- Lead Frame Type LED Package : 3.0×3.0×0.65 (L×W×H) [Unit : mm]
- Viewing Angle : 120º
- Chip Material : InGaN
- Soldering Methods : Reflow soldering
- Taping : 8 mm antistatic clear carrier tape and antistatic clear cover tape.
4,000 pcs/reel, ∅178 mm reel
2. Application
- Interior and Exterior Illumination
3. Outline Dimensions
< Internal Circuit >
( Unit : mm )
Recommendable Soldering Pattern
(for Reflow Soldering)
ESD
Anode Cathode
① ②
protection
Pad Configuration
① Anode Pad
② Cathode Pad
• Tolerances unless otherwise mentioned are ±0.1 mm
3 / 30
Page 4
4. Absolute Maximum Ratings
( Ta=25℃)
Item Symbol Rating Unit
Forward Current If
Pulse Forward Current
*1)
Ifp
200 mA
400 mA
Operating Temperature Topr -40 ~ +85 ℃
Storage Temperature Tstg -40 ~ +100 ℃
Junction Temperature Tj
125 ℃
Soldering Temperature JEDEC-J-STD-020D
ESD Classification Class 2 (JESD22-A114)
*1) Pulse width ≤10ms and duty cycle ≤10%
※ These values are provided for informational purposes only, not any warranty or guarantee. Regarding any kinds
of warranty or guarantee, consult your sales representative.
※ Operating the LED beyond the listed maximum ratings may affect device reliability and cause permanent damage.
These or any other conditions beyond those indicated under recommended operating conditions are not implied.
The exposure to the absolute maximum rated conditions may affect device reliability.
※ The LEDs are not designed to be driven in reverse bias.
※ These values are provided less than Tj 125℃
5. Electro - Optical Characteristics
Item Symbol CCT Min. Typ. Max. Unit
6500 (F)
5700 (G)
Luminous Flux
(Component Level)
Luminous Flux
(Assembly Level)
Forward Voltage Vf All 5.80 - 6.60 V
Color Coordinate
Viewing Angle
Color Rendering Index (CRI)
Thermal Resistance, Junction to
Solder Point
Typical Temperature Coefficient
of Forward Voltage
1)
2)
*1)
Φv
Φv
Cx / Cy
2Θ1/2
Ra
Rth j-s
ΔVf / ΔTj
5000 (H)
4000 (J)
3500 (K)
3000 (L)
2700 (M)
6500 (F)
5700 (G)
5000 (H)
4000 (J)
3500 (K)
3000 (L)
2700 (M)
All Refer to ‘6. Bin Structures -
All - 120 - deg
All 80 - - All - 12 -
*1) These values are measured by a standard of LED Component Level, Pulse width ≤ 10ms
*2) These values are measured by a standard of Assembly Level, Pulse width ≤ 10ms
※ These values are measured by the LG Innotek optical spectrum analyzer within the following tolerances.
Luminous Flux (Φv) : ±7%, Forward Voltage (Vf) : ±0.1V, Color Value : ±0.005, CRI Value : ±2,
※ Although all LEDs are tested by LG Innotek equipment, some values may vary slightly depending on the
conditions of the test equipment.
4 / 30
Page 5
5. Electro - Optical Characteristics
CCT If (mA) Vf (V) Power (W) Φv (Im) lm/W
5.70 0.34 58.1 169.9
5.73 0.37 62.7 168.3
5.94 0.59 93.8 158.0
6.07 0.76 114.9 151.3
6.20 0.93 135.0 145.2
6.44 1.29 172.6 134.0
5.70 0.34 59.0 172.4
5.73 0.37 63.7 170.8
5.94 0.59 95.2 160.3
6.07 0.76 116.6 153.6
6.20 0.93 137.0 147.3
6.44 1.29 175.2 136.0
5.70 0.34 59.4 173.7
5.73 0.37 64.1 172.0
5.94 0.59 95.9 161.5
6.07 0.76 117.5 154.7
6.20 0.93 138.0 148.4
6.44 1.29 176.4 137.0
5.70 0.34 57.7 168.6
5.73 0.37 62.3 167.1
5.94 0.59 93.1 156.8
6.07 0.76 114.1 150.2
6.20 0.93 134.0 144.1
6.44 1.29 171.3 133.1
5.70 0.34 56.0 163.6
5.73 0.37 60.4 162.1
5.94 0.59 90.3 152.1
6.07 0.76 110.6 145.7
6.20 0.93 130.0 139.8
6.44 1.29 166.2 129.1
5.70 0.34 56.0 163.6
5.73 0.37 60.4 162.1
5.94 0.59 90.3 152.1
6.07 0.76 110.6 145.7
6.20 0.93 130.0 139.8
6.44 1.29 166.2 129.1
5.70 0.34 54.3 158.6
5.73 0.37 58.6 157.1
5.94 0.59 87.6 147.5
6.07 0.76 107.2 141.2
6.20 0.93 126.0 135.5
6.44 1.29 161.1 125.1
6500K
(F)
5700K
(G)
5000K
(H)
4000K
(J)
3500K
(K)
3000K
(L)
2700K
(M)
60
65
100
125
150(Typ.)
