3.3V In-System Programmable
SuperBIG™ High Density PLD
Features
• SuperBIG HIGH DENSITY IN-SYSTEM
PROGRAMMABLE LOGIC
— 3.3V Power Supply
— 60,000 PLD Gates/1080 Macrocells
— 192-360 I/O Pins Supporting 3.3V/2.5V I/O
— 1440 Registers
— High-Speed Global and Big Fast Megablock (BFM)
Interconnect
— Wide 20-Macrocell Generic Logic Block (GLB) for
High Performance
— Wide Input Gating (44 Inputs per GLB) for Fast
Counters, State Machines, Address Decoders, Etc.
— PCB-Efficient Ball Grid Array (BGA) Package
Options
2
• HIGH-PERFORMANCE E
—
fmax = 125 MHz Maximum Operating Frequency
tpd = 8.5 ns Propagation Delay
• ARCHITECTURE FEATURES
— Enhanced Pin-Locking Architecture, Symmetrical
Generic Logic Blocks Connected by Hierarchical
Big Fast Megablock and Global Routing Planes
— Product Term Sharing Array Supports up to 28
Product Terms per Macrocell Output
— Macrocells Support Concurrent Combinatorial and
Registered Functions
— Embedded Tristate Bus Can Be Used as an Internal
Tristate Bus or as an Extension of an External
Tristate Bus
— Macrocell and I/O Registers Feature Multiple Control
Options, Including Set, Reset and Clock Enable
— I/O Pins Support Programmable Bus Hold, Pull-Up,
Open-Drain and Slew Rate Options
— Separate VCCIO Power Supply to Support 3.3V or
2.5V Input/Output Logic Levels
— I/O Cell Register Programmable as Input Register for
Fast Setup Time or Output Register for Fast Clock to
Output Time
CMOS® TECHNOLOGY
• ispDesignEXPERT™ – LOGIC COMPILER AND COMPLETE ISP DEVICE DESIGN SYSTEMS FROM HDL
SYNTHESIS THROUGH IN-SYSTEM PROGRAMMING
— Superior Quality of Results
— Tightly Integrated with Leading CAE Vendor Tools
— Productivity Enhancing Timing Analyzer, Explore
Tools, Timing Simulator and ispANALYZER™
— PC and UNIX Platforms
Functional Block Diagram
12
I/O
12
I/O
12
I/O
12
I/O
12
I/O
12
I/O
12
I/O
12
I/O
12
I/O
Boundary
Scan
12
I/O
12
I/O
12
12
I/O
I/O
12
I/O12I/O12I/O
Big Fast Megablock 0
Big Fast Megablock 1
Big Fast Megablock 2
Big Fast Megablock 3
Big Fast Megablock 4
Global Routing Plane
Big Fast Megablock 5
Big Fast Megablock 6
Big Fast Megablock 7
Big Fast Megablock 8
12
12
I/O
I/O
12
I/O12I/O12I/O
81080v block
12
I/O
12
I/O
12
I/O
12
I/O
12
I/O
12
I/O
12
I/O
12
I/O
12
I/O
ispLSI 8000V Family Description
The ispLSI 8000V Family of Register-Intensive, 3.3V
SuperBIG In-System Programmable Logic Devices is
based on Big Fast Megablocks of 120 registered macrocells and a Global Routing Plane (GRP) structure
Global Routing Plane (GRP) with Tristate Bus Lines
2
Page 3
ispLSI 8000V Family Description (Continued)
Specifications ispLSI 81080V
interconnecting the Big Fast Megablocks. Each Big Fast
Megablock contains 120 registered macrocells arranged
in six groups of 20, a group of 20 being referred to as a
Generic Logic Block, or GLB. Within the Big Fast
Megablock, a Big Fast Megablock Routing Pool (BRP)
interconnects the six GLBs to each other and to 24 Big
Fast Megablock I/O cells with optional I/O registers. The
Global Routing Plane which interconnects the Big Fast
Megablocks has additional global I/Os with optional I/O
registers. The 192-I/O version contains 72 Big Fast
Megablock I/Os and 120 global I/Os, while the 360-I/O
version contains 216 Big Fast Megablock I/Os and 144
global I/Os.
Outputs from the GLBs in a Big Fast Megablock can drive
both the Big Fast Megablock Routing Pool within the Big
Fast Megablock and the Global Routing Plane between
the Big Fast Megablocks. Switching resources are provided to allow signals in the Global Routing Plane to drive
any or all the Big Fast Megablocks in the device. This
mechanism allows fast, efficient connections, both within
the Big Fast Megablocks and between them.
Each GLB contains 20 macrocells and a fully populated,
programmable AND-array with 82 logic product terms.
