
Note 10: Quiescent current is defined in the circuit of
Note 11: Absolute Maximum Ratings indicate limits beyond which damage to thedevice may occur. DC and AC electrical specifications do not apply when operating
the device beyond its rated operating conditions (Note 2).
Note 12: Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Note 13: See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” or the section titled “Surface Mount” found in a current National
Semiconductor Linear Data Book for other methods of soldering surface mount devices.
(Average Slope)+10.2+10.2mV/˚F, max
Load RegulationT
(Note 4)T
Line RegulationT
A
MIN
0 ≤ I
A
= +77˚F
L
= +77˚F
(Note 4)5V ≤ V
Quiescent CurrentV
(Note 10)V
= +5V, +77˚F7510075100µA
S
= +5V131176116154µA
S
V
= +30V, +77˚F7610376103µA
S
V
= +30V132181117159µA
S
Change of Quiescent4V ≤ V
Current (Note 4)5V ≤ V
≤ TA≤ +150˚F
≤ 1mA
≤ 30V
S
≤ 30V, +77˚F+0.53.00.53.0µA
S
≤ 30V+1.05.01.05.0µA
S
±
±
±
±
0.4
0.5
0.01
0.02
Temperature Coefficient+0.30+0.7+0.30+0.7µA/˚F
of Quiescent Current
Minimum TemperatureIn circuit of
for Rated AccuracyI
Long-Term StabilityT
=0
L
j=TMAX
Figure 1
,+3.0+5.0+3.0+5.0˚F
±
0.16
for 1000 hours
±
2.0
±
3.0
±
3.0
±
1.0
±
2.5
±
6.0
±
0.1
±
0.2
±
0.8
±
1.0
±
1.6
±
1.6
±
1.2
±
1.8
±
1.8
±
0.4
±
0.4
±
0.5
±
0.01
±
0.02
±
0.16˚F
±
2.0˚F
±
3.0˚F
±
3.0˚F
±
4.0˚F
±
3.0˚F
±
4.0˚F
±
4.0˚F
±
1.0˚F
±
2.5mV/mA
±
6.0mV/mA
±
0.1mV/V
±
0.2mV/V
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Page 5
Typical Performance Characteristics
LM34
Thermal Resistance
Junction to Air
Thermal Response in
Stirred Oil Bath
DS006685-22
Thermal Time Constant
Minimum Supply Voltage
vs. Temperature
DS006685-23
Thermal Response in
Still Air
Quiescent Current vs.
Temperature
(In Circuit of
Figure 1
DS006685-24
)
Quiescent Current vs. Temperature (In Circuit of
−V
= −5V, R1 = 100k)
S
Figure 2
DS006685-25
;
DS006685-28
Accuracy vs. Temperature
(Guaranteed)
DS006685-26
DS006685-29
DS006685-27
Accuracy vs. Temperature
(Guaranteed)
DS006685-30
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Page 6
Typical Performance Characteristics (Continued)
LM34
Noise Voltage
DS006685-31
Typical Applications
The LM34 can be applied easily in the same way as other
integrated-circuit temperature sensors. It can be glued or
cemented to a surface and its temperature will be within
about 0.02˚F of the surface temperature.This presumesthat
the ambient air temperature is almost the same as the
surface temperature; if the air temperature were much
higher or lower than the surface temperature, the actual
temperature of the LM34 die would be at an intermediate
temperature between the surface temperature and the air
temperature. This is expecially true for the TO-92 plastic
package, where the copper leads are the principal thermal
path to carry heat into the device, so its temperature might
be closer to the air temperature than to the surface temperature.
To minimize this problem, be sure that the wiring to the
LM34, as it leaves the device, is held at the same temperature as the surface of interest. The easiest way to do this is
to cover up these wires with a bead of epoxy which will
insure that the leads and wires are all at the same temperature as the surface, and that the LM34 die’s temperature will
not be affected by the air temperature.
The TO-46 metal package can also be soldered to a metal
surface or pipe without damage. Of course in that case, the
V
terminal of the circuit will be grounded to that metal.
