Datasheet LM2931CT/NOPB Specification

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LM2931-N

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LM2931-N Series Low Dropout Regulators

Check for Samples: LM2931-N

FEATURES

• Very Low Quiescent Current

• Output Current in Excess of 100 mA

• Input-output Differential Less than 0.6V

• Reverse Battery Protection

• 60V Load Dump Protection

• −50V Reverse Transient Protection

• Short Circuit Protection

• Internal Thermal Overload Protection

• Mirror-image Insertion Protection

• Available in TO-220, TO-92, TO-263, or SOIC-8 Packages

• Available as Adjustable with TTL Compatible Switch

SNOSBE5G –MARCH 2000–REVISED APRIL 2013

DESCRIPTION

The LM2931-N positive voltage regulator features a very low quiescent current of 1mA or less when supplying 10mA loads. This unique characteristic and the extremely low input-output differential required for proper regulation (0.2V for output currents of 10mA) make the LM2931-N the ideal regulator for standby power systems. Applications include memory standby circuits, CMOS and other low power processor power supplies as well as systems demanding as much as 100mA of output current.

Designed originally for automotive applications, the LM2931-N and all regulated circuitry are protected from reverse battery installations or 2 battery jumps. During line transients, such as a load dump (60V) when the input voltage to the regulator can momentarily exceed the specified maximum operating voltage, the regulator will automatically shut down to protect both internal circuits and the load. The LM2931-N cannot be harmed by temporary mirror-image insertion. Familiar regulator features such as short circuit and thermal overload protection are also provided.

The LM2931-N family includes a fixed 5V output (±3.8% tolerance for A grade) or an adjustable output with ON/OFF pin. Both versions are available in a TO-220 power package, DDPAK/TO-263 surface mount package, and an 8-lead SOIC package. The fixed output version is also available in the TO-92 plastic package.

Connection Diagrams

FIXED VOLTAGE OUTPUT

Figure 1. TO-220 3-Lead Power Package Figure 2. DDPAK/TO-263 Surface-Mount Package

Front View Top View

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Figure 3. Side View

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LM2931-N

SNOSBE5G –MARCH 2000–REVISED APRIL 2013

*NC = Not internally connected. Must be electrically isolated from the rest of the circuit for the DSBGA package.

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Figure 4. 8-Pin SOIC

Top View

Figure 5. TO-92 Plastic Package

Bottom View

Figure 6. 6-Bump DSBGA Figure 7. DSBGA Laser Mark

Top View

(Bump Side Down)

ADJUSTABLE OUTPUT VOLTAGE

Figure 9. DDPAK/TO-263 Figure 10. Side View

5-Lead Surface-Mount Package

Top View

Figure 8. TO-220 5-Lead Power Package

Front View

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LM2931-N

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Typical Applications

*Required if regulator is located far from power supply filter. **C2 must be at least 100 μF to maintain stability. May be increased without bound to maintain regulation during transients. Locate as close as possible to the regulator. This capacitor must be rated over the same operating temperature range as the regulator. The equivalent series resistance (ESR) of this capacitor is critical; see curve.

SNOSBE5G –MARCH 2000–REVISED APRIL 2013

Figure 11. 8-Pin SOIC

Top View

Figure 12. LM2931-N Fixed Output

Note: Using 27k for R1 will automatically compensate for errors in V

(approximately 1 μA).

due to the input bias current of the ADJ pin

OUT

Figure 13. LM2931-N Adjustable Output

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LM2931-N

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1)(2)

Input Voltage

Operating Range 26V Overvoltage Protection

LM2931A, LM2931C (Adjustable) 60V LM2931-N 50V

Internal Power Dissipation

(3) (4)

Internally Limited

Operating Ambient Temperature

Range −40°C to +85°C Maximum Junction Temperature 125°C Storage Temperature Range −65°C to +150°C Lead Temp. (Soldering, 10 seconds) 230°C ESD Tolerance

(5)

