Datasheet LM3103MH, LM3103 Datasheet (NSC)

Page 1
October 2007
LM3103 SIMPLE SWITCHER® Synchronous 1MHz 0.75A Step-Down Voltage Regulator
General Description
The LM3103 Synchronously Rectified Buck Converter fea­tures all required functions to implement a highly efficient and cost effective buck regulator. It is capable of supplying 0.75A to loads with an output voltage as low as 0.6V. Dual N-Chan­nel synchronous MOSFET switches allow a low component count, thus reducing complexity and minimizing board size.
Different from most other COT regulators, the LM3103 does not rely on output capacitor ESR for stability, and is designed to work exceptionally well with ceramic and other very low ESR output capacitors. It requires no loop compensation, re­sults in a fast load transient response and simple circuit implementation. The operating frequency remains nearly con­stant with line variations due to the inverse relationship be­tween the input voltage and the on-time. The operating frequency can be externally programmed up to 1 MHz. Pro­tection features include VCC under-voltage lock-out, output over-voltage protection, thermal shutdown, and gate drive under-voltage lock-out. The LM3103 is available in the ther­mally enhanced eTSSOP-16 package.
Key Specifications
Input voltage range 4.5V-42V
0.75A output current
0.6V, ±2% reference
Integrated dual N-Channel main and synchronous MOSFETs
Thermally enhanced eTSSOP-16 package
Features
Low component count and small solution size
Stable with ceramic and other low ESR capacitors
No loop compensation required
High efficiency at a light load by DCM operation
Pre-bias startup
Ultra-fast transient response
Programmable soft-start
Programmable switching frequency up to 1 MHz
Valley current limit
Thermal shutdown
Output over-voltage protection
Precision internal reference for an adjustable output voltage down to 0.6V
Typical Applications
5VDC, 12VDC, 24VDC, 12VAC, and 24VAC systems
Embedded Systems
Industrial Control
Automotive Telematics and Body Electronics
Point of Load Regulators
Storage Systems
Broadband Infrastructure
Direct Conversion from 2/3/4 Cell Lithium Batteries Systems
Typical Application
30029701
SIMPLE SWITCHER® is a registered trademark of National Semiconductor Corporation
© 2007 National Semiconductor Corporation 300297 www.national.com
LM3103 SIMPLE SWITCHER® Synchronous 1MHz 0.75A Step-Down Voltage Regulator
Page 2
Connection Diagram
30029702
16-Lead Plastic eTSSOP
NS Package Number MXA16A
Ordering Information
Order Number Package Type NSC Package Drawing Supplied As
LM3103MH Exposed Pad TSSOP-16 MXA16A 92 units per Anti-Static Tube
LM3103MHX 2500 Units on Tape and Reel
www.national.com 2
LM3103
Page 3
Pin Descriptions
Pin Name Description Application Information
1, 2 VIN Input supply voltage Supply pin to the device. Nominal input range is 4.5V to 42V.
3, 4 SW Switch Node Internally connected to the source of the main MOSFET and the drain of the
synchronous MOSFET. Connect to the output inductor.
5 BST Connection for
bootstrap capacitor
Connect a 33 nF capacitor from the SW pin to this pin. This capacitor is charged through an internal diode during the main MOSFET off-time.
6 AGND Analog Ground Ground for all internal circuitry other than the PGND pin.
7 SS Soft-start A 70 µA internal current source charges an external capacitor of larger than 22 nF to
provide the soft-start function.
8 NC No Connection This pin should be left unconnected.
9, 10 GND Ground Must be connected to the AGND pin for normal operation. The GND and AGND pins
are not internally connected.
11 FB Feedback Internally connected to the regulation and over-voltage comparators. The regulation
setting is 0.6V at this pin. Connect to feedback resistors.
12 EN Enable pin Internal pull-up. Connect to a voltage higher than 1.6V to enable the device.
13 RON On-time Control An external resistor from the VIN pin to this pin sets the main MOSFET on-time.
14 VCC Startup regulator
Output
Nominally regulated to 6V. Connect a capacitor of larger than 1 µF between the VCC and AGND pins for stable operation.
15, 16 PGND Power Ground Synchronous MOSFET source connection. Tie to a ground plane.
DAP EP Exposed Pad Thermal connection pad. Connect to the ground plane.
