Datasheet LM25576MH, LM25576 Datasheet (NSC)

March 2007
LM25576 SIMPLE SWITCHER® 42V, 3A Step-Down Switching Regulator
General Description
The LM25576 is an easy to use SIMPLE SWITCHER® buck regulator which allows design engineers to design and opti­mize a robust power supply using a minimum set of compo­nents. Operating with an input voltage range of 6 - 42V, the LM25576 delivers 3A of continuous output current with an in­tegrated 170m N-Channel MOSFET. The regulator utilizes an Emulated Current Mode architecture which provides in­herent line regulation, tight load transient response, and ease of loop compensation without the usual limitation of low-duty cycles associated with current mode regulators. The operat­ing frequency is adjustable from 50kHz to 1MHz to allow optimization of size and efficiency. To reduce EMI, a frequen­cy synchronization pin allows multiple IC’s from the LM(2)557x family to self-synchronize or to synchronize to an external clock. The LM25576 guarantees robustness with cy­cle-by-cycle current limit, short-circuit protection, thermal shut-down, and remote shut-down. The device is available in a power enhanced TSSOP-20 package featuring an exposed die attach pad for thermal dissipation. The LM25576 is sup­ported by the full suite of WEBENCH® On-Line design tools.
Features
Integrated 42V, 170m N-channel MOSFET
Ultra-wide input voltage range from 6V to 42V
Adjustable output voltage as low as 1.225V
1.5% feedback reference accuracy
Operating frequency adjustable between 50kHz and 1MHz with single resistor
Master or slave frequency synchronization
Adjustable soft-start
Emulated current mode control architecture
Wide bandwidth error amplifier
Built-in protection
Package
TSSOP-20EP (Exposed Pad)
Simplified Application Schematic
20208701
WEBENCH® is a registered trademark of National Semiconductor Corporation.
© 2007 National Semiconductor Corporation 202087 www.national.com
LM25576 SIMPLE SWITCHER® 42V, 3A Step-Down Switching Regulator
Connection Diagram
20208702
Top View
20-Lead TSSOP
Ordering Information
Order Number Package Type NSC Package Drawing Supplied As
LM25576MH Exposed Pad TSSOP-20 MXA20A 73 Units in Rail
LM25576MHX Exposed Pad TSSOP-20 MXA20A 2500 Units on Tape and Reel
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LM25576
Pin Descriptions
Pin(s) Name Description Application Information
1 VCC Output of the bias regulator Vcc tracks Vin up to 9V. Beyond 9V, Vcc is regulated to 7
Volts. A 0.1uF to 1uF ceramic decoupling capacitor is required. An external voltage (7.5V – 14V) can be applied to this pin to reduce internal power dissipation.
2 SD Shutdown or UVLO input If the SD pin voltage is below 0.7V the regulator will be in a
low power state. If the SD pin voltage is between 0.7V and
1.225V the regulator will be in standby mode. If the SD pin voltage is above 1.225V the regulator will be operational. An external voltage divider can be used to set a line undervoltage shutdown threshold. If the SD pin is left open circuit, a 5µA pull-up current source configures the regulator fully operational.
3, 4 Vin Input supply voltage Nominal operating range: 6V to 42V
5 SYNC Oscillator synchronization input or output The internal oscillator can be synchronized to an external
clock with an external pull-down device. Multiple LM25576 devices can be synchronized together by connection of their SYNC pins.
6 COMP Output of the internal error amplifier The loop compensation network should be connected
between this pin and the FB pin.
7 FB Feedback signal from the regulated
output
This pin is connected to the inverting input of the internal error amplifier. The regulation threshold is 1.225V.
8 RT Internal oscillator frequency set input The internal oscillator is set with a single resistor, connected
between this pin and the AGND pin.
9 RAMP Ramp control signal An external capacitor connected between this pin and the
AGND pin sets the ramp slope used for current mode control. Recommended capacitor range 50pF to 2000pF.
10 AGND Analog ground Internal reference for the regulator control functions
11 SS Soft-start An external capacitor and an internal 10µA current source
set the time constant for the rise of the error amp reference. The SS pin is held low during standby, Vcc UVLO and thermal shutdown.
12 OUT Output voltage connection Connect directly to the regulated output voltage.
13, 14 PGND Power ground Low side reference for the PRE switch and the IS sense
resistor.
15, 16 IS Current sense Current measurement connection for the re-circulating
diode. An internal sense resistor and a sample/hold circuit sense the diode current near the conclusion of the off-time. This current measurement provides the DC level of the emulated current ramp.
17, 18 SW Switching node The source terminal of the internal buck switch. The SW pin
should be connected to the external Schottky diode and to the buck inductor.
19 PRE Pre-charge assist for the bootstrap
capacitor
This open drain output can be connected to SW pin to aid charging the bootstrap capacitor during very light load conditions or in applications where the output may be pre­charged before the LM25576 is enabled. An internal pre­charge MOSFET is turned on for 265ns each cycle just prior to the on-time interval of the buck switch.
