The LM2940/LM2940C positive voltage regulator features the
ability to source 1A of output current with a dropout voltage of
typically 0.5V and a maximum of 1V over the entire temperature range. Furthermore, a quiescent current reduction circuit has been included which reduces the ground current
when the differential between the input voltage and the output
voltage exceeds approximately 3V. The quiescent current
with 1A of output current and an input-output differential of 5V
is therefore only 30 mA. Higher quiescent currents only exist
when the regulator is in the dropout mode (VIN − V
Designed also for vehicular applications, the LM2940/
LM2940C and all regulated circuitry are protected from reverse battery installations or 2-battery jumps. During line
transients, such as load dump when the input voltage can
momentarily exceed the specified maximum operating volt-
OUT
≤ 3V).
January 2007
age, the regulator will automatically shut down to protect both
the internal circuits and the load. The LM2940/LM2940C cannot be harmed by temporary mirror-image insertion. Familiar
regulator features such as short circuit and thermal overload
protection are also provided.
Features
Dropout voltage typically 0.5V @IO = 1A
■
Output current in excess of 1A
■
Output voltage trimmed before assembly
■
Reverse battery protection
■
Internal short circuit current limit
■
Mirror image insertion protection
■
P+ Product Enhancement tested
■
LM2940/LM2940C 1A Low Dropout Regulator
Typical Application
*Required if regulator is located far from power supply filter.
**C
must be at least 22 μF to maintain stability. May be increased without bound to maintain regulation during transients. Locate as close as possible to
OUT
the regulator. This capacitor must be rated over the same operating temperature range as the regulator and the ESR is critical; see curve.
The physical size of the SOT-223 is too small to contain the full device part number. The package markings indicated are what will appear on the actual device.
Internally Limited
Maximum Junction Temperature150°C
Storage Temperature Range
−65°C ≤ TJ ≤ +150°C
Soldering Temperature (Note 3)
TO-220 (T), Wave260°C, 10s
Operating Conditions (Note 1)
Input Voltage26V
Temperature Range
LM2940T, LM2940S
LM2940CT, LM2940CS
LM2940IMP
LM2940J, LM2940WG
LM2940LD
−40°C ≤ TJ ≤ 125°C
0°C ≤ TJ ≤ 125°C
−40°C ≤ TA ≤ 85°C
−55°C ≤ TJ ≤ 125°C
−40°C ≤ TJ ≤ 125°C
TO-263 (S)235°C, 30s
Electrical Characteristics
VIN = VO + 5V, IO = 1A, CO = 22 μF, unless otherwise specified. Boldface limits apply over the entire operating temperature
range of the indicated device. All other specifications apply for TA = TJ = 25°C.
RO = 100Ω
LM2940, T ≤ 100 ms
LM2940/883, T ≤ 20 ms
LM2940C, T ≤ 1 ms
RO = 100Ω
(Note 5)(Note 6)
1.91.61.5/1.31.91.61.6/1.3
7560/607560/60
40/4040/40
55455545
(Note 5)(Note 6)
DC Input VoltageLM2940, LM2940/883−30−15/−15−15/−15−30−15/−15−15/−15V
LM2940C−30−15−30−15
Reverse Polarity
Transient Input
Voltage
RO = 100Ω
LM2940, T ≤ 100 ms
LM2940/883, T ≤ 20 ms
LM2940C, T ≤ 1 ms
−75−50/−50−75−50/−50
−45/−45−45/−45
−55−45/−45
Electrical Characteristics
VIN = VO + 5V, IO = 1A, CO = 22 μF, unless otherwise specified. Boldface limits apply over the entire operating temperature
range of the indicated device. All other specifications apply for TA = TJ = 25°C.