2000V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when

operating the device beyond its rated operating conditions.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications. (3) See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used. (4) The maximum power dissipation is a function of maximum junction temperature T

temperature TA. The maximum allowable power dissipation at any ambient temperature is PD= (T

exceeded, the die temperature will rise above 150°C and the LM2931-N will go into thermal shutdown. For the LM2931-N in the TO-92

, total thermal resistance θJA, and ambient

Jmax

− TA)/θJA. If this dissipation is

Jmax

package, θJAis 195°C/W; in the SOIC-8 package, θJAis 160°C/W, and in the TO-220 package, θJAis 50°C/W; in the DDPAK/TO-263

package, θJAis 73°C/W; and in the 6-Bump DSBGA package θJAis 290°C/W. If the TO-220 package is used with a heat sink, θJAis the

sum of the package thermal resistance junction-to-case of 3°C/W and the thermal resistance added by the heat sink and thermal

interface.If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally

connected to the package: Using 0.5 square inches of copper area, θJAis 50°C/W; with 1 square inch of copper area, θJAis 37°C/W;

and with 1.6 or more square inches of copper area, θJAis 32°C/W. (5) Human body model, 100 pF discharged through 1.5 kΩ.

ELECTRICAL CHARACTERISTICS FOR FIXED 3.3V VERSION

VIN= 14V, IO= 10mA, TJ= 25°C, C2= 100μF (unless otherwise specified)

Parameter Conditions Units

Output Voltage 3.3 3.465 V

4V ≤ VIN≤ 26V, IO= 100 mA 3.630 V

−40°C ≤ TJ≤ 125°C 2.970 V Line Regulation 4V ≤ VIN≤ 26V 4 33 mV Load Regulation 5mA ≤ IO≤ 100mA 10 50 mV Output Impedance 100mADCand 10mA

100Hz - 10kHz

Quiescent Current IO≤ 10mA, 4V ≤ VIN≤ 26V 0.4 1.0 mA

−40°C ≤ TJ≤ 125°C

IO= 100mA, VIN= 14V, TJ= 25°C 15 mA Output Noise Voltage 10Hz -100kHz, C Long Term Stability 13 mV/1000 hr Ripple Rejection fO= 120Hz 80 dB

(1) See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used. (2) All limits are specified for TJ= 25°C (standard type face) or over the full operating junction temperature range of −40°C to +125°C (bold

type face).

, 200 mΩ

rms

= 100μF 330 μV

OUT

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(1)

LM2931-N-3.3

Typ

Limit

(2)

3.135 V

MAX

MIN

MAX

MIN

MAX MAX

MAX

rms

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LM2931-N

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SNOSBE5G –MARCH 2000–REVISED APRIL 2013

ELECTRICAL CHARACTERISTICS FOR FIXED 3.3V VERSION (continued)

VIN= 14V, IO= 10mA, TJ= 25°C, C2= 100μF (unless otherwise specified)

Parameter Conditions Units

Dropout Voltage IO= 10mA 0.05 0.2

IO= 100mA 0.30 0.6 Maximum Operational Input Voltage 33 26 V Maximum Line Transient RL= 500Ω, VO≤ 5.5V, 70 50 V

T = 1ms, τ ≤ 100ms Reverse Polarity Input Voltage, DC VO≥ −0.3V, RL= 500Ω −30 −15 V Reverse Polarity Input Voltage, T = 1ms, τ ≤ 100ms, RL= 500Ω −80 −50 V

Transient

(1)

LM2931-N-3.3

Typ

Limit

(2)

MAX

MIN MIN

ELECTRICAL CHARACTERISTICS FOR FIXED 5V VERSION

VIN= 14V, IO= 10mA, TJ= 25°C, C2 = 100 μF (unless otherwise specified)

Parameter Conditions Units

Output Voltage 5 5.19 5 5.25 V

6.0V ≤ VIN≤ 26V, IO= 100mA 5.25 5.5 V

−40°C ≤ TJ≤ 125°C 4.75 4.5 V

Line Regulation 9V ≤ VIN≤ 16V 2 10 2 10

Load Regulation 5 mA ≤ IO≤ 100mA 14 50 14 50 mV Output Impedance 100mADCand 10mA

Quiescent Current IO≤ 10mA, 6V ≤ VIN≤ 26V 0.4 1.0 0.4 1.0 mA

Output Noise Voltage 10Hz -100kHz, C Long Term Stability 20 20 mV/1000

Ripple Rejection fO= 120 Hz 80 55 80 dB Dropout Voltage IO= 10mA 0.05 0.2 0.05 0.2

