The LC86P6449 is a CMOS 8-bit single chip microcontroller with one-time PROM for the LC866400 series.
This microcontroller has the function and the pin description of the LC866400 series mask ROM version, and 48K-byte
PROM.
Features
(1) Option switching by PROM data
The option function of the LC866400 series can be specified by the PROM data.
LC86P6449 can be checked the function of the trial pieces using the mass production board.
(2) Internal one-time PROM capacity : 49408 bytes
(3) Internal RAM capacity : 1152 bytes
Used PROM or RAM capacity are equal ROM or RAM capacity of mask ROM version which applies LC86P6449.
We offers various services at nominal charges. These include the ROM writing, the ROM reading, the package stamping
and the screening. Contact our representative for further information
Ver.1.01
80796
91400 RM (IM) SK No.6689-1/22
Page 2
LC86P6449
(4) Operating supply voltage : 4.5V to 6.0V
(5) Instruction cycle time : 1.0µs to 366µs
(6) Operating temperature : -30°C to +70°C
(7) The pin and the package compatible with the LC866400 series mask ROM devices
(8) Applicable mask ROM version : LC866448/LC866444/LC866440/LC866436//LC866 432/LC866428
/LC866424/LC866420/LC866416/LC866412/LC866408
Notice for use
LC86P6449 is provided for the first release and small shipping of the LC866400 series.
At using, take notice of the followings.
(1) A point of difference LC86P6449 and LC866400 series
•S28 – S37
Operating supply
Voltage range (VDD)
“L” level hold Tr. of the
high voltage withstand input
terminal
Power dissipation
LC86P6449 uses 256 bytes that is addressed on FF00H to FFFFH in the program memory as the option configuration
data area. This option configuration cannot execute all options which LC866400 series have. Next tables show the
options that correspond and not correspond to LC86P6449.
• A kind of the option corresponding of the LC86P6449
A kind of option Pins, Circuits Contents of the option
Input/output form of
Input/output ports
Pull-up MOS Tr. of input ports Port 7
*1) Specified in a bit
*2) Specified in nibble unit. T he port of N-channel open drain output does not have the Pull-up MOS Tr..
The option is specified until 3ms after
going to a ‘H’ level to the reset terminal by
dgrees. The program is executed from
00H of the program counter.
Pull-down resistor
provided/not provided
Not provi ded
Provided (fixed)
Provided (fixed)
Not provi ded
4.5V to 6.0V 2.5V to 6.0V
Refer to ‘electrical characteristics’ on the semiconductor news.
Port 0
Port 1
*1
Port 3
*1
*1
1. N-channel open drain output
2. CMOS output *1
1. Pull-up MOS Tr. proveded
2. Pull-up MOS Tr. not provided *2
1. Input : Programmable pull-up MOS Tr.
2. Input : Programmable pull-up MOS Tr.
1. Input : No Programmable pull-up MOS Tr.
2. Input : Programmable pull-up MOS Tr.
1. No Pull-up MOS Tr.
2. Pull-up MOS Tr.
The program is executed from 00H of the
program counter immediately after going to a
‘H’ level to reset terminal.
Pull-down resistor
provided/not provided
Specified by the option
Provided (fixed)
Specified by the option
Specified by the option
Output : N-channel open drain
Output : CMOS
Output : N-channel open drain
Output : CMOS
No.6689-2/22
Page 3
LC86P6449
• A kind of the option not corresponding of the LC86P6449
A kind of option Pins, Circuits LC86P6449 LC866448/44/40/36/32/28/24/2 0/16/12/08
Pull-down resistor of
the high voltage
Withstand output terminals
•S0/T0 to S6/T6
•S16 to S27
•S28 to S37
Not provi ded
Provided (fixed)
Not provi ded
Specified by the option
Specified by the option
Specified by the option
(2) Option
The option data is created by the option specified program “SU86K.EXE”. The created option data is linked to the
program area by linkage loader “L86K.EXE” .