The GLB has 44 inputs from the Big Fast Megablock
Routing Pool which are available in both true and complement form for every product term. Up to 20 of these inputs
can be switched to provide local feedback into the GLB
for logic functions that require it. The 80 general-purpose
product terms can be grouped into 20 sets of four and
sent into a Product Term Sharing Array (PTSA) which
allows sharing up to a maximum of 28 product terms for
a single function. Alternatively, the PTSA can be bypassed for functions of four product terms or less.
The 20 registered macrocells in the GLB are driven by the
20 outputs from the PTSA or the PTSA bypass. Each
macrocell contains a programmable XOR gate, a programmable register/latch/toggle flip-flop and the
necessary clocks and control logic to allow combinatorial
or registered operation. Each macrocell has two outputs,
one output can be fed back inside the GLB to the ANDarray, while the other output drives both the Big Fast
Megablock Routing Pool and the Global Routing Plane.
This dual output capability from the macrocell allows
efficient use of the hardware resources. One output can
be a registered function for example, while the other
output can be an unrelated combinatorial function.
Macrocell registers can be clocked from one of several
global, local or product term clocks available on the
device. A global, local and product term clock enable is
also provided, eliminating the need to gate the clock to
the macrocell registers. Reset and preset for the macrocell register is provided from both global and product term
signals. The polarity of all of these control signals is
selectable on an individual macrocell basis. The macrocell register can be programmed to operate as a D-type
register, a D-type flow-through latch or a T-type flip flop.
The 20 outputs from the GLB can drive both the Big Fast
Megablock Routing Pool within the Big Fast Megablock
and the Global Routing Plane between the Big Fast
Megablocks. The Big Fast Megablock Routing Pool contains general purpose tracks which interconnect the six
GLBs within the Big Fast Megablock and dedicated
tracks for the signals from the Big Fast Megablock I/O
cells. The Global Routing Plane contains general purpose tracks that interconnect the Big Fast Megablocks
and also carry the signals from the I/Os connected to the
Global Routing Plane.
Control signals for the I/O cell registers are generated
using an extra product term within each GLB, or using
dedicated input pins. Each GLB has two extra product
terms beyond the 80 available for the macrocell logic.
The first additional product term is used as an optional
shared product term clock for all the macrocells within the
GLB. The second additional product term is then routed
to an I/O Control Bus using a separate routing structure
from the Big Fast Megablock Routing Pool and Global
Routing Plane. Use of a separate control bus routing
structure allows the I/O registers to have many control
signals with no impact on the interconnection of the GLBs
and Big Fast Megablocks. The I/O Control Bus is split into
four quadrants, each servicing the I/O cell control requirements for one edge of the device. Signals in the
control bus can be independently selected by any or all
I/O cells to act as clock, clock enable, output enable,
reset or preset.
Each Big Fast Megablock has 24 I/O cells. The Global
Routing Pool has 144 I/O cells. Each I/O cell can be
configured as a combinatorial input, combinatorial output, registered input, registered output or bidirectional
I/O. I/O cell registers can be clocked from one of several
global, local or product term clocks which are selected
from the I/O control bus. A global and product term clock
enable is also provided, eliminating the need for the user
to gate the clock to the I/O cell registers. Reset and preset
for the I/O cell register is provided from both global and
product term signals. The polarity of all of these control
3
Page 4
Specifications ispLSI 81080V
ispLSI 8000V Family Description (Continued)
signals is selectable on an individual I/O cell basis. The
I/O cell register can be programmed to operate as a Dtype register or a D-type latch.
The input thresholds are fixed at levels which comply with
both 3.3V and 2.5V interfaces. The output driver can
source 4mA and sink 8mA (3.3V output supply). The
output drivers have a separate VCCIO power supply
which is independent of the main VCC supply for the
device. This feature allows the output drivers to run from
either 3.3V or 2.5V while the device logic is always
powered from 3.3V. The output drivers also provide
individually programmable edge rates and open drain
capability. A programmable pullup resistor is provided to
tie off unused inputs and a programmable bus-hold latch
is available to hold tristate outputs in their last valid state
until the bus is driven again by another device.
The ispLSI 8000V Family features 3.3V, non-volatile insystem programmability for both the logic and the
interconnect structures, providing the means to develop
truly reconfigurable systems. Programming is achieved
through the industry standard IEEE 1149.1-compliant
Boundary Scan interface using the JTAG protocol. Boundary Scan test is also supported through the same interface.
An enhanced, multiple cell security scheme is provided
that prevents reading of the JEDEC programming file
when secured. After the device has been secured using
this mechanism, the only way to clear the security is to
execute a bulk-erase instruction.
ispLSI 81080V Description
The ispLSI 81080V device has nine Big Fast Megablocks
for a total of 9 x 120 = 1080 macrocells.
