Datasheet KM44C4105CSL-6, KM44C4105CSL-5, KM44C4105CS-6, KM44C4105CKL-5, KM44C4105CK-6 Datasheet (Samsung)

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Page 1
CMOS DRAMKM44C4005C, KM44C4105C
This is a family of 4,194,304 x 4 bit Quad CAS with Extended Data Out Mode CMOS DRAMs. Extended Data Out Mode offers high speed random access of memory cells within the same row, so called Hyper Page Mode. Refresh cycle (2K Ref. or 4K Ref.), access time (-5 or -6), power consumption(Normal or Low power) and package type(SOJ or TSOP-II) are optional features of this family. All of this family have CAS-before-RAS refresh, RAS-only refresh and Hidden refresh capabilities. Furthermore, Self-refresh operation is avail­able in L-version. Four separate CAS pins provide for seperate I/O operation allowing this device to operate in parity mode. This 4Mx4 Extended Data Out Quad CAS DRAM family is fabricated using Samsungs advanced CMOS process to realize high band­width, low power consumption and high reliability.
Part Identification
- KM44C4005C/C-L (5V, 4K Ref.)
- KM44C4105C/C-L (5V, 2K Ref.)
Extended Data Out mode operation (Fast Page Mode with Extended Data Out)
Four separate CAS pins provide for separate I/O operation
CAS-before-RAS refresh capability
RAS-only and Hidden refresh capability
Self-refresh capability (L-ver only)
Fast parallel test mode capability
TTL compatible inputs and outputs
Early Write or output enable controlled write
JEDEC Standard pinout
Available in Plastic SOJ and TSOP(II) packages
Single +5V±10% power supply
Control Clocks
RAS
CAS0 - 3
W
Vcc Vss
DQ0
to
DQ3
A0-A11
(A0 - A10)*1
A0 - A9
(A0 - A10)*1
Memory Array
4,194,304 x 4
Cells
SAMSUNG ELECTRONICS CO., LTD. reserves the right to change products and specifications without notice.
4M x 4Bit CMOS Quad CAS DRAM with Extended Data Out
DESCRIPTION
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Refresh Cycles Part
NO.
Refresh
cycle
Refresh period
Normal L-ver
C4005C 4K 64ms
128ms
C4105C 2K 32ms
Performance Range
Speed
tRAC tCAC tRC tHPC
-5 50ns 13ns 84ns 20ns
-6 60ns 15ns 104ns 25ns
Active Power Dissipation
Speed
Refresh Cycle
4K 2K
-5 495 605
-6 440 550
Unit : mW
Sense Amps & I/O
Data out
Buffer
Data in
Buffer
OE
Note) *1 : 2K Refresh
Col. Address Buffer
Row Address Buffer
Refresh Counter
Refresh Control
Refresh Timer
Column Decoder
Row Decoder
VBB Generator
Page 2
CMOS DRAMKM44C4005C, KM44C4105C
PIN CONFIGURATION (Top Views)
Pin Name Pin Function
A0 - A11 Address Inputs (4K Product) A0 - A10 Address Inputs (2K Product)
DQ0 - 3 Data In/Out
VSS Ground
RAS Row Address Strobe
CAS0~CAS3 Column Address Strobe
W Read/Write Input
OE Data Output Enable VCC Power(+5.0V) N.C No Connection
VCC DQ0 DQ1
W
RAS
*A11(N.C)
CAS0 CAS1
A10
A0 A1 A2 A3
VCC
VSS DQ3 DQ2 CAS3 OE A9 CAS2 N.C A8 A7 A6 A5 A4 VSS
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
VCC DQ0 DQ1
W
RAS
*A11(N.C)
CAS0 CAS1
A10
A0 A1 A2 A3
VCC
VSS DQ3 DQ2 CAS3 OE A9 CAS2 N.C A8 A7 A6 A5 A4 VSS
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
*A11 is N.C for KM44C4105C(5V, 2K Ref. product) K : 300mil 28 SOJ
S : 300mil 28 TSOP II
•KM44C40(1)05CK
•KM44C40(1)05CS
Page 3
CMOS DRAMKM44C4005C, KM44C4105C
ABSOLUTE MAXIMUM RATINGS
* Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded. Functional operation should be restricted
to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameter Symbol Rating Units
Voltage on any pin relative to VSS VIN,VOUT -1.0 to +7.0 V Voltage on VCC supply relative to VSS VCC -1.0 to +7.0 V Storage Temperature Tstg -55 to +150 °C Power Dissipation PD 1 W Short Circuit Output Current IOS 50 mA
RECOMMENDED OPERATING CONDITIONS (Voltage referenced to Vss, TA= 0 to 70°C)
*1 : VCC+2.0V/20ns, Pulse width is measured at VCC *2 : -2.0/20ns, Pulse width is measured at VSS
Parameter Symbol Min Typ Max Units
Supply Voltage VCC 4.5 5.0 5.5 V Ground VSS 0 0 0 V Input High Voltage VIH 2.4 -
VCC+1.0
*1
V
Input Low Voltage VIL
-1.0
*2
- 0.8 V
DC AND OPERATING CHARACTERISTICS (Recommended operating conditions unless otherwise noted.)
