
FEATURES: APPLICATION:
Ultra compact (1.6×0.8×0.8)
Indicators on printed circuit boards
LCD Back
Illuminations
Automotive-Telecommunication
Recommended Soldering Pattern
※Ultra low profile ※
SURFACE MOUNT CHIP LED LAMPS
Model No. LEM-51121T
※
※
※
-lights※Auto insertable.
Emitted Color Material
GaP 570
Lens Color
ABSOLUTE MAXIMUM RATINGS (Ta = 25℃)
CHARACTERISTIC SYMBOL RATING UNIT
Power dissipation
Forward direct current
Peak forward current
Reverse voltage
Operating temperature
Storage temperature
Pm
IFm
IFp
VRm
Topr
Tstg
78
30
100
5
-25 to +80
-30 to +85
ELECTRO-OPTICAL CHARACTERISTICS (Ta = 25℃)
CHARACTERISTIC SYMBOL CONDITION Min. Typ. Max. UNIT
Luminous intensity
Forward voltage
Reverse current
Peak emission wavelength
Dominant wavelength
Iv IF=20mA
VF IF=20mA
IR VR=5V
λP IF=20mA
λD IF=20mA
2θ1/2 IF=20mA
6.0 15.0
2.3 2.7
568
570
130
10
mW
mA
mA
V
℃
℃
mcd
V
µA
nm
nm
deg.
Note: 1. All dimensions are in millimeters.
2.
for Reflow Soldering
±0.25mm unless otherwise specified.
Letex Technology Corp.