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Letex Technology Corp.
SURFACE MOUNT CHIP LED LAMPS
FEATURES: APPLICATION:
Ultra compact (1.6×0.8×0.8)
Indicators on printed circuit boards
LCD Back
Using 8 mm wide tape
Illuminations
Automotive-Telecommunication
Wavelength (nm)
Yellow Diffused
ABSOLUTE MAXIMUM RATINGS
Viewing angle
PACKAGE DIMENSIONS OF DEVICE
Tolerance is
※Ultra low profile ※
Model No. LEM-95121D
※
※
※
-lights※Auto insertable.
Emitted Color Material
White InGaN 470
(Ta = 25℃)
Lens Color
CHARACTERISTIC SYMBOL RATING UNIT
Power dissipation
Forward direct current
Peak forward current
Reverse voltage
Operating temperature
Storage temperature
Pm
IFm
IFp
VRm
Topr
Tstg
78
30
100
5
-25 to +80
-30 to +85
ELECTRO-OPTICAL CHARACTERISTICS (Ta = 25℃)
CHARACTERISTIC SYMBOL CONDITION Min. Typ. Max. UNIT
Luminous intensity
Forward voltage
Reverse current
Peak emission wavelength
Chromaticity coordinate
Iv IF=20mA
VF IF=20mA
IR VR=5V
λP IF=20mA
X
IF=20mA
Y
2θ1/2 IF=20mA
45 95
3.5 4.2
-
0.29
0.29
140
10
mW
mA
mA
V
℃
℃
mcd
V
µA
nm
deg.
Note: 1. All dimensions are in millimeters.
2.
±0.25mm unless otherwise specified.
Recommended Soldering Pattern
for Reflow Soldering
1
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