Parameter Symbol Min Max Units
Input Leakage Current (Any input 0≤VIN≤VIN+0.5V, all other input pins not under test=0 Volt)
II(L) -5 5 uA
Output Leakage Current (Data out is disabled, 0V≤VOUT≤VCC)
IO(L) -5 5 uA
Output High Voltage Level(IOH=-5mA) VOH 2.4 - V Output Low Voltage Level(IOL=4.2mA) VOL - 0.4 V
Page 4
CMOS DRAMKM44C4005C, KM44C4105C
*Note :
ICC1, ICC3, ICC4 and ICC6 are dependent on output loading and cycle rates. Specified values are obtained with the output open. ICC is specified as an average current. In ICC1, ICC3 and ICC6 address can be changed maximum once while RAS=VIL. In ICC4, address can be changed maximum once within one Hyper page mode cycle time, tHPC.
DC AND OPERATING CHARACTERISTICS (Continued)
ICC1* : Operating Current (RAS and CAS cycling @tRC=min.) ICC2 : Standby Current (RAS=CAS=W=VIH) ICC3* : RAS-only Refresh Current (CAS=VIH, RAS cycling @tRC=min.) ICC4* : Hyper Page Mode Current (RAS=VIL, CAS, Address cycling @tHPC=min.) ICC5 : Standby Current (RAS=CAS=W=VCC-0.2V) ICC6* : CAS-Before-RAS Refresh Current (RAS and CAS cycling @tRC=min.) ICC7 : Battery back-up current, Average power supply current, Battery back-up mode Input high voltage(VIH)=VCC-0.2V, Input low voltage(V IL)=0.2V, CAS=0.2V, DQ=Dont care, TRC=31.25us(4K/L-ver), 62.5us(2K/L-ver), TRAS=TRASmin~300ns ICCS : Self Refresh Current RAS=CAS=0.2V, W=OE=A0 ~ A11=VCC-0.2V or 0.2V, DQ0 ~ DQ3=VCC-0.2V, 0.2V or Open
Symbol Power Speed
Max
Units
KM44C4005C KM44C4105C
ICC1 Dont care
-5
-6
90 80
110 100
mA mA mA
ICC2
Normal
L
Dont care
2 1
2 1
mA mA
ICC3 Dont care
-5
-6
90 80
110 100
mA mA mA
ICC4 Dont care
-5
-6
80 70
90 80
mA mA mA
ICC5
Normal
L
Dont care
1
250
1
250
mA
uA
ICC6 Dont care
-5
-6
90 80
110 100
mA mA
mA ICC7 L Dont care 300 300 uA ICCS L Dont care 250 250 uA
Page 5
CMOS DRAMKM44C4005C, KM44C4105C
CAPACITANCE (TA=25°C, VCC=5V, f=1MHz)
Parameter Symbol Min Max Units
Input capacitance [A0 ~ A11] CIN1 - 5 pF Input capacitance [RAS, CASx, W, OE] CIN2 - 7 pF Output capacitance [DQ0 - DQ3] CDQ - 7 pF
Test condition : VCC=5.0V±10%, Vih/Vil=2.4/0.8V, Voh/Vol=2.0/0.8V
Parameter Symbol
-5 -6 Units Notes
Min Max Min Max
Random read or write cycle time
tRC
84 104 ns
Read-modify-write cycle time
tRWC
106 140 ns
Access time from RAS
tRAC
50 60 ns 3,4,10
Access time from CAS
tCAC
13 15 ns 3,4,5,20
Access time from column address
tAA
25 30 ns 3,10
CAS to output in Low-Z
tCLZ
3 3 ns 3,20
Output buffer turn-off delay from CAS
tCEZ
3 13 3 15 ns 6,13
OE to output in Low-Z
tOLZ
3 3 ns 3
Transition time (rise and fall)
tT
2 50 2 50 ns 2
RAS precharge time
tRP
30 40 ns
RAS pulse width
tRAS
50 10K 60 10K ns
RAS hold time
tRSH
13 15 ns 16
CAS hold time
tCSH
38 45 ns 19
CAS pulse width
tCAS
8 10K 10 10K ns 25
RAS to CAS delay time
tRCD
20 37 20 45 ns 4,18
RAS to column address delay time
tRAD
15 25 15 30 ns 10
CAS to RAS precharge time
tCRP
5 5 ns 17
Row address set-up time
tASR
0 0 ns
Row address hold time
tRAH
10 10 ns
Column address set-up time
tASC
0 0 ns 18
Column address hold time
tCAH
8 10 ns 18
Column address to RAS lead time
tRAL
25 30 ns
Read command set-up time
tRCS
0 0 ns
Read command hold time referenced to CAS
tRCH
0 0 ns 8,17
Read command hold time referenced to RAS
tRRH
0 0 ns 8
Write command hold time
tWCH
10 10 ns 16