(3) ROM space
LC86P6449 and LC86 64 00 seri es use 25 6 bytes that is ad dres sed on 0 FF0 0H t o 0F FFFH in the p ro gr am memory as the
option specified data area. These program memory capacity are 61440 bytes that is addressed on 0000H to BFFFH.
1. When ordering the identical mask ROM and PROM devices simultaneously.
Provide an EPROM containing the target memory contents together with the separate order forms for each of the mask
ROM and PROM versions.
2. When ordering a PROM device.
Provide an EPROM containing the target memory contents together with an order form.
How to use
(1) Specification of option
Programming data for PROM of the LC86P6449 is required.
Debugged evaluation file (EVA file) must be converted to an INTEL-HEX formatted file (HEX file) with file converter
program, EVA2HEX.EXE. The HEX file is used as the programming data for the LC86P6449.
(2) How to program for the PROM
LC86P6449 can be programmed by the EPROM programmer with attachment ; W86EP6448Q.
• “27512 (Vpp=12.5V) Intel high speed programming” mode available. The address must be set to “0 to
0FFFFH” and a jumper (DASEC) must be set to ‘OFF’ at programming
(3) How to use th e data secur ity function
“Data security” is the disabled function to read the data of the PROM.
The following is the process in order to execute the data security.
1. Set ‘ON’ the jumper of attachment.
2.Program again. Then EPROM programmer displays the error. The error means normally activity of the data
security. It is not a trouble of the EPROM programmer or the LSI.
Notes
• Data security is not executed when the data of all address have ‘FFH’ at the sequence 2 above.
• The programming by a sequential operation “BLANK⇒PROGRAM⇒VERIFY” cannot be executed data security at the
sequence 2 above.
• Set to ‘OFF’ the jumper after executing the data security.
Pin name I/O Function description Option PROM mode
VSS1,2 - Power pin (-) - VDD1,2 - Power pin (+) *4 Refer to Notes - VP - P ower pin (-) for the VFD output pull-down
Pin name I/O Function description Option PROM mode
PORT8
P80 to 87
I •8-bit input port
•Other functio n
- -
AD input port (8 port pins)
S0/T0 to
S6/T6 *6
S7/T7 to
S15/T15
*7
S16 to S31
*8
O Output for VFD displa y controll er
Segment/tim i ng in common
O •Output for VFD display cont roller
Segment/timing with interna l pull-down
resistor in common
I/O •Output for VFD display controller Segment
output
•Other functio n
S16 : High voltage input port PC0
S17 : High voltage input port PC1
- -
- TA (*5)
- •Address input
A15 to A0
•PROM
control
signal input
S18 : High voltage input port PC2
S19 : High voltage input port PC3
S20 : High voltage input port PC4
S21 : High voltage input port PC5
S22 : High voltage input port PC6
S23 : High voltage input port PC7
S24 : High voltage input port PD0
S25 : High voltage input port PD1
S26 : High voltage input port PD2
S27 : High voltage input port PD3
S28 : High voltage input port PD4
S29 : High voltage input port PD5
S30 : High voltage input port PD6
S31 : High voltage input port PD7
S32 to S37
*9
I/O •Output for VFD display controller Segment
•Other functio n
- -
S32 : High voltage I/O port PE0
S33 : High voltage I/O port PE1
S34 : High voltage I/O port PE2
S35 : High voltage I/O port PE3
S36 : High voltage I/O port PE4
S37 : High voltage I/O port PE5
RES
XT1/
I Reset pin - I •Input pin for 32.768kHz crystal oscillation
P74
- -
•Other functio n
P74
XT 1 : Input port
In case of non use, connect to VDD1.
XT2/P75 O •Output pin for 32.768kHz crystal
- -
oscillation
•Other functio n
XT 2 : Input port P75
In case of non use, connect to VDD1 at using
as port or unconnect at using as oscillation.
No.6689-8/22
Page 9
LC86P6449
Pin name I/O Function description Option PROM mode
CF1 I Input pin for the ceramic resonator oscillat ion - CF2 O Output pin for the ceramic resonator oscillation - -
♦ All of port options except the pull-up resistor option of port 0 can be specified in a bit unit.