Maximum Operational Input 33 26 33 26 V Voltage

Maximum Line Transient RL= 500Ω, VO≤ 5.5V,

Reverse Polarity Input Voltage, VO≥ −0.3V, RL= 500Ω −30 −15 −30 −15 V DC

Reverse Polarity Input Voltage, T = 1ms, τ ≤ 100ms, RL= 500Ω −80 −50 −80 −50 V Transient

type face).

6V ≤ VIN≤ 26V 4 30 4 30

, 200 200 mΩ

100Hz -10kHz

rms

−40°C ≤ TJ≤ 125°C IO= 100mA, VIN= 14V, TJ= 25°C 15 30 15 mA

= 100μF 500 500 μV

OUT

IO= 100mA 0.3 0.6 0.3 0.6

T = 1ms, τ ≤ 100ms

(1)

LM2931A-5.0 LM2931-N-5.0

Typ Typ

Limit Limit

(2) (2)

4.81 4.75 V

70 60 70 50 V

MAX

MIN

MAX

MIN

MAX

MAX rms

MIN

MAX

MIN

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LM2931-N

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ELECTRICAL CHARACTERISTICS FOR ADJUSTABLE VERSION

VIN= 14V, V

= 3V, IO= 10 mA, TJ= 25°C, R1 = 27k, C2 = 100 μF (unless otherwise specified)

OUT

Parameter Conditions Typ Limit Units Limit

Reference Voltage 1.20 1.26 V

IO≤ 100 mA, −40°C ≤ Tj≤ 125°C, R1 = 27k 1.32 V

Measured from V

to Adjust Pin 1.08 V

OUT

Output Voltage Range 24 V

Line Regulation V

+ 0.6V ≤ VIN≤ 26V 0.2 1.5 mV/V

OUT

Load Regulation 5 mA ≤ IO≤ 100 mA 0.3 1 % Output Impedance 100 mADCand 10 mA

, 100 Hz–10 kHz 40 mΩ/V

rms

Quiescent Current IO= 10 mA 0.4 1 mA

IO= 100 mA 15 mA

During Shutdown RL= 500Ω 0.8 1 mA Output Noise Voltage 10 Hz–100 kHz 100 μV Long Term Stability 0.4 %/1000 hr Ripple Rejection fO= 120 Hz 0.02 %/V Dropout Voltage IO≤ 10 mA 0.05 0.2 V

IO= 100 mA 0.3 0.6 V Maximum Operational Input Voltage 33 26 V Maximum Line Transient IO= 10 mA, Reference Voltage ≤ 1.5V 70 60 V

T = 1 ms, τ ≤ 100 ms Reverse Polarity Input VO≥ −0.3V, RL= 500Ω Voltage, DC −30 −15 V Reverse Polarity Input T = 1 ms, τ ≤ 100 ms, RL= 500Ω Voltage, Transient −80 −50 V On/Off Threshold Voltage VO=3V

On 2.0 1.2 V Off 2.2 3.25 V

On/Off Threshold Current 20 50 μA

(1)

1.14 V

3 V

MAX

MIN

MAX

MIN

MAX

MIN

MAX

rms

MAX MAX

MIN MIN

MIN

MAX

MIN

MAX

(1) See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.

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SNOSBE5G –MARCH 2000–REVISED APRIL 2013

TYPICAL PERFORMANCE CHARACTERISTICS

Dropout Voltage Dropout Voltage

Figure 14. Figure 15.

Low Voltage Behavior Output at Voltage Extremes

Figure 16. Figure 17.

Line Transient Response Load Transient Response

Figure 18. Figure 19.

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LM2931-N

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TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Peak Output Current Quiescent Current

Figure 20. Figure 21.

Quiescent Current Quiescent Current

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Figure 22. Figure 23.