Each Big Fast Megablock has a total of 24 I/O cells and
the Global Routing Plane has a total of 144 I/O cells. This
gives (9 x 24) + 144 = 360 I/Os for the full I/O version,
while the partial I/O version contains 72 Big Fast
Megablock I/Os + 120 global I/Os = 192 I/Os.
Embedded Tristate Bus
There is a 108-line embedded internal tristate bus as part
of the Global Routing Plane (GRP), enabling multiple
GLBs to drive the same tracks. This bus can be partitioned into various bus widths such as twelve 9-line
buses, six 18-line buses or three 36-line buses. The
GLBs can dynamically share a subset of the Global
Routing Plane tracks. This feature eliminates the need to
convert tristate buses to wide multiplexers on the programmable device. Up to 18 macrocells per GLB can
participate in driving the embedded tristate bus. The
remaining two macrocells per GLB are used to generate
the internal tristate driver control signals on each data
byte (with parity). The embedded tristate bus can also be
configured as an extension of an external tristate bus
using the bidirectional capability of the I/O cells connected to the Global Routing Plane. The Global Routing
Plane I/Os 0-8 and 15-23 from each group (I/OGx as
defined in the I/O Pin Location Table) can connect to the
internal tristate bus as well as the unidirectional/nontristate global routing channels. I/Os 9-14 connect only to
the global routing channel.
The embedded tristate bus has internal bus hold and
arbitration features in order to make the function more
“user friendly”. The bus hold feature keeps the internal
bus at the previously driven logic state when the bus is
not driven to eliminate bus float. The bus arbitration is
performed on a “first come, first served” priority. In other
words, once a logic block drives the bus, other logic
blocks cannot drive the bus until the first releases the bus.
This arbitration feature prevents internal bus contention
when there is an overlap between two bus enable signals. Typically, it takes about 3ns to resolve one bus
signal coming off the bus to another bus signal driving the
bus. The arbitration feature, combined with the predictability of the CPLD, makes the embedded tristate bus the
most practical for real world bus implementation.
The total registers in the device is the sum of macrocells
plus I/O cells, 1080 + 360 = 1440 registers.
4
Page 5
Figure 2. ispLSI 8000V GLB Overview
I/O Big Fast Megablock Input Tracks
Specifications ispLSI 81080V
PT 0
PT 1
PT 2
PT 3
PT 4
PT 5
PT 6
PT 7
PT 8
PT 9
PT 10
PT 11
AND Array Input
0
Fully Populated
Routing
AND Array
General Purpose Big Fast Megablock Input Tracks
Feedback Inputs
43
Product Term
Sharing Array
20
Macrocell 0
From PTSA
PTSA Bypass
Single PT
PT Clock
PT Preset
PT Reset
Shared PT Clock
Bus Input
Macrocell 1
From PTSA
PTSA Bypass
Single PT
PT Clock
PT Preset
PT Reset
Shared PT Clock
Bus Input
Macrocell 2
From PTSA
PTSA Bypass
Single PT
PT Clock
PT Preset
PT Reset
Shared PT Clock
Bus Input
0
1
2
To Interconnect
From Tristate
Bus Track
To Interconnect
From Tristate
Bus Track
To Interconnect
PT 12
PT 13
PT 14
PT 15
PT 76
PT 77
PT 78
PT 79
PT 80
PT 81
Macrocell 3
From PTSA
PTSA Bypass
Single PT
PT Clock
PT Preset
PT Reset
Shared PT Clock
Bus Input
Macrocell 19
From PTSA
PTSA Bypass
Single PT
PT Clock
PT Preset
PT Reset
Shared PT Clock
Bus Input
Function Selector (E2 Cell Controlled)Note: Macrocells 9 and 10 do not support Tristate Bus Feedback.
From Tristate
Bus Track
To interconnect
3
From Tristate
Bus Track
To Interconnect
19
From Tristate Bus Track
To Output Control MUX
5
Page 6
Figure 3. ispLSI 8000V Macrocell Overview
Single PT
PTSA
PTSA Bypass
PT Clock
Global Clock Enable
Global Clock 0
Global Clock 1
Global Clock 2
PT Reset
GRST
PT Preset
Specifications ispLSI 81080V
Bus Input From Tristate
Bus Track*
Feedback to AND Array
DQ
To Big Fast Megablock
or Global Interconnect
Clk En
RP
R/L
From Macrocell
9 or 10
To Specific
Global Tristate Bus*
Reset pin
Preset/Reset Input has Global Polarity Control
GRST
To All Macrocells and I/O Cells
From PT80
: Function Selector (E2 Cell Controlled)*Not available for Macrocells 9 and 10.