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LM25576
Pin(s) Name Description Application Information
20 BST Boost input for bootstrap capacitor An external capacitor is required between the BST and the
SW pins. A 0.022µF ceramic capacitor is recommended. The capacitor is charged from Vcc via an internal diode during the off-time of the buck switch.
NA EP Exposed Pad Exposed metal pad on the underside of the device. It is
recommended to connect this pad to the PWB ground plane, in order to aid in heat dissipation.
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LM25576
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
VIN to GND 45V
BST to GND 60V PRE to GND 45V SW to GND (Steady State) -1.5V BST to V
CC
45V
SD, VCC to GND 14V
BST to SW 14V OUT to GND Limited to Vin SYNC, SS, FB, RAMP to GND 7V ESD Rating (Note 2) Human Body Model 2kV Storage Temperature Range -65°C to +150°C
Operating Ratings (Note 1)
V
IN
6V to 42V
Operation Junction Temperature −40°C to + 125°C
Electrical Characteristics Specifications with standard typeface are for T
J
= 25°C, and those with boldface type
apply over full Operating Junction Temperature range. VIN = 24V, RT = 32.4k unless otherwise stated. (Note 3)
Symbol Parameter Conditions Min Typ Max Units
STARTUP REGULATOR
VccReg Vcc Regulator Output 6.85 7.15 7.45 V
Vcc LDO Mode turn-off 9 V
Vcc Current Limit Vcc = 0V 25 mA
VCC SUPPLY
Vcc UVLO Threshold (Vcc increasing) 5.03 5.35 5.67 V
Vcc Undervoltage Hysteresis 0.25 V
Bias Current (Iin) FB = 1.3V 3.4 4.5 mA
Shutdown Current (Iin) SD = 0V 48 70 µA
SHUTDOWN THRESHOLDS
Shutdown Threshold (SD Increasing) 0.47 0.7 0.9 V
Shutdown Hysteresis 0.1 V
Standby Threshold (Standby Increasing) 1.17 1.225 1.28 V
Standby Hysteresis 0.1 V
SD Pull-up Current Source 5 µA
SWITCH CHARACTERSICS
Buck Switch Rds(on) 170 340
m
BOOST UVLO 3.8 V
BOOST UVLO Hysteresis 0.56 V
Pre-charge Switch Rds(on) 70
Pre-charge Switch on-time 265 ns
CURRENT LIMIT
Cycle by Cycle Current Limit RAMP = 0V 3.6 4.2 5.1 A
Cycle by Cycle Current Limit Delay RAMP = 2.5V 100 ns
SOFT-START
SS Current Source 7 10 14 µA
OSCILLATOR
Frequency1 180 200 220 kHz
Frequency2
RT = 11k
425 485 545 kHz
SYNC Source Impedance 11
k
SYNC Sink Impedance 110
SYNC Threshold (falling) 1.3 V
SYNC Frequency
RT = 11k
550 kHz
SYNC Pulse Width Minimum 15 ns
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LM25576
Symbol Parameter Conditions Min Typ Max Units
RAMP GENERATOR
Ramp Current 1 Vin = 36V, Vout=10V 136 160 184 µA
Ramp Current 2 Vin = 10V, Vout=10V 18 25 32 µA
PWM COMPARATOR
Forced Off-time 416 500 575 ns
Min On-time 80 ns
COMP to PWM Comparator Offset 0.7 V
ERROR AMPLIFIER
Feedback Voltage Vfb = COMP 1.207 1.225 1.243 V
FB Bias Current 17 nA
DC Gain 70 dB
COMP Sink / Source Current 3 mA
Unity Gain Bandwidth 3 MHz
DIODE SENSE RESISTANCE
D
SENSE
42
m
THERMAL SHUTDOWN
Tsd Thermal Shutdown Threshold 165 °C
Thermal Shutdown Hysteresis 25 °C
THERMAL RESISTANCE
θ
JC
Junction to Case 6 °C/W
θ
JA
Junction to Ambient 40 °C/W
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: The human body model is a 100pF capacitor discharged through a 1.5k resistor into each pin.
Note 3: Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlation using Statistical
Quality Control (SQC) methods. Limits are used to calculate National’s Average Outgoing Quality Level (AOQL).
Typical Performance Characteristics
Oscillator Frequency vs R
T
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Oscillator Frequency vs Temperature
F
OSC
= 200kHz
20208721
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LM25576
Soft Start Current vs Temperature
20208722
VCC vs I
CC
VIN = 12V
20208723
VCC vs V
IN
RL = 7k
20208724
Error Amplifier Gain/Phase
A
VCL
= 101
20208725
Demoboard Efficiency vs I
OUT
and V
IN
20208726
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LM25576
Typical Application Circuit and Block Diagram
20208703
FIGURE 1.