Write command pulse width
tWP
10 10 ns
Write command to RAS lead time
tRWL
13 15 ns
Write command to CAS lead time
tCWL
8 10 ns 19
AC CHARACTERISTICS (0°CTA70°C, See note 1,2)
Page 6
CMOS DRAMKM44C4005C, KM44C4105C
AC CHARACTERISTICS (Continued)
Parameter Symbol
-5 -6 Units Notes
Min Max Min Max
Data set-up time
tDS
0 0 ns 9
Data hold time
tDH
8 10 ns 9
Refresh period (2K, Normal)
tREF
32 32 ms
Refresh period (4K, Normal)
tREF
64 64 ms
Refresh period (L-ver)
tREF
128 128 ms
Write command set-up time
tWCS
0 0 ns 7,18
CAS to W delay time
tCWD
30 34 ns 7,16
RAS to W delay time
tRWD
67 79 ns 7
Column address to W delay time
tAWD
42 49 ns 7
CAS precharge to W delay time
tCPWD
47 54 ns 7
CAS set-up time (CAS -before-RAS refresh)
tCSR
5 5 ns 18
CAS hold time (CAS -before-RAS refresh)
tCHR
10 10 ns 17
RAS to CAS precharge time
tRPC
5 5 ns 18
Access time from CAS precharge
tCPA
28 35 ns 3,17
Hyper Page mode cycle time
tHPC
20 24 ns 14,21
Hyper Page read-modify-write cycle time
tHPRWC
62 71 ns 14,21
CAS precharge time (Hyper Page cycle)
tCP
8 10 ns 22
RAS pulse width (Hyper Page cycle)
tRASP
50 200K 60 200K ns
RAS hold time from CAS precharge
tRHCP
30 35 ns
OE access time
tOEA
13 15 ns 23
OE to data delay
tOED
13 15 ns 24
Output buffer turn off delay time from OE
tOEZ
3 13 3 15 ns 6
OE command hold time
tOEH
13 15 ns
Write command set-up time (Test mode in)
tWTS
10 10 ns 11
Write command hold time (Test mode in)
tWTH
10 10 ns 11
W to RAS precharge time(C-B-R refresh)
tWRP
10 10 ns
W to RAS hold time(C-B-R refresh)
tWRH
10 10 ns
Output data hold time
tDOH
5 5 ns
Output buffer turn off delay from RAS
tREZ
3 13 3 15 ns 6,13
Output buffer turn off delay from W
tWEZ
3 13 3 15 ns 6
W to data delay
tWED
15 15 ns
OE to CAS hold time
tOCH
5 5 ns
CAS hold time to OE
tCHO
5 5 ns
OE precharge time
tOEP
5 5 ns
W pulse width (Hyper Page Cycle)
tWPE
5 5 ns
RAS pulse width (C-B-R self refresh)
tRASS
100 100 us 27,28,29
RAS precharge time (C-B-R self refresh)
tRPS
90 110 ns 27,28,29
CAS hold time (C-B-R self refresh)
tCHS
-50 -50 ns 27,28,29
Hold time CAS low to CAS high
tCLCH
5 5 ns 15,26
Page 7
CMOS DRAMKM44C4005C, KM44C4105C
TEST MODE CYCLE
Parameter Symbol
-5 -6 Units Notes
Min Max Min Max
Random read or write cycle time
tRC
89 109 ns
Read-modify-write cycle time
tRWC
121 145 ns
Access time from RAS
tRAC
55 65 ns 3,4,10,12
Access time from CAS
tCAC
18 20 ns 3,4,5,12
Access time from column address
tAA
30 35 ns 3,10,12
RAS pulse width
tRAS
55 10K 65 10K ns
CAS pulse width
tCAS
13 10K 15 10K ns
RAS hold time
tRSH
18 20 ns
CAS hold time
tCSH
43 50 ns
Column address to RAS lead time
tRAL
30 35 ns
CAS to W delay time
tCWD
35 39 ns 7
RAS to W delay time
tRWD
72 84 ns 7
Column address to W delay time
tAWD
47 54 ns 7
CAS precharge to W delay time
tCPWD
52 59 ns 7
Hyper Page mode cycle time
tHPC
25 30 ns 14
Hyper Page read-modify-write cycle time
tHPRWC
52 61 ns 14
RAS pulse width (Hyper Page cycle)
tRASP
55 200K 65 200K ns
Access time from CAS precharge
tCPA
33 40 ns 3
OE access time
tOEA
18 20 ns
OE to data delay
tOED
18 20 ns
OE command hold time
tOEH
18 20 ns
( Note 11 )
Page 8
CMOS DRAMKM44C4005C, KM44C4105C
NOTES
