Single Supply...3 V to 30 V
(LM2902 and LM2902Q
3 V to 26 V), or Dual Supplies
D
Low Supply Current Drain Independent of
Supply Voltage . . . 0.8 mA Typ
D
Common-Mode Input Voltage Range
Includes Ground Allowing Direct Sensing
Near Ground
D
Low Input Bias and Offset Parameters:
Input Offset Voltage ...3 mV Typ
A Versions ...2 mV Typ
Input Offset Current...2 nA Typ
Input Bias Current...20 nA Typ
A Versions . . . 15 nA Typ
D
Differential Input Voltage Range Equal to
Maximum-Rated Supply Voltage . . . 32 V
(26 V for LM2902 and LM2902Q)
D
Open-Loop Differential Voltage
Amplification . . . 100 V/mV Typ
D
Internal Frequency Compensation
description
LM124, LM124A ...J OR W PACKAGE
ALL OTHERS . . . D, DB, N OR PW PACKAGE
1OUT
2OUT
LM124, LM124A . . . FK PACKAGE
1IN+
NC
V
CC
NC
2IN+
(TOP VIEW)
1
1IN–
2IN–
2
1IN+
3
V
4
CC
2IN+
5
6
7
(TOP VIEW)
1IN –
1OUT
3212019
4
5
6
7
8
910111213
NC
14
13
12
11
10
9
8
4OUT
4IN –
18
17
16
15
14
4OUT
4IN–
4IN+
GND
3IN+
3IN–
3OUT
4IN+
NC
GND
NC
3IN+
These devices consist of four independent
high-gain frequency-compensated operational
amplifiers that are designed specifically to operate
NC – No internal connection
2IN –
2OUT
NC
3IN –
3OUT
from a single supply over a wide range of voltages.
Operation from split supplies is also possible
symbol (each amplifier)
when the difference between the two supplies is
3 V to 30 V (for the LM2902 and LM2902Q, 3 V to
26 V) and V
is at least 1.5 V more positive than
CC
the input common-mode voltage. The low supply
current drain is independent of the magnitude of
IN –
IN +
–
OUT
+
the supply voltage.
Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational
amplifier circuits that now can be more easily implemented in single-supply-voltage systems. For example, the
LM124 can be operated directly from the standard 5-V supply that is used in digital systems and easily provides
the required interface electronics without requiring additional ±15-V supplies.
The LM2902Q is manufactured to demanding automotive requirements.
The LM124 and LM124A are characterized for operation over the full military temperature range of –55°C to
125°C. The LM224 and LM224A are characterized for operation from –25°C to 85°C. The LM324 and LM324A
are characterized for operation from 0°C to 70°C. The LM2902 and LM2902Q are characterized for operation
from –40°C to 125°C.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
This chip, when properly assembled, displays characteristics similar to the LM324. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
V
(3)
(2)
(7)
(10)
(9)
(14)
(11)
CC+
GND
(4)
(1)
(5)
(6)
(8)
(12)
(13)
1OUT
2IN+
2IN–
3OUT
4IN+
4IN–
62
(2)
(3)
(4)
(5)
(1)
(14)
(13)
(12)
(11)
(10)
1IN+
1IN–
2OUT
3IN+
3IN–
4OUT
CHIP THICKNESS: 15 TYPICAL
(6)
(7)(8)
65
(9)
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
LM124, LM124A
LM224, LM224A
LM324, LM324A
Supply voltage, VCC (see Note 1)3226V
Differential input voltage, VID (see Note 2)±32±26V
Input voltage, VI (either input)–0.3 to 32–0.3 to 26V
Duration of output short circuit (one amplifier) to ground at (or below) TA = 25°C,
VCC ≤ 15 V (see Note 3)
Continuous total dissipationSee Dissipation Rating Table
LM124, LM124A–55 to 125
p
Storage temperature range–65 to 150–65 to 150°C
Case temperature for 60 secondsFK package260°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds J or W package300300°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds D, DB, N, or PW package260260°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
2. Differential voltages are at IN + with respect to IN –.
3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
p
A
LM224, LM224A–25 to 85
LM324, LM324A0 to 70
LM2902, LM2902Q–40 to 125
electrical characteristics at specified free-air temperature, V
A
V
nput offset voltage
nput offset curren
nput bias curren
ICR
V
OH
V
OL
VD
CMRRCommon-mode rejection ratioVIC = V
SVR
VO1/VO2Crosstalk attenuationf = 1 kHz to 20 kHz25 ° C120120120dB
I
O
I
OS
I
CC
†
All characteristics are measured under open-loop conditions with zero common-mode input voltage unless otherwise specified. MAX VCC for testing purposes is 26 V for LM2902
and LM2902Q, 30 V for the others.
‡
Full range is –55°C to 125°C for LM124, –25°C to 85°C for LM224, 0°C to 70°C for LM324, and –40°C to 125°C for LM2902 and LM2902Q.
All characteristics are measured under open-loop conditions with zero common-mode input voltage unless otherwise specified. MAX VCC for
testing purposes is 30 V .
Input offset voltage37mV
Input offset current
Input bias current–20–250nA
Common-mode input voltage
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MA Y INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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