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LM25576
Detailed Operating Description
The LM25576 switching regulator features all of the functions necessary to implement an efficient high voltage buck regu­lator using a minimum of external components. This easy to use regulator integrates a 42V N-Channel buck switch with an output current capability of 3 Amps. The regulator control method is based on current mode control utilizing an emulat­ed current ramp. Peak current mode control provides inherent line voltage feed-forward, cycle-by-cycle current limiting, and ease of loop compensation. The use of an emulated control ramp reduces noise sensitivity of the pulse-width modulation circuit, allowing reliable processing of very small duty cycles necessary in high input voltage applications. The operating frequency is user programmable from 50kHz to 1MHz. An oscillator synchronization pin allows multiple LM25576 regu­lators to self synchronize or be synchronized to an external clock. The output voltage can be set as low as 1.225V. Fault protection features include, current limiting, thermal shutdown and remote shutdown capability. The device is available in the TSSOP-20 package featuring an exposed pad to aid thermal dissipation.
The functional block diagram and typical application of the LM25576 are shown in Figure 1. The LM25576 can be applied in numerous applications to efficiently step-down a high, un­regulated input voltage. The device is well suited for telecom, industrial and automotive power bus voltage ranges.
High Voltage Start-Up Regulator
The LM25576 contains a dual-mode internal high voltage startup regulator that provides the Vcc bias supply for the
PWM controller and boot-strap MOSFET gate driver. The in­put pin (VIN) can be connected directly to the input voltage, as high as 42 Volts. For input voltages below 9V, a low dropout switch connects Vcc directly to Vin. In this supply range, Vcc is approximately equal to Vin. For Vin voltage greater than 9V, the low dropout switch is disabled and the Vcc regulator is enabled to maintain Vcc at approximately 7V. The wide operating range of 6V to 42V is achieved through the use of this dual mode regulator.
The output of the Vcc regulator is current limited to 25mA. Upon power up, the regulator sources current into the capac­itor connected to the VCC pin. When the voltage at the VCC pin exceeds the Vcc UVLO threshold of 5.35V and the SD pin is greater than 1.225V, the output switch is enabled and a soft­start sequence begins. The output switch remains enabled until Vcc falls below 5.0V or the SD pin falls below 1.125V.
An auxiliary supply voltage can be applied to the VCC pin to reduce the IC power dissipation. If the auxiliary voltage is greater than 7.3V, the internal regulator will essentially shut off, reducing the IC power dissipation. The Vcc regulator series pass transistor includes a diode between Vcc and Vin that should not be forward biased in normal operation. There­fore the auxiliary Vcc voltage should never exceed the Vin voltage.
In high voltage applications extra care should be taken to en­sure the VIN pin does not exceed the absolute maximum voltage rating of 45V. During line or load transients, voltage ringing on the Vin line that exceeds the Absolute Maximum Ratings can damage the IC. Both careful PC board layout and the use of quality bypass capacitors located close to the VIN and GND pins are essential.
20208704
FIGURE 2. Vin and Vcc Sequencing
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LM25576
Shutdown / Standby
The LM25576 contains a dual level Shutdown (SD) circuit. When the SD pin voltage is below 0.7V, the regulator is in a low current shutdown mode. When the SD pin voltage is greater than 0.7V but less than 1.225V, the regulator is in standby mode. In standby mode the Vcc regulator is active but the output switch is disabled. When the SD pin voltage exceeds 1.225V, the output switch is enabled and normal op­eration begins. An internal 5µA pull-up current source config­ures the regulator to be fully operational if the SD pin is left open.
An external set-point voltage divider from VIN to GND can be used to set the operational input range of the regulator. The divider must be designed such that the voltage at the SD pin will be greater than 1.225V when Vin is in the desired oper­ating range. The internal 5µA pull-up current source must be included in calculations of the external set-point divider. Hys­teresis of 0.1V is included for both the shutdown and standby thresholds. The SD pin is internally clamped with a 1k re­sistor and an 8V zener clamp. The voltage at the SD pin should never exceed 14V. If the voltage at the SD pin exceeds 8V, the bias current will increase at a rate of 1 mA/V.
The SD pin can also be used to implement various remote enable / disable functions. Pulling the SD pin below the 0.7V threshold totally disables the controller. If the SD pin voltage is above 1.225V the regulator will be operational.
Oscillator and Sync Capability
The LM25576 oscillator frequency is set by a single external resistor connected between the RT pin and the AGND pin. The RT resistor should be located very close to the device and connected directly to the pins of the IC (RT and AGND).To set a desired oscillator frequency (F), the necessary value for the RT resistor can be calculated from the following equation:
The SYNC pin can be used to synchronize the internal oscil­lator to an external clock. The external clock must be of higher frequency than the free-running frequency set by the RT resistor. A clock circuit with an open drain output is the recommended interface from the external clock to the SYNC pin. The clock pulse duration should be greater than 15ns.
