Datasheet LC89512W Datasheet (SANYO)

Ordering number : EN*4852B
O3095HA (OT)/D1694TH (OT) No. 4852-1/5
Overview
The LC89512W integrates a real-time error correction circuit and a SCSI interface in a single chip.
Functions
• CD-ROM error correction function, subcode readout function, SCSI interface
Features
• Support for double-speed drives at an operating frequency of 16.9344 MHz Either SRAM (120 ns), DRAM (80 ns) or pseudo SRAM (85 ns) can be used.
• Support for quad-speed drives at an operating frequency of 33.8688 MHz SRAM (70 ns) must be used.
• Built-in SCSI interface with built-in 48 mA sink buffer (Only the TARGET function is supported.)
• Built-in 12-byte output FIFO for sub-CPU to host computer data transmission
• Built-in 12-byte input FIFO for host computer to sub­CPU data transmission
• Subcode data can be written to buffer RAM and the sub­CPU can read the subcode values by connecting the LC89512 to the CD-DSP subcode pin.
• Sub-CPU access of buffer RAM through the LC89512
• Built-in function for buffer RAM internal data transfer
• Pseudo-SRAM (128-kword × 8-bit and smaller) can be used.
• DRAM (two 256-kword × 4-bit chips or two 1-Mword × 4-bit chips) can be used.
• Transfer speeds:
2.8 MB/second (asynchronous mode) (for CD-ROM decode only operation)
4.2 MB/second (synchronous mode) (CD-ROM decode operation is not supported in synchronous mode) Both of these transfer modes use a 16.9344 MHz clock. (The transfer speed depends on the frequency used.)
• Operating frequencies: 16.9344 MHz (up to double speed), 33.8688 (quad speed)
Package Dimensions
unit: mm
3181A-SQFP100
Preliminary
SANYO: SQFP100
[LC89512W]
LC89512W
SANYO Electric Co.,Ltd. Semiconductor Bussiness Headquarters
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
CD-ROM Error Correction LSI
with Built-In SCSI Interface
CMOS LSI
Block Diagram
No. 4852-2/5
LC89512W
Pin Functions
Type: I: Input pin, O: Output pin, B: Bidirectional pin, P: Power supply pin, NC: No connection pin
No. 4852-3/5
LC89512W
Continued on next page.
Pin No. Pin Type Function
1 DB7 B SCSI connection 2 V
SS
1 P 3 DBP B SCSI connection 4 ATN B SCSI connection 5 V
SS
1 P 6 BSY B SCSI connection 7 ACK B SCSI connection 8 V
SS
1 P 9 RST B SCSI connection
10 MSG B SCSI connection 11 V
SS
1 P
12 SEL B SCSI connection 13 C/D B SCSI connection 14 V
SS
1 P
15 REQ B SCSI connection 16 I/O B SCSI connection 17 V
SS
0 P
18 I
O
0 B
19 I
O
1 B
20 I
O
2 B
21 I
O
3 B Data buffer RAM data signals
22 I
O
4 B These pins have built-in pull-up resistors.
23 I
O
5 B
24 I
O
6 B
25 I
O
7 B 26 INT1 O SCSI block interrupt request signal output (set using a register) 27 V
SS
0 P
28 V
SS
0 P 29 D0 B 30 D1 B 31 D2 B 32 D3 B
Microprocessor data signals
33 D4 B These pins have built-in pull-up resistors. 34 D5 B 35 D6 B 36 D7 B 37 INT0 O Microprocessor interrupt request signal output 38 XTALCK I Crystal oscillator circuit input 39 XTAL O Crystal oscillator circuit output 40 V
SS
0 P 41 V
DD
P 42 RA0 O 43 RA1 O 44 RA2 O 45 RA3 O 46 RA4 O 47 RA5 O 48 RA6 O
Data buffer RAM address signal outputs
49 RA7 O 50 RA8 O 51 RA9 O 52 RA10 O 53 RA11 O
Continued from preceding page.
Type: I: Input pin, O: Output pin, B: Bidirectional pin, P: Power supply pin, NC: No connection pin
Note: 1. NC must be left open. Do not connect any signals to these pins.
