NPN silicon planar epitaxial
microwave power transistor
Product specification
File under Discrete Semiconductors, SC15
Philips Semiconductors
September 1994
Page 2
Philips SemiconductorsProduct specification
NPN silicon planar epitaxial
microwave power transistor
FEATURES
• Diffused emitter ballasting resistors
providing excellent current sharing
and withstanding a high VSWR
• Interdigitated structure provides
high emitter efficiency
• Gold metallization realizes very
good stability of the characteristics
and excellent lifetime
• Multicell geometry gives good
balance of dissipated power and
low thermal resistance
• Internal input and output
prematching ensures good stability
and allows an easier design of
wideband circuits.
APPLICATION
Intended for use in common emitter,
class AB amplifiers in CW conditions
for professional applications between
1.7 GHz and 2.0 GHz.
DESCRIPTION
NPN silicon planar epitaxial
microwave power transistor in a
FO-229 glued cap metal ceramic
flange package, with emitter
connected to flange.
LLE18150X
QUICK REFERENCE DATA
Microwave performance up to T
amplifier.
MODE OF
OPERATIONf(GHz)
V
(V)
Class AB (CW)1.85240.05≥12≥7.8typ. 43see Figs 6
PINNING - FO-229
PINDESCRIPTION
1collector
2base
3emitter connected to flange
handbook, 4 columns
Top view
Fig.1 Simplified outline and symbol.
=25°C in a common emitter class AB
mb
CE
I
(A)
1
2
CQ
3
P
L1
(W)
G
po
(dB)
b
MAM112
c
e
η
(%)
C
Zi; Z
(Ω)
and 7
L
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO slab is not damaged.
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of
the user. It must never be thrown out with the general or domestic waste.
September 19942
Page 3
Philips SemiconductorsProduct specification
NPN silicon planar epitaxial
LLE18150X
microwave power transistor
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
CBO
V
CER
V
CEO
V
EBO
I
C
P
i
P
tot
T
stg
T
j
T
sld
Note
1. Up to 0.2 mm from ceramic.
collector-base voltageopen emitter−45V
collector-emitter voltageRBE = 220 Ω−30V
collector-emitter voltageopen base−22V
emitter-base voltageopen collector−3V
DC collector current−3A
input powerf = 1.85 GHz; VCE= 24 V; class AB −4W
total power dissipationTmb=75°C−25W
storage temperature−65+150°C
junction temperature−200°C
soldering temperaturet ≤ 10 s; note 1−235°C
30
P
tot
(W)
20
10
0
050100200
Fig.2 Power derating curve.
150
T ( C)
mb
MBD741
o
September 19943
Page 4
Philips SemiconductorsProduct specification
NPN silicon planar epitaxial
LLE18150X
microwave power transistor
THERMAL CHARACTERISTICS
SYMBOLPARAMETERCONDITIONSMAX.UNIT
R
th j-mb
R
th mb-h
CHARACTERISTICS
= 25 °C unless otherwise specified.
T
mb
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
I
CBO
V
(BR)CER
V
(BR)CBO
V
(BR)EBO
h
FE
APPLICATION INFORMATION
Microwave performance up to T
thermal resistance from junction to mounting baseTj= 100 °C3.6K/W
thermal resistance from mounting base to heatsink0.2K/W
collector cut-off currentIE= 0; VCB=20V−1.5mA
collector-emitter breakdown voltage IC= 0 mA; RBE= 220 Ω30−V
collector-base breakdown voltageIC=10mA45−V
emitter-base breakdown voltageIE=10mA3−V
DC current gainIC= 0.5 A; VCE= 3 V15100
= 25 °C in a common emitter class AB amplifier.
mb
MODE OF
OPERATION
f
(GHz)
V
(V)
CE
I
CQ
(A)
P
L1
(W)
Class AB (CW)1.85240.05≥12
typ. 15
G
po
(dB)
≥7.8
typ. 8.5
η
(%)
C
Zi; Z
(Ω)
L
typ. 43see Figs 6
and 7
September 19944
Page 5
Philips SemiconductorsProduct specification
NPN silicon planar epitaxial
microwave power transistor
handbook, full pagewidth
4.0
40
0.7
4.0
30
7.0
17.0
1.0
LLE18150X
30
5.0
4.0
6.0
1.0
3.0
8.0
3.0
6.0
2.5
6.02.0
2.5
2.5
7.0
1.0
2.5
13.0
9.0
3.0
40
0.7
2.0
MBD731
F1
C2
V
BB
L1
handbook, full pagewidth
The test circuit is split into two independent halves, each being 30 x 40 mm in size.