20208705
FIGURE 3. Sync from External Clock
20208706
FIGURE 4. Sync from Multiple Devices
Multiple LM25576 devices can be synchronized together sim­ply by connecting the SYNC pins together. In this configura­tion all of the devices will be synchronized to the highest frequency device. The diagram in Figure 5 illustrates the SYNC input/output features of the LM25576. The internal os­cillator circuit drives the SYNC pin with a strong pull-down / weak pull-up inverter. When the SYNC pin is pulled low either by the internal oscillator or an external clock, the ramp cycle of the oscillator is terminated and a new oscillator cycle be­gins. Thus, if the SYNC pins of several LM25576 IC’s are connected together, the IC with the highest internal clock fre­quency will pull the connected SYNC pins low first and termi­nate the oscillator ramp cycles of the other IC’s. The LM25576 with the highest programmed clock frequency will serve as the master and control the switching frequency of the all the devices with lower oscillator frequency.
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LM25576
20208707
FIGURE 5. Simplified Oscillator Block Diagram and SYNC I/O Circuit
Error Amplifier and PWM Comparator
The internal high gain error amplifier generates an error signal proportional to the difference between the regulated output voltage and an internal precision reference (1.225V). The output of the error amplifier is connected to the COMP pin allowing the user to provide loop compensation components, generally a type II network, as illustrated in Figure 1. This network creates a pole at DC, a zero and a noise reducing high frequency pole. The PWM comparator compares the emulated current sense signal from the RAMP generator to the error amplifier output voltage at the COMP pin.
RAMP Generator
The ramp signal used in the pulse width modulator for current mode control is typically derived directly from the buck switch current. This switch current corresponds to the positive slope portion of the output inductor current. Using this signal for the PWM ramp simplifies the control loop transfer function to a single pole response and provides inherent input voltage feed-forward compensation. The disadvantage of using the buck switch current signal for PWM control is the large leading edge spike due to circuit parasitics that must be filtered or blanked. Also, the current measurement may introduce sig­nificant propagation delays. The filtering, blanking time and propagation delay limit the minimum achievable pulsewidth. In applications where the input voltage may be relatively large in comparison to the output voltage, controlling small pulsewidths and duty cycles is necessary for regulation. The LM25576 utilizes a unique ramp generator, which does not actually measure the buck switch current but rather recon­structs the signal. Reconstructing or emulating the inductor current provides a ramp signal to the PWM comparator that is free of leading edge spikes and measurement or filtering delays. The current reconstruction is comprised of two ele­ments; a sample & hold DC level and an emulated current ramp.
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LM25576
20208708
FIGURE 6. Composition of Current Sense Signal
The sample & hold DC level illustrated in Figure 6 is derived from a measurement of the re-circulating Schottky diode an­ode current. The re-circulating diode anode should be con­nected to the IS pin. The diode current flows through an internal current sense resistor between the IS and PGND pins. The voltage level across the sense resistor is sampled and held just prior to the onset of the next conduction interval of the buck switch. The diode current sensing and sample & hold provide the DC level of the reconstructed current signal. The positive slope inductor current ramp is emulated by an external capacitor connected from the RAMP pin to AGND and an internal voltage controlled current source. The ramp current source that emulates the inductor current is a function of the Vin and Vout voltages per the following equation:
I
RAMP
= (5µ x (Vin – Vout)) + 25µA
Proper selection of the RAMP capacitor depends upon the selected value of the output inductor. The value of C
RAMP
can
be selected from: C
RAMP
= L x 10-5, where L is the value of the output inductor in Henrys. With this value, the scale factor of the emulated current ramp will be approximately equal to the scale factor of the DC level sample and hold ( 0.5 V / A). The C
RAMP
capacitor should be located very close to the de­vice and connected directly to the pins of the IC (RAMP and AGND).
For duty cycles greater than 50%, peak current mode control circuits are subject to sub-harmonic oscillation. Sub-harmonic
oscillation is normally characterized by observing alternating wide and narrow pulses at the switch node. Adding a fixed slope voltage ramp (slope compensation) to the current sense signal prevents this oscillation. The 25µA of offset current provided from the emulated current source adds some fixed slope to the ramp signal. In some high output voltage, high duty cycle applications, additional slope may be required. In these applications, a pull-up resistor may be added between the VCC and RAMP pins to increase the ramp slope compen­sation.
For V
OUT
> 7.5V:
Calculate optimal slope current, IOS = V
OUT
x 5µA/V.
For example, at V
OUT
= 10V, IOS = 50µA. Install a resistor from the RAMP pin to VCC: R
RAMP
= VCC / (IOS - 25µA)
20208745
FIGURE 7. R
RAMP
to VCC for V
OUT
> 7.5V
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LM25576
Maximum Duty Cycle / Input Drop­out Voltage
There is a forced off-time of 500ns implemented each cycle to guarantee sufficient time for the diode current to be sam­pled. This forced off-time limits the maximum duty cycle of the buck switch. The maximum duty cycle will vary with the op­erating frequency.