*1 Memory select input for data security
*2 Output enable input
*3 Chip enable input
*4 Connect like the following figure to reduce noise into a VDD1 terminal.
*5 TA ! PROM control signal input
*6 S0/T0 to S6/T6 : not provided the pull-down resistor
*7 S7/T7 to S15/T15 : provided the pull-down resistor (fixed)
*8 S16 to S27 : provided the pull-down resistor (fixed)
*9 S28 to S31 : not provided the pull-down resistor
*10 S32 to S37 : not provided the pull-down resistor
[Notes]
When connecting to the power supply, the power pins must be connected like following figure.
For the LC866448B/44B/40B/36B
Power
Supply
For back-up
LSI
VDD1
VDD2
(VFD power pin)
VSS1 VSS2
For the LC866432A/28A/24A/20A/16A/12A/08A
Power
Supply
For back-up
LSI
VDD1
VDD2
(VFD power pin)
VSS1 VSS2
No.6689-9/22
Page 10
LC86P6449
V
1. Absolute Maximu m Ratings at VSS1=VSS2=0V and Ta=25°C
Parameter Symbol Pins Conditions
Supply voltage VDDMAX VDD1, VDD2 VDD1=VDD2 -0.3 +7.0
Input voltage
VI(1)
•Ports 71,72,73,
RES
•
74
,75,8
-0.3 VDD+0.3
Ratings
DD[V]min. typ. max.
unit
V
VI(2) VP VDD-45 VDD+0.3
Output voltage VO(1) S0/T0 to S15/T15 VDD-45 VDD+0.3
Input/Output
voltage
VIO(1) •Port 1
•Port 70
-0.3 VDD+0.3
•Ports 0, 3 of CMOS
output
VIO(2) Ports 0, 3 of open
-0.3 15
drain output
VIO(3) S16 to S37 VDD-45 VDD+0.3
High
level
output
current
Low
level
output
current
Peak
output
current
Total
output
current
output
current
Total
output
IOPH(1) Ports 0, 1, 3 •CMOS output
•At each pins
IOPH(2) S0/T0 to S15/T1 5 At each pi ns -30
IOPH(3) S16 to S37 At each pins -15 ΣIOAH(1)
IOAH(2)
Σ
ΣIOAH(3)
Ports 0,1,3 The total of all pins -30
S0/T0 to S15/T15 The total of all pins -55
S16 to S37 The total of all pins -115
IOPL(1) Ports 0,1,3 At each pins 20 Peak
IOPL(2) Port 70 At each pins 15
IOAL(1)
Σ
ΣIOAL(2)
Port 0 The total of all pins 40
Ports 1,3 The total of all pins 40
-10
mA
current
Maximum power
dissipation
Operating
Pdmax QFP80E
Ta=-30 to+70°C
480
Topr -30 70
mW
C
°
temperature
range
Storage
Tstg -55 125
temperature
range
No.6689-10/22
Page 11
LC86P6449
2. Recommended Operating Range at Ta=-30°C to +70°C, VSS1=VSS2=0V
Parameter Symbol Pins Conditions
Operating
Supply voltage
VDD(1) VDD1=VDD2
98µs≤tCYC
tCYC≤400µs
Hold voltage VHD VDD1=VDD2 RAMs and t he re gist e r s
hold voltage at HOLD
mode.
