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Letex Technology Corp.
SURFACE MOUNT CHIP LED LAMPS
FEATURES: APPLICATION:
Ultra compact (1.6×0.8×0.8)
Indicators on printed circuit boards
LCD Back
Using 8 mm wide tape
Illuminations
Automotive-Telecommunication
Wavelength (nm)
Water Clear
ABSOLUTE MAXIMUM RATINGS
Viewing angle
for Reflow Soldering
Tolerance is
※Ultra low profile ※
Model No. LEM-65121T
※
※
※
-lights※Auto insertable.
Emitted Color Material
Blue InGaN 470
(Ta = 25℃)
Lens Color
CHARACTERISTIC SYMBOL RATING UNIT
Power dissipation
Forward direct current
Peak forward current
Reverse voltage
Operating temperature
Storage temperature
Pm
IFm
IFp
VRm
Topr
Tstg
78
30
100
5
-25 to +80
-30 to +85
ELECTRO-OPTICAL CHARACTERISTICS (Ta = 25℃)
CHARACTERISTIC SYMBOL CONDITION Min. Typ. Max. UNIT
Luminous intensity
Forward voltage
Reverse current
Peak emission wavelength
Dominant wavelength
Iv IF=20mA
VF IF=20mA
IR VR=5V
λP IF=20mA
λD IF=20mA
2θ1/2 IF=20mA
15 33
3.5 4.2
468
470
130
10
mW
mA
mA
V
℃
℃
mcd
V
µA
nm
nm
deg.
Note: 1. All dimensions are in millimeters.
2.
±0.25mm unless otherwise specified.
Recommended Soldering Pattern
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