3-axis ±2 g absolute analog-output "piccolo" accelerometer
Features
■ Absolute 0-g level and sensitivity
■ Excellent stability over temperature
■ 3 acceleration channels plus multiplexed
analog output
■ Factory-trimmed device sensitivity and
0-g level
■ Power-down mode
■ Embedded self-test
■ 10000 g high shock survivability
■ ECOPACK® RoHS and “Green” compliant
(see Section 6)
LIS352AX
MEMS inertial sensor:
LGA-14
The LIS352AX has a full-scale of
capable of measuring accelerations over a
maximum bandwidth of 2.0 kHz. The device
bandwidth may be reduced by using external
capacitors.
(3x5x0.9mm)
±2 g and is
Applications
■ Free-fall detection for data protection
■ Tilting applications
■ Mobile and battery-operated terminals
■ Gaming and virtual reality input devices
■ Anti-theft systems and Inertial navigation
Description
The LIS352AX is a new small size, low-power 3axis linear accelerometer that includes a sensing
element and an IC interface capable of providing
an absolute analog signal to the external world.
The IC interface is manufactured using a CMOS
process that allows a high level of integration to
design a dedicated circuit trimmed to better match
the sensing element characteristics.
Table 1.Device summary
Order codeTemperature range, ° CPackagePacking
The self-test capability allows the user to check
the functioning of the system.
An embedded multiplexer allows the redirection of
the analog outputs onto a single pin for operation
with a single-channel A/D converter.
ST is already in the field with several hundred
million sensors which have received excellent
acceptance from the market in terms of quality,
reliability and performance.
The LIS352AX is provided in a plastic land grid
array (LGA)package.
Several years ago ST successfully pioneered the
use of this package for accelerometers. Today, ST
has the widest manufacturing capability and
strongest expertise in the world for production of
sensors in plastic LGA packages.
5STSelf-test (logic 0: normal mode; logic 1: self-test)
6PDPower-down (logic 0: normal mode; logic 1: power-down mode)
7VoutxOutput voltage X channel
8VoutyOutput voltage Y channel
9VoutzOutput voltage Z channel
10GND0 V supply
11VoutMultiplexer output
12Aux_inAuxiliary input
13VddPower supply
14ReservedConnect to Vdd
4/15 Doc ID 15530 Rev 2
Page 5
LIS352AXMechanical and electrical specifications
z
2 Mechanical and electrical specifications
2.1 Mechanical characteristics
@ Vdd=3.3 V, T=25 °C unless otherwise noted
Table 3.Mechanical characteristics
SymbolParameterTest conditionMin. Typ.
(4)
(4)
(6)
(2)
Delta from +25 °C±0.01%/°C
T = 25°C1.25- 3.5%1.251.25+ 3.5%V
Delta from +25 °C±0.3mg/°C
Best fit straight line±0.5% FS
Vdd=3.3 V100µg/
T = 25 °C
X axis
T = 25 °C
Y axis
T = 25 °C
Z axis
X, Y, Z axis2.0kHz
(7)
(Vst=Logic1)
=2.0 kHz. Sensor bandwidth=1/(2*π*32kΩ*C
RES
-Vout
ArAcceleration range
SoSensitivity
SoDr
Sensitivity change vs.
temperature
(3)
VoffZer o-g level
OffDr
Zero-g level change
vs temperature
NLNon linearity
CrossAx Cross-axis
Acceleration noise
An
density
Self-test output
Vt
voltage change
Fres
Top
Sensing element
resonant frequency
Operating
temperature range
(5)
WhProduct weight30mgram
1. Typical specifications are not guaranteed
2. Guaranteed by wafer level test and measurement of initial offset and sensitivity
3. Zero-g level and sensitivity are absolute to supply voltage
4. Guaranteed by design
5. Contribution to the measuring output of an inclination/acceleration along any perpendicular axis
6. Self-test output voltage change” is defined as Vout
7. Minimum resonance frequency F
(a)
(1)
Max.Unit
±2.0g
0.363 - 5%0.3630.363 + 5%V/g
±2%
40550mV
40550mV
40550mV
-40+85°C
(Vst=Logic0)
LOAD
), with C
LOAD
>2.5nF
H
a. The product is factory calibrated at 3.3 V. The operational power supply range is specified in Table 4.