6
Page 7
Figure 4. ispLSI 8000V I/O Cell
Specifications ispLSI 81080V
TOE
GLOBAL OE0
GLOBAL OE1
GLOBAL OE2
GLOBAL OE3
From Output
Control Bus
Multiplexed Output From
Big Fast Megablock or
Global Track
GLOBAL I/O CLOCK ENABLE
From Output
Control Bus
GLOBAL CLOCK0
GLOBAL CLOCK2
QUADRANT I/O CLOCK
From Output
Control Bus
DQ
CLKEN
R/L
R
P
VCCIO
Slew
Rate
VCCIO
Open
Drain
VCCIO
Big Fast Megablock I/O Pad
or Global I/O Pad
To Specific
Big Fast Megablock
or Global Tracks
To Specific
Global Tristate Bus
From Output
Control Bus
Global I/O Cell
Only
GRST
From Output
Control Bus
: Function Selector (E2 Cell Controlled)
7
Page 8
Specifications ispLSI 81080V
Output Control Organization
The Global OE signals and Test OE signal are driven
from the dedicated external control input pins.
In addition to the data input and output to the I/O cells,
each I/O cell can have up to six different I/O cell control
signals. In addition to the internal OE control, the five
control signals for each I/O cell consist of pin OE control,
clock enable, clock input, asynchronous preset and asynchronous reset. All of the I/O control signals can be driven
either from the dedicated external input pins or from the
internal control bus.
The output enable of each I/O cell can be driven by 21
different sources – 16 from the output control bus, four
from the Global OE pins and one from the Test OE pin.
The 16-bit wide output control buses are organized in four
different quadrants as shown in Figure 5. Since each
GLB is capable of generating the output control signals,
each of the output control bus signals can be driven from
a unique GLB. The 54 GLBs can generate a total of 54
unique I/O control signals. Referring to Figure 2, the GLB
generates its output control signal from control product
term (PT81).
Figure 5 also illustrates how the quadrant clocks are
routed to the appropriate quadrant I/O cells.
Figure 5. Output Control Bus and Quadrant Organization
Q
ra
, 1
d
a
t 0
u
n
B
(I/O
id
-B
it W
6
-B
0
O
e
<
8
-1
0
>
1
, Q
tp
u
t C
u
o
K
L
C
IO
s
u
l B
tro
n
)
0
s
u
l B
o
tr
n
o
t C
u
tp
u
O
e
id
it W
-B
6
, 1
t 1
n
ra
d
a
u
Q
)
1
K
L
C
IO
, Q
>
3
-2
2
1
<
5
-G
0
G
(I/O
s
u
G
B
L
G
ra
e
n
e
te
d
O
tp
u
t
u
tro
n
o
C
(se
F
e
ig
u
Q
d
a
u
ra
n
(I/O
t 2
6
, 1
B
-B
0
ro
F
m
1
8
P
l
re
2
)
-B
it W
<
8
2
1
T
id
tp
u
O
e
t C
u
o
-2
3
L
, Q
>
C
IO
s
u
l B
tro
n
)
2
K
l B
tro
n
o
t C
u
tp
u
O
e
id
it W
-B
6
, 1
t 3
n
a
r
d
a
u
Q
OE Bus/80180V
)
3
K
L
C
IO
, Q
>
1
1
-
0
<
5
-G
0
G
(I/O
8
Page 9
Figure 6. Boundary Scan Register Circuit for I/O Pins
SCANIN
(from previous
cell)
BSCAN
Registers
DQDQ
PROG_MODE
BSCAN
Latches
Specifications ispLSI 81080V
HIGHZ
EXTEST
TOE
Normal
Function
EXTEST
PROG_MODE
OE
0
1
DQ
DQ
Shift DR
*Internal power-up reset signal. Not connected to external reset pin.