2. V
SS
0 is the logic system ground and VSS1 is the SCSI interface ground. (from the standard cell version)
No. 4852-4/5
LC89512W
Pin No. Pin Type Function
54 RA12 O 55 RA13 O 56 RA14 O
Data buffer RAM address signal outputs
57 RA15 O 58 RA16 O 59 RA17 O 60 V
DD
P 61 V
SS
0 P 62 RESET I Reset 63 TEST1 I 64 TEST2 I Test inputs. These pins should be tied low in normal operation. 65 TEST3 I 66 WFCK I 67 SBSO I Subcode I/O 68 SCOR I 69 SDATA I Serial data input 70 BCK I Serial data input clock 71 LRCK I 44.1 kHz strobe signal input 72 C2PO I C2 pointer input 73 RD I Microprocessor data read signal input 74 WR I Microprocessor data write signal input 75 CS I Chip select signal input (from the microprocessor) 76 RS I Register selection signal input 77 V
SS
0 P 78 SWAIT O Sub-CPU wait signal 79 EXCK O Sub code I/O 80 MCK O Crystal oscillator frequency output 81 TEST0 I Test inputs. These pins should be tied low in normal operation
.
82 RCS O RAM chip select 83 RWE O RAM data write signal output 84 ROE O RAM data read signal output 85 NC 86 NC 87 NC 88 NC 89 V
DD
P
90 V
SS
1 P 91 DB0 B SCSI connection 92 DB1 B SCSI connection 93 V
SS
1 P 94 DB2 B SCSI connection 95 DB3 B SCSI connection 96 V
SS
1 P 97 DB4 B SCSI connection 98 DB5 B SCSI connection 99 V
SS
1 P
100 DB6 B SCSI connection
Continued on next page.
No. 4852-5/5
LC89512W
Specifications
Absolute Maximum Ratings at VSS= 0 V
Allowable Operating Ranges at Ta = –30 to +70°C, VSS= 0 V
DC Characteristics at Ta = –30 to +70°C, VSS= 0 V, VDD= 4.5 to 5.5 V
This catalog provides information as of February, 1997. Specifications and information herein are subject to change without notice.
No products described or contained herein are intended for use in surgical implants, life-support systems, aerospace equipment, nuclear power control systems, vehicles, disaster/crime-prevention equipment and the like, the failure of which may directly or indirectly cause injury, death or property loss.
Anyone purchasing any products described or contained herein for an above-mentioned use shall:Accept full responsibility and indemnify and defend SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and
distributors and all their officers and employees, jointly and severally, against any and all claims and litigation and all damages, cost and expenses associated with such use:
Not impose any responsibility for any fault or negligence which may be cited in any such claim or litigation on
SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and distributors or any of their officers and employees jointly or severally.
Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. SANYO believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties.
Parameter Symbol Conditions Ratings Unit
Maximum supply voltage V
DD
max Ta = 25°C –0.3 to +7.0 V
I/O voltages V
IVO
Ta = 25°C –0.3 to VDD+ 0.3 V Allowable power dissipation Pd max Ta 70°C 350 mW Operating temperature Topr –30 to +70 °C Storage temperature Tstg –55 to +125 °C Soldering thermal stress limit (pins only) 10 seconds 260 °C
Parameter Symbol Conditions min typ max Unit
Supply voltage V
DD
4.5 5.0 5.5 V
Input voltage range V
IN
0 V
DD
V
Parameter Symbol Conditions min typ max Unit
Input high level voltage V
IH
1
All input pins other than (1), (3), and XTALCK
2.2 V
Input low level voltage V
IL
1 0.8 V
Input high level voltage V
IH
2
RESET, I
O
0 to IO7, D0 to D7, RD, CS, WR, WFCK,
2.5 V
Input low level voltage VIL2
SBSO and SCOR(1)
0.6 V
Input high level voltage V
IH
3
ACK, ATN and the input pins (3)
2.0 V
Input low level voltage V
IL
3 0.8 V
Output high level voltage V
OH
1
I
OH
1 = –3 mA: IO0 to IO7, D0 to D7 and all output pins
2.4 V
other than (2), (3) and XTALCK
Output low level voltage V
OL
1
I
OL
1 = 3 mA: IO0 to IO7, D0 to D7 and all output pins
0.4 V
other than (2), (3) and XTALCK
Output low level voltage V
OL
2
I
OL
2 = 3 mA: INT1 and INT0
0.4 V
(pull-up resistor open drain) (2)
Output low level voltage V
OL
3
I
OL
3 = 48 mA: DB0 to DB7, DBP, BSY, I/O, MSG, SEL,
0.4 V
RST, REQ, C/D (2)
Input leakage current I
L
VI= VSS, VDD: All input pins –25 +25 µA
Pull-up resistance R
UPIO
0 to IO7, D0 to D7, INT1 and INT0 40 80 160 k
Loading...