Pull-down
VP VP 4.5 to 6.0 -35 VDD
Voltage
Input high
voltage
VIH(1) Port 0 at CMOS
output
VIH(2) Port 0 at open drain
Output disable 4.5 to 6.0 0.33VDD
Output disable 4.5 to 6.0 0.75VDD 13.5
output
VIH(3) •Port 1
Output disable 4.5 to 6.0 0.75VDD VDD
•Ports 72,73
•Port 3 at CMOS
output
VIH(4) •Port 3 at open
Output disable 4.5 to 6.0 0.75VDD 13.5
drain output
VIH(5) •Port 70
Port input/interrupt
Output N-channel
Tr. OFF
•Port 71
RES
•
VIH(6) Port 70
Watchdog timer
VIH(7) •Port 8
74
•Ports
,75
Output N-channel
Tr. OFF
Using as port 4.5 to 6.0 0.75VDD VDD
VIH(8) S16 to S3 7 Output P-channel
Tr. OFF
Input low
voltage
VIL(1) Port 0 at CMOS
output option
VIL(2) Port 0 at open
Output disable 4.5 to 6.0 VSS 0.2VDD
Output disable 4.5 to 6.0 VSS 0.25VDD
drain output
VIL(3) •Ports 1,3
Output disable 4.5 to 6.0 VSS 0.25VDD
•Ports 72,73
VIL(4) •Port 70
Port input/interrupt
Output N-channel
Tr. OFF
•Port 71
RES
•
VIL(5) Port 70
Watchdog timer
VIL(6) •Port 8
•Ports
74
,75
Output N-channel
Tr. OFF
Using as port 4.5 to 6.0 VSS 0.25VDD
VIL(7) S16 to S37 Output P-channel
Tr. OFF
Operation
tCYC 4.5 to 6.0 0.98 400
cycle time
Continue.
Ratings
VDD[V] min. typ. max.
4.5 6.0
2.0 6.0
VDD
+1.0
4.5 to 6.0 0.75VDD VDD
4.5 to 6.0 0.9VDD VDD
4.5 to 6.0
0.
33VDD
VDD
+1.0
4.5 to 6.0 VSS 0.25VDD
4.5 to 6.0 VSS
8VDD
0.
-1.0
4.5 to 6.0 VP 0.2VDD
unit
V
µs
No.6689-11/22
Page 12
LC86P6449
Parameter Symbol Pins Conditions
Oscillation
frequency
range
(Note 1)
FmCF(1) CF1, CF2 •6MHz
(ceramic resonator
oscillation)
•Refer to figure 1
FmCF(2) CF1, CF2 •3MHz
(ceramic resonator
oscillation)
•Refer to figure 1
FmRC RC oscillation 4.5 to 6.0 0.3 0.8 3.0
FsXtal XT1, XT2 •32.768kHz
(crystal oscillation)
•Refer to figure 2
Oscillation
stabilizing
time period
(Note 1)
tmsCF(1) CF1, CF2 •6MHz
(ceramic resonator
oscillation)
•Refer to figure 3
tmsCF(2) CF1, CF2 •3MHz
(ceramic resonator
oscillation)
•Refer to figure 3
tssXtal XT1, XT2 •32.768kHz
(crystal oscillation)
•Refer to figure 3
(Note 1) The oscillation constant is shown on table 1 and table 2.
Ratings
VDD[V] min. typ. max.
4.5 to 6.0 6
unit
MHz
4.5 to 6.0 3
4.5 to 6.0 32.768 kHz
4.5 to 6.0
ms
4.5 to 6.0
4.5 to 6.0 s
No.6689-12/22
Page 13
LC86P6449
3. Electrical Characteristics at Ta=-30°C to +70°C, VSS1=VSS2=0V
Parameter Symbol Pins Conditions
Input high
current
IIH(1) Ports 0,3 at open
drain output
•Output disable
•VIN=13.5V
(including off-leakage
current of output Tr.)
IIH(2) •Ports 1,3
•Port 0 without
pull-up MOS Tr.
•Output disable
•Pull-up MOS Tr. OFF.
•VIN=VDD
(including off-leakage
current of output Tr.)
IIH(3) •Ports 70,71,72,73
VIN=VDD 4.5 to 6.0 1
without pull-up
MOS Tr.
•Por t 8
IIH(4)
IIH(5)
RES
Ports
74
,75
VIN=VDD 4.5 to 6.0 1
Using as port
VIN=VDD
IIH(6) •S28 to S37 •Output disable
•VIN=VDD
Input low
current
IIL(1) •Ports 1,3
•Port 0 without
pull-up MOS Tr.
•Output disable
•Pull-up MOS Tr. OFF.