Doc ID 15530 Rev 25/15
Page 6
Mechanical and electrical specificationsLIS352AX
2.2 Electrical characteristics
@ Vdd=3.3 V, T=25 °C unless otherwise noted
Table 4.Electrical characteristics
SymbolParameterTest conditionMin.Typ.
VddSupply voltage2.163.33.6V
IddSupply current
Mean value
PD pin connected to GND
(b)
(1)
Max.Unit
0.3mA
IddPdn
Vst
Vpd
Supply current in
power-down mode
Self-test input
Power-down input
Vs0S0 Input
Vs1S1 input
Rout
Output impedance of
Voutx, Vo uty, Vou tz
Capacitive load drive
Cload
fo r Vou tx, Vouty,
(2)
Voutz
Series resistance of
Rmux
multiplexer input vs.
Vout
Capacitive load drive
Cloadmux
for multiplexed output
Vout
Turn-on time at exit
To n
from power-down
mode
1. Typical specifications are not guaranteed
2. Minimum resonance frequency F
=2.0 kHz. Device bandwidth=1/(2*π*32kΩ*C
RES
PD pin connected to Vdd1µA
Logic 0 level00.2*VddV
Logic 1 level0.8*Vdd Vdd
Logic 0 level00.2*Vdd
Logic 1 level0.8*Vdd Vdd
Logic 0 level00.2*Vdd
Logic 1 level0.8*Vdd Vdd
32kΩ
2.5nF
1
k
10pF
C
in µF160*C
LOAD
LOAD
), with C
+0.3ms
LOAD
>2.5nF
LOAD
Ω
b. The product is factory calibrated at 3.3 V. The operational power supply range is specified in Table 3.
6/15 Doc ID 15530 Rev 2
Page 7
LIS352AXAbsolute maximum ratings
3 Absolute maximum ratings
Stresses above those listed as “Absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 5.Absolute maximum ratings
SymbolRatingsMaximum ValueUnit
VddSupply voltage-0.3 to 6V
VinInput voltage on any control pin (PD, ST, S0, S1) -0.3 to Vdd +0.3V
V
Aux_in
A
Aux_in input voltage -0.3 to Vdd +0.3V
3000 g for 0.5 ms
Acceleration (any axis, powered, Vdd=3.3V)
POW
10000 g for 0.1 ms
A
T
Acceleration (any axis, not powered)
UNP
Storage temperature range-40 to +125°C
STG
ESDElectrostatic discharge protection
Note:Supply voltage on any pin should never exceed 6.0 V.
This is a mechanical shock sensitive device, improper handling can cause permanent
damages to the part
This is an ESD sensitive device, improper handling can cause permanent damages to
the part
3000 g for 0.5 ms
10000 g for 0.1 ms
4 (HBM)kV
1.5 (CDM)kV
200 (MM)V
Doc ID 15530 Rev 27/15
Page 8
Absolute maximum ratingsLIS352AX
3.1 Terminology
3.2 Sensitivity
Sensitivity describes the gain of the sensor and can be determined by applying 1 g
acceleration to it. Because the sensor can measure DC accelerations, this can be done
easily by pointing the selected axis towards the ground, noting the output value, rotating the
sensor 180 degrees (pointing towards the sky) and noting the output value again. By doing
so, a ±1 g acceleration is applied to the sensor. Subtracting the larger output value from the
smaller one, and dividing the result by 2, produces the actual sensitivity of the sensor. This
value changes very little over temperature (see sensitivity change vs. temperature) and over
time. The sensitivity tolerance describes the range of sensitivities of a large number of
sensors.
3.3 Zero-g level
Zero-g level describes the actual output signal if there is no acceleration present. A sensor
in a steady state on a horizontal surface will measure 0 g on both the X and Y axes,
whereas the Z axis will measure 1 g. A deviation from the ideal 0-g level (1250 mV, in this
case) is called Zero-g offset. Offset is to some extent a result of stress to the MEMS sensor
and therefore the offset can slightly change after mounting the sensor onto a printed circuit
board or exposing it to extensive mechanical stress. Offset changes little over temperature
(see “Zero-g level change vs. temperature” in Table 3: Mechanical characteristics). The
Zero-g level of an individual sensor is also very stable over its lifetime. The Zero-g level
tolerance describes the range of Zero-g levels of a group of sensors.