3 www.national.com
LM3103
Page 4
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
VIN, RON to AGND -0.3V to 43.5V SW to AGND -0.3V to 43.5V SW to AGND (Transient) -2V (< 100ns) VIN to SW -0.3V to 43.5V BST to SW -0.3V to 7V VCC to AGND -0.3V to 7V FB to AGND -0.3V to 5V
All Other Inputs to AGND -0.3V to 7V ESD Rating (Note 2) Human Body Model ±2kV Storage Temperature Range -65°C to +150°C Junction Temperature (TJ) 150°C
Operating Ratings (Note 1)
Supply Voltage Range (VIN) 4.5V to 42V Junction Temperature Range (TJ)
−40°C to +125°C
Thermal Resistance (θJA) (Note 3)
35°C/W
Electrical Characteristics Specifications with standard type are for T
J
= 25°C only; limits in boldface type apply over the full Operating Junction Temperature (TJ) range. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 18V, V
OUT
= 3.3V.
Symbol Parameter Conditions Min Typ Max Units
Start-Up Regulator, V
CC
V
CC
VCC output voltage C
VCC
= 1 µF, no load 5.6 6.0 6.2 V
VIN - V
CC
V
IN
- VCC dropout voltage (Note 4) ICC = 2mA 55 150 mV
ICC = 10mA 235 500
V
CC-UVLO
VCC under-voltage lockout threshold (UVLO)
VIN increasing 3.5 3.7 4.1 V
V
CC-UVLO-HYS
VCC UVLO hysteresis VIN decreasing 275 mV
I
IN
IIN operating current No switching, VFB = 1V 1.0 1.25 mA
I
IN-SD
IIN operating current, Device shutdown VEN = 0V 20 40 µA
I
VCC
VCC current limit VCC = 0V 20 33 42 mA
Switching Characteristics
R
DS-UP-ON
Main MOSFET R
DS(on)
0.370 0.7
R
DS- DN-ON
Syn. MOSFET R
DS(on)
0.220 0.4
Soft-start
I
SS
SS pin source current VSS = 0V 45 70 95 µA
Current Limit
I
CL
Syn. MOSFET current limit threshold 0.9 A
ON/OFF Timer
t
on
ON timer pulse width
VIN = 10V, RON = 33 k
0.350 µs
VIN = 18V, RON = 33 k
0.170
t
on-MIN
ON timer minimum pulse width 100 ns
t
off
OFF timer pulse width 240 ns
Enable Input
V
EN
EN Pin input threshold VEN rising 1.6 1.85 V
V
EN-HYS
Enable threshold hysteresis VEN falling 230 mV
I
EN
Enable Pull-up Current VEN = 0V 1 µA
Regulation and Over-Voltage Comparator
V
FB
In-regulation feedback voltage TJ = −40°C to +125°C 0.588 0.6 0.612 V
V
FB-OV
Feedback over-voltage threshold 0.655 0.680 0.705 V
I
FB
1 nA
www.national.com 4
LM3103
Page 5
Symbol Parameter Conditions Min Typ Max Units
Thermal Shutdown
T
SD
Thermal shutdown temperature TJ rising 165 °C
T
SD-HYS
Thermal shutdown temperature hysteresis
TJ falling 20 °C
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: The human body model is a 100pF capacitor discharged through a 1.5k resistor into each pin.
Note 3: θJA measurements were performed in general accordance with JEDEC Standards JESD51-1 to JESD51-11.
Note 4: VCC provides self bias for the internal gate drive and control circuits. Device thermal limitations limit external loading.
5 www.national.com
LM3103
Page 6
Typical Performance Characteristics
All curves are taken at VIN = 18V with the configuration in the typical application circuit for V
OUT
= 3.3V shown in this datasheet.
TA = 25°C, unless otherwise specified.