Clock DR
Update DR
DQ
Reset*
Figure 7. Boundary Scan Register Circuit for Input-Only Pins
Normal
Function
0
1
SCANOUT
(to next cell)
I/O Pin
Input Pin
SCANIN
(from previous
cell
Shift DR
Clock DR
DQ
9
SCANOUT
(to next cell)
Page 10
Specifications ispLSI 81080V
Figure 8. Boundary Scan Waveforms and Timing Specifications
TMS
TDI
T
btsu
T
btch
TCK
TDO
Data to be
captured
Data to be
driven out
SYMBOL
t
btcpTCK Clock Pulse Width—ns
t
btch
t
btcl
t
btsu
t
bth
t
rfTCK, TDI, TMS Rise and Fall Time—mV/ns
t
btco
t
btozTAP Controller, TCK to TDO High-Impedance25ns—
t
btvo
t
btcpsu
t
btcph
t
btuco
t
btuoz
t
btuov
TCK Pulse Width High
TCK Pulse Width Low
TDI, TMS Setup Time to TCK
TDI, TMS Hold Time from TCK
TAP Controller, TCK to TDO Valid
TAP Controller, TCK to TDO High-Impedance to Valid Output
BSCAN Test Capture Register Setup Time
BSCAN Test Capture Register Hold Time
BSCAN Test Update Register Clock to Valid Output
BSCAN Test Update Register Clock to High-Impedance
BSCAN Test Update Register High-Impedance to Valid Output
T
btcl
T
btvo
T
btcpsu
T
btuov
PARAMETER
Data Captured
T
bth
T
btcp
T
btco
Valid DataValid Data
T
btcph
T
btuco
Valid DataValid Data
MIN
100
50
50
25
25
50
—
—
25
25
—
—
—
T
btoz
T
btuoz
MAXUNITS
—ns
—
—
25ns
25
—
65
65
Table 2-0010/81080V
ns
ns
ns—
ns
ns
ns—
ns
ns
ns65
10
Page 11
Specifications ispLSI 81080V
Absolute Maximum Ratings
1,2
Supply Voltage Vcc.................................. -0.5 to +5.4V
Input Voltage Applied............................... -0.5 to +5.6V
Tri-Stated Output Voltage Applied........... -0.5 to +5.6V
Storage Temperature................................ -65 to 150°C
Case Temp. with Power Applied .............. -55 to 125°C
Max. Junction Temp. (TJ) with Power Applied ... 150°C
1. Stresses above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation of the device at these or at any other conditions above those indicated in the operational sections of this specification
is not implied (while programming, follow the programming specifications).
2. Compliance with the Thermal Management section of the Lattice Semiconductor Data Book or CD-ROM is a requirement.
DC Recommended Operating Condition
SYMBOL
VCC
VCCIO
Supply VoltageCommercial T = 0°C to 70°C3.03.6V
I/O Supply Voltage
PARAMETER
MIN.MAX.UNITS
A
2.33.6V
Table 2-0005/81080V
Capacitance (TA=25°C,f=1.0 MHz)
SYMBOL
C
1
C
2
C
3
I/O Capacitance
Clock Capacitance
Global Input Capacitance
PARAMETER
Erase/Reprogram Specification
PARAMETERMINIMUMMAXIMUMUNITS
Erase/Reprogram Cycles
UNITSTYPICALTEST CONDITIONS
10
10
10
10000–Cycles
pfV = 3.3V, V = 2.0V
pfV = 3.3V, V = 2.0V
pfV = 3.3V, V = 2.0V
CCI/O
CCCK
CCG
Table 2-0006/81080V
Table 2-0008/81080V
11
Page 12
Switching Test Conditions
R
1
V
CCIO
R
2
C
L
*
Device
Output
Test
Point
*
CL includes Test Fixture and Probe Capacitance.
0213A/81080V
Specifications ispLSI 81080V
Input Pulse Levels
Input Rise and Fall Time
Input Timing Reference Levels
Ouput Timing Reference Levels
Output Load
3-state levels are measured 0.5V from
Input or I/O Low Leakage Current0V ≤ V ≤ V (Max.)
Input or I/O High Leakage Current
4
I/O Active Pullup Current
Bus Hold Low Sustaining Current
Bus Hold High Sustaining Current
Bus Hold Low Overdrive Current
Bus Hold High Overdrive Current
Bus Hold Trip Points
1,3,5
Operating Power Supply Current
1. Measured at a frequency of 1MHz using 54 20-bit counters.
2. Typical values are at V
3. Maximum I
varies widely with specific device configuration and operating frequency.
CC
4. Pullup is capable of pulling minimum voltage of V
5. Unused inputs held at GND.
PARAMETER
= 3.3V and T
CC
= 25°C.
A
IN IL
(V
-0.2)V ≤ VIN ≤ V
CCIO
V
≤ VIN ≤ 5.25V
CCIO
0V
≤ VIN ≤ V
VIN = V
IL(max)
VIN = V
IH(min)
0V ≤ VIN ≤ V
0V ≤ VIN ≤ V
V = 0.5V, V = 3.0V
IL IH
f = 1 MHz
TOGGLE
under no-load conditions.
OH
Specifications ispLSI 81080V
CONDITIONMIN.TYP.MAX. UNITS
–
CCIO
–
–
IL
40
-40
CCIO
CCIO
High Speed Mode
Low Power Mode
–
–
V
IL
–
–
2
–
-10
–
–
––
10
50
-250
–
–
–
550
–
-550
–
V
590
250–
Table 2-0007C/81080V
–
–
IH
–
µA
µA
µA
µA
µA
µA
µA
µA
V
mA
13
Page 14
Specifications ispLSI 81080V
External Switching Characteristics
1
Over Recommended Operating Conditions
PARA-
METER
t
pd1
t
pd2
f
max
t
suq
t
hq
t
coq
t
sug
t
hg
t
cog
t
su1
t
h1
t
co1
t
suceq
t
hceq
t
suceg
t
hceg
t
goe
t
rglb
t
rio
t
rw
t
wh
t
wl
1. Unless noted otherwise, all parameters use PTSA and CLK0.
2. Refer to Timing Model in this data sheet for further details.
3. Standard 20-bit counter with local feedback.
4. Refer to Switching Test Conditions section.
TEST
COND.