•VIN=VSS
(including off-leakage
current of output Tr.)
IIL(2) •Ports 70,71,72,73
VIN=VSS 4.5 to 6.0 -1
without pull-up
MOS Tr.
•Por t 8
IIL(3)
IIL(4)
RES
Ports
74
,75
VIN=VSS 4.5 to 6.0 -1
Using as port
VIN=VSS
Output high
voltage
VOH(1) IOH=-1.0mA 4.5 to 6.0 VDD-1
VOH(2)
VOH(3) IOH=-20mA 4.5 to 6.0 VDD-1.8
VOH(4)
Ports 0,1,3 of
CMOS output
S0/T0 to S15 / T15
IOH=-0.1mA 4.5 to 6.0 VDD-0.5
•IOH=-1.0mA
•The current of these each
pins is not over 1mA.
VOH(5) IOH=-5mA 4.5 to 6.0 VDD-1.8
VOH(6)
S16 to S37
•IOH=-1.0mA
•The current of these each
pins is not over 1mA.
Output low
voltage
VOL(1) IOL=10mA 4.5 to 6.0 1.5
VOL(2) IOL=1.6mA 4.5 to 6.0 0.4
VOL(3)
Ports 0,1,3
•IOL=1mA
•The current of these each
pins is not over 1mA.
VOL(4) Port 70 IOL =1mA 4.5 to 6.0 0.4
Pull-up MOS
Tr. resistor
Rpu •Ports 0,1,3
•Ports 70,71,72,73
VOH=0.9VDD 4.5 to 6.0 15 40 70
Continue.
Ratings
VDD[V] min. typ. max.
4.5 to 6.0 5
4.5 to 6.0 1
4.5 to 6.0 1
4.5 to 6.0 1
4.5 to 6.0 -1
4.5 to 6.0 -1
4.5 to 6.0 VDD-1
4.5 to 6.0 VDD-1
4.5 to 6.0 0.4
unit
µA
V
kΩ
No.6689-13/22
Page 14
LC86P6449
Parameter Symbol Pins Conditions
IOFF(1) •Output P-channel
leakage current
IOFF(2)
•S0/T0 to S6/T6
•S28 to S37
(without pull-down
resistor)
Tr. OFF
•VOUT=VSS
•Output P-channel
Tr. OFF
•VOUT=VDD-40V
‘L’ level hold Tr.
of high voltage
Rinpd S16 to S37 Output P-channel
Tr. OFF
withstand input
pull-down
transistor resistor
Hysteresis
voltage
Rpd •S7/T7 to S15/T15
•S16 to S27
(without pull-down
resistor)
VHIS •Port 1
•Ports 70,71,72,73
RES
•
•Output P-channel
Tr. OFF
•VOUT=3V
•Vp=-30V
Output disable 4.5 to 6.0 0.1VDD V
Pin capacitance CP All pins •f=1MHz
•VIN=VSS for all
unmeasured terminals.
•Ta=25°C
4. Serial Input/output Characteristics at Ta=-30°C to +70°C, VSS1=VSS2=0V
Parameter Symbol Pins Conditions
Cycle tCKCY(1) 2
Low Level
tCKL(1) 1
SCK0,S CK1 Refer to figure 5 4.5 to 6.0
VDD[V] min. typ. max.
pulse width
High Level
Input clock
pulse width
Cycle tCKCY(2) 2
Serial clock
Low Level
pulse width
High Level
Output clock
pulse width
Data set-up time
Data hold time
Serial input
Output delay time
(External clock
using for serial
transfer clock)
Output delay time
(Internal clock
Serial output
using for serial
tCKH(1)
SCK0,SCK1 •Use pull-up
tCKL(2) 1/2tCKCY
resistor (1kΩ)
4.5 to 6.0
in the open drain
tCKH(2)
output.