D
MAX
= 1 - Fs x 500ns
Where Fs is the oscillator frequency. Limiting the maximum duty cycle will raise the input dropout voltage. The input dropout voltage is the lowest input voltage required to main­tain regulation of the output voltage. An approximation of the input dropout voltage is:
Where VD is the voltage drop across the re-circulatory diode. Operating at high switching frequency raises the minimum in­put voltage necessary to maintain regulation.
Current Limit
The LM25576 contains a unique current monitoring scheme for control and over-current protection. When set correctly, the emulated current sense signal provides a signal which is proportional to the buck switch current with a scale factor of
0.5 V / A. The emulated ramp signal is applied to the current limit comparator. If the emulated ramp signal exceeds 2.1V (4.2A) the present current cycle is terminated (cycle-by-cycle current limiting). In applications with small output inductance and high input voltage the switch current may overshoot due to the propagation delay of the current limit comparator. If an overshoot should occur, the diode current sampling circuit will detect the excess inductor current during the off-time of the buck switch. If the sample & hold DC level exceeds the 2.1V current limit threshold, the buck switch will be disabled and skip pulses until the diode current sampling circuit detects the inductor current has decayed below the current limit thresh­old. This approach prevents current runaway conditions due to propagation delays or inductor saturation since the inductor current is forced to decay following any current overshoot.
Soft-Start
The soft-start feature allows the regulator to gradually reach the initial steady state operating point, thus reducing start-up
stresses and surges. The internal soft-start current source, set to 10µA, gradually increases the voltage of an external soft-start capacitor connected to the SS pin. The soft-start capacitor voltage is connected to the reference input of the error amplifier. Various sequencing and tracking schemes can be implemented using external circuits that limit or clamp the voltage level of the SS pin.
In the event a fault is detected (over-temperature, Vcc UVLO, SD) the soft-start capacitor will be discharged. When the fault condition is no longer present a new soft-start sequence will commence.
Boost Pin
The LM25576 integrates an N-Channel buck switch and as­sociated floating high voltage level shift / gate driver. This gate driver circuit works in conjunction with an internal diode and an external bootstrap capacitor. A 0.022µF ceramic capacitor, connected with short traces between the BST pin and SW pin, is recommended. During the off-time of the buck switch, the SW pin voltage is approximately -0.5V and the bootstrap ca­pacitor is charged from Vcc through the internal bootstrap diode. When operating with a high PWM duty cycle, the buck switch will be forced off each cycle for 500ns to ensure that the bootstrap capacitor is recharged.
Under very light load conditions or when the output voltage is pre-charged, the SW voltage will not remain low during the off-time of the buck switch. If the inductor current falls to zero and the SW pin rises, the bootstrap capacitor will not receive sufficient voltage to operate the buck switch gate driver. For these applications, the PRE pin can be connected to the SW pin to pre-charge the bootstrap capacitor. The internal pre­charge MOSFET and diode connected between the PRE pin and PGND turns on each cycle for 265ns just prior to the onset of a new switching cycle. If the SW pin is at a normal negative voltage level (continuous conduction mode), then no current will flow through the pre-charge MOSFET/diode.
Thermal Protection
Internal Thermal Shutdown circuitry is provided to protect the integrated circuit in the event the maximum junction temper­ature is exceeded. When activated, typically at 165°C, the controller is forced into a low power reset state, disabling the output driver and the bias regulator. This feature is provided to prevent catastrophic failures from accidental device over­heating.
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LM25576
Application Information
EXTERNAL COMPONENTS
The procedure for calculating the external components is il­lustrated with the following design example. The Bill of Mate­rials for this design is listed in Table 1. The circuit shown in Figure 1 is configured for the following specifications:
V
OUT
= 5V
VIN = 7V to 42V
Fs = 300kHz
Minimum load current (for CCM) = 250mA
Maximum load current = 3A
R3 (RT)
RT sets the oscillator switching frequency. Generally, higher frequency applications are smaller but have higher losses. Operation at 300kHz was selected for this example as a rea­sonable compromise for both small size and high efficiency. The value of RT for 300kHz switching frequency can be cal­culated as follows:
The nearest standard value of 21k was chosen for RT.
L1
The inductor value is determined based on the operating fre­quency, load current, ripple current, and the minimum and maximum input voltage (V
IN(min)
, V
IN(max)
).
20208710
FIGURE 8. Inductor Current Waveform
To keep the circuit in continuous conduction mode (CCM), the maximum ripple current I
RIPPLE
should be less than twice the minimum load current, or 0.5Ap-p. Using this value of ripple current, the value of inductor (L1) is calculated using the fol­lowing:
This procedure provides a guide to select the value of L1. The nearest standard value (33µH) will be used. L1 must be rated for the peak current (I
PK+
) to prevent saturation. During normal loading conditions, the peak current occurs at maximum load current plus maximum ripple. During an overload condition the peak current is limited to 4.2A nominal (5.1A maximum).
The selected inductor (see Table 1) has a conservative 6.2 Amp saturation current rating. For this manufacturer, the sat­uration rating is defined as the current necessary for the inductance to reduce by 30%, at 20°C.