An initial pause of 200us is required after power-up followed by any 8 RAS-only refresh or CAS-before-RAS refresh cycles before proper device operation is achieved. VIH(min) and VIL(max) are reference levels for measuring timing of input signals. Transition times are measured between VIH(min) and VIL(max) and are assumed to be 2ns for all inputs. Measured with a load equivalent to 2 TTL loads and 100pF. Operation within the tRCD(max) limit insures that tRAC(max) can be met. tRCD(max) is specified as a reference point only.
If tRCD is greater than the specified tRCD(max) limit, then access time is controlled exclusively by tCAC. Assumes the tRCDtRCD(max). This parameter defines the time at which the output achieves the open circuit condition and is not referenced to Voh or Vol.
tWCS, tRWD, tCWD, tAWD and tCPWD are non restrictive operating parameters. They are included in the data sheet as electrical
characteristics only. If tWCStWCS(min), the cycle is an early write cycle and the data output will remain high impedance for the duration of the cycle. If tCWDtCWD(min), tRWDtRWD(min), tAWDtAWD(min) and tCPWDtCPWD(min), then the cycle is a read­modify-write cycle and the data output will contain the data read from the selected address. If neither of the above conditions is satisfied, the condition of the data out is indeterminate.
tRCH and tRRH must be satisfied for a read cycle.
These parameters are referenced to the first CAS falling edge in early write cycles and to W falling edge in OE controlled write cycle and read-modify-write cycles. Operation within the tRAD(max) limit insures that tRAC(max) can be met. tRAD(max) is specified as a reference point only. If tRAD is greater than the specified tRAD(max) limit, then access time is controlled by tAA. These specifications are applied in the test mode. In test mode read cycle, the values of tRAC, tAA and tCAC are delayed by 2ns to 5ns for the specified values. These parame­ters should be specified in test mode cycles by adding 5ns to the specified value in this data sheet. If RAS goes high before CAS high going, the open circuit condition of the output is achieved by CAS high going. If CAS goes high before RAS high going, the open circuit condition of the output is achieved by RAS high going.
tASC≥6ns, Assume tT = 2.0ns.
In order to hold the address latched by the first CAS going low, the parameter tCLCH must be met. The last CASx edge to go low. The last CASx edge to go high. The first CASx edge to go low. The first CASx edge to go high. Output parameter is refrenced to corresponding CASx input. The last rising CASx edge to next cycles last rising CASx edge. The last rising CASx edge to first falling CASx edge. The first DQx controlled by the first CASx to go low. The last DQx controlled by the last CASx to go high. Each CASx must meet minimum pulse width. The last falling CASx edge to the first rising CASx edge. If tRASS100us, then RAS precharge time must use tRPS instead of tRP. For RAS-only refresh and burst CAS-before-RAS refresh mode, 4096(4K)/2048(2K) cycles of burst refresh must be executed within 64ms/32ms before and after self refresh, in order to meet refresh specification. For distributed CAS-before-RAS with 15.6us interval, CAS-before-RAS refresh should be executed with in 15.6us immedi­ately before and after self refresh in order to meet refresh specification.