200
60
65
100
125
150(Typ.)
200
60
65
100
125
150(Typ.)
200
60
65
100
125
150(Typ.)
200
60
65
100
125
150(Typ.)
200
60
65
100
125
150(Typ.)
200
60
65
100
125
150(Typ.)
200
( Ta=25℃)
※ Φv values are for representative references only.
※ Flux is binned by assembly level
5 / 30
Page 6
6. Flux Characteristics and Order Code
Luminous Flux [lm]
Color CRI CCT
Vf @ 150mA
[V]
Code
@ 150mA
Bin
( Ta=25℃)
Order Code
Min. Max.
Cool 80
Cool 80
Cool 80
Neutral 80
6500
(F)
5700
(G)
5000
(H)
4000
(J)
5.80 ~ 6.00 (0)
6.00 ~ 6.20 (1)
6.20 ~ 6.40 (2)
6.40 ~ 6.60 (3)
5.80 ~ 6.00 (0)
6.00 ~ 6.20 (1)
6.20 ~ 6.40 (2)
6.40 ~ 6.60 (3)
5.80 ~ 6.00 (0)
6.00 ~ 6.20 (1)
6.20 ~ 6.40 (2)
6.40 ~ 6.60 (3)
5.80 ~ 6.00 (0)
6.00 ~ 6.20 (1)
6.20 ~ 6.40 (2)
6.40 ~ 6.60 (3)
X6
X7
X8
X7
X8
X9
X7
X8
X9
X7
X8
X9
126.7 132.4
132.4 138.1
138.1 143.8
132.4 138.1
138.1 143.8
143.8 147.6
132.4 138.1
138.1 143.8
143.8 147.6
131.4 137.1
137.1 142.9
142.9 146.7
LEMWS36X80FZ2Fxx
LEMWS36X80GZ2Fxx
LEMWS36X80HZ2Fxx
LEMWS36X80JZ3Fxx
5.80 ~ 6.00 (0)
Warm 80
Warm 80
Warm 80
※ Φv values are for representative references only.
※ Flux is binned by assembly level
3500
(K)
3000
(L)
2700
(M)
6.00 ~ 6.20 (1)
6.20 ~ 6.40 (2)
6.40 ~ 6.60 (3)
5.80 ~ 6.00 (0)
6.00 ~ 6.20 (1)
6.20 ~ 6.40 (2)
6.40 ~ 6.60 (3)
5.80 ~ 6.00 (0)
6.00 ~ 6.20 (1)
6.20 ~ 6.40 (2)
6.40 ~ 6.60 (3)
X7
X8
X9
X7
X8
X9
X7
X8
X9
6 / 30
126.7 131.4
131.4 136.2
136.2 141.0
126.7 131.4
131.4 136.2
136.2 141.0
121.9 127.6
127.6 133.3
133.3 138.1
LEMWS36X80KZ3Fxx
LEMWS36X80LZ3Fxx
LEMWS36X80MZ3Fxx
Page 7
0.3028
0.3304
0.3207
0.3462
0.3376
0.3616
0.3548
0.3736
0.3087
0.3363
0.3263
0.3513
0.3434
0.3664
0.3611
0.3782
0.3098
0.3296
0.3266
0.3437
0.3428
0.3579
0.3595
0.3689
0.3041
0.3240
0.3212
0.3389
0.3373
0.3534
0.3536
0.3646
0.3041
0.3240
0.3212
0.3389
0.3373
0.3534
0.3536
0.3646
0.3098
0.3296
0.3266
0.3437
0.3428
0.3579
0.3595
0.3689
0.3108
0.3229
0.3268
0.3361
0.3422
0.3494
0.3580
0.3596
0.3055
0.3177
0.3217
0.3316
0.3369
0.3451
0.3524
0.3555
0.3055
0.3177
0.3217
0.3316
0.3369
0.3451
0.3524
0.3555
0.3108
0.3229
0.3268
0.3361
0.3422
0.3494
0.3580
0.3596
0.3119
0.3162
0.3270
0.3285
0.3416
0.3408
0.3565
0.3503
0.3068
0.3113
0.3222
0.3243
0.3366
0.3369
0.3512
0.3465
0.3087
0.3363
0.3263
0.3513
0.3434
0.3664
0.3611
0.3782
0.3146
0.3422
0.3320
0.3565
0.3493
0.3712
0.3673
0.3828
0.3154
0.3352
0.3319
0.3485
0.3484
0.3624
0.3655
0.3732
0.3098
0.3296
0.3266
0.3437
0.3428
0.3579
0.3595
0.3689
7. Chromaticity Bins (Cool White)
