Datasheet L-934SURDK Specification

L-934SURDK

T-1 (3mm) Solid State Lamp

DESCRIPTIONS

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The Hyper Red source color devices are made with

AlGaInP on GaAs substrate Light Emitting Diode

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Electrostatic discharge and power surge could

damage the LEDs

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It is recommended to use a wrist band or

anti-electrostatic glove when handling the LEDs

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All devices, equipments and machineries must be

electrically grounded

FEATURES

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Low power consumption

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Popular T-1 diameter package

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General purpose leads

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Reliable and rugged

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Long life - solid state reliability

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Available on tape and reel

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RoHS compliant

APPLICATIONS

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Status indicator

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Illuminator

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Signage applications

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Decorative and entertainment lighting

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Commercial and residential architectural lighting

ATTENTION

Observe precautions for handling electrostatic discharge sensitive devices

PACKAGE DIMENSIONS

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ±0.25(0.01") unless otherwise noted.

3. Lead spacing is measured where the leads emerge from the package.

4. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.

SELECTION GUIDE

Part Number

L-934SURDK

Notes:

1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.

2. Luminous intensity / luminous flux: +/-15%. * Luminous intensity value is traceable to CIE127-2007 standards.

Emitting Color

(Material)

■

Hyper Red (AlGaInP)

Lens Type

Red Diffused

Iv (mcd) @ 20mA

[2]

Viewing Angle

Min. Typ. 2θ1/2

400 900

50°

*120 *240

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[1]

ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C

Parameter Symbol Emitting Color

Value

Typ. Max.

L-934SURDK

Unit

Wavelength at Peak Emission I

Dominant Wavelength I

F

Spectral Bandwidth at 50% Φ REL MAX I

= 20mA

F

= 20mA λ

F

= 20mA λ

Hyper Red 645 - nm

peak

[1]

dom

∆λ

Hyper Red 630 - nm

Hyper Red 28 - nm

Capacitance C Hyper Red 35 - pF

Forward Voltage I

Reverse Current (V

Temperature Coefficient of λ I

= 20mA, -10°C ≤ T ≤ 85°C

F

Temperature Coefficient of λ I

= 20mA, -10°C ≤ T ≤ 85°C

F

Temperature Coefficient of V I

= 20mA, -10°C ≤ T ≤ 85°C

F

Notes:

1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )

2. Forward voltage: ±0.1V.

3. Wavelength value is traceable to CIE127-2007 standards.

4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.

= 20mA V

F

= 5V) IR Hyper Red - 10 µA

R

peak

dom

F

[2]

Hyper Red 1.95 2.5 V

F

TC

Hyper Red 0.14 - nm/° C

λpeak

TC

Hyper Red 0.05 - nm/° C

λdom

TCV Hyper Red -1.9 - mV/ °C

ABSOLUTE MAXIMUM RATINGS at TA=25°C

Parameter

Symbol

Value

Power Dissipation PD 75 mW

Reverse Voltage VR 5 V

Junction Temperature

Tj 115 °C

Operating Temperature Top -40 To +85 °C

Storage Temperature T

-40 To +85 °C

stg

DC Forward Current IF 30 mA

Peak Forward Current I

Electrostatic Discharge Threshold (HBM)

Thermal Resistance (Junction / Ambient) Rth JA

Thermal Resistance (Junction / Solder point) Rth JS

Lead Solder Temperature

Notes:

1. 1/10 Duty Cycle, 0.1ms Pulse Width.

2. Rth JA ,Rth

3. 2mm below package base.

4. 5mm below package base.

5. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.

Res ults from mounti ng o n PC b oar d F R4 (pad siz e ≥ 16 mm2 pe r p ad).

JS

[3]

[4]

[1]

185 mA

FM

-

[2]

3000 V

670 °C/W

440 °C/W

260°C For 3 Seconds

260°C For 5 Seconds

Unit

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TECHNICAL DATA

RELATIVE INTENSITY vs. WAVELENGTH

100%

Ta = 25 °C

80%

60%

40%

20%

Relative Intensity (a. u.)

0%

350 400 450 500 550 600 650 700 7 50 800

Forward Current vs. Forward Voltage

50

Ta = 25 °C

40

Wavelength (nm)

Luminous Intensity vs. Forward Current

2.5

2.0

Ta = 25 °C

HYPER RED

50

40

SPATIAL DISTRIBUTION

Ta = 25 °C

-45°

-60°

-75°

-90°

1.0 1.0

Forward Current Derating Curve

-15°

-30°

0.5 0.50.0

2.5

2.0

L-934SURDK

0°

15°

30°

Luminous Intensity vs. Ambient Temperature

45°

60°

75°

90°

30

20

Forward current (mA)

10

0

1.5 1.7 1.9 2.1 2.3 2.5 Forward voltage (V)

20 mA

Luminous intensity normalised at

RECOMMENDED WAVE SOLDERING PROFILE

1.5

1.0

0.5

0.0 0 10 20 30 40 50

Forward current (mA)

30

20

10

Permissible forward current (mA)

0

-40 -20 0 20 40 60 80 100 Ambient temperature (°C)

Notes:

1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath temperature of 260°C

2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max).

3. Do not apply stress to the epoxy resin while the temperature is above 85°C.

4. Fixtures should not incur stress on the component when mounting and during soldering process.

5. SAC 305 solder alloy is recommended.

6. No more than one wave soldering pass.

1.5

1.0

Ta = 25 °C

0.5

Luminous intensity normalised at

0.0

-40 -20 0 20 40 60 80 100 Ambient temperature (°C)

PACKING & LABEL SPECIFICATIONS

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L-934SURDK

PRECAUTIONS

Storage conditions

1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient temperature.

2. LEDs should be stored with temperature ≤ 30°C and relative humidity < 60%.

3. Product in the original sealed package is recommended to be assembled within 72 hours of opening.

Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C.

LED Mounting Method

1. The lead pitch of the LED must match the pitch of the mounting holes on the PCB during component placement.

Lead-forming may be required to insure the lead pitch matches the hole pitch. Refer to the figure below for proper lead forming procedures.

Note 1-3: Do not route PCB trace in the contact area between the leadframe and the PCB to prevent short-circuits.

2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact. Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the internal structures and cause failure.

" ○"

Correct mounting method

" x "

Incorrect mounting method

3. Use stand-offs

(Fig.1)

or spacers

(Fig.2)

to securely position the LED above the PCB.

4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead bend

(Fig. 3 ,Fig. 4)

.

5. During lead forming, use tools or jigs to hold the leads securely so that the bending force will not be transmitted to the LED lens and its internal structures. Do not perform lead forming once the component has been mounted onto the PCB.

(Fig. 5 )

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Lead Forming Procedures

1. Do not bend the leads more than twice.

2. During soldering, component covers and holders should leave clearance to avoid placing damaging stress on the LED during soldering.

(Fig. 7)

3. The tip of the soldering iron should never touch the lens epoxy.

4. Through-hole LEDs are incompatible with reflow soldering.

5. If the LED will undergo multiple soldering passes or face other

processes where the part may be subjected to intense heat, please check with Kingbright for compatibility.

(Fig. 6 )

L-934SURDK

PRECAUTIONARY NOTES

1. The information included in this document refl ects representative usage scenarios and is intended for technical reference only.

2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specificati ons.

3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electri cal limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.

4. The information in this document appl ies to typical usage in consumer electronics applications. If customer's appl ication has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.

5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.

6. All design applications should refer to Kingbri ght application notes available at https://www.Kingbright.com/application_notes

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