8.
6.
5.
10.
9.
3.
2.
1.
4.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
11.
12.
13.
25.
26.
27.
28.
29.
7.
Page 9
CMOS DRAMKM44C4005C, KM44C4105C
tCRP
RAS
VIH - VIL -
CAS0
VIH - VIL -
A
VIH - VIL -
W
VIH - VIL -
OE
VIH - VIL -
VIH - VIL -
DQ0 ~ DQ3
READ CYCLE
COLUMN
ADDRESS
ROW
ADDRESS
tRAS
tRC
tCRP
tRP
tCSH
tRSHtRCD
tCAS
tRAL
tRAD
tASR tRAH
tASC
tCAH
tAA
tOEA
tCAC
tCLZ
tRAC
OPEN
tRRH
tRCH
Dont care
Undefined
tRCS
tCRP
CAS1
VIH - VIL -
tCRP
CAS2
VIH - VIL -
tCRP
CAS3
VIH - VIL -
tCLCH
tREZ
tOEZ
tCEZ
tWEZ
DATA-OUT
tOLZ
tROH
Page 10
CMOS DRAMKM44C4005C, KM44C4105C
tWCS
WRITE CYCLE ( EARLY WRITE )
NOTE : DOUT = OPEN
A
VIH - VIL -
W
VIH - VIL -
OE
VIH - VIL -
ROW
ADDRESS
tRAL
tRAD
tASR tRAH
tASC
tCAH
tWP
tDS
tDH
tWCH
Dont care
DATA-IN
Undefined
tCRP
RAS
VIH - VIL -
CAS0
VIH - VIL -
tRAS
tRC
tCRP
tRP
tCSH
tRSHtRCD
tCAS
tCRP
CAS1
VIH - VIL -
tCRP
CAS2
VIH - VIL -
tCRP
CAS3
VIH - VIL -
tCLCH
VIH - VIL -
DQ0 ~ DQ3
COLUMN
ADDRESS
tCSH
Page 11
CMOS DRAMKM44C4005C, KM44C4105C
tOED
A
VIH - VIL -
W
VIH - VIL -
OE
VIH - VIL -
VIH - VIL -
DQ0 ~ DQ3
COLUMN
ADDRESS
ROW
ADDRESS
tRAL
tRAD
tASR tRAH
tASC
tCAH
DATA-IN
tWP
Dont care
WRITE CYCLE ( OE CONTROLLED WRITE )
NOTE : DOUT = OPEN
tCWL
tRWL
tDS
tDH
tOEH
Undefined
tCRP
RAS
VIH - VIL -
CAS0
VIH - VIL -
tRAS
tRC
tCRP
tRP
tCSH
tRSHtRCD tCAS
tCRP
CAS1
VIH - VIL -
tCRP
CAS2
VIH - VIL -
tCRP
CAS3
VIH - VIL -
tCLCH
Page 12
CMOS DRAMKM44C4005C, KM44C4105C
W
VIH - VIL -
OE
VIH - VIL -
VIH - VIL -
DQ0 ~ DQ3
VALID
tWP
Dont care
READ - MODIFY - WRTIE CYCLE
tRWL
tCWL
tOEZ
tOED
tAWD
tCWD
DATA-OUT
Undefined
VALID
DATA-IN
tRAC
tAA
tDS
tDH
tCRP
RAS
VIH - VIL -
CAS0
VIH - VIL -
tRAS
tRC
tCRP
tRP
tCSH
tRSHtRCD
tCAS
tCRP
CAS1
VIH - VIL -
tCRP
CAS2
VIH - VIL -
tCRP
CAS3
VIH - VIL -
tCLCH
A
VIH - VIL -
ROW
ADDRESS
tRAL
tRAD
tASR tRAH
tASC
tCAH
tOEA
tRWD
COLUMN