Ripple Rejection Ripple Rejection

Figure 24. Figure 25.

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SNOSBE5G –MARCH 2000–REVISED APRIL 2013

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Output Impedance Dump

Figure 26. Figure 27.

Reference Voltage (SOIC-8)

Operation During Load

Maximum Power Dissipation

Figure 28. Figure 29.

Maximum Power Dissipation Maximum Power Dissipation

(TO-220) (TO-92)

Figure 30. Figure 31.

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TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Maximum Power Dissipation

(TO-263)

Figure 32. Figure 33.

(1)

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On/Off Threshold

Output Capacitor ESR

Figure 34.

(1) The maximum power dissipation is a function of maximum junction temperature T

temperature TA. The maximum allowable power dissipation at any ambient temperature is PD= (T exceeded, the die temperature will rise above 150°C and the LM2931-N will go into thermal shutdown. For the LM2931-N in the TO-92 package, θJAis 195°C/W; in the SOIC-8 package, θJAis 160°C/W, and in the TO-220 package, θJAis 50°C/W; in the DDPAK/TO-263 package, θJAis 73°C/W; and in the 6-Bump DSBGA package θJAis 290°C/W. If the TO-220 package is used with a heat sink, θJAis the sum of the package thermal resistance junction-to-case of 3°C/W and the thermal resistance added by the heat sink and thermal interface.If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package: Using 0.5 square inches of copper area, θJAis 50°C/W; with 1 square inch of copper area, θJAis 37°C/W; and with 1.6 or more square inches of copper area, θJAis 32°C/W.

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, total thermal resistance θJA, and ambient

Jmax

− TA)/θJA. If this dissipation is

Jmax

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LM2931-N

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SNOSBE5G –MARCH 2000–REVISED APRIL 2013

SCHEMATIC DIAGRAM

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APPLICATION HINTS

One of the distinguishing factors of the LM2931-N series regulators is the requirement of an output capacitor for device stability. The value required varies greatly depending upon the application circuit and other factors. Thus some comments on the characteristics of both capacitors and the regulator are in order.

High frequency characteristics of electrolytic capacitors depend greatly on the type and even the manufacturer. As a result, a value of capacitance that works well with the LM2931-N for one brand or type may not necessary be sufficient with an electrolytic of different origin. Sometimes actual bench testing, as described later, will be the only means to determine the proper capacitor type and value. Experience has shown that, as a rule of thumb, the more expensive and higher quality electrolytics generally allow a smaller value for regulator stability. As an example, while a high-quality 100 μF aluminum electrolytic covers all general application circuits, similar stability can be obtained with a tantalum electrolytic of only 47μF. This factor of two can generally be applied to any special application circuit also.

Another critical characteristic of electrolytics is their performance over temperature. While the LM2931-N is designed to operate to −40°C, the same is not always true with all electrolytics (hot is generally not a problem). The electrolyte in many aluminum types will freeze around −30°C, reducing their effective value to zero. Since the capacitance is needed for regulator stability, the natural result is oscillation (and lots of it) at the regulator output. For all application circuits where cold operation is necessary, the output capacitor must be rated to operate at the minimum temperature. By coincidence, worst-case stability for the LM2931-N also occurs at minimum temperatures. As a result, in applications where the regulator junction temperature will never be less than 25°C, the output capacitor can be reduced approximately by a factor of two over the value needed for the entire temperature range. To continue our example with the tantalum electrolytic, a value of only 22μF would probably thus suffice. For high-quality aluminum, 47μF would be adequate in such an application.

Another regulator characteristic that is noteworthy is that stability decreases with higher output currents. This sensible fact has important connotations. In many applications, the LM2931-N is operated at only a few milliamps of output current or less. In such a circuit, the output capacitor can be further reduced in value. As a rough estimation, a circuit that is required to deliver a maximum of 10mA of output current from the regulator would need an output capacitor of only half the value compared to the same regulator required to deliver the full output current of 100mA. If the example of the tantalum capacitor in the circuit rated at 25°C junction temperature and above were continued to include a maximum of 10mA of output current, then the 22μF output capacitor could be reduced to only 10μF.