LG Innotek complies with the ANSI C78.377A standard for its chromaticity bin
structure. For each ANSI quadrangle for the CCT range of 4500K to 6500K, LG
Innotek provides 9 micro bins.
CIE Y
CIE X
Bin CIE X CIE Y Bin CIE X CIE Y Bin CIE X CIE Y Bin CIE X CIE Y
FB1
FB2
FB3
FB4
GB1
GB2
GB3
GB4
7 / 30
HB1
HB2
HB3
HB4
IB1
IB2
IB3
IB4
Page 8
7. Chromaticity Bins (Continued)
Bin CIE X CIE Y Bin CIE X CIE Y Bin CIE X CIE Y Bin CIE X CIE Y
Bin CIE X CIE Y Bin CIE X CIE Y Bin CIE X CIE Y Bin CIE X CIE Y
J21
J22
J23
J24
J31
J32
J33
K21
K22
K23
K24
K31
K32
K33
L21
L22
L23
L24
L31
L32
L33
M21
M22
M23
M24
M31
M32
M33
J34
J41
J42
J43
J44
K34
K41
K42
K43
K44
L34
L41
L42
L43
L44
10 / 30
M34
M41
M42
M43
M44
Page 11
8. Typical Characteristic Curves
60
80
100
120
140
160
180
200
5.45.65.86.06.26.46.6
0%
20%
40%
60%
80%
100%
120%
140%
0255075100125150175200
Forward Current vs. Forward Voltage
Forward Current [mA]
Ta=25℃
Forward Voltage [V]
Relative Luminous Flux vs. Forward Current
Ta=25℃
Relative Luminous Flux [%]
Forward Current [mA]
11 / 30
Page 12
0
20
40
60
80
100
380430480530580630680730780
8. Typical Characteristic Curves
0
20
40
60
80
100
380430480530580630680730780
Spectrum
Relative Spectral Power Distribution
Wavelength [nm]
Ta = 25℃, If = 150mA
Cool
Ta = 25℃, If = 150mA
Neutral
Relative Spectral Power Distribution
Wavelength [nm]
Relative Spectral Power Distribution
Wavelength [nm]
12 / 30
Ta = 25℃, If = 150mA
Warm
Page 13
-0.004
-0.003
-0.002
-0.001
0.000
0.001
0.002
0.003
0.004
658095110125140155170185200
8. Typical Characteristic Curves
Chromaticity Coordinate vs. Forward Current
ΔChromaticity Coordinate
Ta=25℃
Cx
Cy
Forward Current [mA]
Radiation Characteristics
Ta=25℃, If = 150mA
X-X Y-Y
0
-30
-60
-90
100
50
0
30
60
90
50 100
-60
100
-30
50
Ta=25℃, If = 150mA
0
0
50 100
30
60
90 -90
13 / 30
Page 14
70
75
80
85
90
95
100
105
2540557085100
8. Typical Characteristic Curves
-0.04
-0.03
-0.02
-0.01
0.00
0.01
2540557085100
Luminous Flux vs. Temperature
Relative Luminous Flux [%]
Ambient Temperature [℃]
If=150mA
Chromaticity Coordinate vs. Temperature
If=150mA
Cx
Cy
ΔChromaticity Coordinate
Ambient Temperature [℃]
14 / 30
Page 15
8. Typical Characteristic Curves
-0.5
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
0.4
0.5
0.6
-40-20020406080100
Forward Voltage vs. Temperature
ΔForward Voltage [V]
If=150mA
Ambient Temperature [℃]
15 / 30
Page 16
9. Reliability Test Items and Conditions
9-1. Failure Criteria
Items Symbol Test Conditions
Criteria
Min. Max.