A
A
—
—
—
A
—
—
A
—
—
A
—
—
—
—
B/C
—
—
—
—
—
2
4
Prop Delay, BFM Input to Same BFM Output, 4 PT Bypass—10.0ns
1
Prop Delay, Global Input to Global Output —ns
2
Clk Frequency, Local Feedback, Same GLB90.0—
3
I/O Cell Reg, Data Setup Time, Quadrant I/O Clock8.0—ns
4
I/O Cell Reg, Data Hold Time, Quadrant I/O Clock—ns
5
I/O Cell Reg, Quadrant Clock to Output Delay6.0ns
6
I/O Cell Reg, Data Setup Time, Global Clock—ns
7
I/O Cell Reg, Data Hold Time, Global Clock—ns
8
I/O Cell Reg, Global Clock to Output Delay7.5ns
9
GLB Reg Setup, BFM Input to Same BFM GLB, 4 PT Bypass—ns
10
GLB Reg Hold Time, BFM Input to Same BFM GLB0.0ns
11
GLB Reg, Global Clock to Same BFM Output Delay10.0ns
12
I/O Cell Reg, CLKEN Setup Time, Quadrant I/O Clock6.5ns
13
I/O Cell Reg, CLKEN Hold Time, Quadrant I/O Clock0.0ns
14
GLB Reg, CLKEN Setup Time, Global Clock4.5ns
15
GLB Reg, CLKEN Hold Time, Global Clock0.0ns
16
Global Output Enable/Disable Delay—ns
17
Global Reset/Preset Time, GLB Reg—15.0ns
18
Global Reset/Preset Time, I/O Cell Reg—10.0ns
19
Global Reset/Preset Pulse Duration6.5—ns
20
Global or Quadrant Clock Pulse, High Duration6.0—ns
21
Global or Quadrant Clock Pulse, Low Duration6.0—ns
22
DESCRIPTION#
-125
MIN. MAX.
—8.5
—
3
125.0
0.0
3.5
0.0
4.5
—
5.0
—
4.0
—
—
—
6.0
—
—
—
0.0
—
8.0
—
5.5
—
0.0
—
3.5
—
0.0
7.0
—
—14.0
—8.5
5.0—
4.0—
4.0—
-90-60
MIN. MAX.
16.014.5
0.0
—
6.0
0.0
—
7.0
—
—
—
—
—
—
10.0
UNITS
MAX.
MIN.
—15.0
—
24.0
60.0—MHz
12.0—
—
0.0
9.0
—
—
9.0
0.0
10.0
—
11.0
—
—
—
0.0
—
15.0
—
9.5
—
0.0
—
6.5
—
0.0
15.0
—
—22.0
—15.0
9.5—
9.0—
9.0—
Table 2-0030/81080V
14
Page 15
Internal Timing Parameters
Over Recommended Operating Conditions
Specifications ispLSI 81080V
PARAMETER #
I/O Cell Delay
2
DESCRIPTION
-125-90-60
MINMAXMINMAXMINMAXUNITS
tidcom23 Input Pad and Input Buffer, Combinatorial Input–0.3–0.4–0.6ns
tidreg24 Input Pad and Input Buffer, Registered Input–6.4–7.6–11.2ns
tobp25 Output Register/Latch Bypass to Output Buffer–0.0–0.0–0.0ns
tibp26 Input Register/Latch Bypass to BFM Routing or GRP–0.4–0.5–0.8ns
tiolat27 I/O Cell Latch, Transparent Mode–2.0–2.4–3.6ns
tioco28 I/O Cell Register/Latch, Clk/Gate to Output–0.5–1.2–1.6ns
tiosu29 I/O Cell Register/Latch, Setup Time0.5–2.4–3.9–ns
tioh30 I/O Cell Register/Latch, Hold Time2.5–3.2–4.7–ns
tiorst31 I/O Cell Register/Latch, Reset or Set Time–1.5–1.7–2.5ns
tiosuce32 I/O C e l l R e g i ster/Latch, Setup Time for Clk Enable0.9–1.0–1.2–ns
tiohce33 I / O c e l l R e g i ster/Latch, Hold Time for Clk Enable4.6–4.6–6.9–ns