Quiescent Current, IIN vs V
IN
30029703
VCC vs I
CC
30029704
VCC vs V
IN
30029705
ton vs V
IN
30029706
Switching Frequency, fSW vs V
IN
30029707
VFB vs Temperature
30029708
www.national.com 6
LM3103
Page 7
R
DS(on)
vs Temperature
30029709
Efficiency vs Load Current
(V
OUT
= 3.3V)
30029710
V
OUT
Regulation vs Load Current
(V
OUT
= 3.3V)
30029711
Efficiency vs Load Current
(V
OUT
= 0.6V)
30029712
V
OUT
Regulation vs Load Current
(V
OUT
= 0.6V)
30029713
Power Up
(V
OUT
= 3.3V, 0.75A Loaded)
30029714
7 www.national.com
LM3103
Page 8
Enable Transient
(V
OUT
= 3.3V, 0.75A Loaded)
30029715
Shutdown Transient
(V
OUT
= 3.3V, 0.75A Loaded)
30029716
Continuous Mode Operation
(V
OUT
= 3.3V, 2.5A Loaded)
30029717
Discontinuous Mode Operation
(V
OUT
= 3.3V, 0.02A Loaded)
30029718
DCM to CCM Transition
(V
OUT
= 3.3V, 0.01A - 0.75A Load)
30029719
Load Transient
(V
OUT
= 3.3V, 0.075A - 0.75A Load, Current slew-rate: 2.5A/µs)
30029720
www.national.com 8
LM3103
Page 9
Simplified Functional Block Diagram
30029721
9 www.national.com
LM3103
Page 10
Functional Description
The LM3103 Step Down Switching Regulator features all re­quired functions to implement a cost effective, efficient buck power converter which is capable of supplying 0.75A to loads. It contains dual N-Channel main and synchronous MOS­FETs. The Constant ON-Time (COT) regulation scheme re­quires no loop compensation, results in a fast load transient response and simple circuit implementation. The regulator can function properly even with an all ceramic output capac­itor network, and does not rely on the output capacitor’s ESR for stability. The operating frequency remains constant with line variations due to the inverse relationship between the in­put voltage and the on-time. The valley current limit detection circuit, with a limit set internally at 0.9A, inhibits the main MOSFET until the inductor current level subsides.
The LM3103 can be applied in numerous applications and can operate efficiently for inputs as high as 42V. Protection features include VCC under-voltage lockout, output over-volt­age protection, thermal shutdown, gate drive under-voltage lock-out. The LM3103 is available in the thermally enhanced eTSSOP-16 package.
COT Control Circuit Overview
COT control is based on a comparator and a one-shot on­timer, with the output voltage feedback (feeding to the FB pin) compared with a 0.6V internal reference. If the voltage of the FB pin is below the reference, the main MOSFET is turned on for a fixed on-time determined by a programming resistor RON and the input voltage VIN, upon which the on-time varies inversely. Following the on-time, the main MOSFET remains off for a minimum of 240 ns. Then, if the voltage of the FB pin is below the reference, the main MOSFET is turned on again for another on-time period. The switching will continue to achieve regulation.
The regulator will operate in the discontinuous conduction mode (DCM) at a light load, and the continuous conduction mode (CCM) with a heavy load. In the DCM, the current through the inductor starts at zero and ramps up to a peak during the on-time, and then ramps back to zero before the end of the off-time. It remains zero and the load current is supplied entirely by the output capacitor. The next on-time period starts when the voltage at the FB pin falls below the internal reference. The operating frequency in the DCM is lower and varies larger with the load current as compared with the CCM. Conversion efficiency is maintained since conduc­tion loss and switching loss are reduced with the reduction in the load and the switching frequency respectively. The oper­ating frequency in the DCM can be calculated approximately as follows:
(1)
In the continuous conduction mode (CCM), the current flows through the inductor in the entire switching cycle, and never reaches zero during the off-time. The operating frequency re­mains relatively constant with load and line variations. The CCM operating frequency can be calculated approximately as follows:
(2)
The output voltage is set by two external resistors R
FB1
and
R
FB2
. The regulated output voltage is
V
OUT
= 0.6V x (R
FB1
+ R
FB2
)/R
FB2
(3)
Startup Regulator (VCC)
A startup regulator is integrated within the LM3103. The input pin VIN can be connected directly to a line voltage up to 42V. The VCC output regulates at 6V, and is current limited to 30 mA. Upon power up, the regulator sources current into an ex­ternal capacitor C
VCC
, which is connected to the VCC pin. For
stability, C
VCC
must be at least 1 µF. When the voltage on the VCC pin is higher than the under-voltage lock-out (UVLO) threshold of 3.7V, the main MOSFET is enabled and the SS pin is released to allow the soft-start capacitor CSS to charge.
The minimum input voltage is determined by the dropout volt­age of the regulator and the VCC UVLO falling threshold (3.4V). If VIN is less than 4.0V, the regulator shuts off and VCC goes to zero.