In the case of the LM2931CT adjustable regulator, the minimum value of output capacitance is a function of the output voltage. As a general rule, the value decreases with higher output voltages, since internal loop gain is reduced.

At this point, the procedure for bench testing the minimum value of an output capacitor in a special application circuit should be clear. Since worst-case occurs at minimum operating temperatures and maximum operating currents, the entire circuit, including the electrolytic, should be cooled to the minimum temperature. The input voltage to the regulator should be maintained at 0.6V above the output to keep internal power dissipation and die heating to a minimum. Worst-case occurs just after input power is applied and before the die has had a chance to heat up. Once the minimum value of capacitance has been found for the brand and type of electrolytic in question, the value should be doubled for actual use to account for production variations both in the capacitor and the regulator. (All the values in this section and the remainder of the data sheet were determined in this fashion.)

LM2931-N DSBGA Light Sensitivity

When the LM2931-N DSBGA package is exposed to bright sunlight, normal office fluorescent light, and other LED's, it operates within the limits specified in the electrical characteristic table.

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LM2931-N

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SNOSBE5G –MARCH 2000–REVISED APRIL 2013

Definition of Terms

Dropout Voltage: The input-output voltage differential at which the circuit ceases to regulate against further

reduction in input voltage. Measured when the output voltage has dropped 100 mV from the nominal value obtained at 14V input, dropout voltage is dependent upon load current and junction temperature.

Input Voltage: The DC voltage applied to the input terminals with respect to ground. Input-Output Differential: The voltage difference between the unregulated input voltage and the regulated

output voltage for which the regulator will operate.

Line Regulation: The change in output voltage for a change in the input voltage. The measurement is made

under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected.

Load Regulation: The change in output voltage for a change in load current at constant chip temperature. Long Term Stability: Output voltage stability under accelerated life-test conditions after 1000 hours with

maximum rated voltage and junction temperature.

Output Noise Voltage: The rms AC voltage at the output, with constant load and no input ripple, measured

over a specified frequency range.

Quiescent Current: That part of the positive input current that does not contribute to the positive load current.

The regulator ground lead current.

Ripple Rejection: The ratio of the peak-to-peak input ripple voltage to the peak-to-peak output ripple voltage at

a specified frequency.

Temperature Stability of VO: The percentage change in output voltage for a thermal variation from room

temperature to either temperature extreme.

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REVISION HISTORY

Changes from Revision F (April 2013) to Revision G Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 13

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PACKAGE OPTION ADDENDUM

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PACKAGING INFORMATION

Orderable Device Status

LM2931AM-5.0/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 2931A

LM2931AMX-5.0/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 2931A

LM2931AS-5.0/NOPB ACTIVE DDPAK/

LM2931ASX-5.0/NOPB ACTIVE DDPAK/

LM2931AT-5.0/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 85 LM2931

LM2931AZ-5.0/LFT1 LIFEBUY TO-92 LP 3 2000 RoHS & Green Call TI N / A for Pkg Type -40 to 85 LM293

LM2931AZ-5.0/LFT3 LIFEBUY TO-92 LP 3 2000 RoHS & Green Call TI N / A for Pkg Type -40 to 85 LM293

LM2931AZ-5.0/LFT4 LIFEBUY TO-92 LP 3 2000 RoHS & Green Call TI N / A for Pkg Type -40 to 85 LM293

LM2931AZ-5.0/NOPB LIFEBUY TO-92 LP 3 1800 RoHS & Green Call TI N / A for Pkg Type -40 to 85 LM293

LM2931CM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM29

LM2931CMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM29

LM2931CS/NOPB ACTIVE DDPAK/

LM2931CT/NOPB ACTIVE TO-220 KC 5 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 85 LM2931CT

LM2931M-5.0/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 2931

LM2931MX-5.0/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 2931

LM2931S-5.0/NOPB ACTIVE DDPAK/

LM2931T-5.0/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 85 LM2931T

Package Type Package

(1)

TO-263

Drawing

Pins Package

Qty

Eco Plan

(2)

