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Letex Technology Corp.
SURFACE MOUNT CHIP LED LAMPS
Ultra compact (3.2×1.6×1.1)
Indicators on printed circuit boards
LCD Back
Illuminations
Automotive-Telecommunication
Wavelength (nm)
Yellow Green
Water Clear
ABSOLUTE MAXIMUM RATINGS
Viewing angle
PACKAGE DIMENSIONS OF DEVICE
for Reflow Soldering
Tolerance is
FEATURES: APPLICATION:
※
equipment
※Compatible with reflow solder process ※
Model No. LEM-51321T
※
※
※
-lights※Compatible with automatic placement
Emitted Color Material
GaP
570
(T a = 25℃)
Lens Color
CHARACTERISTIC SYMBOL RATING UNIT
Power dissipation
Forward direct current
Peak forward current
Reverse voltage
Operating temperature
Storage temperature
Pm
IFm
IFp
VRm
Topr
Tstg
68
30
100
5
-30 to +80
-40 to +85
ELECTRO-OPTICAL CHARACTERISTICS (Ta = 25℃)
CHARACTERISTIC SYMBOL CONDITION Min. Typ. Max. UNIT
Luminous intensity
Forward voltage
Reverse current
Peak emission wavelength
Dominant wavelength
Iv IF=20mA
VF IF=20mA
IR VR=5V
λP IF=20mA
λD IF=20mA
2θ1/2 IF=20mA
6.0 15
2.3 2.7
10
568
570
140
mW
mA
mA
V
℃
℃
mcd
V
µA
nm
nm
deg.
Note: 1. All dimensions are in millimeters.
2.
±0.25mm unless otherwise specified.
Recommended Soldering Pattern
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