C3 (C
RAMP
)
With the inductor value selected, the value of C3 (C
RAMP
)
necessary for the emulation ramp circuit is:
C
RAMP
= L x 10
-5
Where L is in Henrys With L1 selected for 33µH the recommended value for C3 is
330pF.
C9, C10
The output capacitors, C9 and C10, smooth the inductor rip­ple current and provide a source of charge for transient load­ing conditions. For this design a 22µF ceramic capacitor and a 150µF SP organic capacitor were selected. The ceramic capacitor provides ultra low ESR to reduce the output ripple voltage and noise spikes, while the SP capacitor provides a large bulk capacitance in a small volume for transient loading conditions. An approximation for the output ripple voltage is:
D1
A Schottky type re-circulating diode is required for all LM25576 applications. Ultra-fast diodes are not recommend­ed and may result in damage to the IC due to reverse recovery current transients. The near ideal reverse recovery charac­teristics and low forward voltage drop are particularly impor­tant diode characteristics for high input voltage and low output voltage applications common to the LM25576. The reverse recovery characteristic determines how long the current surge lasts each cycle when the buck switch is turned on. The reverse recovery characteristics of Schottky diodes minimize the peak instantaneous power in the buck switch occurring during turn-on each cycle. The resulting switching losses of the buck switch are significantly reduced when using a Schot­tky diode. The reverse breakdown rating should be selected for the maximum VIN, plus some safety margin.
The forward voltage drop has a significant impact on the con­version efficiency, especially for applications with a low output voltage. “Rated” current for diodes vary widely from various manufacturers. The worst case is to assume a short circuit load condition. In this case the diode will carry the output cur­rent almost continuously. For the LM25576 this current can be as high as 4.2A. Assuming a worst case 1V drop across the diode, the maximum diode power dissipation can be as high as 4.2W. For the reference design a 60V Schottky in a DPAK package was selected.
C1, C2
The regulator supply voltage has a large source impedance at the switching frequency. Good quality input capacitors are necessary to limit the ripple voltage at the VIN pin while sup­plying most of the switch current during the on-time. When the buck switch turns on, the current into the VIN pin steps to the lower peak of the inductor current waveform, ramps up to the peak value, then drops to zero at turn-off. The average current into VIN during the on-time is the load current. The input ca-
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LM25576
pacitance should be selected for RMS current rating and minimum ripple voltage. A good approximation for the re­quired ripple current rating necessary is I
RMS
> I
OUT
/ 2.
Quality ceramic capacitors with a low ESR should be selected for the input filter. To allow for capacitor tolerances and volt­age effects, two 2.2µF, 100V ceramic capacitors will be used. If step input voltage transients are expected near the maxi­mum rating of the LM25576, a careful evaluation of ringing and possible spikes at the device VIN pin should be complet­ed. An additional damping network or input voltage clamp may be required in these cases.
C8
The capacitor at the VCC pin provides noise filtering and sta­bility for the VCC regulator. The recommended value of C8 should be no smaller than 0.1µF, and should be a good qual­ity, low ESR, ceramic capacitor. A value of 0.47µF was se­lected for this design.
C7
The bootstrap capacitor between the BST and the SW pins supplies the gate current to charge the buck switch gate at turn-on. The recommended value of C7 is 0.022µF, and should be a good quality, low ESR, ceramic capacitor.
C4
The capacitor at the SS pin determines the soft-start time, i.e. the time for the reference voltage and the output voltage, to reach the final regulated value. The time is determined from:
For this application, a C4 value of 0.01µF was chosen which corresponds to a soft-start time of 1ms.
R5, R6
R5 and R6 set the output voltage level, the ratio of these re­sistors is calculated from:
R5/R6 = (V
OUT
/ 1.225V) - 1
For a 5V output, the R5/R6 ratio calculates to 3.082. The re­sistors should be chosen from standard value resistors, a good starting point is selection in the range of 1.0k - 10k. Values of 5.11k for R5, and 1.65k for R6 were selected.
R1, R2, C12
A voltage divider can be connected to the SD pin to set a minimum operating voltage Vin
(min)
for the regulator. If this
feature is required, the easiest approach to select the divider resistor values is to select a value for R1 (between 10kΩ and 100k recommended) then calculate R2 from:
Capacitor C12 provides filtering for the divider. The voltage at the SD pin should never exceed 8V, when using an external set-point divider it may be necessary to clamp the SD pin at high input voltage conditions. The reference design utilizes the full range of the LM25576 (6V to 42V); therefore these components can be omitted. With the SD pin open circuit the LM25576 responds once the Vcc UVLO threshold is satisfied.
R7, C11
A snubber network across the power diode reduces ringing and spikes at the switching node. Excessive ringing and spikes can cause erratic operation and couple spikes and noise to the output. Voltage spikes beyond the rating of the LM25576 or the re-circulating diode can damage these de­vices. Selecting the values for the snubber is best accom­plished through empirical methods. First, make sure the lead lengths for the snubber connections are very short. For the current levels typical for the LM25576 a resistor value be­tween 5 and 20 Ohms is adequate. Increasing the value of the snubber capacitor results in more damping but higher losses. Select a minimum value of C11 that provides ade­quate damping of the SW pin waveform at high load.