KTT 3 45 RoHS-Exempt

& Green

KTT 3 500 RoHS-Exempt

& Green

KTT 5 45 RoHS-Exempt

& Green

KTT 3 45 RoHS-Exempt

& Green

Lead finish/ Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

SN Level-3-245C-168 HR -40 to 85 LM2931

SN Level-3-245C-168 HR -40 to 85 LM2931CS

SN Level-3-245C-168 HR -40 to 85 LM2931S

M-5.0

AS5.0

AT5.0

1AZ-5

31CM

M-5.0

5.0

30-Apr-2024

Samples

(4/5)

Samples

Addendum-Page 1

Page 16

PACKAGE OPTION ADDENDUM

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Orderable Device Status

LM2931Z-5.0/LFT2 LIFEBUY TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type -40 to 85 LM293

LM2931Z-5.0/NOPB LIFEBUY TO-92 LP 3 1800 RoHS & Green Call TI N / A for Pkg Type -40 to 85 LM293

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

Package Type Package

(1)

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead finish/ Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

1Z-5

30-Apr-2024

(4/5)

(2)

RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Samples

Addendum-Page 2

Page 17

PACKAGE MATERIALS INFORMATION

Reel Width (W1)

REEL DIMENSIONS

A0 B0 K0

Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers

Dimension designed to accommodate the component width

TAPE DIMENSIONS

K0 P1

Cavity

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Pocket Quadrants

Sprocket Holes

Q1Q2 Q2

Q3 Q3Q4 Q4

User Direction of Feed

Reel

Diameter

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TAPE AND REEL INFORMATION

*All dimensions are nominal

LM2931AMX-5.0/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2931ASX-5.0/NOPB DDPAK/

LM2931CMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM2931MX-5.0/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

Device Package

TO-263

Type

Package

Drawing

Pins SPQ Reel

KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

Diameter

(mm)

Reel

Width

W1 (mm)

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

Page 18

PACKAGE MATERIALS INFORMATION

TAPE AND REEL BOX DIMENSIONS

Width (mm)

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*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM2931AMX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM2931ASX-5.0/NOPB DDPAK/TO-263 KTT 3 500 356.0 356.0 45.0

LM2931CMX/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM2931MX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0

Pack Materials-Page 2

Page 19

PACKAGE MATERIALS INFORMATION

www.ti.com 11-May-2024

TUBE

T - Tube

height

W - Tube

width

B - Alignment groove width

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)

LM2931AM-5.0/NOPB D SOIC 8 95 495 8 4064 3.05 LM2931AS-5.0/NOPB KTT TO-263 3 45 502 25 8204.2 9.19 LM2931AT-5.0/NOPB NDE TO-220 3 45 502 33 6985 4.06

LM2931CM/NOPB D SOIC 8 95 495 8 4064 3.05 LM2931CS/NOPB KTT TO-263 5 45 502 25 8204.2 9.19

LM2931CT/NOPB KC TO-220 5 45 502 33 6985 4.06

LM2931M-5.0/NOPB D SOIC 8 95 495 8 4064 3.05

LM2931S-5.0/NOPB KTT TO-263 3 45 502 25 8204.2 9.19 LM2931T-5.0/NOPB NDE TO-220 3 45 502 33 6985 4.06

L - Tube length

Pack Materials-Page 3

Page 20

NDE0003B

MECHANICAL DATA

www.ti.com

Page 21

PACKAGE OUTLINE

2X 2.54

0.97

0.71

0.25 C A B

OPTIONAL

0.76

0.38

SCALE 1.000

B 8.64

14.35 MAX

TO-263 - 4.83 mm max heightKTT0003B

TO-263

10.41

9.91

1.27 MAX

0 -8

2.24

1.24

GAGE PLANE

0.25

0.25 GAGE PLANE

OPTIONAL LEAD FORM

4.64

4.45

8 0

2.24

1.24

EXPOSED

THERMAL PAD

NOTE 3

0.25

0.00

5.08 MIN

NOTE 3

1.32

1.22

5.08 MIN

4215105/B 05/2023

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Features may not exist and shape may vary per different assembly sites.