todreg34 I/O Cell Output Buffer Delay, Registered Output–1.6–1.9–2.9ns
todcom35 I / O C e l l O utput Buffer Delay, Combinatorial Output–1.6–1.9–2.9ns
todz36 Output Driver Disable Time–1.4–1.7–2.6ns
tslf37 Slew Rate Adder, Fast Slew Rate–0.0–0.0–0.0ns
tsls38 Slew Rate Adder, Slow Slew Rate–6.2–7.3–10.9ns
GLB / Macrocell Delay
tandhs39 AND Array, High Speed Mode–2.6–2.9–4.2ns
tandlp40 AND Array, Low Power Mode–6.5–7.7–11.5ns
t1pt41 Single Product Term Bypass–1.9–2.2–3.4ns
t4ptcom 42 Four Product Term Bypass, Combinatorial Macrocell–0.5–0.6–0.9ns
t4ptreg43 Four Product Term Bypass, Registered Macrocell–1.4–1.7–2.2ns
tptsa44 Product Term Sharing Array–2.4–2.7–4.1ns
tmbp45 Macrocell Register/Latch Bypass–0.0–0.0–0.0ns
tmlat46 Macrocell Latch, Transparent Mode–4.6–5.5–8.2ns
tmco47 Macrocell Register/Latch, Clk/Gate to Output–0.2–0.8–0.9ns
tmsu48 Macrocell Register/Latch, Setup Time2.7–4.5–6.9–ns
tmh49 Macrocell Register/Latch, Hold Time1.0–1.2–1.1–ns
tmrst50 Macrocell Register/Latch, Reset or Set Time–1.4–1.5–1.6ns
tmsuce51 Macrocell Register/Latch, Setup Time for Clk Enable1.0–1.3–1.7–ns
tmhce52 Macrocell Register/Latch, Hold Time for Clk Enable2.3–2.6–3.9–ns
tfloc54 Local Feedback to AND Array–0.1–0.1–0.6ns
tpck55 Single Product Term, Clk1.31.31.61.62.52.5ns
tpcken56 Single Product Term, Clk Enable–1.7–2.0–3.1ns
tsck57 Shared Product Term, Clk1.71.92.02.33.13.5ns
tscken58 Shared Product Term, Clk Enable1.71.92.02.33.13.5ns
tprst59 Single Product Term, Reset or Set Delay–1.5–1.7–2.6ns
trdir60 Macrocell Register, Direct Input from GRP–7.2–8.4–12.7ns
15
Page 16
Specifications ispLSI 81080V
Internal Timing Parameters
Over Recommended Operating Conditions
PARAMETER #
BFM / Global Routing Pool Delay
2
DESCRIPTION
tbfmi61 BFM Routing Delay, Signal from I/O Cell0.41.00.61.30.81.9ns
tgrpi62 GRP Delay, Signal from I/O Cell–1.8–1.9–2.8ns
tgrpiz63 Internal Tristate Bus Enable/Disable, I/O Cell Buffer–4.3–4.9–7.3ns
tbfmm64 BFM Routing Delay, Signal from Macrocell–0.6–0.7–1.1ns
tgrpm65 GRP Delay, Signal from Macrocell–2.6–3.0–4.5ns
tgrpmz66
Internal Tristate Bus Enable/Disable, Macrocell Buffer
tbfmg67 BFM Routing Delay, Signal from GRP–3.3–3.3–4.9ns
tgrpb68 GRP Delay, Signal from BFM Routing–1.3–1.5–2.3ns
tbcom69 BFM Routing to I/O Cell, Combinatorial Path–1.5–1.7–2.6ns
tbreg70 BFM Routing to I/O Cell, Registered Path–2.3–2.6–4.0ns
tgcom71 GRP to I/O Cell, Combinatorial Path–0.8–0.8–1.2ns
tgreg72 GRP to I/O Cell, Registered Path–1.6–1.7–2.6ns
I/O Control Bus Delay
tpiock73 Product Term as I/O Cell Register Clock–4.1–4.7–7.2ns
tpiocken 74 Product Term as I/O Cell Register Clock Enable–4.6–5.3–8.1ns
tpoe75 Product Term as Output Buffer Enable/Disable–5.6–6.5–9.9ns
tpiorst76
Product Term as I/O Cell Register Reset or Set Delay
tpioz77 Internal Tristate Bus Control Signal for I/O Cell Buffer–3.3–3.8–5.8ns
Global Control Delay
tgck78 Global Macrocell Register Clk3.94.14.34.96.67.5ns
tgcken79 Global Macrocell Register Clk Enable6.46.47.57.511.411.4ns
tgiock80 Global I/O Register Clk3.43.94.04.46.16.5ns
tgiocken 81 Global I/O Register Clk Enable6.56.57.57.511.411.4ns
tqck82 Quadrant I/O Register Clk1.91.92.02.93.14.5ns
tgoe83 Global Output Enable–5.6–8.3–12.4ns
ttoe84 Test Output Enable–8.5–10.1–15.2ns
tgmrst85 Global GLB Register Reset–7.6–7.8–11.8ns
tgiorst86 Global I/O Cell Register Reset–5.4–6.4–9.6ns
1. Internal Timing Parameters are not tested and are for reference only.
2. Refer to Timing Model in this data sheet for further details.
Note: Calculations are based upon timing specifications for the ispLSI 81080V-125L
18
Page 19
Power Consumption
Specifications ispLSI 81080V
Power consumption in the ispLSI 81080V device depends on two primary factors: the speed at which the
device is operating and the number of product terms
used. The product terms have a fuse-selectable speed/
power tradeoff setting. Each group of four product terms