3.4 Self-test
Self-test (ST) provides a means of testing of the mechanical and electrical parts of the
sensor, allowing the seismic mass to be moved by through an electrostatic test-force. The
self-test function is off when the ST pin is connected to GND. When the ST pin is tied at
Vdd, an actuation force is applied to the sensor, simulating a definite input acceleration. In
this case the sensor outputs exhibits a voltage change in its DC levels. When ST is
activated, the device output level is given by the algebraic sum of the signals produced by
the acceleration acting on the sensor and by the electrostatic test-force. If the output signals
change within the amplitude specified in Table 3, then the sensor is working properly and
the parameters of the interface chip are within the defined specifications.
3.5 Output impedance
Output impedance describes the resistor inside the output stage of each channel. This
resistor is part of a filter consisting of an external capacitor of at least 2.5 nF and the internal
resistor. Due to the resistor level, only small inexpensive external capacitors are needed to
generate low corner frequencies. When interfacing with an ADC, it is important to use high
input impedance input circuitries to avoid measurement errors. Note that the minimum load
capacitance forms a corner frequency close to the resonant frequency of the sensor. In
general, the smallest possible bandwidth for a particular application should be chosen to
obtain the best results.
8/15 Doc ID 15530 Rev 2
Page 9
LIS352AXFunctionality
4 Functionality
The LIS352AX is a 3-axis ultracompact low-power, analog output linear accelerometer
packaged in a LGA package. The complete device includes a sensing element and an IC
interface capable of taking information from the sensing element providing an analog signal
to the external world.
4.1 Sensing element
A proprietary process is used to create a surface micro-machined accelerometer. The
technology allows the creation of suspended silicon structures which are attached to the
substrate at several points called “anchors” and are free to move in the direction of the
sensed acceleration. To be compatible with traditional packaging techniques, a cap is
placed on top of the sensing element to prevent blocking of the moving parts during the
moulding phase of plastic encapsulation.
When an acceleration is applied to the sensor, the proof mass shifts from its nominal
position, causing an imbalance in the capacitive half-bridge. This imbalance is measured
using charge integration in response to a voltage pulse applied to the sense capacitor.
At steady state, the nominal value of the capacitors are a few pF, and when an acceleration
is applied the maximum variation of the capacitive load is in the fF range.
4.2 IC interface
The complete signal processing utilizes a fully differential structure, while the final stage
converts the differential signal into a single-ended signal to be compatible with external
applications.
The first stage is a low-noise capacitive amplifier that implements a correlated double
sampling (CDS) at its output to cancel the offset and the 1/f noise. The signal produced is
then sent to three different S&Hs, one for each channel, and made available to the outside.
The device provides an embedded multiplexer to allow the redirection of either the analog
output signals Voutx, Vouty, and Voutz, or of an auxiliary input signal onto a single pin for
operation with a single-channel A/D converter.
All the analog parameters (output offset voltage and sensitivity) are absolute with respect to
the voltage supply. Increasing or decreasing the voltage supply will not cause a change in
the sensitivity and the offset. The feature allows the coupling of the sensor with an ADC,
having a fixed voltage reference independent from Vdd.
4.3 Factory calibration
The IC interface is factory calibrated for sensitivity (So) and zero-g level (Voff).
The trimming values are stored inside the device in a non volatile structure. Any time the
device is turned on, the trimming parameters are downloaded into the registers to be
employed during the normal operation. This allows the user to employ the device without
further calibration.