Output Voltage (VO)9V10V
LM2940
ParameterConditionsTyp
LimitLimit
Typ
(Note 5)(Note 5)
Output Voltage
5 mA ≤ IO ≤1A
10.5V ≤ VIN ≤ 26V11.5V ≤ VIN ≤ 26V
9.008.73/8.5510.009.70/9.50
9.27/9.4510.30/10.50V
Line Regulation
VO + 2V ≤ VIN ≤ 26V,
209020100
IO = 5 mA
Load Regulation
50 mA ≤ IO ≤ 1A
LM29406090/15065100/165mV
LM2940C6090
Output Impedance100 mADC and
20 mArms,6065
fO = 120 Hz
Quiescent
VO +2V ≤ VIN < 26V,
CurrentIO = 5 mA
LM29401015/201015/20mA
LM2940C1015
Output Noise10 Hz − 100 kHz,
VIN = VO + 5V, IO = 1A3045/603045/60mA
270
300
VoltageIO = 5 mA
Ripple RejectionfO = 120 Hz, 1 V
,
rms
IO = 100 mA
LM29406452/466351/45dB
LM2940C6452
Long Term
Stability
1000 Hr
3436mV/
LM2940
Units
A
MIN
V
MIN
MIN
V
MIN
Units
V
MIN
MAX
mV
MAX
MAX
mΩ
MAX
MAX
μV
rms
MIN
www.national.com4
Page 6
Output Voltage (VO)9V10V
ParameterConditionsTyp
LM2940
LimitLimit
Typ
LM2940
Units
(Note 5)(Note 5)
Dropout VoltageIO = 1A0.50.8/1.00.50.8/1.0V
IO = 100 mA110150/200110150/200mV
Short Circuit(Note 7)
1.91.61.91.6
A
Current
Maximum Line
Transient
RO = 100Ω
T ≤ 100 ms
LM29407560/607560/60V
LM2940C5545
Reverse Polarity
RO = 100Ω
DC Input VoltageLM2940−30−15/−15−30−15/−15V
LM2940C−30−15
Reverse Polarity
Transient Input
RO = 100Ω
T ≤ 100 ms
VoltageLM2940−75−50/−50−75−50/−50V
LM2940C−55−45/−45
LM2940/LM2940C
MAX
MAX
MIN
MIN
MIN
MIN
Electrical Characteristics
VIN = VO + 5V, IO = 1A, CO = 22 μF, unless otherwise specified. Boldface limits apply over the entire operating temperature
range of the indicated device. All other specifications apply for TA = TJ = 25°C.
RO = 100Ω
LM2940, T ≤ 100 ms
LM2940/883, T ≤ 20 ms
LM2940C, T ≤ 1 ms
RO = 100Ω
7560/60
40/4040/40V
55455545
DC InputLM2940, LM2940/883−30−15/−15−15/−15−15/−15V
VoltageLM2940C−30−15−30−15
Reverse Polarity
Transient Input
Voltage
RO = 100Ω
LM2940, T ≤ 100 ms
LM2940/883, T ≤ 20 ms
LM2940C, T ≤ 1 ms
−75−50/−50
−45/−45−45/−45V
−55−45/−45−55−45/−45
Units
dB
A
MIN
MIN
MAX
MAX
MIN
MIN
MIN
MIN
Thermal Performance
Thermal Resistance
Junction-to-Case, θ
(JC)
Thermal Resistance
Junction-to-Ambient, θ
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device
functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics.
Note 2: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ, the junction-to-ambient thermal resistance, θJA, and
the ambient temperature, TA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal
shutdown. The value of θJA (for devices in still air with no heatsink) is 60°C/W for the TO-220 package, 80°C/W for the TO-263 package, and 174°C/W for the
SOT-223 package. The effective value of θJA can be reduced by using a heatsink (see Application Hints for specific information on heatsinking). The value of
θJA for the LLP package is specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance
and power dissipation for the LLP package, refer to Application Note AN-1187. It is recommended that 6 vias be placed under the center pad to improve thermal
performance.
Note 3: Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the temperature and time
are for Sn-Pb (STD) only.
Note 4: ESD rating is based on the human body model, 100 pF discharged through 1.5 kΩ.
Note 5: All limits are guaranteed at TA = TJ = 25°C only (standard typeface) or over the entire operating temperature range of the indicated device (boldface type).
All limits at TA = TJ = 25°C are 100% production tested. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control
methods.
Note 6: All limits are guaranteed at TA = TJ = 25°C only (standard typeface) or over the entire operating temperature range of the indicated device (boldface type).
All limits are 100% production tested and are used to calculate Outgoing Quality Levels.
Note 7: Output current will decrease with increasing temperature but will not drop below 1A at the maximum specified temperature.