ADDRESS
tCAC
tCLZ
tOLZ
Page 13
CMOS DRAMKM44C4005C, KM44C4105C
DQ0
DQ1
DQ2
DQ3
tRCH
tOEZ
tCLZ
RAS
VIH - VIL -
VIH - VIL -
A
VIH - VIL -
W
VIH - VIL -
OE
VIH - VIL -
VIH - VIL -
COLUMN
ADDRESS
ROW
ADDR
tRHCP
tRASP
tCAS
tASC
tRAD
tASR
tRAH
tCRP
VALID
Don't care
HYPER PAGE MODE READ CYCLE
tOEZ
tRRH
DATA-OUT
Undefined
VALID
DATA-OUT
COLUMN
ADDRESS
COLUMN
ADDRESS
tRSH
tCAS
tRCD
tHPC
¡ó
tCAH
¡ó
¡ó
¡ó
tRCH
¡ó
tRCS tRCS
tRCS
tOEA
tCLZ
tAA
tOEZ
tRAC
tAA
¡ó
¡ó
tCP
tCAS
tRP
tCP
VIH - VIL -
VIH - VIL -
VIH - VIL -
CAS0
CAS1
CAS2
CAS3
¡ó
¡ó
tCLCH
tASC
VIH - VIL -
VIH - VIL -
VIH - VIL -
tHPC
tCPA
tAA
tCPA
tCAC
¡ó
tCLZ
VALID
DATA-OUT
VALID
DATA-OUT
VALID
DATA-OUT
VALID
DATA-OUT
VALID
DATA-OUT
¡ó
VALID
DATA-OUT
tCLCH
tRCH
tOLZ
tCSH tASC
tRAL
tRAC
tCLZ
¡ó
¡ó
tCAH
tCAH
tASC
Page 14
CMOS DRAMKM44C4005C, KM44C4105C
tASC
tCAH
RAS
VIH - VIL -
CAS0
VIH - VIL -
A
VIH - VIL -
W
VIH - VIL -
OE
VIH - VIL -
VIH - VIL -
COLUMN
ADDRESS
ROW
ADDR
tRHCP
tRASP
tCAS
tRAD
tASR tRAH
tASC
tCRP
VALID
Dont care
HYPER PAGE MODE WRITE CYCLE ( EARLY WRITE )
DATA-IN
Undefined
VALID
DATA-IN
tDS
NOTE : DOUT = OPEN
COLUMN
ADDRESS
tRSH
tCAS
tRCD
tHPC
¡ó
tCSH
tCAH tASC
¡ó
¡ó
¡ó
tWCS tWCH
tWCS
tWP
tWP
tWCH
tWCS
tWCH
tDH tDS tDH tDS
¡ó
¡ó
¡ó
tRP
tCP
tCP
tCAS
tHPC
CAS1
VIH - VIL -
tCAS
¡ó
tCAS
CAS2
VIH - VIL -
tCAS
¡ó
tCAS
CAS3
VIH - VIL -
tCAS
¡ó
VIH - VIL -
VALID
DATA-IN
tDS
VALID
DATA-IN
tDH tDS
VIH - VIL -
VALID
DATA-IN
VALID
DATA-IN
tDS tDH tDS tDH
VIH - VIL -
VALID
DATA-IN
tDS
DQ0
DQ1
DQ2
DQ3
tDH
tDH
VALID
DATA-IN
tDH
¡ó
¡ó
¡ó
¡ó
¡ó
¡ó
¡ó
¡ó
tWP
COLUMN
ADDRESS
tCAH
Page 15
CMOS DRAMKM44C4005C, KM44C4105C
tCAC
tASC
tASC
RAS
VIH - VIL -
A
VIH - VIL -
W
VIH - VIL -
OE
VIH - VIL -
VIH - VIL -
DQ0 ~ DQ3
ROW
ADDR
tRASP
tASR
VALID
Dont care
HYPER PAGE READ - MODIFY - WRITE CYCLE
DATA-OUT
Undefined
tRCD
tCP
tRAD
tCAH
tWP
tDH
COL.
ADDR
COL.