4. Reference JEDEC registration TO-263, except minimum lead thickness and minimum exposed pad length.

www.ti.com

Page 22

EXAMPLE BOARD LAYOUT

TO-263 - 4.83 mm max heightKTT0003B

TO-263

(6.99)

(1.91)

3X (1.07)

(2.54)

(R0.05) TYP

SOLDER MASK METAL

OPENING

NON SOLDER MASK

0.07 MAX ALL AROUND

DEFINED

3X (2.16)

(14.17)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:5X

EXPOSED METAL

METAL UNDER SOLDER MASK

SYMM

0.07 MIN ALL AROUND

SOLDER MASK

DEFINED

(10.8)

(8.33)

SOLDER MASK OPENING

SOLDER MASK DETAILS

4215105/B 05/2023

NOTES: (continued)

5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004).

6. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented.

www.ti.com

Page 23

EXAMPLE STENCIL DESIGN

TO-263 - 4.83 mm max heightKTT0003B

TO-263

(0.905)(1.28) TYP

(1.24)

3X (1.07)

(2.54)

(R0.05) TYP

3X (2.16)

(1.27) TYP

(4.435)

SYMM

EXPOSED METAL TYP

14.17

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD

60% PRINTED SOLDER COVERAGE BY AREA

SCALE:6X

4215105/B 05/2023

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.

8. Board assembly site may have different recommendations for stencil design.

www.ti.com

Page 24

PACKAGE OUTLINE

.189-.197 [4.81-5.00]

NOTE 3

.228-.244 TYP [5.80-6.19]

B .150-.157

[3.81-3.98]

PIN 1 ID AREA

NOTE 4

SCALE 2.800

6X .050

[1.27]

.150 [3.81]

8X .012-.020 [0.31-0.51]

.010 [0.25] C A B

SOIC - 1.75 mm max heightD0008A

SMALL OUTLINE INTEGRATED CIRCUIT

SEATING PLANE

.004 [0.1] C

4X (0 -15 )

.069 MAX

[1.75]

.005-.010 TYP [0.13-0.25]

4X (0 -15 )

SEE DETAIL A

.010 [0.25]

0 - 8

.016-.050 [0.41-1.27]

(.041) [1.04]

DETAIL A

TYPICAL

.004-.010 [0.11-0.25]

4214825/C 02/2019

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side.

4. This dimension does not include interlead flash.

5. Reference JEDEC registration MS-012, variation AA.

www.ti.com

Page 25

8X (.061 )

8X (.024)

6X (.050 )

[1.27]

[0.6]

[1.55]

SYMM

(.213)

[5.4]

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:8X

EXAMPLE BOARD LAYOUT

SOIC - 1.75 mm max heightD0008A

SMALL OUTLINE INTEGRATED CIRCUIT

SEE DETAILS

SYMM

(R.002 ) TYP

[0.05]

EXPOSED

METAL

NON SOLDER MASK

SOLDER MASK OPENING

.0028 MAX [0.07] ALL AROUND

DEFINED

SOLDER MASK

OPENING

EXPOSED

METAL

.0028 MIN [0.07] ALL AROUND

SOLDER MASK

DEFINED

SOLDER MASK DETAILS

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

METAL UNDER SOLDER MASK

4214825/C 02/2019

www.ti.com

Page 26

8X (.061 )

8X (.024)

[0.6]

6X (.050 )

[1.27]

[1.55]

EXAMPLE STENCIL DESIGN

SOIC - 1.75 mm max heightD0008A

SMALL OUTLINE INTEGRATED CIRCUIT

SYMM

(R.002 ) TYP

(.213)

[5.4]

[0.05]

BASED ON .005 INCH [0.125 MM] THICK STENCIL

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.

