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LM2435
Monolithic Triple 5.5 ns CRT Driver
General Description
The LM2435 is an integrated high voltage CRT driver circuit
designed for use in color monitor applications. The IC contains three high input impedance, wide band amplifiers
which directly drivethe RGB cathodes of a CRT. Each channel has its gain internally set to −14 and can drive CRT capacitive loads as well as resistive loads present in other applications, limited only by the package’s power dissipation.
The IC is packaged in an industry standard 9-lead TO-220
molded plastic power package. See Thermal Considerations
section.
Features
n Dissipates approximately 45%less power than the
LM2405
Schematic and Connection Diagrams
n Well matched with LM1279 and LM1282/83 video
preamps
n 0V to 5V input range
n Stable with 0 pF–20 pF capacitive loads and inductive
peaking networks
n Convenient TO-220 staggered lead package style
n Standard LM243X Family Pinout which is designed for
easy PCB layout
Applications
n 1280 x 1024 Displays up to 75 Hz Refresh
n Pixel clock frequencies up to 135 MHz
n Monitors using video blanking
LM2435 Monolithic Triple 5.5 ns CRT Driver
August 1999
Note: TabisatGND
Top View
Order Number LM2435T
DS101044-1
FIGURE 1. Simplified Schematic Diagram
(One Channel)
© 1999 National Semiconductor Corporation DS101044 www.national.com
DS101044-2
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Absolute Maximum Ratings (Notes 1, 3)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage, (V
Bias Voltage, (V
Input Voltage, (V
Storage Temperature Range, (T
) +90V
CC
) +16V
BB
) 0Vto6V
IN
) −65˚C to +150˚C
STG
Lead Temperature
<
(Soldering,
10 sec.) 300˚C
ESD Tolerance, Human Body Model 2 kV
Machine Model 250V
Operating Ranges (Note 2)
V
CC
V
BB
V
IN
V
OUT
+60V to +85V
+8V to +15V
+0V to +5V
+15V to +75V
Case Temperature −20˚C to +100˚C
Do not operate the part without a heat sink.
Electrical Characteristics
(See
Figure 2
Unless otherwise noted: V
DC Tests: VIN= +2.8 V
AC Tests: Output = 40 VPP(25V to 65V) at 1 MHz.
for Test Circuit)
Symbol Parameter Condition
I
I
V
A
∆A
CC
BB
OUT
V
Supply Current Per Channel, No Input Signal, No
Bias Current All Three Channels 14 mA
DC Output Voltage No AC Input Signal, VIN= 1.35V 62 65 68 V
DC Voltage Gain No AC Input Signal −12 −14 −16
Gain Matching (Note 4), No AC Input Signal 1.0 dB
V
LE Linearity Error (Notes 4, 5), No AC Input Signal 8
t
R
t
F
Rise Time (Note 6), 10%to 90
Fall Time (Note 6), 90%to 10
OS Overshoot (Note 6) 5
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.
Note 2: Operating ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and
test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may
change when the device is not operated under the listed test conditions.
Note 3: All voltages are measured with respect to GND, unless otherwise specified.
Note 4: Calculated value from Voltage Gain test on each channel.
Note 5: Linearity Error is the variation in dc gain from V
Note 6: Input from signal generator: t
= +80V, VBB= +12V, CL= 8 pF, TC= 50˚C
CC
DC
Output Load
= 1.0V to VIN= 4.5V.
1 ns.
IN
r,tf
<
LM2435
Min Typ Max
Units
13 mA
%
%
5.5 ns
6.0 ns
DC
%
%
AC Test Circuit
Note: 8 pF load includes parasitic capacitance.
FIGURE 2. Test Circuit (One Channel)
Figure 2
shows a typical test circuit for evaluation of the LM2435. This circuit is designed to allow testing of the LM2435 in a 50Ω
environment without the use of an expensive FET probe. The two 2490Ω resistors at the output form a 200:1 voltage divider when
connected to a 50Ω load. The compensation cap is used to flatten the frequency response of the 200:1 divider.