−
Alternatively, the LM34 can be mounted inside a sealed-end
metal tube, and can then be dipped into a bath or screwed
into a threaded hole in a tank.As with any IC, the LM34 and
accompanying wiring and circuits must be keptinsulatedand
dry, to avoid leakage and corrosion. This is especially true if
the circuit may operate at cold temperatures where condensation can occur.Printed-circuitcoatings and varnishes such
as Humiseal and epoxy paints or dips are often used to
insure that moisture cannot corrode the LM34 or its connections.
Start-Up Response
DS006685-32
These devices are sometimes soldered to a small,
light-weight heat fin to decrease the thermal time constant
and speed up the response in slowly-moving air. On the
other hand, a small thermal mass may be added to the
sensor to give the steadiest reading despite small deviations
in the air temperature.
Capacitive Loads
Like most micropower circuits, the LM34 has a limited ability
to drive heavy capacitive loads. The LM34 by itself is able to
drive 50 pF without special precautions. If heavier loads are
anticipated, it is easy to isolate or decouple the load with a
resistor; see
capacitance with a series R-C damper from output to
ground; see
load resistor (as shown), it is relatively immune to wiring
capacitance because the capacitance forms a bypass from
ground to input, not on the output. However, as with any
linear circuit connected to wires in a hostile environment, its
performance can be affected adversely by intense electromagnetic sources such as relays, radio transmitters, motors
with arcing brushes, SCR’s transients, etc., as its wiring can
act as a receiving antenna and its internal junctions can act
as rectifiers. For best results in such cases, a bypass capacitor from V
75Ω in series with 0.2or1µF from output to ground are often
useful. These are shown in the following circuits.
Figure 3
Figure 4
. Or you can improve the tolerance of
. When the LM34 is applied with a 499Ω
to ground and a series R-C damper such as
IN
DS006685-6
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Page 7
Typical Applications
DS006685-7
FIGURE 3. LM34 with Decoupling from Capacitive Load
DS006685-8
Temperature Rise of LM34 Due to Self-Heating (Thermal Resistance)
ConditionsTO-46,TO-46,TO-92,TO-92,SO-8SO-8
No Heat
Sink
Small Heat Fin
(Note 14)
No Heat
Sink
Still air720˚F/W180˚F/W324˚F/W252˚F/W400˚F/W200˚F/W
Moving air180˚F/W72˚F/W162˚F/W126˚F/W190˚F/W160˚F/W
Still oil180˚F/W72˚F/W162˚F/W126˚F/W
Stirred oil90˚F/W54˚F/W81˚F/W72˚F/W
(Clamped to metal,(43˚F/W)(95˚F/W)
infinite heat sink)
FIGURE 4. LM34 with R-C Damper
Small Heat Fin
(Note 15)
No Heat
Sink
Small Heat Fin
(Note 15)
LM34
Note 14: Wakefield type 201 or 1" disc of 0.020" sheet brass, soldered to case, or similar.
Note 15: TO-92 and SO-8 packages glued and leads soldered to 1" square of 1/16" printed circuit board with 2 oz copper foil, or similar.
Two-Wire Remote Temperature Sensor
V
= 10mV/˚F (TA+3˚F)
OUT
FROM +3˚F TO + 100˚F
(Grounded Sensor)
DS006685-9
Two-Wire Remote Temperature Sensor
(Output Referred to Ground)
DS006685-10
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Page 8
Typical Applications (Continued)
LM34
4-to-20 mA Current Source
(0 to +100˚F)
DS006685-11
Expanded Scale Thermometer
(50˚ to 80˚ Fahrenheit, for Example Shown)
Fahrenheit Thermometer
(Analog Meter)
DS006685-12
Temperature-to-Digital Converter
(Serial Output, +128˚F Full Scale)
DS006685-13
LM34 with Voltage-to-Frequency Converter and Isolated Output
(3˚F to + 300˚F; 30 Hz to 3000 Hz)
DS006685-15
DS006685-14
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Page 9
Typical Applications (Continued)
LM34
Bar-Graph Temperature Display
(Dot Mode)
*
= 1% or 2% film resistor
—Trim R
—Trim R
—Trim R
—Example, VA= 3.285V at 80˚F
for VB= 3.525V
B
for VC= 2.725V
C
for VA= 0.085V + 40 mV/˚F x T
A
(Parallel TRI-STATE
AMBIENT
Temperature-to-Digital Converter
®
Outputs for Standard Data Bus to µP Interface, 128 ˚F Full Scale)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.