R4, C5, C6
These components configure the error amplifier gain charac­teristics to accomplish a stable overall loop gain. One advan­tage of current mode control is the ability to close the loop with only two feedback components, R4 and C5. The overall loop gain is the product of the modulator gain and the error ampli­fier gain. The DC modulator gain of the LM25576 is as follows:
DC Gain
(MOD)
= G
m(MOD)
x R
LOAD
= 2 x R
LOAD
The dominant low frequency pole of the modulator is deter­mined by the load resistance (R
LOAD
,) and output capacitance
(C
OUT
). The corner frequency of this pole is:
f
p(MOD)
= 1 / (2π R
LOAD COUT
)
For R
LOAD
= 5Ω and C
OUT
= 177µF then f
p(MOD)
= 180Hz
DC Gain
(MOD)
= 2 x 5 = 10 = 20dB
For the design example of Figure 1 the following modulator gain vs. frequency characteristic was measured as shown in Figure 9.
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FIGURE 9. Gain and Phase of Modulator
R
LOAD
= 5 Ohms and C
OUT
= 177µF
Components R4 and C5 configure the error amplifier as a type II configuration which has a pole at DC and a zero at fZ = 1 /
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LM25576
(2πR4C5). The error amplifier zero cancels the modulator pole leaving a single pole response at the crossover frequen­cy of the loop gain. A single pole response at the crossover frequency yields a very stable loop with 90 degrees of phase margin.
For the design example, a target loop bandwidth (crossover frequency) of 20kHz was selected. The compensation net­work zero (fZ) should be selected at least an order of magni­tude less than the target crossover frequency. This constrains the product of R4 and C5 for a desired compensation network zero 1 / (2π R4 C5) to be less than 2kHz. Increasing R4, while proportionally decreasing C5, increases the error amp gain. Conversely, decreasing R4 while proportionally increasing C5, decreases the error amp gain. For the design example C5 was selected for 0.01µF and R4 was selected for
49.9k. These values configure the compensation network zero at 320Hz. The error amp gain at frequencies greater than fZ is: R4 / R5, which is approximately 10 (20dB).
20208716
FIGURE 10. Error Amplifier Gain and Phase
The overall loop can be predicted as the sum (in dB) of the modulator gain and the error amp gain.
20208717
FIGURE 11. Overall Loop Gain and Phase
If a network analyzer is available, the modulator gain can be measured and the error amplifier gain can be configured for the desired loop transfer function. If a network analyzer is not available, the error amplifier compensation components can be designed with the guidelines given. Step load transient tests can be performed to verify acceptable performance. The step load goal is minimum overshoot with a damped re­sponse. C6 can be added to the compensation network to decrease noise susceptibility of the error amplifier. The value of C6 must be sufficiently small since the addition of this ca­pacitor adds a pole in the error amplifier transfer function. This pole must be well beyond the loop crossover frequency. A good approximation of the location of the pole added by C6 is: fp2 = fz x C5 / C6.
BIAS POWER DISSIPATION REDUCTION
Buck regulators operating with high input voltage can dissi­pate an appreciable amount of power for the bias of the IC. The VCC regulator must step-down the input voltage VIN to a nominal VCC level of 7V. The large voltage drop across the VCC regulator translates into a large power dissipation within the Vcc regulator. There are several techniques that can sig­nificantly reduce this bias regulator power dissipation. Figure 12 and Figure 13 depict two methods to bias the IC from the output voltage. In each case the internal Vcc regulator is used to initially bias the VCC pin. After the output voltage is estab­lished, the VCC pin potential is raised above the nominal 7V regulation level, which effectively disables the internal V
CC
regulator. The voltage applied to the VCC pin should never exceed 14V. The VCC voltage should never be larger than the VIN voltage.
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LM25576
20208718
FIGURE 12. VCC Bias from VOUT for 8V < VOUT < 14V
20208719
FIGURE 13. VCC Bias with Additional Winding on the Output Inductor
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LM25576
PCB LAYOUT AND THERMAL CONSIDERATIONS
The circuit in Figure 13 serves as both a block diagram of the LM25576 and a typical application board schematic for the LM25576. In a buck regulator there are two loops where cur­rents are switched very fast. The first loop starts from the input capacitors, to the regulator VIN pin, to the regulator SW pin, to the inductor then out to the load. The second loop starts from the output capacitor ground, to the regulator PGND pins, to the regulator IS pins, to the diode anode, to the inductor and then out to the load. Minimizing the loop area of these two loops reduces the stray inductance and minimizes noise and possible erratic operation. A ground plane in the PC board is recommended as a means to connect the input filter capacitors to the output filter capacitors and the PGND pins of the regulator. Connect all of the low power ground connec­tions (CSS, RT, C
RAMP
) directly to the regulator AGND pin. Connect the AGND and PGND pins together through the top­side copper area covering the entire underside of the device. Place several vias in this underside copper area to the ground plane.