Regulation Comparator
The feedback voltage at the FB pin is compared to a 0.6V internal reference. In normal operation (the output voltage is regulated), an on-time period is initiated when the voltage at the FB pin falls below 0.6V. The main MOSFET stays on for the programmed on-time, causing the output voltage to rise and consequently the voltage of the FB pin to rise above 0.6V. After the on-time period, the main MOSFET stays off until the voltage of the FB pin falls below 0.6V again. Bias current at the FB pin is nominally 1 nA.
Zero Coil Current Detect
The current of the synchronous MOSFET is monitored by a zero coil current detection circuit which inhibits the syn­chronous MOSFET when its current reaches zero until the next on-time. This circuit enables the DCM operation, which improves the efficiency at a light load.
Over-Voltage Comparator
The voltage at the FB pin is compared to a 0.68V internal reference. If it rises above 0.68V, the on-time is immediately terminated. This condition is known as over-voltage protec­tion (OVP). It can occur if the input voltage or the output load changes suddenly. Once the OVP is activated, the main MOSFET remains off until the voltage at the FB pin falls below
0.6V. The synchronous MOSFET will stay on to discharge the inductor until the inductor current reduces to zero and then switch off.
ON-Time Timer, Shutdown
The on-time of the LM3103 main MOSFET is determined by the resistor RON and the input voltage VIN. It is calculated as follows:
(4)
The inverse relationship of ton and VIN gives a nearly constant frequency as VIN is varied. RON should be selected such that the on-time at maximum VIN is greater than 100 ns. The on­timer has a limiter to ensure a minimum of 100 ns for ton. This limits the maximum operating frequency, which is governed by the following equation:
www.national.com 10
LM3103
Page 11
(5)
The LM3103 can be remotely shut down by pulling the voltage of the EN pin below 1.6V. In this shutdown mode, the SS pin is internally grounded, the on-timer is disabled, and bias cur­rents are reduced. Releasing the EN pin allows normal oper­ation to resume because the EN pin is internally pulled up.
30029726
FIGURE 1. Shutdown Implementation
Current Limit
Current limit detection is carried out during the off-time by monitoring the re-circulating current through the synchronous MOSFET. Referring to the Functional Block Diagram, when
the main MOSFET is turned off, the inductor current flows through the load, the PGND pin and the internal synchronous MOSFET. If this current exceeds 0.9A, the current limit com­parator toggles, and as a result the start of the next on-time period is disabled. The next switching cycle starts when the re-circulating current falls back below 0.9A (and the voltage at the FB pin is below 0.6V). The inductor current is monitored during the on-time of the synchronous MOSFET. As long as the inductor current exceeds 0.9A, the main MOSFET will re­main inhibited to achieve current limit. The operating frequen­cy is lower during current limit owing to a longer off-time.
Figure 2 illustrates an inductor current waveform. On aver­age, the output current I
OUT
is the same as the inductor current IL, which is the average of the rippled inductor current. In case of current limit (the current limit portion of Figure 2), the next on-time will not initiate until that the current drops below 0.9A (assume the voltage at the FB pin is lower than
0.6V). During each on-time the current ramps up an amount equal to:
(6)
During current limit, the LM3103 operates in a constant cur­rent mode with an average output current I
OUT(CL)
equal to
0.9A + ILR / 2.
30029728
FIGURE 2. Inductor Current - Current Limit Operation
11 www.national.com
LM3103
Page 12
N-Channel MOSFET and Driver
The LM3103 integrates an N-Channel main MOSFET and an associated floating high voltage main MOSFET gate driver. The gate drive circuit works in conjunction with an external bootstrap capacitor C
BST
and an internal high voltage diode.
C
BST
connected between the BST and SW pins powers the main MOSFET gate driver during the main MOSFET on-time. During each off-time, the voltage of the SW pin falls to ap­proximately -1V, and C
BST
charges from VCC through the internal diode. The minimum off-time of 240 ns provides enough time for charging C
BST
in each cycle.