Doc ID 15530 Rev 29/15
Page 10
Application hintsLIS352AX
R
5 Application hints
Figure 3.LIS352AX electrical connection
,)3!8
6DD
TOPVIEW
6DD
3
3
34
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'.$'.$
#LOADMUX
#LOADZ
N&
!UX)N
'.$
&
/PTIONAL
/PTIONAL
8
6OU T
9
6OU T:
:
0ININDICATO
$)2%#4)/.3/&
$%4%#4!", %
!##%,%2!4)/. 3
!NALOGSIGNALS
$IGITALSIGNALS
#LOADY
#LOAD
/PTIONAL
/PTIONAL
X
6OU T9
6OUT8
!-V
Power supply decoupling capacitors (100 nF ceramic or polyester + 10 µF aluminum) should
be placed as near as possible to the device (common design practice).
The LIS352AX allows band limiting of Voutx, Vouty and Voutz through the use of external
capacitors. The recommended frequency range spans from DC up to 2.0 kHz. Capacitors
must be added at the output pins to implement low-pass filtering for anti-aliasing and noise
reduction, even if only the multiplexed output (Vout) is used. The equation for the cut-off
frequency ( f
Taking into account that the internal filtering resistor (R
equation for the external filter cut-off frequency may be simplified as follows:
f
10/15 Doc ID 15530 Rev 2
-------------------------------------- -
t
C
out
load
1
C
load
xyz,,()⋅⋅
) has a nominal value of 32 kΩ, the
out
5µF
Hz[]=
xyz,,()
Page 11
LIS352AXApplication hints
The tolerance of the internal resistor can vary ±20% (typ) from its nominal value of 32 kΩ;
thus the cut-off frequency will vary accordingly. A minimum capacitance of 2.5 nF for C
LOAD
(x, y, z) is required.
An external capacitor can be added to the Vout pin. Values below 10 pF are recommended.
Table 6.Filter capacitor selection, C
Cut-off frequencyCapacitor value
1 Hz5 µF
10 Hz0.5µF
20 Hz250nF
50 Hz100nF
100 Hz50nF
200 Hz25nF
500 Hz10nF
Table 7.MUX I/O table
S1 pinS0 pin MUX status
LOAD
(x,y,z)
00Vout=Voutx
01Vout=Vouty
10Vout=Voutz
11Vout=Aux_in
5.1 Soldering information
The LGA package is compliant with the ECOPACK®, RoHs and “Green” standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020C.
Leave “pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com.
Doc ID 15530 Rev 211/15
Page 12
Application hintsLIS352AX
5.2 Output response vs. orientation
Figure 4.Output response vs. orientation
X=0.89V (-1g)
Y=1.25V (0g)
Z=1.25V (0g)
X=1.25V (0g)
Y=1.61V (+1g)
Z=1.25V (0g)
TOP VIEW
X=1.61V (+1g)
Y=1.25V (0g)
Z=1.25V (0g)
X=1.25V (0g)
Y=0.89V (-1g)
Z=1.25V (0g)
Bottom
To p
To p
Bottom
Earth’ surface
X=1.25V (0g)
Y=1.25V (0g)
Z=0.89V (-1g)
X=1.25V (0g)
Y=1.25V (0g)
Z=1.61V (+1g)
12/15 Doc ID 15530 Rev 2
Page 13
LIS352AXPackage information
6 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
Figure 5.LGA-14: mechanical data and package dimensions
Dimensions
mminch
Ref.
Min. Typ. Max. Min.Typ. Max.
A10.9010.033 0.035 0.037
A20.70.027
A3 0.16 0.2 0.24 0.006 0.007 0.009
D1 2.8533.15 0.116 0.118 0.120
E1 4.8555.15 0.194 0.196 0.198
N10.80.031
L140.157
P11.340.052
P21.20.047 0.048
T10.80.031
T20.50.019
d0.150.005
M0.10.003
k0.050.002
Outline and
mechanical data
LGA-14 (3x5x0.9mm)
pitch 0.8mm
Land Grid Array Package
7773587E
Doc ID 15530 Rev 213/15
Page 14
Revision historyLIS352AX
7 Revision history
Tabl e 8.Document revision history
DateRevisionChanges
26-Mar-20091Initial datasheet
Updated Section 2.1: Mechanical characteristics and Section 2.2:
02-Feb-20092
Electrical characteristics.
Minor text changes
14/15 Doc ID 15530 Rev 2
Page 15
LIS352AX
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