Forward Voltage Vf
If = 150mA - Initial Value 1.1
Luminous Flux ΦvIf = 150mA Initial Value 0.7 -
9-2. Reliability Tests
Test
No Items Test Conditions
Room Temperature Operating Life
1
Wet High Temperature Operating Life
2
High Temperature Operating Life
3
Low Temperature Operating Life
4
(RTOL)
(WHTOL)
(HTOL)
(LTOL)
Ta = 25℃, If = 200mA
Ta = 60℃, RH = 90%
If = 200mA
Ta = 85℃, If = 200mA
Ta = -40℃, If = 200mA
Hours
/Cycles
1,000
Hours
1,000
Hours
1,000
Hours
1,000
Hours
Sample
Size
Ac/Re
20 pcs 0/1
20 pcs 0/1
20 pcs 0/1
20 pcs 0/1
5
6
7
8
9
High Temperature Storage Life
(HTSL)
Low Temperature Storage Life
(LTSL)
Wet High Temperature Storage
Life (WHTSL)
Temperature Cycle
(TC)
Moisture Sensitivity Level
(MSL)
Ta = 100℃
Ta = -40℃
Ta = 85℃, RH = 85%
-40℃(30min) ~ 100℃(30min)
Tsld = 260℃
(Pre treatment 60℃,60%
168 hours)
1,000
Hours
1,000
Hours
1,000
Hours
100
Cycles
20 pcs 0/1
20 pcs 0/1
20 pcs 0/1
20 pcs 0/1
3 Times 20 pcs 0/1
100~2000~100Hz
10 Vibration
Sweep 4min.
200m/s², 3 directions
※ All samples are tested using LG Innotek Standard Metal PCB (25x25x1.6 mm3(L×W×H)) except MSL test .
※ All samples must pass each test item and all test items must be satisfied.
48
Minutes
20 pcs 0/1
16 / 30
Page 17
10. Packing and Labeling of Products
10-1. Taping Outline Dimension
( Unit : mm )
Packing Materials :
- Reel : Conductive PS (Black)
- Embossed Carrier Tape : Antistatic PET (Clear)
- Cover Tape : Conductive PET Base
Polarity
Direction
Cathode
Anode
Taping Arrangement
( End )
Trailer
(Empty Pockets)
(Min. 400mm)
Loaded Pocket
(4,000 pcs)
(1,600mm)
Embossed Carrier Tape
Cover Tape
Feed Direction
( Start )
Leader with
Cover Tape
(Min.500mm)
17 / 30
Page 18
10. Packing and Labeling of Products
10-2. Packing Structures
Reeled products are packed in a sealed-off and moisture-proof aluminum bag with desiccants
(silica gel) and HIC (Humidity Indicator Card). A maximum of four aluminum bags are packed in an
inner box and six inner boxes are packed in an outer box.
Q’ty : 4000[pcs]
Run No : F00401-4517
Rack No : C-107
LG Innotek Co., Ltd.
80mm
7 8 9
TH #
( 00 ~ 99 )
※ Label C
Specifying ‘Customer’, ‘Date’, ‘Model Name’, ‘Quantity’, ‘Customer Part no.’, ‘Outbox ID’, ‘LGIT internal Model name’
10
Serial No
( 00 ~ ZZ ) ( 01~31)
OutBox Customer
LEMWS36X80FZ3F00/4000
40mm
X7-M32-1=4000
Box ID. indication
1 2 3 4 5
Manufactured
Site
Paju : P
Huizhou : H
PKG
Site
PKG : S, P Inner Box : I
Outer Box : O
2013 : 3
2014 : 4
···
2020 : 0
2021 : 1
Month Year
1~9 : 1~9
10 : A
11 : B
12 : C
19 / 30
80mm
2018.03.16
PSO2221003
9
Serial No Box Date
( 01 ~ 31)( 001 ~ 999 )
10 6 7 8
Page 20
11. Cautions on Use
11-1. Moisture-Proof Package
-. The moisture in the SMD package may vaporize and expand during soldering.