Soft-Start
The soft-start feature allows the converter to gradually reach a steady state operating point, thereby reducing startup stresses and current surges. Upon turn-on, after VCC reaches the under-voltage threshold and a 180 µs fixed delay, a 70 µA internal current source charges an external capacitor C
SS
connecting to the SS pin. The ramping voltage at the SS pin (and the non-inverting input of the regulation comparator as well) ramps up the output voltage V
OUT
in a controlled man­ner. An internal switch grounds the SS pin if any of the following three cases happen: (i) VCC is below the under-volt­age lockout threshold; (ii) a thermal shutdown occurs; or (iii) the EN pin is grounded. Alternatively, the output voltage can be shut off by connecting the SS pin to the ground using an external switch. Releasing the switch allows the voltage of the SS pin to ramp up and the output voltage to return to normal. The shutdown configuration is shown in Figure 3.
30029729
FIGURE 3. Alternate Shutdown Implementation
Thermal Protection
The junction temperature of the LM3103 should not exceed the maximum limit. Thermal protection is implemented by an internal Thermal Shutdown circuit, which activates (typically) at 165°C to make the controller enter a low power reset state by disabling the main MOSFET, disabling the on-timer, and grounding the SS pin. Thermal protection helps prevent catastrophic failures from accidental device overheating. When the junction temperature falls back below 145°C (typi­cal hysteresis = 20°C), the SS pin is released and normal operation resumes.
Applications Information
EXTERNAL COMPONENTS
The following guidelines can be used to select external com­ponents.
R
FB1
and R
FB2
: These resistors should be chosen from stan-
dard values in the range of 1.0 k to 10 k, satisfying the following ratio:
R
FB1/RFB2
= (V
OUT
/0.6V) - 1 (7)
For V
OUT
= 0.6V, the FB pin can be connected to the output directly with a pre-load resistor drawing more than 20 µA. This is because the converter operation needs a minimum inductor current ripple to maintain good regulation when no load is connected.
RON: Equation (2) can be used to select RON if a desired op- erating frequency is selected. But the minimum value of RON is determined by the minimum on-time. It can be calcu­lated as follows:
(8)
If RON calculated from (2) is smaller than the minimum value determined in (8), a lower frequency should be selected to re­calculate RON by (2). Alternatively, V
IN(MAX)
can also be limited in order to keep the frequency unchanged. The relationship of V
IN(MAX)
and RON is shown in Figure 4.
On the other hand, the minimum off-time of 240 ns can limit the maximum duty ratio. This may be significant at low VIN. A larger RON should be selected in any application requiring a large duty ratio.
30029738
FIGURE 4. Maximum VIN for selected R
ON
L: The main parameter affected by the inductor is the ampli-
tude of the inductor current ripple (ILR), which is recommend­ed to be greater than 0.3A. Once ILR is selected, L can be determined by:
(9)
where VIN is the input voltage and fSW is determined from (2).
www.national.com 12
LM3103
Page 13
If the output current I
OUT
is known, by assuming that I
OUT
= IL, the peak and valley of ILR can be determined. Beware that the peak of ILR should not be larger than the saturation current of the inductor and the current rating of the main and syn­chronous MOSFETs. Also, the valley of ILR must be positive if CCM operation is required.
30029732
FIGURE 5. Inductor selection for V
OUT
= 3.3V
30029733
FIGURE 6. Inductor selection for V
OUT
= 0.6V
Figures 5 and 6 show curves on inductor selection for various V
OUT
and RON. According to (8), VIN is limited for small RON.
Some curves are therefore limited as shown in the figures.
C
VCC
: The capacitor on the VCC output provides not only noise
filtering and stability, but also prevents false triggering of the VCC UVLO at the main MOSFET on/off transitions. C
VCC
should be no smaller than 1 µF for stability, and should be a good quality, low ESR, ceramic capacitor.
C
OUT
and C
OUT3
: C
OUT
should generally be no smaller than 10 µF. Experimentation is usually necessary to determine the minimum value for C
OUT
, as the nature of the load may require a larger value. A load which creates significant transients re­quires a larger C
OUT
than a fixed load.
C
OUT3
is a small value ceramic capacitor located close to the
LM3103 to further suppress high frequency noise at V
OUT
. A
47 nF capacitor is recommended.
CIN and C
IN3
: The function of CIN is to supply most of the main
MOSFET current during the on-time, and limit the voltage rip­ple at the VIN pin, assuming that the voltage source connect­ing to the VIN pin has finite output impedance. If the voltage source’s dynamic impedance is high (effectively a current source), CIN supplies the difference between the instanta­neous input current and the average input current.