ADDR
tCAS
tCAS
tCRP
tCAH
tRAL
tPRWC
tRCS
tCWL
tCWD
tAWD
tRWD
tWP
tCWD
tAWD
tAA
tRAC
tOEA
tCLZ
tCAC
tOEZ
tOED
VALID
DATA-IN
VALID
DATA-OUT
VALID
DATA-IN
tCLZ
tDS
tOEA
tAA
tDH
tDS
tOEZ
tOED
tRWL
tRP
tRSH
tRAH
tCLCH
tCAS
tCAS
tCAS
tCAS
CAS0
VIH - VIL -
CAS1
VIH - VIL -
CAS2
VIH - VIL -
CAS3
VIH - VIL -
tCLCH
tCWL
tCSH
Page 16
CMOS DRAMKM44C4005C, KM44C4105C
RAS
VIH - VIL -
CASX
VIH - VIL -
A
VIH - VIL -
ROW
ADDR
tRAS
tRC
tRP
tASR tRAH
tCRP
Dont care
RAS - ONLY REFRESH CYCLE*
Undefined
NOTE : W, OE, DIN = Don′t care
DOUT = OPEN
tRPC
tCRP
CAS - BEFORE - RAS REFRESH CYCLE
NOTE : OE, A = Dont care
RAS
VIH - VIL -
CASX
VIH - VIL -
tRAS
tRC
tRP
tWRP
tRPC
tRP
tCP
tCHR
tCSR
W
VIH - VIL -
tWRH
tCEZ
tRPC
VIH - VIL -
DQ0 ~ DQ3
OPEN
Page 17
CMOS DRAMKM44C4005C, KM44C4105C
tCEZ
RAS
VIH - VIL -
CASX
VIH - VIL -
A
VIH - VIL -
W
VIH - VIL -
OE
VIH - VIL -
VIH - VIL -
DQX
HIDDEN REFRESH CYCLE ( READ )
COLUMN
ADDRESS
ROW
ADDRESS
tRAS
tRC
tCHRtRCD
tRAD
tASR tRAH tASC
tCAH
tCRP
tRCS
tAA
tOEA
tCAC
tCLZ
tRAC
OPEN
Dont care
tRSH
tOEZ
Undefined
tRC
DATA-OUT
tRP tRP
tRAS
tWRH
Page 18
CMOS DRAMKM44C4005C, KM44C4105C
RAS
VIH - VIL -
CASX
VIH - VIL -
A
VIH - VIL -
W
VIH - VIL -
OE
VIH - VIL -
VIH - VIL -
HIDDEN REFRESH CYCLE ( WRITE )
COLUMN
ADDRESS
ROW
ADDRESS
tRAS
tRC
tCHR
tRCD
tRAD
tASR tRAH tASC
tCAH
tCRP
Dont care
tRSH
DATA-IN
Undefined
tRC
NOTE : DOUT = OPEN
tWCH
tWP
tDH
tRPtRP
tRAS
tDS
tWCS
DQX
tWRH
tWRP
Page 19
CMOS DRAMKM44C4005C, KM44C4105C
Dont care
Undefined
CAS - BEFORE - RAS SELF REFRESH CYCLE
NOTE : OE, A = Dont care, WE=Vcc-0.2V
RAS
VIH - VIL -
CASX
VIH - VIL -
tRASS tRPS
tRPC
tCHS
tRP
tCP
tCSR
tCEZ
tRPC
OPEN
VOH - VOL -
DQ0 ~ DQ3
TEST MODE IN CYCLE
NOTE : OE, A = Dont care
RAS
VIH - VIL -
CASX
VIH - VIL -
tRAS
tRC
tRP
tCRP
tWTS
tRPC
tRP
tCP
tCHR
tCSR
W
VIH - VIL -
tWTH
tCEZ
OPEN
VIH - VIL -
DQ0 ~ DQ3
Page 20
CMOS DRAMKM44C4005C, KM44C4105C
PACKAGE DIMENSION
28 SOJ 300mil
0.300 (7.62)
0.330 (8.39)
0.340 (8.63)
0.730 (18.54)
0.720 (18.30)
MAX
0.741 (18.82)
MAX
0.148 (3.76)
0.0375 (0.95) 0.050 (1.27)
0.032 (0.81)
0.026 (0.66)
0.021 (0.53)
0.015 (0.38)
0.027 (0.69)
0.012 (0.30)
0.006 (0.15)
0.280 (7.11)
0.260 (6.61)
MIN
#28
#1
Units : Inches (millimeters)
28 TSOP(II) 300mil
MAX
0.047 (1.20)
MIN
0.002 (0.05)
0.020 (0.50)
0.012 (0.30)
0.050 (1.27)0.037 (0.95)
0.721 (18.31)
0.729 (18.51)
0.741 (18.81) MAX
0.010 (0.25)
0.004 (0.10)
0.300 (7.62)
0.371 (9.42)
0.355 (9.02)
Units : Inches (millimeters)
0~8
0.030 (0.75)
0.018 (0.45)
TYP
0.010 (0.25)
O
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