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DS101044-3
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Typical Performance Characteristics (V
(25V-65V), Test Circuit -
Figure 2
unless otherwise specified)
=
+80 V
CC
DC,VBB
=
+12 V
DC,CL
=
8pF,V
OUT
=
40V
PP
DS101044-4
FIGURE 3. V
OUT
vs V
IN
DS101044-5
FIGURE 4. Speed vs Temperature
DS101044-7
FIGURE 6. Power Dissipation vs Frequency
DS101044-8
FIGURE 7. Speed vs Offset
DS101044-6
FIGURE 5. LM2435 Pulse Response
DS101044-9
FIGURE 8. Speed vs Load Capacitance
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Theory of Operation
The LM2435 is a high voltage monolithic three channel CRT
driver suitable for high resolution display applications. The
LM2435 operates with 80V and 12V power supplies. The
part is housed in the industry standard 9-lead TO-220
molded plastic power package.
The circuit diagram of the LM2435 is shown in
PNP emitter follower, Q5, provides input buffering. Q1 and
Q2 form a fixed gain cascode amplifier with resistors R1 and
R2 setting the gain at −14. Emitter followers Q3 and Q4 isolate the high output impedance of the cascode stage from
the capacitance of the CRT cathode which decreases the
sensitivity of the device to load capacitance. Q6 provides biasing to the output emitter follower stage to reduce crossover distortion at low signal levels.
Figure 2
LM2435. This circuit is designed to allow testing of the
LM2435 in a 50Ω environment without the use of an expensive FET probe. In this test circuit, two low inductance resistors in series totaling 4.98 kΩ form a 200:1 wideband, low
capacitance probe when connected to a 50Ω coaxial cable
anda50Ωload (such as a 50Ω oscilloscope input). The in-
put signal from the generator is ac coupled to the base of
Q5.
shows a typical test circuit for evaluation of the
Figure 1
. The
Application Hints
INTRODUCTION
National Semiconductor (NSC) is committed to provide application information that assists our customers in obtaining
the best performance possible from our products. The following information is provided in order to support this commitment. The reader should be aware that the optimization of
performance was done using a specific printed circuit board
designed at NSC. Variations in performance can be realized
due to physical changes in the printed circuit board and the
application. Therefore, the designer should know that component value changes may be required in order to optimize
performance in a given application. The values shown in this
document can be used as a starting point for evaluation purposes. When working with high bandwidth circuits, good layout practices are also critical to achieving maximum performance.
IMPORTANT INFORMATION
The LM2435 performance is targeted for the SXGA (1280 x
1024, 75 Hz refresh) resolution market. The application circuits shown in this document to optimize performance and to
protect against damage from CRT arc-over are designed
specifically for the LM2435. If another member of the
LM243X family is used, please refer to its datasheet. Since
the LM2435 is a high speed amplifier, the connection of the
device to PCB ground is very important. It is critical that the
device tab is connected to PCB Ground through the heatsink, in order to eliminate excessive overshoot and ringing.
The LM1279/243X (Rev.B) demo board provides a good example of how to do this.
POWER SUPPLY BYPASS
Since the LM2435 is a wide bandwidth amplifier, proper
power supply bypassing is critical for optimum performance.
Improper power supply bypassing can result in large overshoot, ringing or oscillation. A 0.1 µF capacitor should be
connected from the supply pin, V
the supply and ground pins as is practical. Additionally, a
10 µF to 100 µF electrolytic capacitor should be connected
from the supply pin to ground. The electrolytic capacitor
should also be placed reasonably close to the LM2435’s
supply and ground pins. A 0.1 µF capacitor should be connected from the bias pin, V
tical to the part.
ARC PROTECTION
During normal CRT operation, internal arcing may occasionally occur. Spark gaps, in the range of 200V, connected from
the CRT cathodes to CRTground will limit the maximum voltage, but to a value that is much higher than allowable on the
LM2435. This fast, high voltage, high energy pulse can damage the LM2435 output stage. The application circuit shown
in
Figure 9
put of the LM2435 to a safe level. The clamp diodes, D1 and
D2, should have a fast transient response, high peak current
rating, low series impedance and low shunt capacitance.