•Refer to figure 5
tICK 0.1
•SI0,SI1
•SB0,SB1
•Data set-up to
SCK0,1
4.5 to 6.0
•Data hold from
tCKI
SCK0,1
•Refer to figure 5
tCKO(1) 7/12
•SO0,SO1
•SB0,SB1
•Use pull-up
resistor (1kΩ) in
4.5 to 6.0
the open drain
output.
tCKO(2)
•Data hold from
SCK0,1
•Refer to figure 5
transfer clock)
Ratings
VDD[V] min. typ. max.
4.5 to 6.0 -1 Output off-
unit
A
µ
4.5 to 6.0 -30
4.5 to 6.0 400
5.0 60 100 200
kΩ
kΩ
4.5 to 6.0 10 pF
Ratings
unit
tCYC
1
1/2tCKCY
s
µ
0.1
tCYC
+0.2
1/3
tCYC
+0.2
No.6689-14/22
Page 15
LC86P6449
5. Pulse Input Conditions at Ta=-30°C to +70°C, VSS1=VSS2=0V
Parameter Symbol Pins Conditions
High/low level
pulse width
tPIH(1)
tPIL(1)
tPIH(2)
tPIL(2)
•INT0, INT1
•INT2/T0IN
INT3/T0IN
(The noise rejection clock
•Interrupt acceptable
•Timer0-countable
•Interrupt acceptable
•Timer0-countable
Ratings
VDD[V] min. typ. max.
4.5 to 6.0 1
4.5 to 6.0 2
unit
tCYC
selected to 1/1.)
tPIH(3)
tPIL(3)
INT3/T0IN
(The noise rejection clock
•Interrupt acceptable
•Timer0-countable
4.5 to 6.0 32
selected to 1/16.)
tPIH(4)
tPIL(4)
INT3/T0IN
(The noise rejection clock
•Interrupt acceptable
•Timer0-countable
4.5 to 6.0 128
selected to 1/64.)
tPIL(5)
RES
Reset acceptable 4.5 to 6.0 200
µs
6. AD Converter Characteristics at Ta=-30°C to + 70°C, VSS1=VSS2=0V
Parameter Symbol Pins Conditions
Ratings
VDD[V] min. typ. max.
unit
Resolution N 4.5 to 6.0 8 bit
Absolute precision
ET 4.5 to 6.0 ±1.5 LSB
(Note 2)
Conversion time tCAD
AD conversion time =
16 × tCYC
(ADCR2=0)
4.5 to 6.0
68
15.
(tCYC=
0.98µs)
65.28
(tCYC=
4.08µs)
µs
(Note 3)
AD conversion time =
32 × tCYC
(ADCR2=1)
31.36
(tCYC=
0.98µs)
130.56
(tCYC=
4.08µs)
(Note 3)
Analog input
VAIN 4.5 to 6.0 VSS VDD V
AN0 to AN7
voltage range
input current
IAINH VAIN=VDD 4.5 to 6.0 1 Analog port
IAINL
VAIN=VSS 4.5 to 6.0 -1
A
µ
(Note 2) Absolute precision excepts the quantizing error (±1/2 LSB).
(Note 3) The conversion time means the time from executing the AD conversion instruction to setting the complete digital
conversion value to the register.
No.6689-15/22
Page 16
LC86P6449
7. Current Dissipation Characteristics at Ta=-30°C to +70°C, VSS1=VSS2=0V
Parameter Symbol Pins Conditions
Current dissipation
during basic
operation
(Note 4)
IDDOP(1) •FmCF=6MHz
Ceramic resonator
oscillation
•FsXtal=32.768kHz
Ratings
VDD[V] min. typ. max.
4.5 to 6.0 14 33
crystal oscillation
•System clock :
CF oscillation
•Internal RC
oscillation stops
•1/1 divided
IDDOP(2) •FmCF=3MHz
4.5 to 6.0 6 18
Ceramic resonator
oscillation
•FsXtal=32.768kHz
crystal oscillation
•System clock :
CF oscillation
•Internal RC
oscillation stops
•1/2 divided
IDDOP(3) •FmCF=0Hz
4.5 to 6.0 4 13
(The oscillation
stops)
•FsXtal=32.768kHz
crystal oscillation
•System clock :
RC oscillation
•1/2 divided
IDDOP(4)
•FmCF=0Hz
4.5 to 6.0 3 10
(The oscillation
stops)
•FsXtal=32.768kHz
crystal oscillation
•System clock :
32.768kHz
•Internal RC
oscillation stops
•1/2 divided
Continue.
unit
mA
No.6689-16/22
Page 17
LC86P6449
Parameter Symbol Pins Conditions
Current dissipation
in HALT mode
(Note 4)
IDDHALT(1) •HALT mode
•FmCF=6MHz
Ceramic resonator
Ratings
VDD[V] min. typ. max.