has a single speed/power tradeoff control fuse that acts
on the complete group of four. The fast “high-speed”
Figure 10. Typical Device Power Consumption vs fmax
1300
1200
1100
1000
900
800
700
CC (mA)
I
600
500
400
setting operates product terms at their normal full power
consumption. For portions of the logic that can tolerate
longer propagation delays, selecting the slower “lowpower” setting will significantly reduce the power
dissipation for these product terms. Figure 10 shows the
relationship between power and operating speed.
ispLSI 81080V
Turbo
Non-Turbo
300
200
0 102030405060708090100
f
max (MHz)
Notes: Configuration of 54 20-bit counters
Typical current at 3.3V, 25¡ C
ICC can be estimated for the ispLSI 81080V using the following equation:
ICC = 45.0 + (# of Turbo PTs * 0.25) + (# of Non-Turbo PTs * 0.11) + (# of Macrocells Used * Fmax * AF * .043)
# of Turbo PTs = Number of Turbo Product Terms Used in Design
# of Non-Turbo PTs = Number of Non-Turbo Product Terms Used in Design
fmax = Maximum Operating Frequency
AF (Activity Factor) =
Note: An Activity Factor of 1.0 means all macrocell registers toggle at fmax. An Activity Factor of 0.5 means the
average macrocell register toggles at half of fmax.
The I
on average exists. These values are for estimates only. Since the value of I
and the program in the device, the actual I
estimate is based on typical conditions (VCC = 3.3V, room temperature) and an assumption of two GLB loads
CC
Average Macrocell Toggle Frequency
Fmax
should be verified.
CC
is sensitive to operating conditions
CC
110 120 130
0127/81080V
19
Page 20
Specifications ispLSI 81080V
Signal Descriptions
Signal Name Description
CLK0, CLK1,Dedicated clock input for the GLB registers only. These clock inputs are connected to one of the clock
CLK2inputs of all GLB registers in the device.
CLKENDedicated clock enable input for the GLB registers only. This input is available as a clock enable for
each GLB register in the device. Use of the clock enable input eliminates the need for the user to gate
the clock to the register.
GNDGround (GND)
GOE0, GOE1,Global Output Enable inputs.
GOE2, GOE3
SET/RESETDedicated reset/preset pin connected to ALL registers in the device, GLB registers and I/O registers.
Each register can independently choose to be reset or preset when this signal goes active. The active
polarity is user-selectable.
IOCLKENDedicated clock enable input for the I/O registers only. This input is available as a clock enable input for
all I/O registers in the device. Use of the clock enable input eliminates the need for the user to tie the
clock to the I/O register.
I/OInput/Output – These are the general purpose I/O used by the logic array.
EPENEmbedded Port Enable Pin – When this pin is high, the port is enabled. When this pin is low, the
state machine is held at reset asynchronously and TCK, TMS and TDI are ignored.
TMSInput – This signal is the Test Mode Select input signal.
QIOCLK0,Dedicated clock inputs for the I/O registers only. These clock inputs are connected to the I/O registers
QIOCLK1,on the same side of the device only, they are not connected to all of the I/O registers. Use of these
QIOCLK2,quadrant I/O clocks gives the fastest tco from the device.
QIOCLK3
TCKInput – This signal is the Test Clock input signal.
TDIInput – This signal is the Test Data input signal.
TDOOutput – This signal is the Test Data Out Output Signal.
TOETest Output Enable. Tristates all I/O pins when a logic low is driven.
VCCVcc
VCCIOPower supply for the output drivers. The internal logic of the device is connected to VCC which is
always 3.3V. The output drivers are connected to VCCIO which can be equal to VCC or 2.5V. This
allows the output drivers to be powered from 2.5V, for example, to interface directly with another 2.5V
device.
1
NC
1. NC pins are not to be connected to any active signals, VCC or GND.