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SEMICONDUCTOR
TECHNICAL DATA
KMB014P30QA
P-Ch Trench MOSFET
Revision No : 1
GENERAL DESCRIPTION
This Trench MOSFET has better characteristics, such as fast switching time, low
on resistance, low gate charge and excellent avalanche characteristiscs. It is mainly
suitable for Battery pack.
FEATURES
V
DSS
=-30V, ID=-14A.
Drain-Source ON Resistance.
R
DS(ON)
=12m (Max.) @ VGS=-10V
R
DS(ON)
=18m (Max.) @ VGS=-4.5V
Super High Dense Cell Design
MOSFET Maximum Ratings (Ta=25 Unless otherwise noted)
B2
G
H
B1
1
4
5
8
A
P
D
L
T
FLP-8
0.20+0.1/-0.05T
P
1.27
MILLIMETERSDIM
A
4.85 0.2
+
_
B1
3.94 0.2
+
_
B2
6.02 0.3
+
_
D
0.4 0.1
+
_
G
0.15+0.1/-0.05
H
1.63 0.2
+
_
L
0.65 0.2
+
_
Note : *Surface Mounted on FR4 Board
CHARACTERISTIC SYMBOL PATING UNIT
Drain Source Voltage
V
DSS
-30 V
Gate Source Voltage
V
GSS
20
V
Drain Current
DC
ID*
-14 A
Pulsed
I
DP
-70 A
Drain Source Diode Forward Current
I
S
-1.7 A
Drain Power Dissipation
PD*
2.5
W
Maximum Junction Temperature
T
j
150
Storage Temperature Range
T
stg
-55~150
Thermal Resistance, Junction to Ambient
R
thJA
*
50
/W
PIN CONNECTION (TOP VIEW)
KMB014P
30QA
706
S
S
S
G
8
D
7
D
6
D
D
5
1
2
3
4
1
2
3
4
8
7
6
5

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KMB014P30QA
Revision No : 1
ELECTRICAL CHARACTERISTICS (Ta=25 ) UNLESS OTHERWISE NOTED
CHARACTERISTIC SYMBOL TEST CONDITION MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage
BV
DSS
IDS=-250 A, VGS=0V
-30 - - V
Drain Cut-off Current
I
DSS
VDS=-24V, VGS=0V
- - -1
A
Gate Leakage Current
I
GSS
VGS= 25V, VDS=0V
- -
100
nA
Gate Threshold Voltage
V
th
VDS=V
GS, ID
=-250 A
-1.4 -1.9 -2.6 V
Drain-Source ON Resistance
R
DS(ON)*
VGS=-10V, ID=-12A
- 8.5 12.0
m
VGS=-4.5V, ID=-10A
- 12 18
On-State Drain Current
I
D(ON)*
VDS=-5V, VGS=-10V
-50 - - A
Forward Transconductance
G
fs*
VDS=-5V, ID=-10A
- 14 - S
Dynamic
Input Capaclitance
C
iss
VDS=15V, VGS=0V, f=1MHz
- 3625 -
pFOuput Capacitance
C
oss
- 980 -
Reverse Transfer Capacitance
C
rss
- 705 -
Total Gate Charge
Q
g*
VDS=-15V, VGS=-10V, ID=-12A
- 65.5 -
nC
VDS=-15V, VGS=-4.5V, ID=-12A
- 32.6 -
Gate-Source Charge
Q
gs*
VDS=-15V, VGS=-10V, ID=-12A
- 10.9 -
Gate-Drain Charge
Q
gd*
- 17.5 -
Turn-On Delay Time
t
d(on)*
VDD=-15V, VGS=-10V
R
L
=12A, RG=3
- 48.5 -
ns
Turn-On Rise Time
t
r*
- 20.3 -
Turn-Off Delay Time
t
d(off)*
- 110.8 -
Turn-Off Fall Time
t
f*
- 52.8 -
Source-Drain Diode Ratings
Source-Drain Forward Voltage
V
SDF*
VGS=0V, IDR=-1.7A,
- -0.73 -1.2 V
Note
1. Pulse Test : Pulse width 10 , Duty cycle 1%

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KMB014P30QA
Revision No : 1
25
20
(A)
D
15
10
Drain Current I
6000
5000
4000
-VGS=10V
5
0
0
0.5
C
iss
Fig 1. ID - V
-VGS=4V
-VGS=4.5V
1.0 1.5 2.0 2.5 3.0
DS
-VGS=3.5V
-VGS=3V
Drain - Source Voltage VDS (V)
Fig 3. C - V
DS
25
20
(A)
D
15
10
Drain Current I
5
0
1.8
VGS =-10V
= -12A
I
D
1.6
1.4
Fig 2. ID - V
1.2 2.403.60.6 1.8 3.0
125
25
GS
C
C
Gate - Source Voltage VGS (V)
Fig 4. R
DS(ON)
- T
j
-55
C
3000
2000
C
Capacitance (pF)
1000
oss
C
rss
0
1505 20 30
10
Drain - Source Voltage V
Fig 5. Vth - T
1.3
th
1.2
1.1
1.0
0.9
0.8
0.7
Normalized Threshold Voltage V
0.6
-50 -25
05010025
j
25
(V)
DS
VDS = V
IDS = 250µA
1.2
1.0
0.8
Normalized On Resistance
0.6
-55 -25 25 50 75 1251000
Junction Temperature Tj ( )
Fig 6. IDR - V
20
GS
12575
(A)
Reverse Source-Drain Current I
VGS = 0V
DR
10
1
0.2 0.8 1.20.6 1.00.4
C
SD
Junction Temperature Tj ( )
C
Source-Drain Forword Voltage V
SDF
(V)

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KMB014P30QA
Revision No : 1
Fig 7. Qg - V
10
V
= -15V
DS
ID = -12A
(V)
GS
Gate - Source Voltage V
8
6
4
2
0
0
22
11
Total Gate Charge
0
10
GS
2
10
1
10
(A)
D
0
10
Operation in this
area is limited by R
-1
10
Drain Current I
-2
10
-1
33
44
55
8866
77
10
Qg (nC)
Fig8. Safe Operation Area
DS(ON)
VGS= 10V
SINGLE PULSE
0
10
Drain - Source Voltage V
10
1ms
10ms
100ms
1s
10s
DC
1
2
10
(V)
DS
10
3
Fig9. Transient Thermal Response Curve
Duty Cycle = 0.5
0.2
-1
10
0.1
0.05
0.02
-2
10
-4
10
Single Pluse
-3
10
-2
10
Normalized Transient Thermal Resistance
-1 10
10
0
Square Wave Pulse Duration (sec)
P
DM
t
1
1. Duty Cycle, D =
2. Per Unit Base = R
1
10
10
t
2
θJA
2
t
1
t
2
= 50 C/W
10
3