Datasheet ixfp3n50pm Datasheet

Page 1
Preliminary Technical Information
PolarHV
TM
HiPerFET
IXFP 3N50PM
Power MOSFET
(Electrically Isolated Tab)
N-Channel Enhancement Mode Avalanche Rated Fast Intrinsic Diode
Symbol Test Conditions Maximum Ratings
DSS
DGR
Continuous ± 30 V
GSS
GSM
I
D25
I
DM
I
AR
AR
AS
dv/dt I
D
T
J
T
JM
T
stg
T
L
T
SOLD
M
d
Weight 4g
TJ= 25° C to 150° C 500 V TJ= 25° C to 150° C; RGS = 1 MΩ 500 V
Transient ± 40 V
TC= 25° C 2.7 A TC= 25° C, pulse width limited by T
TC= 25° C3A TC= 25° C10mJ TC= 25° C 100 mJ
≤ IDM, di/dt ≤ 100 A/µs, VDD ≤ V
S
TJ≤ 150° C, RG = 50 Ω
TC= 25° C36W
1.6 mm (0.062 in.) from case for 10 s 300 °C Plastic body for 10 s 260 °C
Mounting torque 1.13/10 Nm/lb.in.
JM
, 10 V/ns
DSS
-55 ... +150 °C
-55 ... +150 °C
8A
150 °C
OVERMOLDED TO-220 (IXTP...M) OUTLINE
Features
l
Plastic overmolded tab for electrical isolation
l
Fast intrinsic diode
l
International standard package
l
Unclamped Inductive Switching (UIS) rated
l
Low package inductance
- easy to drive and to protect
V
DSS
I
D25
R
DS(on)
t
rr
G
D
G = Gate D = Drain S = Source
= 500 V = 2.7 A
≤≤
≤ 2.0
≤≤ ≤≤
≤ 200 ns
≤≤
Isolated Tab
ΩΩ
Ω
ΩΩ
Symbol Test Conditions Characteristic Values (TJ = 25° C, unless otherwise specified) Min. Typ. Max.
BV
DSS
GS(th)
I
GSS
I
DSS
R
DS(on)
© 2006 IXYS All rights reserved
VGS= 0 V, ID = 250 µA 500 V
VDS= VGS, ID = 250 µA 3.0 5.5 V
VGS= ±30 VDC, VDS = 0 ±100 nA
VDS= V VGS= 0 V TJ = 125° C 200 µA
VGS= 10 V, ID = 1.8 A 2.0 Ω Note 1
DSS
5 µA
Advantages
l
Easy to mount
l
Space savings
l
High power density
DS99509E(04/06)
Page 2
IXFP 3N50PM
Symbol Test Conditions Characteristic Values
= 25° C, unless otherwise specified)
J
Min. Typ. Max.
409 pF
6.1 pF
25 ns
29 ns
9.3 nC
3.4 nC
3.5 °C/W
g
C
C
C
t
t
t
t
Q
Q
Q
R
fs
iss
oss
rss
d(on)
r
d(off)
f
g(on)
gs
gd
thJC
(T
VDS= 10 V; ID = 1.8 A, Note 1 3.5 S
VGS = 0 V, VDS = 25 V, f = 1 MHz 48 pF
VGS = 10 V, VDS = 0.5 V
, ID = 3.6 A 28 ns
DSS
RG = 50 Ω (External) 63 ns
VGS= 10 V, VDS = 0.5 V
, ID = 1.8 3.3 nC
DSS
Source-Drain Diode Characteristic Values
(T
Symbol Test Conditions Min. Typ. Max.
= 25° C unless otherwise specified)
J
ISOLATED TO-220 (IXTP...M)
123
Terminals: 1 - Gate
2 - Drain (Collector) 3 - Source (Emitter)
I
S
I
SM
SD
t
rr
Q
RM
I
RM
VGS = 0 V 3.6 A
Repetitive 5 A
IF = IS, VGS = 0 V, Note 1 1.5 V
IF = 3.6 A, -di/dt = 100 A/µs, 200 ns VR = 100 V, VGS = 0 V 0.1 µC
0.5 A
Notes: 1) Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
2) Test current I
= 2.5 A
T
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived from data gathered during objective characterizations of preliminary engineer­ing lots; but also may yet contain some information supplied during a pre-production design evaluation. IXYS reserves the right to change limits, test conditions, and dimen­sions without notice.
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 one or moreof the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405B2 6,759,692
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2
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