FDH400 or equivalent diodes are recommended. Do not use
1N4148 diodes for the clamp diodes. D1 and D2 should have
short, low impedance connections to V
spectively. The cathode of D1 should be located very close
to a separately decoupled bypass capacitor (C3 in
The ground connection of D2 and the decoupling capacitor
should be very close to the LM2435 ground. This will significantly reduce the high frequency voltage transients that the
LM2435 would be subjected to during an arcover condition.
Resistor R2 limits the arcover current that is seen by the diodes while R1 limits the current into the LM2435 as well as
the voltage stress at the outputs of the device. R2 should be
a 1/2W solid carbon type resistor.R1 can be a 1/4W metal or
carbon film type resistor. Having large value resistors for R1
and R2 would be desirable, but this has the effect of increasing rise and fall times. Inductor L1 is critical to reduce the initial high frequency voltage levels that the LM2435 would be
subjected to. The inductor will not only help protect the device but it will also help minimize rise and fall times as well as
minimize EMI. For proper arc protection, it is important to not
omit any of the arc protection components shown in
9
.
is designed to help clamp the voltage at the out-
, to ground, as close to
CC
, to ground, as close as is prac-
BB
and ground re-
CC
Figure 9
Figure
).
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Application Hints (Continued)
FIGURE 9. One Channel of the LM2435 with the Recommended Application Circuit
OPTIMIZING TRANSIENT RESPONSE
Figure 9
Referring to
and L1) that can be adjusted to optimize the transient response of the application circuit. Increasing the values of R1
and R2 will slow the circuit down while decreasing overshoot. Increasing the value of L1 will speed up the circuit as
well as increase overshoot. It is very important to use inductors with very high self-resonant frequencies, preferably
above 300 MHz. Ferrite core inductors from J.W. Miller Magnetics (part
mance of the device in the NSC application board. The values shown in
for the evaluation of the LM2435. Using a variable resistor
for R1 will simplify finding the value needed for optimum performance in a given application. Once the optimum values
are determined the variable resistor can be replaced with
fixed values.
EFFECT OF LOAD CAPACITANCE
Figure 8
shows the effect of increased load capacitance on
the speed of the device. This demonstrates the importance
of knowing the load capacitance in the application.
EFFECT OF OFFSET
Figure 7
shows the variation in rise and fall times when the
output offset of the device is varied from 40 V
The rise time shows a maximum variation relative to the center data point (45 V
maximum variation of about 3%relative to the center data
point.
THERMAL CONSIDERATIONS
Figure 4
shows the performance of the LM2435 in the test
circuit shown in
The figure shows that the rise time of the LM2435 increases
by approximately 12%as the case temperature increases
from 50˚C to 100˚C. This corresponds to a speed degradation of 2.4%for every 10˚C rise in case temperature. There
is a negligible change in fall time vs. temperature in the test
circuit.
Figure 6
shows the maximum power dissipation of the
LM2435 vs Frequency when all three channels of the device
are driving an 8 pF load with a 40 V
on, one pixel off signal. The graph assumes a 72%active
time (device operating at the specified frequency) which is
typical in a monitor application. The other 28%of the time
the device is assumed to be sitting at the black level (65V in
this case). This graph gives the designer the information
needed to determine the heat sink requirement for the appli-
, there are three components (R1, R2
#
78FR22K) were used for optimizing the perfor-
Figure 9
can be used as a good starting point
to 50 VDC.
DC
) of about 13%. The fall time shows a
DC
Figure 2
as a function of case temperature.
alternating one pixel
p-p
DS101044-10
cation. The designer should note that if the load capacitance
is increased theAC component of the total power dissipation
will also increase.
The LM2435 case temperature must be maintained below
100˚C. If the maximum expected ambient temperature is
70˚C and the maximum power dissipation is 8.7W (from
ure 6
, 72.5 MHz bandwidth) then a maximum heat sink ther-
Fig-
mal resistance can be calculated:
This example assumes a capacitive load of 8 pF and no resistive load.