4.5 to 6.0 5 14
oscillation
•FsXtal=32.768kHz
crystal oscillation
•System clock :
CF oscillation
•Internal RC
oscillation stops
•1/1 divided
IDDHALT(2) •HALT mode
4.5 to 6.0 2.2 7
•FmCF=3MHz
Ceramic resonator
oscillation
•FsXtal=32.768kHz
crystal oscillation
•System clock :
CF oscillation
•Internal RC
oscillation stops
•1/2 divided
IDDHALT(3) •HALT mode
4.5 to 6.0 400 1600
FmCF=0Hz
(The oscillation
stops)
•FsXtal=32.768kHz
crystal oscillation
•System clock :
RC oscillation
•1/2 divided
IDDHALT(4)
•HALT mode
4.5 to 6.0 25 100
FmCF=0Hz
(The oscillation
stops)
•FsXtal=32.768kHz
crystal oscillation
•System clock :
crystal oscillation
•Internal RC
oscillation stops
•1/2 divided
Current dissipation
in HOLD mode
IDDHOLD(1) HOLD mode
4.5 to 6.0 0.05 30
(Note 4)
(Note 4) The currents of the output transistors and the pull-up MOS transistors are ignored.
* Both C3 and C4 must be use J rank (±5%) and CH characteristics.
(Not in need of high precision, use K rank (±10%) and SL characteristics.)
(Notes) • Please place the oscillation-related parts as close to the oscillation pins as possible with the shortest
possible pattern length since the circuit pattern affects the oscillation frequency.
• If you use other oscillators herein, we provide no guarantee for the characteristics.
sure to reset until 200µs, after Power
supply has be en over inferior limit of
RES
C
supply voltage.
Figure 4 Reset circuit
<AC timing point>
0.5VDD
tCKCY
VDD
SCK0
SCK1
SI0
SI1
SO0, SO1
SB0, SB1
tCKL tCKH
tICK tCKI
tCKO
<Timing>
1kΩ
50pF
<Test load>
Figure 5 Serial input / output test condition
tPIL tPIH
Figure 6 Pulse input timing condition
No.6689-20/22
Page 21
LC86P6449
Notice for use
The construction of the one-time programmable microcomputer with a blank built-in PROM makes it impossible for Sanyo to
•
completely factory-test it before shipping. To probe reliability of the programmed devices, the screening procedure shown
in the following figure should always be followed.
It is not possible to perform a writing test on the blank PROM. 100% yield, therefore, cannot be guaranteed.
•
Keeping the dry packing
•
The environment must be held at a temperature of 30°C or less and a humidity level of 70% or less.
After openi ng the packing
•
The preparation procedures shown in the following figure should always be followed prior to mounting the packages on the
substrate. After opening the packing, a controlled environment must be maintained until soldering. The environment
must be held at a temperature of 30°C or less and a humidity level of 70% or less. Please solder within 96 hours.
Unused devices should be kept in the dry atmosphere such as inside of desiccator or dry these up before assembling on the
board.
a. Shipping with a blank PROM b. Shipping with a programmed PROM
(Programming the data by yourself) (Programming the data by Sanyo)
Writing data for program/Verifying
Recommended process of screening
Reading ascertation of program
DIP
Heat-soak
Mounting
+1
-0
150±5°C, 24 Hr
VDD=5±0.5V
QFP
Mounting
No.6689-21/22
Page 22
memo:
LC86P6449
No.6689-22/22
PS
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.