9. Board assembly site may have different recommendations for stencil design.

SCALE:8X

4214825/C 02/2019

SOLDER PASTE EXAMPLE

www.ti.com

Page 27

PACKAGE OUTLINE

3.05

2.54

-3.963.71

2X (R1)

OPTIONAL

PIN 1 ID

(OPTIONAL)

(4.25)

10.67

9.65

AAAA

6.86

5.69

9.25

7.67

SCALE 0.850

OPTIONAL

CHAMFER

4.83

4.06

TO-220 - 16.51 mm max heightKC0005A

1.40

1.14

16.51 MAX

TO-220

8.89

6.86

(6.275)

12.88

10.08

NOTE 3

14.73

12.29

1.02

0.64

0.25 C A B 4X 1.7

6.8

NOTES:

1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Shape may vary per different assembly sites.

0.61

0.30

3.05

2.03

4215009/A 01/2017

www.ti.com

Page 28

EXAMPLE BOARD LAYOUT

TO-220 - 16.51 mm max heightKC0005A

TO-220

0.07 MAX

ALL AROUND

(R0.05) TYP

5X ( 1.2)

(2)

(1.45)

(1.7) TYP

PKG

METAL TYP

(6.8)

0.07 MAX

ALL AROUND

SOLDER MASK OPENING, TYP

LAND PATTERN

NON-SOLDER MASK DEFINED

SCALE:12X

4X (1.45)

PKG

4X (2)

FULL R TYP

www.ti.com

4215009/A 01/2017

Page 29

KTT0005B

MECHANICAL DATA

BOTTOM SIDE OF PACKAGE

TS5B (Rev D)

www.ti.com

Page 30

NEB0005F

MECHANICAL DATA

www.ti.com

Page 31

Page 32

PACKAGE OUTLINE

4 MAX

SEATING PLANE

SCALE 1.200

5.34

4.32

12.7 MIN

(2.54)

NOTE 3

SCALE 1.200

TO-92 - 5.34 mm max heightLP0003A

TO-92

5.21

4.44

EJECTOR PIN OPTIONAL

(1.5) TYP

SEATING

PLANE

(0.51) TYP

0.076 MAX

0.43

2.6

0.2

0.55

0.38 2X 1.27 0.13

0.35

FORMED LEAD OPTION

OTHER DIMENSIONS IDENTICAL

TO STRAIGHT LEAD OPTION

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Lead dimensions are not controlled within this area.

4. Reference JEDEC TO-226, variation AA.

5. Shipping method: a. Straight lead option available in bulk pack only. b. Formed lead option available in tape and reel or ammo pack. c. Specific products can be offered in limited combinations of shipping medium and lead options. d. Consult product folder for more information on available options.

STRAIGHT LEAD OPTION

2.67

2.03

3.43 MIN

4.19

3.17

4215214/B 04/2017

www.ti.com

Page 33

0.05 MAX

ALL AROUND

TYP

(1.5)

(R0.05) TYP

SOLDER MASK

OPENING

EXAMPLE BOARD LAYOUT

FULL R

(1.07)

(1.27)

LAND PATTERN EXAMPLE

STRAIGHT LEAD OPTION

NON-SOLDER MASK DEFINED

SCALE:15X

TYP

METAL TYP

2 3

(2.54)

TO-92 - 5.34 mm max heightLP0003A

TO-92

3X ( 0.85) HOLE

2X METAL

2X (1.5)

2X SOLDER MASK OPENING

2X (1.07)

ALL AROUND

TYP

METAL

(R0.05) TYP

SOLDER MASK

OPENING

( 1.4)0.05 MAX

(2.6)

(5.2)

2X ( 1.4)

METAL

3X ( 0.9) HOLE

2X SOLDER MASK OPENING

LAND PATTERN EXAMPLE

FORMED LEAD OPTION

NON-SOLDER MASK DEFINED

SCALE:15X

4215214/B 04/2017

www.ti.com

Page 34

32 23

TAPE SPECIFICATIONS

TO-92 - 5.34 mm max heightLP0003A

TO-92

13.7

11.7

16.5

15.5

11.0

8.5

(2.5) TYP

2.9

2.4

TYP

6.75

5.95

13.0

12.4

FOR FORMED LEAD OPTION PACKAGE

0.5 MIN

9.75

8.50

19.0

17.5

TYP-4.33.7

www.ti.com

4215214/B 04/2017

Page 35

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.

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These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.

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