TYPICAL APPLICATION
A typical application of the LM2435 is shown in
Figure 10
Used in conjunction with an LM1279, a complete video channel from monitor input to CRTcathode can be achieved. Performance is ideal for 1280 x 1024 resolution displays with
pixel clock frequencies up to 135 MHz.
Figure 10
is the schematic for the NSC demonstration board that can be used to
evaluate the LM1279/2435 combination in a monitor.
PC BOARD LAYOUT CONSIDERATIONS
For optimum performance, an adequate ground plane, isolation between channels, good supply bypassing and minimizing unwanted feedback are necessary.Also,the length of the
signal traces from the preamplifier to the LM2435 and from
the LM2435 to the CRT cathode should be as short as possible. The following references are recommended:
Ott, Henry W., “Noise Reduction Techniques in Electronic
Systems”, John Wiley & Sons, New York, 1976.
“Video Amplifier Design for Computer Monitors”, National
Semiconductor Application Note 1013.
Pease, Robert A., “Troubleshooting Analog Circuits”,
Butterworth-Heinemann, 1991.
Because of its high small signal bandwidth, the part may oscillate in a monitor if feedback occurs around the video channel through the chassis wiring. To prevent this, leads to the
video amplifier input circuit should be shielded, and input circuit wiring should be spaced as far as possible from output
circuit wiring.
It is very important that the tab of the heatsink is connected
to PCB ground. The single ground pin does not provide an
adequate return path at high frequencies. The ground connection can be made using the heatsink. The NSC LM1279
& LM243X (Nov.1998, Rev. B) demo board, shown in
11
and
Figure 12
, provides a good example of how this can
Figure
be done. A Thermalloy 6698B heatsink is used in the demo
.
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Application Hints (Continued)
board. Note that the heatsink is attached (soldered) to PCB
ground just to the left and just to the right of the device. The
LM2435 is attached to the heatsink using a screw, star
washer and nut. The star washer should be located on the
side of the heatsink opposite the device.
NSC DEMONSTRATION BOARD
Figure 11
NSC LM1279/243X demonstration board. The schematic of
the board is shown in
example of a layout that can be used as a guide for future
layouts. Note the location of the following components:
•
•
•
The routing of the LM2435 outputs to the CRT is very critical
to achieving optimum performance.
shows routing and component placement on the
Figure 10
. This board provides a good
C54, C56—VCCbypass capacitor, located very close to
pin 4 and ground connections to the device.
C43, C44—VBBbypass capacitors, located close to pin
8 and ground.
C53, C55—VCCbypass capacitors, near LM2435 and
V
clamp diodes. This is very important for arc protec-
CC
tion.
Figure 12
shows the
routing and component placement from pin 1 of the LM2435
to the red cathode. Note that the components are placed so
that they almost line up from the output pin of the LM2435 to
the red cathode pin of the CRT connector. This is done to
minimize the length of the video path between these two
components. Note also that the arc protection diodes, D16
and D17 are placed close to L1 and C14 in order to minimize
the size of the node connecting all these components. R21
and D9 are placed close to C14 and R32 for the same reason. This minimizes parasitic capacitance in the video path
and also enhances the effectiveness of the protection diodes. The anode of protection diode D16 is connected directly to a section of the ground plane that has a short and
direct path to the LM2435 ground. The cathode of D16 is
connected to V
(see
Figure 12
very close to decoupling capacitor C53
CC
) which is connected to the same section of
the ground plane as D17. The diode placement and routing
is very important for minimizing the voltage stress on the
LM2435 during an arc over event. Lastly, notice that S1 is
placed very close to the red cathode and is tied directly to
CRT ground.
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Application Hints (Continued)
DS101044-13
FIGURE 10. LM1279/243X Demonstration Board Schematic
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Application Hints (Continued)
FIGURE 11. LM1279/243X Demo Board Layout
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DS101044-14
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Application Hints (Continued)
FIGURE 12. Trace Routing and Component Placement for Red Channel Output
DS101044-15
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Physical Dimensions inches (millimeters) unless otherwise noted
LM2435 Monolithic Triple 5.5 ns CRT Driver
NS Package Number TA09A
Order Number LM2435T
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