Dimensions in mm.
Substrate: Epsilam 10.
Thickness: 0.635 mm.
Permittivity: εr = 10.
C5
C6
C3
V
CC
L2
C4C1
MBD732
outputinput
Fig.3 Prematching test circuit board.
September 19945
Page 6
Philips SemiconductorsProduct specification
NPN silicon planar epitaxial
microwave power transistor
handbook, full pagewidth
R1
R2
P1
BIAS CIRCUIT
TR1
D1
D2
LLE18150X
PREMATCHING TEST
CIRCUIT
V
CC
C5
F1
C7R3
L1
C6
L2
DUT
MEA600
Fig.4 Class AB bias circuit.
List of components (see Figs 3 and 4).
COMPONENTDESCRIPTIONVALUEORDERING INFORMATION
TR1transistor, BDT91 or equivalent
C1, C4DC blocking chip capacitor100 pFATC 100A101kp
C2, C3trimmer capacitor0.5 to 5.0 pFTekelec 727-1
C5, C6feedthrough bypass capacitor1500 pFErie 1250-003
C7electrolytic capacitor10 µF, >30 V
D1diode BY239 or equivalent; note 1
D2diode BY239 or equivalent; note 2
L14 turns 0.5 mm copper wire;
internal diameter = 2 mm
L24 turns 0.5 mm copper wire;
internal diameter = 2 mm
P1linear potentiometer4.7 kΩ
R1resistor100 Ω, 0.25 W
R2resistor10 kΩ, 0.25 W
R3resistor56 Ω, 0.25 W
F1ferrite beadPhilips tube, 12NC = 4330 030 43081
4.2 x 2.2 x 3.2 mm (4B1)
Notes
1. In thermal contact with TR1.
2. In thermal contact with DUT.
September 19946
Page 7
Philips SemiconductorsProduct specification
NPN silicon planar epitaxial
microwave power transistor
20
P
L
(W)
16
12
8
4
0
0
I = 20 mA
CQ
50 mA
100 mA
1234
P (W)
MBD737
i
LLE18150X
Input and optimum load impedances.
V
= 24 V; ICQ = 50 mA; Zo = 10 Ω (see Figs 6 and 7);
CE
typical values at P
f
(GHz)
1.704.5 + j8.06.2 − j0.5
1.807.5 + j9.05.7 − j1.0
1.859.2 + j8.24.7 − j1.7
1.909.5 + j6.53.9 − j2.2
2.007.0 + j3.02.7 − j2.4
L=PL1
.
Z
i
(Ω)
Z
(Ω)
L
VCE = 24 V; f = 1850 MHz.
Fig.5 Load power as a function of input power.
September 19947
Page 8
Philips SemiconductorsProduct specification
NPN silicon planar epitaxial
microwave power transistor
0.5
0.2
+ j
0
– j
0.2
0.20.51052
0.5
Z
i
1.7 GHz
2 GHz
1
1
LLE18150X
2
5
1.85 GHz
10
∞
10
5
2
MBD742
VCE = 24 V; Zo = 10 Ω; ICQ = 50 mA.
Fig.6 Input impedance as a function of frequency; typical values at PL=P
L1
1
0.5
1.7 GHz
Z
L
0.2
+ j
0
– j
0.2
0.20.51052
1.85 GHz
2 GHz
0.5
2
5
10
∞
10
5
2
VCE = 24 V; Zo = 10 Ω; ICQ = 50 mA.
Fig.7 Optimum load impedance as a function of frequency; typical values at PL=PL1.
September 19948
1
MBD743
Page 9
Philips SemiconductorsProduct specification
NPN silicon planar epitaxial
microwave power transistor
PACKAGE OUTLINE
2.3
2.0
O 3.3
0.13
max
seating
plane
0.25
LLE18150X
19.1 max
6.5
max
14.22
M
1
3
2
1.7 max
1.7
max
4.5 min
6.5
6.2
4.5 min
MBB945
4.8
max
Dimensions in mm.
Torque on screws: max. 0.5 Nm.
Recommended screw: M3.
Fig.8 FO-229.
DEFINITIONS
Data Sheet Status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
September 19949
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