The two highest power dissipating components are the re­circulating diode and the LM25576 regulator IC. The easiest method to determine the power dissipated within the LM25576 is to measure the total conversion losses (Pin – Pout) then subtract the power losses in the Schottky diode, output inductor and snubber resistor. An approximation for the Schottky diode loss is P = (1-D) x Iout x Vfwd. An approx­imation for the output inductor power is P = I
OUT
2
x R x 1.1, where R is the DC resistance of the inductor and the 1.1 factor is an approximation for the AC losses. If a snubber is used, an approximation for the damping resistor power dissipation is P = Vin2 x Fsw x Csnub, where Fsw is the switching fre­quency and Csnub is the snubber capacitor. The regulator has an exposed thermal pad to aid power dissipation. Adding
several vias under the device to the ground plane will greatly reduce the regulator junction temperature. Selecting a diode with an exposed pad will aid the power dissipation of the diode.
The most significant variables that affect the power dissipated by the LM25576 are the output current, input voltage and op­erating frequency. The power dissipated while operating near the maximum output current and maximum input volatge can be appreciable. The operating frequency of the LM25576 evaluation board has been designed for 300kHz. When op­erating at 3A output current with a 42V input the power dissipation of the LM25576 regulator is approximately 1.9W.
The junction-to-ambient thermal resistance of the LM25576 will vary with the application. The most significant variables are the area of copper in the PC board, the number of vias under the IC exposed pad and the amount of forced air cooling provided. Referring to the evaluation board artwork, the area under the LM25576 (component side) is covered with copper and there are 5 connection vias to the solder side ground plane. Additional vias under the IC will have diminishing value as more vias are added. The integrity of the solder connection from the IC exposed pad to the PC board is critical. Excessive voids will greatly diminish the thermal dissipation capacity. The junction-to-ambient thermal resistance of the LM25576 mounted in the evaluation board varies from 45°C/W with no airflow to 25°C/W with 900 LFM (Linear Feet per Minute). With a 25°C ambient temperature and no airflow, the predicted junction temperature for the LM25576 will be 25 + (45 x 1.9) = 110°C. If the evaluation board is operated at 3A output cur­rent and 42V input voltage for a prolonged period of time the thermal shutdown protection within the IC may activate. The IC will turn off allowing the junction to cool, followed by restart with the soft-start capacitor reset to zero.
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LM25576
TABLE 1. 5V, 3A Demo Board Bill of Materials
ITEM PART NUMBER DESCRIPTION VALUE
C 1 C4532X7R2A225M CAPACITOR, CER, TDK 2.2µ, 100V
C 2 C4532X7R2A225M CAPACITOR, CER, TDK 2.2µ, 100V
C 3 C0805C331G1GAC CAPACITOR, CER, KEMET 330p, 100V
C 4 C2012X7R2A103K CAPACITOR, CER, TDK 0.01µ, 100V
C 5 C2012X7R2A103K CAPACITOR, CER, TDK 0.01µ, 100V
C 6 OPEN NOT USED
C 7 C2012X7R2A223K CAPACITOR, CER, TDK 0.022µ, 100V
C 8 C2012X7R1C474M CAPACITOR, CER, TDK 0.47µ, 16V
C 9 C3225X7R1C226M CAPACITOR, CER, TDK 22µ, 16V
C 10 EEFHE0J151R CAPACITOR, SP, PANASONIC 150µ, 6.3V
C 11 C0805C331G1GAC CAPACITOR, CER, KEMET 330p, 100V
C 12 OPEN NOT USED
D 1 CSHD6-60C DIODE, 60V, CENTRAL
6CWQ10FN DIODE, 100V, IR (D1-ALT)
L 1 DR127-330 INDUCTOR, COOPER 33µH
R 1 OPEN NOT USED
R 2 OPEN NOT USED
R 3 CRCW08052102F RESISTOR
21k
R 4 CRCW08054992F RESISTOR
49.9k
R 5 CRCW08055111F RESISTOR
5.11k
R 6 CRCW08051651F RESISTOR
1.65k
R 7 CRCW2512100J RESISTOR 10, 1W
U 1 LM25576 REGULATOR, NATIONAL SEMICONDUCTOR
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LM25576
PCB Layout
20208729
Component Side
20208730
Solder Side
20208731
Silkscreen
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LM25576
Typical Schematic for High Frequency (1MHz) Application
20208740
Schematic 3.3V, 3A, 1MHz
Typical Schematic for Buck/Boost (Inverting) Application
20208742
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LM25576
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead TSSOP Package
NS Package Number MXA20A
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LM25576
Notes
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LM25576
Notes
LM25576 SIMPLE SWITCHER® 42V, 3A Step-Down Switching Regulator
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