At the maximum load current, when the main MOSFET turns on, the current to the VIN pin suddenly increases from zero to the valley of the inductor’s ripple current and ramps up to the peak value. It then drops to zero at turn-off. The average current during the on-time is the load current. For a worst case calculation, CIN must be capable of supplying this average load current during the maximum on-time. CIN is calculated from:
(10)
where I
OUT
is the load current, ton is the maximum on-time,
and ΔVIN is the allowable ripple voltage at VIN. C
IN3
’s purpose is to help avoid transients and ringing due to long lead inductance at the VIN pin. A low ESR 0.1 µF ceramic chip capacitor located close to the LM3103 is recommended.
C
BST
: A 33 nF high quality ceramic capacitor with low ESR is
recommended for C
BST
since it supplies a surge current to charge the main MOSFET gate driver at each turn-on. Low ESR also helps ensure a complete recharge during each off­time.
CSS: The capacitor at the SS pin determines the soft-start time, i.e. the time for the reference voltage at the regulation comparator and therefore, the output voltage to reach their final value. The time is determined from the following equa­tion:
(11)
CFB: If the output voltage is higher than 1.6V, CFB is needed in the Discontinuous Conduction Mode to reduce the output ripple. The recommended value for CFB is 10 nF.
PC BOARD LAYOUT
The LM3103 regulation, over-voltage, and current limit com­parators are very fast so they will respond to short duration noise pulses. Layout is therefore critical for optimum perfor­mance. It must be as neat and compact as possible, and all external components must be as close to their associated pins of the LM3103 as possible. Refer to the functional block diagram. The loop formed by CIN, the main and synchronous MOSFET internal to the LM3103, and the PGND pin should be as small as possible. The connection from the PGND pin to CIN should be as short and direct as possible. Vias should be added to connect the ground of CIN to a ground plane, located as close to the capacitor as possible. The bootstrap capacitor C
BST
should be connected as close to the SW and BST pins as possible, and the connecting traces should be thick. The feedback resistors and capacitor R
FB1
, R
FB2
, and CFB should be close to the FB pin. A long trace running from V
OUT
to R
FB1
is generally acceptable since this is a low
impedance node. Ground R
FB2
directly to the AGND pin (pin
7). The output capacitor C
OUT
should be connected close to the load and tied directly to the ground plane. The inductor L should be connected close to the SW pin with as short a trace as possible to reduce the potential for EMI (electromagnetic interference) generation. If it is expected that the internal dis-
13 www.national.com
LM3103
Page 14
sipation of the LM3103 will produce excessive junction tem­perature during normal operation, making good use of the PC board’s ground plane can help considerably to dissipate heat. The exposed pad on the bottom of the LM3103 IC package can be soldered to the ground plane, which should extend out from beneath the LM3103 to help dissipate heat. The exposed pad is internally connected to the LM3103 IC substrate. Ad-
ditionally the use of thick traces, where possible, can help conduct heat away from the LM3103. Using numerous vias to connect the die attached pad to the ground plane is a good practice. Judicious positioning of the PC board within the end product, along with the use of any available air flow (forced or natural convection) can help reduce the junction temperature.
30029736
Typical Application Schematic for V
OUT
= 3.3V
30029737
Typical Application Schematic for V
OUT
= 0.6V
www.national.com 14
LM3103
Page 15
Physical Dimensions inches (millimeters) unless otherwise noted
16-Lead Plastic eTSSOP Package
NS Package Number MXA16A
15 www.national.com
LM3103
Page 16
Notes
LM3103 SIMPLE SWITCHER® Synchronous 1MHz 0.75A Step-Down Voltage Regulator
THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION (“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS, IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.
TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.
EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.
National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other brand or product names may be trademarks or registered trademarks of their respective holders.
Copyright© 2007 National Semiconductor Corporation
For the most current product information visit us at www.national.com
National Semiconductor Americas Customer Support Center
Email: new.feedback@nsc.com Tel: 1-800-272-9959
National Semiconductor Europe Customer Support Center
Fax: +49 (0) 180-530-85-86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +49 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790
National Semiconductor Asia Pacific Customer Support Center
Email: ap.support@nsc.com
National Semiconductor Japan Customer Support Center
Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com Tel: 81-3-5639-7560
www.national.com
Loading...