(JA)
3-Lead TO-2204
3-Lead TO-2634
3-Lead TO-220 (Note 2)60
3-Lead TO-263 (Note 2)80
SOT-223(Note 2)174
8-Lead LLP (Note 2)35
°C/W
°C/W
www.national.com6
Page 8
Typical Performance Characteristics
LM2940/LM2940C
Dropout Voltage
Output Voltage vs. Temperature
882213
Dropout Voltage vs. Temperature
882214
Quiescent Current vs. Temperature
Quiescent Current
882215
882217
882216
Quiescent Current
882218
7www.national.com
Page 9
LM2940/LM2940C
Line Transient Response
Load Transient Response
Ripple Rejection
Low Voltage Behavior
882219
882221
882220
Low Voltage Behavior
882225
Low Voltage Behavior
882226
www.national.com8
882227
Page 10
LM2940/LM2940C
Low Voltage Behavior
Low Voltage Behavior
882228
Low Voltage Behavior
882229
Output at Voltage Extremes
Output at Voltage Extremes
882230
882232
882231
Output at Voltage Extremes
882233
9www.national.com
Page 11
LM2940/LM2940C
Output at Voltage Extremes
Output at Voltage Extremes
Output at Voltage Extremes
Peak Output Current
882234
882236
882235
Output Capacitor ESR
882206
Output Impedance
882208
www.national.com10
882222
Page 12
LM2940/LM2940C
Maximum Power Dissipation (TO-220)
Maximum Power Dissipation (TO-263)
Maximum Power Dissipation (SOT-223)
882224
882223
882210
11www.national.com
Page 13
Equivalent Schematic Diagram
LM2940/LM2940C
882201
www.national.com12
Page 14
LM2940/LM2940C
Application Information
EXTERNAL CAPACITORS
The output capacitor is critical to maintaining regulator stability, and must meet the required conditions for both ESR
(Equivalent Series Resistance) and minimum amount of capacitance.
MINIMUM CAPACITANCE:
The minimum output capacitance required to maintain stabil-
ity is 22 μF (this value may be increased without limit). Larger
values of output capacitance will give improved transient response.
ESR LIMITS:
The ESR of the output capacitor will cause loop instability if it
is too high or too low. The acceptable range of ESR plotted
versus load current is shown in the graph below. It is essen-
tial that the output capacitor meet these requirements, or
oscillations can result.
Output Capacitor ESR
882206
FIGURE 1. ESR Limits
It is important to note that for most capacitors, ESR is specified only at room temperature. However, the designer must
ensure that the ESR will stay inside the limits shown over the
entire operating temperature range for the design.
For aluminum electrolytic capacitors, ESR will increase by
about 30X as the temperature is reduced from 25°C to −40°
C. This type of capacitor is not well-suited for low temperature
operation.
Solid tantalum capacitors have a more stable ESR over temperature, but are more expensive than aluminum electrolytics. A cost-effective approach sometimes used is to parallel
an aluminum electrolytic with a solid Tantalum, with the total
capacitance split about 75/25% with the Aluminum being the
larger value.
If two capacitors are paralleled, the effective ESR is the parallel of the two individual values. The “flatter” ESR of the
Tantalum will keep the effective ESR from rising as quickly at
low temperatures.
HEATSINKING
A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of the application. Under all possible operating conditions, the junction
temperature must be within the range specified under Absolute Maximum Ratings.
To determine if a heatsink is required, the power dissipated
by the regulator, PD, must be calculated.
The figure below shows the voltages and currents which are
present in the circuit, as well as the formula for calculating the
power dissipated in the regulator:
IIN = IL + I
G
PD = (VIN − V
) IL + (VIN) I
OUT
G
882237
FIGURE 2. Power Dissipation Diagram
The next parameter which must be calculated is the maximum
allowable temperature rise, T
ing the formula:
. This is calculated by us-
R(MAX)
T
R(MAX)
= T
J(MAX)
− T
A(MAX)
where: T
is the maximum allowable junction tempera-
J(MAX)
ture, which is 125°C for commercial grade
parts.
T
A(MAX)
Using the calculated values for T
allowable value for the junction-to-ambient thermal resistance, θ
(JA)
IMPORTANT: If the maximum allowable value for θ
found to be ≥ 53°C/W for the TO-220 package, ≥ 80°C/W for
is the maximum ambient temperature which
will be encountered in the application.
and PD, the maximum
R(MAX)
, can now be found:
θ
(JA)
= T
R(MAX)
/ P
D
(JA)
is
the TO-263 package, or ≥ 174°C/W for the SOT-223 package, no heatsink is needed since the package alone will
dissipate enough heat to satisfy these requirements.
If the calculated value for θ
heatsink is required.
falls below these limits, a
(JA)
HEATSINKING TO-220 PACKAGE PARTS
The TO-220 can be attached to a typical heatsink, or secured
to a copper plane on a PC board. If a copper plane is to be
used, the values of θ
section for the TO-263.
will be the same as shown in the next
(JA)
If a manufactured heatsink is to be selected, the value of
heatsink-to-ambient thermal resistance, θ
calculated:
, must first be
(H−A)
θ
= θ
(H−A)
(JA)
− θ
(C−H)
− θ
(J−C)
Where: θ
is defined as the thermal resistance from the
(J−C)
junction to the surface of the case. A value of
3°C/W can be assumed for θ
culation.