-. The moisture can damage the optical characteristics of the LEDs due to the encapsulation.
11-2. During Storage
Storage
11-3. During Usage
-. The LED should avoid direct contact with hazardous materials such as sulfur, chlorine, phthalate,
etc.
-. The metal parts on the LED can rust when exposed to corrosive gases. Therefore, exposure to
corrosive gases must be avoided during operation and storage.
-. The silver-plated metal parts also can be affected not only by the corrosive gases emitted inside of
the end-products but by the gases penetrated from outside environment.
-. Extreme environments such as sudden ambient temperature changes or high humidity that can
cause condensation must be avoided.
Conditions Temperature Humidity Time
Before Opening Aluminum Bag 5℃ ~ 30℃< 50%RH
After Opening Aluminum Bag 5℃ ~ 30℃< 60%RH ≤ 672 hours
Baking 65 ± 5℃< 10%RH 10 ~ 24 hours
Within 1 Year from
the Delivery Date
11-4. Cleaning
-. Do not use brushes for cleaning or organic solvents (i.e. Acetone, TCE, etc..) for washing as
they may damage the resin of the LEDs.
-. Isopropyl Alcohol(IPA) is the recommended solvent for cleaning the LEDs under the following
conditions. (Cleaning Condition : IPA, 25℃ max. × 60sec max.)
-. Ultrasonic cleaning is not recommended.
-. Pretests should be conducted with the actual cleaning process to validate that the process will not
damage the LEDs.
11-5. Thermal Management
-. The thermal design of the end product must be seriously considered, particularly at the beginning of
the system design process.
-. The generation of heat is greatly impacted by the input power, the thermal resistance of the circuit
boards and the density of the LED array combined with other components.
20 / 30
Page 21
11. Cautions on Use
11-6. Testing & Measurement (Compliance)
-. When the individual LED is tested, LG Innotek recommends that the compliance of the source
meter should be controlled like as; the input voltage should be set below 75V and the current
also should be set below 30mA.
Otherwise, the LED chip might be affected by certain surge or electrical overstress in a moment.
And that means it can lead to serious failure for that LED.
11-7. Static Electricity
-. Wristbands and anti-electrostatic gloves are strongly recommended and all devices, equipment and
machinery must be properly grounded when handling the LEDs, which are sensitive against static
electricity and surge.
-. Precautions are to be taken against surge voltage to the equipment that mounts the LEDs.
-. Unusual characteristics such as significant increase of current leakage, decrease of turn-on voltage,
or non-operation at a low current can occur when the LED is damaged.
11-8. Recommended Circuit
-. The current through each LED must not exceed the absolute maximum rating when designing the
circuits.
-. In general, there can be various forward voltages for LEDs. Different forward voltages in parallel via
a single resistor can result in different forward currents to each LED, which also can output different
luminous flux values. In the worst case, the currents can exceed the absolute maximum ratings
which can stress the LEDs. Matrix circuit with a single resistor for each LED is recommended to
avoid the luminous flux fluctuations.
RL
L
1
RL
1
Fig.1 Recommended Circuit in Parallel Mode
: Separate resistors must be used for each LED.
-. The driving circuits must be designed to operate the LEDs by forward bias only.
-. Reverse voltages can damage the zener diode, which can cause the LED to fail.
-. A constant current LED driver is recommended to power the LEDs.
L
2
RL
2
L
3
3
L
1
Fig.2 Abnormal Circuit
Circuits to Avoid : The current through the LEDs may vary
due to the variation in LED forward voltage.
L
L
2
L
1
3
RL
L
2
L
3
21 / 30
Page 22
11. Cautions on Use
11-9. Soldering Conditions
-. Reflow soldering is the recommended method for assembling LEDs on a circuit board.
-. LG Innotek does not guarantee the performance of the LEDs assembled by the dip soldering
method.