(J−C)
for this cal-
13www.national.com
Page 15
θ
is defined as the thermal resistance between
(C−H)
the case and the surface of the heatsink. The
value of θ
about 2.5°C/W (depending on method of at-
will vary from about 1.5°C/W to
(C−H)
tachment, insulator, etc.). If the exact value is
unknown, 2°C/W should be assumed for θ
.
LM2940/LM2940C
When a value for θ
heatsink must be selected that has a value that is less than
−H)
is found using the equation shown, a
(H−A)
or equal to this number.
θ
is specified numerically by the heatsink manufacturer
(H−A)
in the catalog, or shown in a curve that plots temperature rise
vs power dissipation for the heatsink.
HEATSINKING TO-263 PACKAGE PARTS
The TO-263 (“S”) package uses a copper plane on the PCB
and the PCB itself as a heatsink. To optimize the heat sinking
ability of the plane and PCB, solder the tab of the package to
the plane.
Figure 3 shows for the TO-263 the measured values of θ
for different copper area sizes using a typical PCB with 1
ounce copper and no solder mask over the copper area used
for heatsinking.
(JA)
(C
882239
FIGURE 4. Maximum Power Dissipation vs. TA for the
TO-263 Package
HEATSINKING SOT-223 PACKAGE PARTS
The SOT-223 (“MP”) packages use a copper plane on the
PCB and the PCB itself as a heatsink. To optimize the heat
sinking ability of the plane and PCB, solder the tab of the
package to the plane.
Figure 5 and Figure 6 show the information for the SOT-223
package. Figure 6 assumes a θ
inch of 1 ounce copper and 51°C/W for 1 square inch of 2
of 74°C/W for 1 square
(JA)
ounce copper, with a maximum ambient temperature (TA) of
85°C and a maximum junction temperature (TJ) of 125°C.
For techniques for improving the thermal resistance and power dissipation for the SOT-223 package, please refer to Application Note AN-1028.
882238
FIGURE 3. θ
vs. Copper (1 ounce) Area for the TO-263
(JA)
Package
As shown in the figure, increasing the copper area beyond 1
square inch produces very little improvement. It should also
be observed that the minimum value of θ
package mounted to a PCB is 32°C/W.
for the TO-263
(JA)
As a design aid, Figure 4 shows the maximum allowable power dissipation compared to ambient temperature for the
TO-263 device. This assumes a θ
inch of 1 ounce copper and a maximum junction temperature
of 35°C/W for 1 square
(JA)
(TJ) of 125°C.
FIGURE 5. θ
882240
vs. Copper (2 ounce) Area for the SOT-223
(JA)
Package
www.national.com14
Page 16
882241
LM2940/LM2940C
HEATSINKING LLP PACKAGE PARTS
The value of θJA for the LLP package is specifically dependent
on PCB trace area, trace material, and the number of layers
and thermal vias. It is recommended that a minimum of 6
thermal vias be placed under the center pad to improve thermal performance.
For techniques for improving the thermal resistance and power dissipation for the LLP package, please refer to Application
Note AN-1187.
FIGURE 6. Maximum Power Dissipation vs. TA for the
THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION
(“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY
OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO
SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS,
IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS
DOCUMENT.
TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT
NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL
PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR
APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND
APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE
NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.
EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO
LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE
AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY
RIGHT.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and
whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected
to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform
can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.
National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other
brand or product names may be trademarks or registered trademarks of their respective holders.
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
ProductsApplications
Audiowww.ti.com/audioCommunications and Telecom www.ti.com/communications
Amplifiersamplifier.ti.comComputers and Peripheralswww.ti.com/computers
Data Convertersdataconverter.ti.comConsumer Electronicswww.ti.com/consumer-apps
DLP® Productswww.dlp.comEnergy and Lightingwww.ti.com/energy
DSPdsp.ti.comIndustrialwww.ti.com/industrial
Clocks and Timerswww.ti.com/clocksMedicalwww.ti.com/medical
Interfaceinterface.ti.comSecuritywww.ti.com/security
Logiclogic.ti.comSpace, Avionics and Defensewww.ti.com/space-avionics-defense
Power Mgmtpower.ti.comTransportation and Automotive www.ti.com/automotive
Microcontrollersmicrocontroller.ti.comVideo and Imagingwww.ti.com/video
RFIDwww.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivitywww.ti.com/wirelessconnectivity