-. Recommended Soldering Profile (according to JEDEC J-STD-020D)
Maximum time(ts) from T
Maximum peak package body temperature (Tp)
Time(tp) within 5℃ of the specified temperature (Tc)
Maximum Time 25℃ to peak temperature
-. Reflow or hand soldering at the lowest possible temperature is desirable for the LEDs although
the recommended soldering conditions are specified in the above diagrams.
-. A rapid cooling process is not recommended for the LEDs from the peak temperature.
-. The silicone encapsulant at the top of the LED package is a soft surface, which can easily be
damaged by pressure. Precautions should be taken to avoid strong pressure on the silicone resin
when leveraging the pick and place machines.
-. Reflow soldering should not be done more than two times.
Profile Feature Pb-Free Assembly
Preheat / Soak
Temperature Min (T
Temperature Max (T
Ramp-up rate (TL to Tp)
Liquidous temperature (TL)
Time (tL) maintained above T
Ramp-down rate (Tp to TL)
smin
smin
smax
)
)
to T
smax
L
60~120 seconds
3℃/ second max. 3℃/ second max.
60~150 seconds 60~150 seconds
6℃/second max. 6℃/second max.
Pb-Based Assembly
150℃
200℃
217℃ 183℃
260℃ 235℃
30 seconds 20 seconds
8 minutes max. 6 minutes max.
100℃
150℃
60~120 seconds
22 / 30
Page 23
11. Cautions on Use
11-10. Soldering Iron
-. The recommended condition is less than 5 seconds at 260℃.
-. The time must be shorter for higher temperatures. (+10℃ → -1sec).
-. The power dissipation of the soldering iron should be lower than 15W and the surface temperature
of the device should be controlled at or under 230℃.
11-11. Eye Safety Guidelines
-. Do not directly look at the light when the LEDs are on.
-. Proceed with caution to avoid the risk of damage to the eyes when examining the LEDs with optical
instruments.
11-12. Manual Handling
-. Use Teflon-type tweezers to grab the base of the LED and do not apply mechanical pressure on the
surface of the encapsulant.
12. Disclaimers
-. LG Innotek is not responsible for any damages or accidents caused if the operating or storage
conditions exceed the absolute maximum ratings recommended in this document.
-. The LEDs described in this document are intended to be operated by ordinary electronic equipment.
-. It is recommended to consult with LG Innotek when the environment or the LED operation is non standard in order to avoid any possible malfunctions or damage to product or risk of life or health.
-. Disassembly of the LED products for the purpose of reverse engineering is prohibited without prior
written consent from LG Innotek. All defected LEDs must be reported to LG Innotek and are not to
be disassembled or analyzed.
-. The product information can be modified and upgraded without prior notice.
23 / 30
Page 24
Appendix. Nomenclature of Package
All LEDs are tested and sorted by color, luminous flux and forward voltage where every
LED in a tube has only a single color bin, luminous flux bin and forward voltage bin.
However, the forward voltage bin information is not captured in the part number
nomenclature.
A 16-digit part number is required when orders are placed. LG Innotek leverages the
following part number nomenclature.
Type
LE = Light Emitting Diode
Color
RR = Red
BB = Blue
MW = Multi Mixing White
MC = Multi Color
PKG Type
S = SMD Type
M = Module Type
A = Ceramic Type
H = High Power SMD Type
PKG Dimension Revision
1 3 4 6 7 8 10 2 9
5
11 12
Label Code
0 = MES
A = NEDA
13 14 15 16
Flux Bin Code
0 = Full Bins
1 = 15% Micro-Bins
2 = 7.5% Micro-Bins
CIE Bin Code
1 = 4 Bins
2 = 9 Bins
3 = 16 Bins
Special Code
CIE Bin
24 / 30
Optical Bin (CRI)
Optical Bin (Flux)
Page 25
Datasheet
MODEL LEMWS36U80 Series DOCUMENT No. REG.DATE 2016.06.17 REV. No. 0.2
REV.DATE 2018.03.16 PAGE -
History of Revision
Revision Date Contents Revision Remark
Rev. 0.0 16.06.17 New Establishment
Rev. 0.1 16.07.05 Revision New Calculation Flux
Rev. 0.2 18.03.16 Add the New Generation (G4)
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